CN202041316U - Transparent packaging thermistor temperature sensor - Google Patents
Transparent packaging thermistor temperature sensor Download PDFInfo
- Publication number
- CN202041316U CN202041316U CN2011200525923U CN201120052592U CN202041316U CN 202041316 U CN202041316 U CN 202041316U CN 2011200525923 U CN2011200525923 U CN 2011200525923U CN 201120052592 U CN201120052592 U CN 201120052592U CN 202041316 U CN202041316 U CN 202041316U
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- transparent
- temperature sensor
- sensitive chip
- packaging
- thermistor temperature
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Abstract
The utility model belongs to the technical field of temperature sensor, and particularly discloses a transparent packaging thermistor temperature sensor comprising a thermo-sensitive chip and a leading wire; the thermo-sensitive chip and the leading wire are electrically connected through a conductive connecting piece; and transparent insulated packaging layers packaged by transparent insulated weathering packaging material are arranged on the thermo-sensitive chip and the connecting part of the thermo-sensitive chip and the leading wire. The transparent packaging thermistor temperature sensor efficiently solves the disadvantages that certain visual quality defects and reliability hidden troubles are incapable of being directly observed, screened and eliminated through visualization (or microscope) caused by nontransparent packaging with deep color adopted in the traditional packaging technology, and the observation can be performed in detail through visualization or microscope through completely transparent package; therefore, the quality defects and reliability hidden troubles can be distinguished in time, and the high stability and the high reliability of the product can be ensured.
Description
Technical field
The utility model belongs to thermistor temperature sensor, particularly a kind of transparent enclosure thermistor temperature sensor.
Background technology
At present, thermistor and the temperature sensor of taking different packing forms to constitute are widely used in all temps detection, temperature compensation, temperature-control circuit, and it plays the central role that temperature variable is changed into required electronic signal in circuit.Because the sensitivity requirement of detecting temperature has proposed more and more higher requirement to NTC resistance, this just requires the high precision, highly reliable of NTC thermistor.High precision and highly reliable be complementary: high precision must will guarantee high stable, highly reliable, otherwise meaningless.
In the prior art,, be key subjects of electronic devices and components to the reliability screening of electronic devices and components, the rejecting of initial failure always.Because the encapsulation of existing thermistor temperature sensor takes opaque epoxy packages material (as: black, blueness, redness) to encapsulate always, as shown in Figure 1, thermistor temperature sensor comprises lead-in wire 1 and temperature-sensitive chip, but the temperature-sensitive chip is to place opaque epoxy packages material, therefore, it can not come out and reject by the vision Direct observation can be with the reliability hidden danger of visualization the time when there being some.For example: in the rosin joint of welding, the chips welding process owing to the chip cracks that thermal shock produces, install and use inherent vice that produces in the process or the like at element.
The utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of transparent enclosure thermistor temperature sensor is provided, this thermistor temperature sensor solves effectively that conventional package technology is taked dark opaque encapsulation and some the visual mass defects and the reliability hidden danger that cause can not directly be observed by visual (microscope), screening, the deficiency of rejecting, take complete transparent packing forms to observe in detail by visual or microscope, and then mass defect and reliability hidden danger screened timely, guarantee product higher stability and high reliability.
In order to overcome above-mentioned technical purpose, the utility model is realized by following technical scheme:
A kind of transparent enclosure thermistor temperature sensor described in the utility model, comprise temperature-sensitive chip and lead-in wire, described temperature-sensitive chip with the lead-in wire between be connected by conducting connecting part, described temperature-sensitive chip and with the lead-in wire junction be provided with the transparent insulation encapsulated layer that encapsulates by the weather-proof encapsulating material of transparent insulation.
As the further improvement of above-mentioned technology, described conducting connecting part is that metallic tin is made, and it mainly is by metallic tin temperature-sensitive chip and wire bonds to be in the same place.
As the further improvement of above-mentioned technology, the weather-proof encapsulating material of transparent insulation of described composition transparent insulation encapsulated layer is transparent epoxy resin, silicones or silica gel.
Compared with prior art, the beneficial effects of the utility model are:
The utility model is owing to take transparent packing forms fully, thereby can adopt visual or microscope is observed in detail to thermistor temperature sensor, and then, guarantee the high stability and the high reliability of product to the examination that mass defect and reliability hidden danger are necessary.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in detail:
Fig. 1 is the encapsulating structure synoptic diagram of expression thermistor temperature sensor in the prior art;
Fig. 2 is a thermistor temperature sensor structural representation in the utility model;
Fig. 3 is a thermistor temperature sensor technological process structural representation in the utility model.
Embodiment
As shown in Figure 2, a kind of transparent enclosure thermistor temperature sensor described in the utility model, comprise temperature-sensitive chip 2 and lead-in wire 1, described temperature-sensitive chip 2 is connected by conducting connecting part 3 between 1 with lead-in wire, described conducting connecting part is that metallic tin is made, and it mainly is by metallic tin temperature-sensitive chip and wire bonds to be in the same place.In addition, described temperature-sensitive chip 2 and with the lead-in wire 1 junction the periphery by the transparent insulation encapsulated layer 4 that the weather-proof encapsulating material of transparent insulation encapsulates, the weather-proof encapsulating material of transparent insulation of forming this transparent insulation encapsulated layer 4 is a transparent epoxy resin.
Below specify the technology manufacturing process of transparent enclosure thermally sensitive temperature sensor described in the utility model:
(1) preparation of temperature-sensitive chip and lead-in wire:
Wherein temperature-sensitive chip preparation: adopt compressing tablet one sintering one silver ink firing legal system to get disk type NTC thermistor chip, or one section one of static pressure such as employing one sintering is made square NTC thermistor chip by a silver-colored scribing method.
Lead preparation: lead is cut into the length that needs and strips the end of a thread, line tail.
(2) chip connects (intermediate plate one welding)
Utilize the power of holding that adds of lead-in wire that the temperature-sensitive chip is clamped, soak scaling powder then and immerse in the tin stove again and weld, the tin furnace temperature is: 230～280 ℃; Be weld interval: 1～5 second.
(3) transparent insulation weatherable materials encapsulation
The temperature-sensitive chip of the good lead-in wire of welding is immersed in the deployed weather-proof encapsulating material of transparent insulation, to the required shape of sealing.
(4) solidify
The element of the weather-proof encapsulating material of transparent insulation sealed is put into baking box, adopt the condition of cure of this material correspondence to be cured.
(5) microscope or the directly visual defective sieve that carries out
Adopting microscope that the transparent enclosure thermistor temperature sensor that is cured is carried out bad defective selects.The defective that rejecting may cause reliability to reduce, as: chip cracks that produces owing to thermal shock in the rosin joint of welding, the chips welding process or the like.
(6) encapsulation, testing, sorting
By required electric property the transparent enclosure thermistor temperature sensor is carried out the performance sorting, reject substandard product.
The utility model is owing to adopt transparent encapsulation material to encapsulate thermistor temperature sensor, so just make this thermistor temperature sensor to screen, to reject the hidden danger of initial failure to the reliability defective by the visual defective sieve that carries out of microscope.In case it can come out by the vision Direct observation can be with the reliability hidden danger of visualization the time some.As in the rosin joint, chips welding process of welding owing to the chip cracks that thermal shock produces, install and use inherent vice that produces in the process or the like at element.
In addition, test the front and back rate of change all less than ± 0.3% by the NTC thermistor that above-mentioned process is produced through 1000 circulations of thermal shock, high temperature ageing 1000 hours and high-temperature load, there are not cracking, micro-crack phenomenon, yet highly stable drift, the jumping phenomenon of not having of its resistance at abominable experiment condition NTC thermistor chips such as frequent thermal shocks with the lead-in wire junction.Compare low temperature is connected the NTC thermistor that technology produces not only qualification rate, reliability, quality has all had tangible lifting with existing technology.Following table is that the example that is not all of rate of change is illustrated before and after testing with the NTC thermistor temperature sensor of existing opaque encapsulation and transparent NTC thermistor temperature sensor of the present utility model:
As seen from the above table: the NTC thermistor temperature sensor of novel transparent encapsulation does not have cracking, micro-crack phenomenon at abominable experiment condition NTC thermistor chips such as frequent thermal shocks with the lead-in wire junction, also highly stable drift, the jumping phenomenon of not having of its resistance, reliability, stability improve greatly.
Claims (3)
1. transparent enclosure thermistor temperature sensor, comprise temperature-sensitive chip and lead-in wire, it is characterized in that: described temperature-sensitive chip with the lead-in wire between be connected by conducting connecting part, described temperature-sensitive chip and with the lead-in wire junction be provided with the transparent insulation encapsulated layer that encapsulates by the weather-proof encapsulating material of transparent insulation.
2. transparent enclosure thermistor temperature sensor according to claim 1 is characterized in that: described conducting connecting part is a metallic tin, and it is in the same place temperature-sensitive chip and wire bonds by metallic tin.
3. transparent enclosure thermistor temperature sensor according to claim 1 and 2 is characterized in that: the weather-proof encapsulating material of transparent insulation of described composition transparent insulation encapsulated layer is transparent epoxy resin, silicones or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200525923U CN202041316U (en) | 2011-03-02 | 2011-03-02 | Transparent packaging thermistor temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200525923U CN202041316U (en) | 2011-03-02 | 2011-03-02 | Transparent packaging thermistor temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202041316U true CN202041316U (en) | 2011-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200525923U Expired - Lifetime CN202041316U (en) | 2011-03-02 | 2011-03-02 | Transparent packaging thermistor temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202041316U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104006897A (en) * | 2014-06-12 | 2014-08-27 | 肇庆爱晟电子科技有限公司 | Fast-response thermosensitive temperature sensor and manufacturing method thereof |
| CN105258820A (en) * | 2015-11-05 | 2016-01-20 | 广东爱晟电子科技有限公司 | Manufacturing method of silicone resin packaged temperature sensor, and temperature sensor |
| CN105424210A (en) * | 2015-11-05 | 2016-03-23 | 广东爱晟电子科技有限公司 | High-sensitivity fluid temperature sensor and manufacturing method therefor |
| WO2017050000A1 (en) * | 2015-09-25 | 2017-03-30 | 株式会社村田制作所 | Electronic component assembly with leads and manufacturing method therefor |
| CN110736497A (en) * | 2018-07-20 | 2020-01-31 | 盛思锐汽车解决方案股份公司 | Sensor device with trackable markers |
-
2011
- 2011-03-02 CN CN2011200525923U patent/CN202041316U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104006897A (en) * | 2014-06-12 | 2014-08-27 | 肇庆爱晟电子科技有限公司 | Fast-response thermosensitive temperature sensor and manufacturing method thereof |
| WO2017050000A1 (en) * | 2015-09-25 | 2017-03-30 | 株式会社村田制作所 | Electronic component assembly with leads and manufacturing method therefor |
| US10176909B2 (en) | 2015-09-25 | 2019-01-08 | Murata Manufacturing Co., Ltd. | Electronic component module with leads and method for manufacturing the same |
| CN105258820A (en) * | 2015-11-05 | 2016-01-20 | 广东爱晟电子科技有限公司 | Manufacturing method of silicone resin packaged temperature sensor, and temperature sensor |
| CN105424210A (en) * | 2015-11-05 | 2016-03-23 | 广东爱晟电子科技有限公司 | High-sensitivity fluid temperature sensor and manufacturing method therefor |
| CN105424210B (en) * | 2015-11-05 | 2018-07-06 | 广东爱晟电子科技有限公司 | A kind of highly sensitive fluid temperature sensor and preparation method thereof |
| CN110736497A (en) * | 2018-07-20 | 2020-01-31 | 盛思锐汽车解决方案股份公司 | Sensor device with trackable markers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111116 |