CN102288321A - Glass sintered and packaged metal probe quick response temperature sensor and manufacturing method thereof - Google Patents
Glass sintered and packaged metal probe quick response temperature sensor and manufacturing method thereof Download PDFInfo
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- CN102288321A CN102288321A CN2011102074985A CN201110207498A CN102288321A CN 102288321 A CN102288321 A CN 102288321A CN 2011102074985 A CN2011102074985 A CN 2011102074985A CN 201110207498 A CN201110207498 A CN 201110207498A CN 102288321 A CN102288321 A CN 102288321A
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Abstract
The invention belongs to the technical field of temperature sensors, and in particular discloses a glass sintered and packaged metal probe quick response temperature sensor. The temperature sensor comprises a metal shell, at least one radial lead glass packaged negative temperature coefficient (NTC) thermistor, and low-temperature glass slurry filled between the metal shell and a chip of the glass packaged NTC thermistor. The invention also discloses a manufacturing method for the temperature sensor. The temperature sensor has a high response speed, the thermal time constant of the temperature sensor is only 1/10 of that of the conventional product, and the phenomena of drift and abrupt change can be avoided due to stable resistance; compared with the conventional process, the method has the advantage that: the yield, reliability and quality of the temperature sensor are obviously improved; in addition, the high-temperature resistance and moisture resistance of the temperature sensor are far superior to those of the conventional temperature sensor, and the mechanical strength of the temperature sensor is far higher than that of a pure glass packaged temperature sensor.
Description
Technical field
The invention belongs to the temperature sensor technical field, particularly a kind of glass sintering package metals quick response temperature sensor of popping one's head in.
Background technology
By NTC temperature-sensitive chip as core component, thermistor and the temperature sensor of taking different packing forms to constitute are widely used in all temps detection, temperature compensation, temperature-control circuit, and it plays the central role that temperature variable is changed into required electronic signal in circuit.
Along with development of electronic technology, further multifunction of various electronics and intellectuality, NTC temperature-sensitive chip variously need survey, control temperature, the application of occasion such as compensation increases day by day.
Because the sensitivity requirement of detecting temperature, the reaction velocity of NTC temperature sensor has been proposed more and more faster requirement, this just requires the thermal time constant of NTC temperature sensor as far as possible little, and it is fast that response speed is wanted.
Present NTC temperature sensor is generally taked:
(1) selects NTC temperature-sensitive chip 31 ' for use;
(2) in NTC temperature-sensitive Lead-on-Chip 32 ';
(3) NTC temperature-sensitive chip is sealed by outer insulation 33 ' formed NTC thermistor 3 ';
(4) NTC thermistor 2 is carried out resistivity measurement;
(5) NTC thermistor 3 ' is filled NTC temperature-sensitive chip 31 ' and outer insulation 33 ' embedding thereof by potting resin 2 ';
(6) embedding is solidified the back with potting resin 2 ' and form the NTC temperature sensor;
(7) the NTC temperature sensor is carried out resistivity measurement.
As from the foregoing, the NTC temperature sensor of prior art manufacturing:
(1) because temperature-sensitive chip 31 ' thickness is thicker, be generally 0.3～3mm, and the also thicker and poor thermal conductivity of outer layer insulation encapsulated layer 33 ' (being generally epoxy resin, phenolics, silicones) thickness;
(2) its coefficient of heat conductivity of the potting resin 33 ' between shell 1 ' (being made by materials such as metal, plastic cement, potteries usually) and temperature-sensitive chip 31 ' (being generally materials such as epoxy, phenolic aldehyde, silicones, heat conduction rule fat/glue) is not high.
This NTC temperature sensor heat in the temperature-sensitive process will transmit through which floor, just can be delivered to chip.Especially the potting resin 2 ' of filling between the shell 1 ' made of materials such as metal, plastic cement, pottery and the temperature-sensitive chip 31 ', its heat conductivility is not good, be unfavorable for that heat promptly arrives the core of temperature-sensitive chip 31 ', need the long time when reaching ambient temperature fully.
The thermal time constant of the NTC thermistor temperature sensor of this kind structure was generally 5～15 seconds.This reaction velocity can not satisfy the highly sensitive requirement that temperature is surveyed.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of glass sintering package metals quick response temperature sensor of popping one's head in is provided, this temperature sensor reaction velocity is fast, its thermal time constant only is 1/10 of an existing product, stable drift and the jumping phenomenon of not having of resistance, compare its qualification rate, reliability and stability with existing technology tangible lifting is all arranged, and high temperature resistant, the moisture-resistance of temperature sensor of the present invention be far superior to traditional temperature sensor, and its physical strength is higher than pure glass-encapsulated temperature sensor far away.
In order to overcome above-mentioned technical purpose, the present invention realizes by following technical scheme:
Of the present invention kind of glass sintering package metals quick response temperature sensor of popping one's head in, comprise metal shell, at least one radial lead glass envelope NTC thermistor, be filled in the low temperature glass slurry between the element of metal shell and radial lead glass envelope NTC thermistor.
As the further improvement of above-mentioned technology, described metal shell is made by the refractory metal material.
As the further improvement of above-mentioned technology, the softening point of described low temperature glass slurry is lower than the softening point of the glass outer clad of radial lead glass envelope NTC thermistor.
The method for making that the present invention also provides the glass sintering package metals to pop one's head in quick response temperature sensor the steps include:
(1) preparation metal shell;
(2) filling liquid low temperature glass slurry in metal shell;
(3) again at least one radial lead glass envelope NTC thermistor is built in the liquid low temperature glass slurry;
(4) liquid low temperature glass slurry is carried out glass sintering;
(5) resistivity measurement.
Compared with prior art, the invention has the beneficial effects as follows:
(1) the present invention takes built-in one or more radial lead glass envelope NTC thermistor in the thermostable heat-conductive metal shell, the slurry that the low temperature glass powder that adopts glass softening point to be lower than radial lead glass envelope NTC thermistor glass material is then made is filled, sinter low temperature glass into fine and close interstitital texture by glass sintering technology again, form high temperature resistant, humidity, glass-encapsulated temperature temperature sensor at last.Owing to adopt glass sintering technology, make that temperature sensor is high temperature resistant, good reliability, humidity salt fog superior performance, anti-aging.In addition, owing to adopt glass as encapsulating material, its coefficient of heat conductivity is higher than resin far away, so just make its response speed very soon, and its moisture-resistance is good.It can high temperature resistant 300-500 ℃.
And traditional resin-encapsulated temperature sensor adopts is resin-encapsulated technology, is low-temperature setting again after resin is filled, and it is the highest only to 200 ℃.
(2) the present invention is because the thermal conductivity of the glass-encapsulated material of refractory metal shell and filling is all very high, make that the required time of NTC thermistor temperature sensor heat conduction in the thermometric process is very short, thermal time constant is generally for 0.5～3～second, is 1/10th of conventional art.
(3) in addition, because the densified sintering product of packaged glass makes high temperature resistant, the moisture-resistance of temperature sensor of the present invention be far superior to traditional temperature sensor.
(4) temperature sensor of the present invention makes its physical strength be higher than pure glass-encapsulated temperature sensor far away because outermost shell is a metal material.
Description of drawings
Below in conjunction with the drawings and specific embodiments the present invention is described in detail:
Fig. 1 is the NTC arrangement of temperature sensor synoptic diagram of prior art;
Fig. 2 is the glass sintering package metals of the present invention quick response temperature sensor construction synoptic diagram of popping one's head in;
Fig. 3 is the glass sintering package metals of the present invention quick response temperature sensor production schematic flow sheet of popping one's head in.
Embodiment
As shown in Figure 2, the glass sintering package metals of the present invention quick response temperature sensor of popping one's head in, in order to overcome above-mentioned technical purpose, the present invention realizes by following technical scheme:
Of the present invention kind of glass sintering package metals quick response temperature sensor of popping one's head in, comprise metal shell 1, place the radial lead glass envelope NTC thermistor 3 of shell 1 inside, and be filled in the low temperature glass material 2 between the element of metal shell 1 and radial lead glass envelope NTC thermistor 3.
Described metal shell 1 is made by Dumet copper or kovar alloy or stainless steel alloy.
The softening point of described low temperature glass slurry 2 is lower than the softening point of the glass outer clad of radial lead glass envelope NTC thermistor 3.
The method for making that the present invention also provides the glass sintering package metals to pop one's head in quick response temperature sensor, as shown in Figure 3, its concrete steps are:
(1) preparation metal shell 1: adopt the refractory metal material (as: Dumet copper, kovar alloy, stainless steel alloy etc.) of expansion coefficient and extraordinary filling glass coupling, prepare Can by required size.
(2) filling liquid low temperature glass slurry 3 in metal shell 1;
(3) again at least one radial lead glass envelope NTC thermistor is built in the liquid low temperature glass slurry, because this moment, the low temperature glass slurry 3 also was in liquid state, its mobile can nature to fill up shell 1 gapped with the institute of radial lead glass envelope NTC thermistor 3 fullly.
(4) liquid low temperature glass slurry 2 is carried out glass sintering, sinter low temperature glass slurry 2 into fine and close interstitital texture by sintering process.
(5) test: the temperature sensor of making is carried out resistivity measurement.
Below by the pop one's head in thermal time constant contrast of quick response temperature sensor and existing epoxy encapsulation temperature sensor product of the glass sintering package metals of above-mentioned technology made:
Unit: second
By above form as can be known: the thermal time constant of traditional epoxy encapsulation temperature sensor is generally 5～15 seconds, and temperature sensor of the present invention only needs 0.5～1.5 second)
In addition, glass sintering package metals of the present invention is popped one's head in quick response temperature sensor through rate of change is all less than ± 0.3% before and after the serial reliability testing (1000 circulations of thermal shock, high temperature ageing 1000 hours and high-temperature load experiment), and specifically seeing the following form has the NTC thermistor heat detector of conventional resins encapsulation now
With the glass sintering package metals of the present invention quick response temperature sensor (glass sintering encapsulation metal probe NTC thermistor temperature sensor) of popping one's head in.
As seen from the above table: the pop one's head in resistance stability of quick response temperature sensor of glass sintering package metals of the present invention is good, does not have drift, jumping phenomenon.Compare with existing technology, the glass sintering package metals of the present invention quick response temperature sensor qualification rate height of popping one's head in, good reliability, quality is good.
The present invention is not limited to above-mentioned embodiment, every various changes of the present invention or modification are not broken away from the spirit and scope of the present invention, if these are changed and modification belongs within claim of the present invention and the equivalent technologies scope, then the present invention also means and comprises these changes and modification.
Claims (4)
1. a glass sintering package metals quick response temperature sensor of popping one's head in, it is characterized in that: comprise metal shell, at least one radial lead glass envelope NTC thermistor, be filled in the low temperature glass slurry between the chip of metal shell and glass envelope NTC thermistor.
2. the glass sintering package metals according to claim 1 quick response temperature sensor of popping one's head in, it is characterized in that: described metal shell is made by the refractory metal material.
3. the glass sintering package metals according to claim 1 and 2 quick response temperature sensor of popping one's head in is characterized in that: the softening point of described low temperature glass slurry is lower than the softening point of the glass outer clad of radial lead glass envelope NTC thermistor.
4. the pop one's head in method for making of quick response temperature sensor of glass sintering package metals according to claim 1 the steps include:
(1) preparation metal shell;
(2) in metal shell, fill the low temperature glass slurry;
(3) again at least one radial lead glass envelope NTC thermistor is built in the liquid low temperature glass slurry;
(4) liquid low temperature glass slurry is carried out glass sintering;
(5) electric performance test.
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| CN2011102074985A CN102288321A (en) | 2011-07-22 | 2011-07-22 | Glass sintered and packaged metal probe quick response temperature sensor and manufacturing method thereof |
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| CN2011102074985A CN102288321A (en) | 2011-07-22 | 2011-07-22 | Glass sintered and packaged metal probe quick response temperature sensor and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620854A (en) * | 2012-03-19 | 2012-08-01 | 陈建平 | Temperature sensor |
| CN103454007A (en) * | 2013-08-26 | 2013-12-18 | 安徽蓝德集团股份有限公司 | Junction box inner portion thermosensitive element |
| CN103542437A (en) * | 2013-10-31 | 2014-01-29 | 合肥荣事达三洋电器股份有限公司 | Idle load prevention microwave oven and idle load detection method thereof |
| CN103557889A (en) * | 2013-11-14 | 2014-02-05 | 无锡信大气象传感网科技有限公司 | Device for improving response speed of temperature and humidity sensor |
| CN104535215A (en) * | 2014-12-02 | 2015-04-22 | 苏州长风航空电子有限公司 | Method for manufacturing platinum resistor thermo-sensitive element |
| CN105300549A (en) * | 2015-11-05 | 2016-02-03 | 广东爱晟电子科技有限公司 | Surface contact type fast response temperature sensor and manufacture method |
| CN110220616A (en) * | 2019-06-26 | 2019-09-10 | 兴勤（宜昌）电子有限公司 | A kind of glass-encapsulated temperature sensor and its manufacturing method |
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| CN102052972A (en) * | 2010-11-02 | 2011-05-11 | 肇庆爱晟电子科技有限公司 | Rapid reaction NTC (Negative Temperature Coefficient) temperature sensor and manufacturing method thereof |
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| EP1227308A1 (en) * | 2001-01-26 | 2002-07-31 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
| CN2795837Y (en) * | 2003-05-02 | 2006-07-12 | 日本特殊陶业株式会社 | Temperature sensor |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620854A (en) * | 2012-03-19 | 2012-08-01 | 陈建平 | Temperature sensor |
| CN103454007A (en) * | 2013-08-26 | 2013-12-18 | 安徽蓝德集团股份有限公司 | Junction box inner portion thermosensitive element |
| CN103542437A (en) * | 2013-10-31 | 2014-01-29 | 合肥荣事达三洋电器股份有限公司 | Idle load prevention microwave oven and idle load detection method thereof |
| CN103542437B (en) * | 2013-10-31 | 2016-03-23 | 惠而浦（中国）股份有限公司 | A kind of preventing idle load micro-wave oven and detection method thereof |
| CN103557889A (en) * | 2013-11-14 | 2014-02-05 | 无锡信大气象传感网科技有限公司 | Device for improving response speed of temperature and humidity sensor |
| CN104535215A (en) * | 2014-12-02 | 2015-04-22 | 苏州长风航空电子有限公司 | Method for manufacturing platinum resistor thermo-sensitive element |
| CN105300549A (en) * | 2015-11-05 | 2016-02-03 | 广东爱晟电子科技有限公司 | Surface contact type fast response temperature sensor and manufacture method |
| CN105300549B (en) * | 2015-11-05 | 2018-06-01 | 广东爱晟电子科技有限公司 | A kind of surface contact quick response temperature sensor and preparation method thereof |
| CN110220616A (en) * | 2019-06-26 | 2019-09-10 | 兴勤（宜昌）电子有限公司 | A kind of glass-encapsulated temperature sensor and its manufacturing method |
| CN110220616B (en) * | 2019-06-26 | 2021-02-09 | 兴勤（宜昌）电子有限公司 | Glass packaged temperature sensor and manufacturing method thereof |
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Application publication date: 20111221 |