CN106225945A - A kind of waterproof and dampproof temperature sensor and preparation method thereof - Google Patents
A kind of waterproof and dampproof temperature sensor and preparation method thereof Download PDFInfo
- Publication number
- CN106225945A CN106225945A CN201610595884.9A CN201610595884A CN106225945A CN 106225945 A CN106225945 A CN 106225945A CN 201610595884 A CN201610595884 A CN 201610595884A CN 106225945 A CN106225945 A CN 106225945A
- Authority
- CN
- China
- Prior art keywords
- temperature sensor
- critesistor
- waterproof
- electric wire
- dampproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a kind of waterproof and dampproof temperature sensor and preparation method thereof, described waterproof and dampproof temperature sensor includes housing, at least one critesistor of being arranged in housing, the electric wire that is connected to critesistor；Described critesistor outer encapsulating has the first encapsulated layer, its cladding critesistor and critesistor and the junction of electric wire；Between described housing and critesistor, embedding has embedding layer；Described electric wire exposes to the afterbody of housing and is encapsulated with the second encapsulated layer, and exposes the core of electric wire.The gap of described temperature sensor is all filled with waterproof layer.Relative to prior art, the present invention is encapsulated with the second encapsulated layer at afterbody, prevent moisture from entering into inside temperature sensor from afterbody, and take the mode of circulation pressurization decompression to carry out the oil pressure of cell breath, between making oil well into each gap of temperature sensor, isolation moisture enters inside temperature sensor, and waterproof and dampproof performance is good, and temperature sensor resistance stability is good, reliability is high.
Description
Technical field
The invention belongs to technical field of electronic components, particularly relate to a kind of waterproof and dampproof temperature sensor and preparation side thereof
Method.
Background technology
By heat sensitive chip as core component, take critesistor that different packing forms constitutes and temperature sensor wide
General being applied to various temperature sensing, temperature-compensating, temperature-control circuit, it plays in circuit and the variable of temperature is converted into institute
The central role of the electronic signal needed.Along with the development of electronic technology, the further multifunction of various electronic devices and intellectuality,
Heat sensitive chip various needing temperature is detected, control, the application of the occasion such as compensation increases day by day.Due to temperature sensor
There are requirements of one's work in wet environment, more and more higher to requirement waterproof, moistureproof, it is therefore desirable to strengthen the encapsulation of temperature sensor
Sealing and waterproof and dampproof performance.
Current temperature sensor includes the heat sensitive chip being arranged in housing, and heat sensitive chip is provided with two groups of lead-in wires,
Described lead-in wire epoxy encapsulating material is encapsulated, and embedding PGL in described housing is used for solidifying heat sensitive chip.Prior art system
The temperature sensor protection against the tide wetting resistance made is poor, is not suitable in moist environmental applications.The encapsulating material of temperature sensor and lead-in wire
Causing short texture in conjunction with bad, in water or in high humidity environment, moisture is first into the seam between lead-in wire and encapsulated layer
Gap, then step into heat sensitive chip, when heat sensitive chip core has moisture, resistance there will be decline or labile state, leads
Cause temperature sensor cisco unity malfunction, occur abnormal.It is waterproof that the sensor of this structure can not meet temperature sensing
Requirement, and lower work in water or in high humidity environment, reliability does not reaches requirement.
Summary of the invention
It is an object of the invention to overcome shortcoming and defect of the prior art, it is provided that a kind of waterproof and dampproof temperature sensor
And preparation method thereof, described temperature sensor is waterproof, humidity resistance good, and resistance stably will not occur instability or jumping phenomenon,
And there is higher mechanical strength.
The present invention is achieved by the following technical solutions: a kind of waterproof and dampproof temperature sensor, including housing, is arranged at
At least one critesistor in housing, it is connected to the electric wire of critesistor；Described critesistor outer encapsulating has the first encapsulating
Layer, its cladding critesistor and critesistor and the junction of electric wire；Between described housing and critesistor, embedding has embedding
Layer；Described electric wire exposes to the afterbody of housing and is encapsulated with the second encapsulated layer, and exposes the core of electric wire.
Relative to prior art, the waterproof and dampproof temperature sensor of the present invention, it is encapsulated with the second encapsulated layer at afterbody, prevents
Moisture enters into inside temperature sensor from afterbody, and isolation moisture enters inside temperature sensor, and waterproof and dampproof performance is good, temperature
Resistance of sensor good stability, reliability are high.
Further, described first encapsulated layer, embedding layer and the second encapsulated layer are respectively and between critesistor and electric wire
Gap is all filled with waterproof layer.
Further, described first encapsulated layer, embedding layer and the second encapsulated layer are in epoxy resin, phenolic resin or silicones
Any one.
Further, described waterproof layer is oil.
Further, described critesistor includes heat sensitive chip and is arranged in heat sensitive chip for connecting drawing of electric wire
Foot；Described critesistor is welded to connect with described electric wire by pin.
Further, described heat sensitive chip is NTC heat sensitive chip.
Present invention also offers the preparation method of a kind of waterproof and dampproof temperature sensor, comprise the following steps:
(1) critesistor is welded to connect with electric wire, then encapsulates encapsulating material, critesistor and pad are wrapped up close
Envelope, and carry out high temperature sintering；
(2) critesistor encapsulated is placed in housing, and exposes electric wire, be molded between critesistor and housing
Or embedding potting compound carry out high temperature sintering；
(3) afterbody exposing to the electric wire of housing is encapsulated encapsulating material, expose the core of electric wire, and encapsulating material is entered
Row high temperature sintering；
(4) temperature sensor prepared in step (3) is placed in the compression pump of oil, takes circulation pressurization decompression
Mode carry out the oil pressure of cell breath, between making oil well into each gap of temperature sensor.
The preparation method of the waterproof and dampproof temperature sensor of the present invention, is encapsulated with the second encapsulated layer at afterbody, prevents moisture
Enter into inside temperature sensor from afterbody；And temperature sensor is placed in the compression pump of oil, take circulation pressurization decompression
Mode carry out the oil pressure of cell breath, between making oil well into each gap of temperature sensor, isolation moisture enters temperature
Degree sensor internal, waterproof and dampproof performance is good, and temperature sensor resistance stability is good, reliability is high.
Further, any one during described encapsulating material and potting compound are respectively epoxy resin, phenolic resin or silicones.
Further, the preparation method of described critesistor: after pin is set in heat sensitive chip, encapsulate temperature-sensitive with encapsulating material
Chip and pin, and expose pin end, it is used for connecting electric wire.
Further, described heat sensitive chip is NTC heat sensitive chip.
In order to be more fully understood that and implement, describe the present invention below in conjunction with the accompanying drawings in detail.
Accompanying drawing explanation
Fig. 1 is the section of structure of the waterproof and dampproof temperature sensor of the present invention.
Fig. 2 is the structural representation of the waterproof and dampproof temperature sensor of the present invention.
Fig. 3 is the operation chart of the waterproof and dampproof temperature sensor preparation process (4) of the present invention.
Detailed description of the invention
Referring to Fig. 1, Fig. 2, it is the profile of waterproof and dampproof temperature sensor and the structural representation of the present invention respectively.
Described waterproof and dampproof temperature sensor 1 includes housing 2, be arranged in housing 2 at least one critesistor 3, it is connected to temperature-sensitive
Electric wire 4, first encapsulated layer 5 of resistance 3, embedding layer 6 and the second encapsulated layer 7.Described critesistor 3 and electric wire 4 company of welding
Connecing, described first encapsulated layer 5 is by critesistor 3 and pad environmental sealing.The embedding of described embedding layer 6 is in housing 2 and temperature-sensitive electricity
Between resistance 3.Described second encapsulated layer 7 is encapsulated in electric wire 4 and exposes to the afterbody of housing 2, and exposes the core of electric wire 4.Institute
State the first encapsulated layer 5, embedding layer 6 and second encapsulated layer 7 gap filling respectively and between critesistor 3 and electric wire 4 and have anti-
Water layer.
Described housing 2 is made for high temperature resistant material, such as materials such as metal, plastic cement, potteries, but is not limited to this, and housing 2 can
To protect critesistor.Described critesistor 3 includes heat sensitive chip and is arranged in heat sensitive chip for connecting drawing of electric wire
Foot.Described critesistor 3 is welded to connect with described electric wire 4 by pin.
In the present embodiment, described first encapsulated layer 5, embedding layer 6 and the second encapsulated layer 7 can be selected for epoxy resin, phenolic aldehyde
Any one in resin or silicones, also can be selected for other waterproof sealing insulant.Described waterproof layer can be selected for oil etc. to be prevented
Water substance.
The preparation method of waterproof and dampproof temperature sensor 1 of the present invention is as follows:
(1) critesistor 3 is welded to connect with electric wire 4, then encapsulates encapsulating material, critesistor and pad are wrapped up
Seal, and carry out high temperature sintering；The first encapsulated layer 5 is formed after described encapsulating material solidification sintering；Wherein, described critesistor 3
Preparation method is as follows: after arranging pin in heat sensitive chip, encapsulates heat sensitive chip and pin with encapsulating material, and exposes leads ends
Portion, is used for connecting electric wire；In the present embodiment, described heat sensitive chip is NTC heat sensitive chip；
(2) critesistor 3 encapsulated is placed in housing 2, and exposes electric wire 4, critesistor 3 and housing 2 it
Between injection or embedding potting compound carry out high temperature sintering；Described potting compound solidification sintering after between critesistor 3 and housing 2 shape
Become embedding layer 6；
(3) afterbody exposing to the electric wire 4 of housing 2 is encapsulated encapsulating material, expose the core of electric wire 4, and to encapsulating
Material carries out high temperature sintering；The second encapsulated layer 7 is formed after described encapsulating material solidification sintering；
(4) temperature sensor 1 prepared in step (3) is placed in the compression pump 8 of oil 81, carries out cell breath
Oil pressure；Referring to Fig. 3, it is the operation chart of step (4).First compression pump is carried out a period of time of pressurizeing, subtract the most again
Pressure a period of time, move in circles.By the oil pressure of the cell breath of step (4), make oil well into the first encapsulated layer 5, filling
Inside gap between sealing 6 and the second encapsulated layer 7, make all gaps of temperature sensor are full of oil, it is to avoid moisture enters
Temperature sensor, thus obtain waterproof and dampproof temperature sensor.
The waterproof and dampproof temperature sensor prepared by described preparation method is through reliability testing (thermal shock
1000 circulations, 100 DEG C of decocting in water 1000 hours, high temperature and high pressure steam 1000 hours and the experiment in 1000 hours of 0.4MPa hydraulic pressure),
Before and after its test, each performance parameter variations rate is respectively less than ± 3%, is specifically shown in table 1 below.As shown in Table 1, of the present invention waterproof
The resistance stability of moistureproof temperature sensor is good, will not drift about, suddenlys change, the phenomenon such as resistance decrease, compared with prior art,
The waterproof and dampproof temperature sensor qualification rate of the present invention is high, good reliability.
Performance change (15 groups of samples) before and after table 1 present invention waterproof and dampproof temperature sensor reliability testing
Relative to prior art, the waterproof and dampproof temperature sensor of the present invention, it is encapsulated with the second encapsulated layer at afterbody, prevents
Moisture enters into inside temperature sensor from afterbody；And temperature sensor is placed in the compression pump of oil, take circulation pressurization
The mode of decompression carries out the oil pressure of cell breath, and between making oil well into each gap of temperature sensor, isolation moisture enters
Entering inside temperature sensor, waterproof and dampproof performance is good, and temperature sensor resistance stability is good, reliability is high.
The invention is not limited in above-mentioned embodiment, if various changes or deformation to the present invention are without departing from the present invention
Spirit and scope, if these are changed and within the scope of deformation belongs to claim and the equivalent technologies of the present invention, then this
Bright being also intended to comprises these changes and deformation.
Claims (10)
1. a waterproof and dampproof temperature sensor, at least one critesistor including housing, being arranged in housing, is connected to heat
The electric wire of quick resistance, it is characterised in that: described critesistor outer encapsulating has the first encapsulated layer, its cladding critesistor and temperature-sensitive
Resistance and the junction of electric wire；Between described housing and critesistor, embedding has embedding layer；Described electric wire exposes to housing
Afterbody be encapsulated with the second encapsulated layer, and expose the core of electric wire.
Waterproof and dampproof temperature sensor the most according to claim 1, it is characterised in that: described first encapsulated layer, embedding layer
And second encapsulated layer gap respectively and between critesistor and electric wire be all filled with waterproof layer.
Waterproof and dampproof temperature sensor the most according to claim 1 and 2, it is characterised in that: described first encapsulated layer, embedding
Layer and the second encapsulated layer are any one in epoxy resin, phenolic resin or silicones.
Waterproof and dampproof temperature sensor the most according to claim 2, it is characterised in that: described waterproof layer is oil.
Waterproof and dampproof temperature sensor the most according to claim 1, it is characterised in that: described critesistor includes temperature-sensitive core
Sheet and be arranged in heat sensitive chip the pin for connecting electric wire；Described critesistor is welded with described electric wire by pin
Connect.
Waterproof and dampproof temperature sensor the most according to claim 5, it is characterised in that: described heat sensitive chip is NTC temperature-sensitive
Chip.
7. the preparation method of a waterproof and dampproof temperature sensor, it is characterised in that: comprise the following steps:
(1) critesistor is welded to connect with electric wire, then encapsulates encapsulating material, by critesistor and pad environmental sealing,
And carry out high temperature sintering；
(2) critesistor encapsulated is placed in housing, and exposes electric wire, be molded between critesistor and housing or fill
Envelope potting compound also carries out high temperature sintering；
(3) afterbody exposing to the electric wire of housing is encapsulated encapsulating material, expose the core of electric wire, and encapsulating material is carried out height
Temperature sintering；
(4) temperature sensor prepared in step (3) is placed in the compression pump of oil, takes the side of circulation pressurization decompression
Formula carries out the oil pressure of cell breath, between making oil well into each gap of temperature sensor.
The preparation method of waterproof and dampproof temperature sensor the most according to claim 7, it is characterised in that: described encapsulating material and
Potting compound is respectively any one in epoxy resin, phenolic resin or silicones.
The preparation method of waterproof and dampproof temperature sensor the most according to claim 7, it is characterised in that: described critesistor
Preparation method: after arranging pin in heat sensitive chip, by encapsulating material encapsulating heat sensitive chip and pin, and expose pin end,
For connecting electric wire.
The preparation method of waterproof and dampproof temperature sensor the most according to claim 9, it is characterised in that: described temperature-sensitive core
Sheet is NTC heat sensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610595884.9A CN106225945B (en) | 2016-07-26 | 2016-07-26 | A kind of waterproof and dampproof temperature sensor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610595884.9A CN106225945B (en) | 2016-07-26 | 2016-07-26 | A kind of waterproof and dampproof temperature sensor and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106225945A true CN106225945A (en) | 2016-12-14 |
| CN106225945B CN106225945B (en) | 2018-10-09 |
Family
ID=57533000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610595884.9A Active CN106225945B (en) | 2016-07-26 | 2016-07-26 | A kind of waterproof and dampproof temperature sensor and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106225945B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110088587A (en) * | 2016-12-20 | 2019-08-02 | 株式会社电装 | Semiconductor device and its manufacturing method |
| CN111174821A (en) * | 2019-11-28 | 2020-05-19 | 北京宇航系统工程研究所 | Temperature and humidity sensor and monitoring system for carrier rocket |
| WO2021255005A1 (en) * | 2020-06-17 | 2021-12-23 | Tdk Electronics Ag | Sensor with housing and silicone resin filler |
| CN114166805A (en) * | 2021-11-03 | 2022-03-11 | 格力电器（合肥）有限公司 | NTC temperature sensor detection method and device, NTC temperature sensor and manufacturing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216003A (en) * | 1999-01-22 | 2000-08-04 | Murata Mfg Co Ltd | Ntc thermistor |
| CN202048997U (en) * | 2011-05-09 | 2011-11-23 | 肇庆爱晟电子科技有限公司 | Water-proof anti-aging high-reliability temperature sensor |
| CN102636284A (en) * | 2012-05-14 | 2012-08-15 | 花国樑 | NTC (negative temperature coefficient) surface temperature-measuring temperature sensor |
| CN102680127A (en) * | 2012-06-04 | 2012-09-19 | 句容市博远电子有限公司 | Negative temperature coefficient (NTC) temperature sensor |
| CN202710202U (en) * | 2012-06-29 | 2013-01-30 | 广东风华高新科技股份有限公司 | Sensor with strong waterproofness |
| CN103398795A (en) * | 2013-08-14 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Water-proof and damp-proof temperature sensor |
| CN204788688U (en) * | 2015-07-21 | 2015-11-18 | 孝感华工高理电子有限公司 | Temperature sensor for refrigerator |
-
2016
- 2016-07-26 CN CN201610595884.9A patent/CN106225945B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000216003A (en) * | 1999-01-22 | 2000-08-04 | Murata Mfg Co Ltd | Ntc thermistor |
| CN202048997U (en) * | 2011-05-09 | 2011-11-23 | 肇庆爱晟电子科技有限公司 | Water-proof anti-aging high-reliability temperature sensor |
| CN102636284A (en) * | 2012-05-14 | 2012-08-15 | 花国樑 | NTC (negative temperature coefficient) surface temperature-measuring temperature sensor |
| CN102680127A (en) * | 2012-06-04 | 2012-09-19 | 句容市博远电子有限公司 | Negative temperature coefficient (NTC) temperature sensor |
| CN202710202U (en) * | 2012-06-29 | 2013-01-30 | 广东风华高新科技股份有限公司 | Sensor with strong waterproofness |
| CN103398795A (en) * | 2013-08-14 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Water-proof and damp-proof temperature sensor |
| CN204788688U (en) * | 2015-07-21 | 2015-11-18 | 孝感华工高理电子有限公司 | Temperature sensor for refrigerator |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110088587A (en) * | 2016-12-20 | 2019-08-02 | 株式会社电装 | Semiconductor device and its manufacturing method |
| CN111174821A (en) * | 2019-11-28 | 2020-05-19 | 北京宇航系统工程研究所 | Temperature and humidity sensor and monitoring system for carrier rocket |
| WO2021255005A1 (en) * | 2020-06-17 | 2021-12-23 | Tdk Electronics Ag | Sensor with housing and silicone resin filler |
| CN114364949A (en) * | 2020-06-17 | 2022-04-15 | Tdk电子股份有限公司 | Sensor with housing and silicone filling |
| CN114166805A (en) * | 2021-11-03 | 2022-03-11 | 格力电器（合肥）有限公司 | NTC temperature sensor detection method and device, NTC temperature sensor and manufacturing method |
| CN114166805B (en) * | 2021-11-03 | 2024-01-30 | 格力电器（合肥）有限公司 | NTC temperature sensor detection method and device, NTC temperature sensor and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106225945B (en) | 2018-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106225945A (en) | A kind of waterproof and dampproof temperature sensor and preparation method thereof | |
| CN102749159B (en) | There is the sensor component sealing structure | |
| CN104681500B (en) | physical quantity measuring sensor | |
| CN103855104B (en) | Semiconductor module to moisture seal and the method for its manufacture | |
| CN102486425B (en) | Pressure transducer and assemble method thereof | |
| CN103398795B (en) | A kind of waterproof and dampproof temperature sensor | |
| US11355423B2 (en) | Bottom package exposed die MEMS pressure sensor integrated circuit package design | |
| CN105731354B (en) | Wafer-class encapsulation and corresponding manufacturing process for MEMS sensor device | |
| US8049290B2 (en) | Integrated circuit package | |
| CN102009946A (en) | Method for manufacturing component including micro-structured or nano-structured element | |
| CN106092233B (en) | Flow sensor and its manufacturing method | |
| CN105609490B (en) | A kind of encapsulating structure and its manufacturing method of compound sensor module | |
| CN107180796A (en) | Sealing for semiconductor packages | |
| CN104319266B (en) | The sealant sealing assembling structure and glue encapsulation method of auto electronic element | |
| CN105424210B (en) | A kind of highly sensitive fluid temperature sensor and preparation method thereof | |
| CN104422558A (en) | Die edge protection for pressure sensor packages | |
| US10347569B2 (en) | Leadframe package with stable extended leads | |
| CN102593090A (en) | Lead frame package with die arranged on pedestal for lead isolation | |
| US20170033034A1 (en) | Electronic device and package | |
| US7737544B2 (en) | Sensor system having a substrate and a housing, and method for manufacturing a sensor system | |
| CN105609472B (en) | The encapsulating structure and its manufacture method of pressure sensor | |
| CN104931112B (en) | Sensor | |
| WO2021109303A1 (en) | Waterproof and dustproof pressure sensor and processing method therefor | |
| CN105489568B (en) | Flip chip and flip chip's flip-chip packaging structure | |
| CN104465588B (en) | Semiconductor package part with stress release and radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170224 Address after: 526020 Guangdong Province, Zhaoqing city Duanzhou District Mu Gang Industrial Zone of Tangxia town Applicant after: Zhaoqing AI Sheng Sensor Technology Co Ltd Address before: 526020 Guangdong Province, Zhaoqing city Duanzhou District Mu Gang Industrial Zone of Tangxia town Applicant before: GUANGDONG AISHENG ELECTRONIC TECHNOLOGY CO., LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |