CN104501981A - Temperature sensor chip with communication function - Google Patents
Temperature sensor chip with communication function Download PDFInfo
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- CN104501981A CN104501981A CN201410748522.XA CN201410748522A CN104501981A CN 104501981 A CN104501981 A CN 104501981A CN 201410748522 A CN201410748522 A CN 201410748522A CN 104501981 A CN104501981 A CN 104501981A
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- temperature sensor
- sensor chip
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- communication function
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Abstract
The invention relates to a temperature sensor chip with a communication function. The temperature sensor chip is mainly characterized in that a two-pin encapsulation mode is adopted, the chip comprises a plastic package encapsulation body part 203, a first metal pipe pin part 201 and a second metal pipe pin part 202, wherein the encapsulation body part is made of lead-free plastic package plastics, the first metal pipe pin part 201 and the second metal pipe pin part 202 are made of copper, iron and silver alloy materials subjected to special metal electroplating, after the special metal electroplating, pipe pins cannot be easily corroded by acid, and the application to the relevant temperature measuring industry is more stable and more reliable. The temperature sensor adopts the two-pin encapsulation, a gap between the chip pipe pins is increased, the short circuit possibility is reduced, in addition, the work procedures are greatly saved in the production process, and the qualification rate is improved. Through the temperature sensor chip provided by the invention, the problem of complicated production work procedures and the problem of short circuit due to various reasons for a long time in the relevant temperature measuring industry are solved.
Description
Technical field
The present invention relates to field of temperature measurement, the temperature sensor chip with communication function of the particularly application such as grain feelings thermometric.
Background technology
Grain is the grand strategy commodity involved the interests of the state and the people, and along with the opening gradually of China's entry into the WTO and grain market, stores the development of a large amount of grain to stable national economy and plays vital effect.Information-based silo is modern general grain storage equipment, and temperature survey ensures in information-based silo that grain stores good necessary means.The thermometric mode of current employing is the form of measuring temp. wire cable, and this form can possess thermometric and the dual-use function communicated.Concrete mode to have the temperature sensor chip plastic packaging of communication function in measuring temp. wire cable, again cable is distributed to each space of silo, by distribution or the mode of concentrated collection, the temperature information of monitoring each point is outputted to monitor terminal, reach the object of the whole grain temperature distribution of monitoring.Therefore the quality of temperature sensor chip and measuring temp. wire cable is related to the reliability of information-based silo and the major issue of grain storage.Except grain application, this temperature sensor chip with communication function can also be applied to the various fields such as brewing fermentation, flue-cured tobacco, Industry Control, monitoring of tools, indoor and outdoor temperature monitoring, fire safety.
Traditional sensor chip that relevant thermometric industry adopts at present is TO92 and encapsulates 3 pin temperature sensors, and temperature sensor chip is made up of plastic packaging packaging body part and 3 metal pins, as shown in Figure 1.In use, pin one 01 and pin one 03 are welded on a line of measuring temp. wire cable, pin one 02 are welded on another line of measuring temp. wire cable, then by injection machine, sensor chip are encapsulated in measuring temp. wire cable.The method complex technical process, needs a large amount of artificial during large-scale production, and still has some problems to need to solve:
(1) because traditional sensors chip adopts 3 pin encapsulation, it needs 101 when using, 103 pins are welded on the same line of cable, and 102 pins are welded on different cable, this technological process needs 101,103 pins and pin, complex technical process, and easily cause rosin joint, thus the quality problems such as cause loose contact, communication not smooth.
(2) traditional sensors chip adopts 3 pin encapsulation, distance between each pin is less, in use cable gas leakage can cause the intrusion of dust, steam, magazine, thus cause electric short circuit phenomenon, once single-point electric short circuit whole cable will can not use completely, this is another difficult problem perplexing a lot of measuring temp. wire cable factory.
(3) traditional sensors chip metal pin adopts tin plating technique, corrosion proof function need be possessed when association area is applied, such as, need in silo to carry out stifling insect protected with hydrogen phosphide, and hydrogen phosphide is easy to become acid in atmosphere, therefore be easy to sensor/sensor chip pin to corrode, thus occur the phenomenon of open circuit or short circuit.
Summary of the invention
The present invention is in order to solve the problem, there is provided a kind of temperature sensor chip with communication function of 2 pin, this sensor chip simplifies the processing step of traditional measuring temp. wire cable production run, reduces rosin joint probability, greatly reduce short circuit probability, and there is the characteristic of anti-acid corrosion.
The present invention adopts bipod packing forms, comprises plastic packaging packaging body part, and the 1st metal pin part and the 2nd metal pin part, achieve unibus communication and distributed temperature measuring function.
The present invention, by having the packing forms of the temperature sensor of communication function at present from 3 metal pin forms, is reduced to 2 metal pin forms, simplify traditional sensors use time and the complicacy of the technique such as pin, welding.
Plastic packaging packaging body part of the present invention is identical with the temperature sensor at present with communication function, after metal pin is reduced to 2 pin from 3 pin, lead pin pitch widens, and solves gas leakage in measuring temp. wire cable use procedure and causes the intrusion of dust, steam, magazine, thus cause the problem of electric short circuit.
Plastic packaging packaging body part of the present invention, for capsulation material, 1st metal pin part, for copper, iron, the silver alloy of electroplate, 2nd metal pin part, for copper, iron, the silver alloy of electroplate, there is superpower Corrosion Protection, solve sensor chip pin and easily caused the problem of electrical open, short circuit by acid corrosion.
The present invention adopts bipod to encapsulate, and saves material, reduces cost in chip manufacturing and encapsulation process.
Beneficial effect of the present invention is specifically: use of the present invention simplifies the processing step of relevant field of temperature measurement cable processing, greatly reduce the harm that the short circuit of temperature sensor chip pin causes temp measuring system, enhance the corrosion resistivity of temperature sensor chip greatly, save material simultaneously, reduce cost.This serves great impetus for this chip in the reliability of relevant thermometric industry, the further widespread use of stability.Applying of this chip will promote that the field such as grain feelings thermometric, brewing fermentation, flue-cured tobacco, Industry Control, monitoring of tools, indoor and outdoor temperature monitoring, fire safety is developed further, play an important role in national economy and informationized society.
Accompanying drawing explanation
The temperature sensor chip that Fig. 1 is traditional
Fig. 2 temperature sensor chip of the present invention
Fig. 3 conventional temperature sensor chip application circuit
Fig. 4 conventional temperature sensor chip cable application drawing
Fig. 5 temperature sensor chip application circuit of the present invention
Fig. 6 temperature sensor chip cable of the present invention application drawing
Embodiment
Below in conjunction with accompanying drawing and practical application, specific embodiment of the invention method is described further.Fig. 1 is conventional temperature sensor chip, is made up of plastic packaging packaging body part 104, first metal pin 101, second metal pin 102 and the 3rd metal pin 103.As shown in Figure 3, the first metal pin GND and the 3rd metal pin VDD is connected on the ground its application circuit simultaneously; One I/O 302 of the second metal pin DQ and CPU is connected; CPU is connected with pull-up MOSFET 304 by the 2nd I/O 301, and MOSFET 304 is connected with the second metal pin DQ of sensor chip again, forms strong pull-up circuit; The DQ of resistance R and sensor chip is connected to form weak pull-up circuit, and CPU is communicated with temperature sensor chip with DQ by pull-up circuit.Fig. 4 be conventional temperature sensor chip with measuring temp. wire cable weld sectional view, the first metal pin GND and the 3rd metal pin VDD is welded on the metal wire 401 of measuring temp. wire cable simultaneously; Second metal pin DQ is welded on the metal wire 402 of measuring temp. wire cable.From Fig. 3 and Fig. 4, when traditional temperature sensor chip is applied, because connecting line is more, cause complex process; Traditional temperature sensor chip lead pin pitch is less, and line is many, easily causes short circuit, and conventional temperature sensor chip, does not have corrosion-resistant treatments, when applying in grain depot, easily by acid corrosion.
Fig. 2 temperature sensor chip of the present invention, is made up of plastic packaging packaging body part 203, first metal pin 201 and the second metal pin 202.As shown in Figure 5, the first metal pin GND is connected on the ground its application circuit; One I/O 502 of the second metal pin DQ and CPU is connected; CPU is connected with pull-up MOSFET 504 by the 2nd I/O 501, and MOSFET 504 is connected with the second metal pin DQ of sensor chip again, forms strong pull-up circuit; The DQ of resistance R and sensor chip
Be connected to form weak pull-up circuit, CPU is communicated with temperature sensor chip with DQ by pull-up circuit.Fig. 6 be temperature sensor chip of the present invention with measuring temp. wire cable weld sectional view, the first metal pin GND is welded on the metal wire 601 of measuring temp. wire cable; Second metal pin DQ is welded on the metal wire 602 of measuring temp. wire cable.From Fig. 5 and Fig. 6, during temperature sensor chip application of the present invention, because connecting line is little, simplify cable manufacturing technique; Temperature sensor chip lead pin pitch of the present invention is comparatively large, and line is few, greatly reduces short-circuit risks, and temperature sensor chip of the present invention, has corrosion-resistant treatments, when applying in grain depot, more reliable and more stable.
The foregoing is only preferred embodiment of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.In some applications, weak pull-up resistance can be removed; In more simply applying, strong pull-up MOSFET can be removed.Within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. there is a temperature sensor chip for communication function, it is characterized in that, adopt bipod packing forms, comprise plastic packaging packaging body part the 203,1st metal pin part 201 and the 2nd metal pin part 202, achieve communication and temp sensing function.
2. requiring the described temperature sensor chip with communication function according to right 1, it is characterized in that, by there is the packing forms of the temperature sensor of communication function at present from 3 metal pin forms, being reduced to 2 metal pin forms.
3. the temperature sensor chip with communication function described in requiring according to right 1 and 2, it is characterized in that, described plastic packaging packaging body part is identical with the temperature sensor at present with communication function, and after metal pin is reduced to 2 pin from 3 pin, lead pin pitch widens.
4. the temperature sensor chip with communication function according to claim 1, it is characterized in that, described plastic packaging packaging body part 203, for capsulation material, 1st metal pin part 201, for surface has the strong alloy material of anti-corrosion function, the 2nd metal pin part 202, for surface has the strong alloy material of anti-corrosion function.
5. the temperature sensor chip with communication function according to claim 1 and 4, is characterized in that, the 1st metal pin part 201, can be the alloy material of electroplate, and the 2nd metal pin part 202 can be the alloy material of electroplate.
6. the temperature sensor chip with communication function according to claim 1 and 4, it is characterized in that, the 1st metal pin part 201, its alloy material can be copper, iron, silver alloy, 2nd metal pin part 202, its alloy material can be copper, iron, silver alloy.
7. the temperature sensor chip with communication function described in requiring according to right 1,2 and 3, is characterized in that, adopts 2 pin encapsulation, decrease when connecting external cable 3 pin packaged chips wherein 2 pin and be 1 pin and the manufacturing procedure of pin and welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410748522.XA CN104501981A (en) | 2014-12-10 | 2014-12-10 | Temperature sensor chip with communication function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410748522.XA CN104501981A (en) | 2014-12-10 | 2014-12-10 | Temperature sensor chip with communication function |
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| Publication Number | Publication Date |
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| CN104501981A true CN104501981A (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410748522.XA Pending CN104501981A (en) | 2014-12-10 | 2014-12-10 | Temperature sensor chip with communication function |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5899722A (en) * | 1981-05-07 | 1983-06-14 | ソニエ デュバル オ ショド ショファージ エス・デー・ウー・セー・セー（ソシエテ アノニム） | Temperature sensor |
| DE4439566A1 (en) * | 1994-11-05 | 1996-05-09 | Vdo Schindling | Temperature sensor for motor vehicle |
| CN1971223A (en) * | 2006-12-04 | 2007-05-30 | 济南格林谷安科技有限公司 | Temperature measuring cable |
| CN201213075Y (en) * | 2008-06-27 | 2009-03-25 | 中国铝业股份有限公司 | Electric cable having real-time temperature measuring function |
| CN201215513Y (en) * | 2008-05-28 | 2009-04-01 | 上海良友（集团）有限公司 | Temperature measuring electric cable |
| CN201741518U (en) * | 2010-06-03 | 2011-02-09 | 深圳市金石泰科技有限公司 | T0-92 and T0-92S encapsulation of NTC thermistor |
| CN202067586U (en) * | 2011-04-27 | 2011-12-07 | 东南大学 | Sealed cable for sensor |
-
2014
- 2014-12-10 CN CN201410748522.XA patent/CN104501981A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5899722A (en) * | 1981-05-07 | 1983-06-14 | ソニエ デュバル オ ショド ショファージ エス・デー・ウー・セー・セー（ソシエテ アノニム） | Temperature sensor |
| DE4439566A1 (en) * | 1994-11-05 | 1996-05-09 | Vdo Schindling | Temperature sensor for motor vehicle |
| CN1971223A (en) * | 2006-12-04 | 2007-05-30 | 济南格林谷安科技有限公司 | Temperature measuring cable |
| CN201215513Y (en) * | 2008-05-28 | 2009-04-01 | 上海良友（集团）有限公司 | Temperature measuring electric cable |
| CN201213075Y (en) * | 2008-06-27 | 2009-03-25 | 中国铝业股份有限公司 | Electric cable having real-time temperature measuring function |
| CN201741518U (en) * | 2010-06-03 | 2011-02-09 | 深圳市金石泰科技有限公司 | T0-92 and T0-92S encapsulation of NTC thermistor |
| CN202067586U (en) * | 2011-04-27 | 2011-12-07 | 东南大学 | Sealed cable for sensor |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Beijing 7Q Technology Co., Ltd. Document name: Notification of Publication and of Entering the Substantive Examination Stage of the Application for Invention |
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| CB02 | Change of applicant information |
Address after: Room 5, building 98, No. 102300 West Lake Road, Mentougou District, Beijing, China Applicant after: Beijing 7Q Technology Co., Ltd. Address before: 100029, A, block 69, mount, No. 202, Beichen West Road, Beijing, Chaoyang District Applicant before: Beijing 7Q Technology Co., Ltd. |
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| COR | Change of bibliographic data | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150408 |
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| WD01 | Invention patent application deemed withdrawn after publication |