WO2021109303A1 - Waterproof and dustproof pressure sensor and processing method therefor - Google Patents
Waterproof and dustproof pressure sensor and processing method therefor Download PDFInfo
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- WO2021109303A1 WO2021109303A1 PCT/CN2019/130236 CN2019130236W WO2021109303A1 WO 2021109303 A1 WO2021109303 A1 WO 2021109303A1 CN 2019130236 W CN2019130236 W CN 2019130236W WO 2021109303 A1 WO2021109303 A1 WO 2021109303A1
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- chip
- substrate
- sensitive area
- waterproof
- pressure sensor
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
Definitions
- the present invention relates to the technical field of pressure sensors, and more specifically, to a water- and dust-proof pressure sensor and a processing method thereof.
- the waterproof air pressure sensor is a device used to measure the ambient air pressure.
- the air pressure value is used to calculate the altitude, so it is widely used in consumer electronic terminals.
- the current waterproof air pressure sensors are all realized by pouring silicone gel inside the product. Although it can achieve the waterproof function, the silica gel is easily contaminated with foreign objects and affects the product performance; and in order to reduce the process difficulty, the size of the product is relatively large.
- one of the objectives of the present invention is to provide a waterproof and dustproof pressure sensor.
- the use of this waterproof and dustproof pressure sensor can solve the problem that the waterproof function is realized by filling silica gel inside the packaging structure in the prior art, but the silica gel is easily contaminated. Foreign matter, which can cause problems such as affecting product performance.
- the present invention provides a water-proof and dust-proof pressure sensor, which includes a package structure formed by a housing and a substrate.
- a chip is arranged inside the package structure, and the chip is fixed on the substrate and is electrically connected to the substrate.
- the housing includes a plastic packaging structure and a chip sensitive area protective film; wherein the plastic packaging structure is arranged around the chip, and the sensitive area of the chip is arranged outside the plastic packaging structure, and the bottom end of the plastic packaging structure is fixed at On the substrate; the chip sensitive area protective film is arranged at the upper end of the sensitive area of the chip, and the end of the chip sensitive area protective film is hermetically connected with the plastic packaging structure.
- thermosetting connection layer is provided at the end of the protective film in the sensitive area of the chip; wherein the bottom end of the thermosetting connection layer is fixed on the chip; The top end is hermetically connected with the plastic sealing structure.
- a preferred solution is that the chip is fixed in the middle of the substrate, the sensitive area of the chip is located in the middle of the top of the chip, and the plastic encapsulation structure is symmetrically arranged on the center perpendicular to the substrate. Around the chip.
- the chip is fixed in the middle of the substrate by a patch glue.
- the chip is electrically connected to the substrate through a metal wire, and the metal wire is arranged inside the plastic packaging structure.
- the material of the plastic packaging structure is an epoxy plastic packaging compound.
- the protective film for the sensitive area of the chip is a polytetrafluoroethylene film.
- a preferred solution is that the bottom end of the plastic encapsulation structure is fixed on the substrate by an adhesive, wherein the adhesive is silver paste, solder paste, or epoxy glue.
- the substrate is a BT resin substrate or a ceramic substrate.
- Another object of the present invention is to provide a method for processing a water- and dust-proof pressure sensor as described above.
- the processing method includes the following steps:
- the housing of the waterproof and dustproof pressure sensor and its processing method provided by the present invention includes a plastic encapsulation structure and a chip sensitive area protective film.
- the chip sensitive area protective film can effectively protect the sensitive area of the chip and avoid foreign matter. In the sensitive area of the chip, the sensitivity of the chip is reduced, which affects the performance of the product.
- the plastic packaging structure can effectively protect the electrical connection between the chip and the substrate, ensuring that the product can achieve high reliability and high-level waterproof and dustproof effects.
- Fig. 1 is a schematic structural diagram of a waterproof and dustproof pressure sensor according to an embodiment of the present invention
- Fig. 2 is a schematic top view of the structure of a water- and dust-proof pressure sensor according to an embodiment of the present invention
- 3 to 5 are schematic diagrams of the processing process of a waterproof and dustproof pressure sensor according to an embodiment of the present invention.
- the reference signs include: 11-plastic packaging structure, 12-chip sensitive area protective film, 121-thermosetting connection layer, 2-substrate, 3-chip, 4-metal wire, 5-chip adhesive.
- Fig. 1 shows the structure of a waterproof and dustproof pressure sensor according to an embodiment of the present invention.
- a water-proof and dust-proof pressure sensor includes a package structure formed by a housing and a substrate 2.
- a chip 3 is arranged inside the package structure.
- the chip 3 is fixed on the substrate 2 and is electrically connected to the substrate 2.
- the housing includes a plastic packaging structure 11 and a chip sensitive area protection film 12; wherein the plastic packaging structure 11 is arranged around the chip 3, and the sensitive area of the chip 3 is arranged outside the plastic packaging structure 11, and the bottom end of the plastic packaging structure 11 is fixed on the substrate 2;
- the sensitive area protection film 12 is arranged on the upper end of the sensitive area of the chip 3, and the end of the chip sensitive area protection film 12 is hermetically connected with the plastic packaging structure 11.
- the chip 3 can be a separate chip.
- the chip 3 includes two separate ASIC chips and MEMS chips.
- the two chips can be arranged side by side, and the two chips are connected by metal wires, in the sensitive area of each chip.
- the upper end is provided with a chip sensitive area protective film 12; the above two chips can also be arranged in a stacked manner.
- the ASIC chip is fixed on the substrate 2 first, and then the MEMS chip is fixed on the ASIC chip.
- the chip 3 is fixed in the middle of the substrate 2, the sensitive area of the chip 3 is located in the middle of the top of the chip 3, and the plastic packaging structure 11 is symmetrically arranged around the chip 3 with the middle perpendicular of the substrate 2 as the center.
- the shape of the shell can be a rectangular parallelepiped or a cube, or a stepped cylinder (as shown in Figures 1 and 2).
- the shape of the shell is not particularly limited.
- thermosetting connection layer 121 is provided at the end of the protective film 12 in the sensitive area of the chip; the bottom end of the thermosetting connection layer 121 is fixed on the chip 3; the top end of the thermosetting connection layer 121 is connected to the plastic packaging structure 11 Seal the connection.
- the chip 3 is fixed to the middle of the substrate 2 by a patch adhesive 5.
- the chip sensitive area protective film 12 is a polytetrafluoroethylene film (PTFE film for short), a thermosetting connection layer is provided at the end of the PTFE film, and the polytetrafluoroethylene film is used as a "non-stick coating" or “easy “Clean material” has the characteristics of resistance to acid, alkali, and various organic solvents, and it is almost insoluble in all solvents.
- PTFE polytetrafluoroethylene film
- the chip 3 is electrically connected to the substrate 2 through a metal wire 4, and the metal wire 4 is arranged inside the plastic packaging structure 11.
- Metal wires are a common electrical connection method, but metal wires are easily corroded during the use of the product. Therefore, the metal wires are arranged inside the plastic packaging structure, and the plastic packaging structure protects the metal wires and prolongs the service life of the product.
- the material of the plastic packaging structure 11 is an epoxy plastic packaging compound.
- Epoxy molding compound EMC for short in English
- EMC epoxy molding compound
- the plastic packaging process uses transfer molding to extrude EMC into the mold cavity, embed the chips in it, and at the same time cross-link and solidify to form a semiconductor device with a certain structural appearance, which can achieve both waterproof and dust-proof effects. At the same time, it protects the metal wires.
- the bottom end of the plastic encapsulation structure 11 is fixed on the substrate 2 by an adhesive, wherein the adhesive is silver paste, solder paste, or epoxy glue.
- the type of the substrate 2 is preferably a BT resin substrate or a ceramic substrate.
- BT resin is based on bismaleimide (BMI) and triazine as the main resin components, and epoxy resin, polyphenylene ether resin (PPE) or allyl compounds are added as modified components to form The thermosetting resin.
- the substrate may also be other types of substrates, such as epoxy resin substrates, etc., which are not particularly limited herein.
- FIGS 3 to 5 show the processing process of the waterproof and dustproof pressure sensor according to an embodiment of the present invention.
- the processing method of the waterproof and dustproof pressure sensor provided by the present invention includes the following steps:
- the chip 3 is fixed on the substrate 2 to obtain a first fixing structure of the chip and the substrate.
- the chip 3 may be a separate chip.
- the chip 3 includes two separate ASIC chips and a MEMS chip.
- the two chips can be arranged side by side; they can also be arranged in a stacked manner; of course, the chip 3 can also be an integrated single chip.
- the preferred way for the chip 3 to be fixed on the substrate 2 is patch glue.
- the chip 3 is fixed on the middle part of the substrate 2 by patch glue; the sensitive area of the chip 3 is located in the middle part of the top end of the chip 3.
- the chip sensitive area protective film 12 covers the sensitive area of the chip 3 of the first fixing structure of the chip and the substrate to obtain the second fixing structure of the chip and the substrate.
- the chip sensitive area protective film 12 is a polytetrafluoroethylene film (PTFE film for short), and a thermosetting connection layer 121 is provided at the end of the chip sensitive area protection film 12; the bottom end of the thermosetting connection layer 121 is fixed to the chip 3 on.
- PTFE film polytetrafluoroethylene film
- S3, the chip 3 and the substrate 2 on the second fixing structure of the chip and the substrate are electrically connected to obtain the third fixing structure of the chip and the substrate.
- connection mode of the electrical connection between the chip 3 and the substrate 2 is electrical connection through a metal wire.
- the chip 3 on the third fixing structure of the chip and the substrate is injection molded through an injection process, so that a plastic packaging structure 11 is formed around the chip 3 on the third fixing structure of the chip and the substrate.
- the bottom of the chip 11 is fixed on the substrate 2, the chip sensitive area protection film 12 is located outside the plastic packaging structure 11, and the end of the chip sensitive area protection film 12 is hermetically connected to the plastic packaging structure 11.
- the top end of the thermosetting connection layer 121 at the end of the chip sensitive area protective film 12 is connected to the plastic packaging structure 11, and the material of the injection molding structure 11 is epoxy plastic packaging material.
- the shape of the plastic-encapsulated product can be a rectangular parallelepiped or a cube to achieve a single waterproof and dustproof; it can also be a stepped cylinder. This form can be fitted with an O-ring to cooperate with the terminal structure for overall waterproof and dustproof.
- the working principle of the waterproof and dustproof pressure sensor shown in FIG. 1 provided by the present invention is:
- the sensitive area of the chip 3 receives the external pressure change signal, converts the pressure change signal to form a digital signal, and then transmits the digital signal to the substrate 2 through a metal wire.
- the substrate 2 is provided with pads, and the pads are electrically connected to external devices. Connect, and transmit the signal through the pad.
- the chip sensitive area protective film 12 can effectively protect the sensitive area of the chip 3 by arranging the chip sensitive area protection film 12 on the sensitive area of the chip 3 to prevent foreign matter from adhering to the sensitive area of the chip, which will reduce the sensitivity of the chip and affect the product performance.
- the plastic packaging structure 11 can effectively The electrical connection between the chip 3 and the substrate 2 is protected to ensure that the product can achieve high-reliability, high-level waterproof and dust-proof effects.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Disclosed are a waterproof and dustproof pressure sensor and a processing method therefor. The waterproof and dustproof pressure sensor comprises an encapsulation structure formed by a housing and a substrate (2), a chip (3) is arranged in the encapsulation structure, and the chip (3) is fixed on the substrate (2) and is electrically connected to the substrate (2). The housing comprises a plastic encapsulation structure (11) and a chip sensitive area protective film (12), wherein the plastic encapsulation structure (11) is arranged around the chip (3), a sensitive area of the chip (3) is arranged outside the plastic encapsulation structure (11), and the bottom end of the plastic encapsulation structure (11) is fixed on the substrate (2); and the chip sensitive area protective film (12) is arranged at the upper end of the sensitive area of the chip (3), and end portions of the chip sensitive area protective film (12) are in sealed connection with the plastic encapsulation structure (11). The problems in the prior art, such as realizing a waterproof function by filling an encapsulation structure with silica gel, however as silica gel is easily contaminated with foreign matter, product performance is affected, can be solved.
Description
本发明涉及压力传感器技术领域,更为具体地,涉及一种防水防尘压力传感器及其加工方法。The present invention relates to the technical field of pressure sensors, and more specifically, to a water- and dust-proof pressure sensor and a processing method thereof.
防水型气压传感器是一种用来测量环境气压的器件,通过气压值来计算海拔高度,因此广泛应用在消费电子终端中。The waterproof air pressure sensor is a device used to measure the ambient air pressure. The air pressure value is used to calculate the altitude, so it is widely used in consumer electronic terminals.
目前的防水气压传感器均采用在产品内部灌注硅凝胶来实现,虽然能够实现防水功能,但硅胶很容易沾染异物,影响产品性能;而且为了降低工艺难度,产品的尺寸都比较大。The current waterproof air pressure sensors are all realized by pouring silicone gel inside the product. Although it can achieve the waterproof function, the silica gel is easily contaminated with foreign objects and affects the product performance; and in order to reduce the process difficulty, the size of the product is relatively large.
发明内容Summary of the invention
鉴于上述问题,本发明的目的之一是提供一种防水防尘压力传感器,采用这种防水防尘压力传感器能够解决现有技术中通过在封装结构内部填充硅胶实现防水功能,但由于硅胶容易沾染异物,从而导致响产品性能等问题。In view of the above problems, one of the objectives of the present invention is to provide a waterproof and dustproof pressure sensor. The use of this waterproof and dustproof pressure sensor can solve the problem that the waterproof function is realized by filling silica gel inside the packaging structure in the prior art, but the silica gel is easily contaminated. Foreign matter, which can cause problems such as affecting product performance.
本发明提供一种防水防尘压力传感器,包括由壳体和基板形成的封装结构,在所述封装结构内部设置有芯片,所述芯片固定在所述基板上,并与所述基板电连接,所述壳体包括塑封结构和芯片敏感区域保护膜;其中,所述塑封结构围绕所述芯片设置,且所述芯片的敏感区域设置在所述塑封结构外部,所述塑封结构的底端固定在所述基板上;所述芯片敏感区域保护膜设置在所述芯片的敏感区域上端,且所述芯片敏感区域保护膜的端部与所述塑封结构密封连接。The present invention provides a water-proof and dust-proof pressure sensor, which includes a package structure formed by a housing and a substrate. A chip is arranged inside the package structure, and the chip is fixed on the substrate and is electrically connected to the substrate. The housing includes a plastic packaging structure and a chip sensitive area protective film; wherein the plastic packaging structure is arranged around the chip, and the sensitive area of the chip is arranged outside the plastic packaging structure, and the bottom end of the plastic packaging structure is fixed at On the substrate; the chip sensitive area protective film is arranged at the upper end of the sensitive area of the chip, and the end of the chip sensitive area protective film is hermetically connected with the plastic packaging structure.
此外,优选的方案是,在所述芯片敏感区域保护膜的端部设置有热固连接层;其中,所述热固连接层的底端固定在所述芯片上;所述热固连接层的顶端与所述塑封结构密封连接。In addition, a preferred solution is that a thermosetting connection layer is provided at the end of the protective film in the sensitive area of the chip; wherein the bottom end of the thermosetting connection layer is fixed on the chip; The top end is hermetically connected with the plastic sealing structure.
此外,优选的方案是,所述芯片固定在所述基板的中部,所述芯片的敏 感区域位于所述芯片顶端的中部,所述塑封结构以所述基板的中垂线为中心,对称设置在所述芯片的周围。In addition, a preferred solution is that the chip is fixed in the middle of the substrate, the sensitive area of the chip is located in the middle of the top of the chip, and the plastic encapsulation structure is symmetrically arranged on the center perpendicular to the substrate. Around the chip.
此外,优选的方案是,所述芯片通过贴片胶固定在所述基板的中部。In addition, a preferred solution is that the chip is fixed in the middle of the substrate by a patch glue.
此外,优选的方案是,所述芯片通过金属导线与所述基板电连接,且所述金属导线设置在所述塑封结构内部。In addition, a preferred solution is that the chip is electrically connected to the substrate through a metal wire, and the metal wire is arranged inside the plastic packaging structure.
此外,优选的方案是,所述塑封结构的材料为环氧塑封料。In addition, a preferred solution is that the material of the plastic packaging structure is an epoxy plastic packaging compound.
此外,优选的方案是,所述芯片敏感区域保护膜为聚四氟乙烯膜。In addition, a preferred solution is that the protective film for the sensitive area of the chip is a polytetrafluoroethylene film.
此外,优选的方案是,所述塑封结构的底端通过粘合剂固定在所述基板上,其中,所述粘合剂为银浆或者锡膏或者环氧胶。In addition, a preferred solution is that the bottom end of the plastic encapsulation structure is fixed on the substrate by an adhesive, wherein the adhesive is silver paste, solder paste, or epoxy glue.
此外,优选的方案是,所述基板为BT树脂基板或陶瓷基板。In addition, a preferred solution is that the substrate is a BT resin substrate or a ceramic substrate.
本发明的另一目的是提供一种如上所述的防水防尘压力传感器的加工方法,该加工方法包括如下步骤:Another object of the present invention is to provide a method for processing a water- and dust-proof pressure sensor as described above. The processing method includes the following steps:
S1、将芯片固定在基板上,得到芯片与基板的第一固定结构;S1. Fixing the chip on the substrate to obtain a first fixing structure of the chip and the substrate;
S2、将芯片敏感区域保护膜覆盖在所述芯片与基板的第一固定结构的芯片的敏感区域,得到芯片与基板的第二固定结构;S2. Cover the sensitive area of the chip of the chip of the first fixing structure of the chip and the substrate with a protective film for the sensitive area of the chip to obtain a second fixing structure of the chip and the substrate;
S3、将所述芯片与基板的第二固定结构上的芯片与基板电连接,得到芯片与基板的第三固定结构;S3, electrically connecting the chip and the substrate on the second fixing structure of the chip and the substrate to obtain a third fixing structure of the chip and the substrate;
S4、通过注塑工艺围绕所述芯片与基板的第三固定结构上的芯片进行注塑加工,使所述芯片与基板的第三固定结构上的芯片的周围形成塑封结构,所述塑封结构的底部固定在所述基板上,所述芯片敏感区域保护膜位于所述塑封结构的外部,所述芯片敏感区域保护膜的端部与所述塑封结构密封连接。S4. Perform injection molding processing around the chip on the third fixing structure of the chip and the substrate through an injection molding process, so that a plastic encapsulation structure is formed around the chip on the third fixing structure of the chip and the substrate, and the bottom of the plastic encapsulation structure is fixed On the substrate, the chip sensitive area protection film is located outside the plastic packaging structure, and the end of the chip sensitive area protection film is hermetically connected with the plastic packaging structure.
从上面的技术方案可知,本发明提供的防水防尘压力传感器及其加工方法的壳体包括塑封结构和芯片敏感区域保护膜,通过芯片敏感区域保护膜能够有效保护芯片的敏感区域,避免异物沾到芯片的敏感区域,导致芯片灵敏性降低,从而影响产品性能,通过塑封结构能够有效保护芯片与基板的电连接处,保证产品可实现高可靠性、高等级的防水防尘效果。It can be seen from the above technical solutions that the housing of the waterproof and dustproof pressure sensor and its processing method provided by the present invention includes a plastic encapsulation structure and a chip sensitive area protective film. The chip sensitive area protective film can effectively protect the sensitive area of the chip and avoid foreign matter. In the sensitive area of the chip, the sensitivity of the chip is reduced, which affects the performance of the product. The plastic packaging structure can effectively protect the electrical connection between the chip and the substrate, ensuring that the product can achieve high reliability and high-level waterproof and dustproof effects.
为了实现上述以及相关目的,本发明的一个或多个方面包括后面将详细说明的特征。下面的说明以及附图详细说明了本发明的某些示例性方面。然而,这些方面指示的仅仅是可使用本发明的原理的各种方式中的一些方式。 此外,本发明旨在包括所有这些方面以及它们的等同物。In order to achieve the above and related objects, one or more aspects of the present invention include features that will be described in detail later. The following description and the drawings illustrate certain exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. Furthermore, the present invention is intended to include all these aspects and their equivalents.
通过参考以下结合附图的说明,并且随着对本发明的更全面理解,本发明的其它目的及结果将更加明白及易于理解。在附图中:By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objectives and results of the present invention will be more clear and easy to understand. In the attached picture:
图1为根据本发明实施例的防水防尘压力传感器的结构示意图;Fig. 1 is a schematic structural diagram of a waterproof and dustproof pressure sensor according to an embodiment of the present invention;
图2为根据本发明实施例的防水防尘压力传感器的俯视结构示意图;Fig. 2 is a schematic top view of the structure of a water- and dust-proof pressure sensor according to an embodiment of the present invention;
图3-图5为根据本发明实施例的防水防尘压力传感器的加工过程示意图;3 to 5 are schematic diagrams of the processing process of a waterproof and dustproof pressure sensor according to an embodiment of the present invention;
其中的附图标记包括:11-塑封结构,12-芯片敏感区域保护膜,121-热固连接层,2-基板,3-芯片,4-金属导线,5-贴片胶。The reference signs include: 11-plastic packaging structure, 12-chip sensitive area protective film, 121-thermosetting connection layer, 2-substrate, 3-chip, 4-metal wire, 5-chip adhesive.
在所有附图中相同的标号指示相似或相应的特征或功能。The same reference numerals in all the drawings indicate similar or corresponding features or functions.
在下面的描述中,出于说明的目的,为了提供对一个或多个实施例的全面理解,阐述了许多具体细节。然而,很明显,也可以在没有这些具体细节的情况下实现这些实施例。In the following description, for illustrative purposes, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is obvious that these embodiments can also be implemented without these specific details.
以下将结合附图对本发明的具体实施例进行详细描述。The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
图1示出了根据本发明实施例的防水防尘压力传感器的结构。Fig. 1 shows the structure of a waterproof and dustproof pressure sensor according to an embodiment of the present invention.
如图1所示,一种防水防尘压力传感器,包括由壳体和基板2形成的封装结构,在封装结构内部设置有芯片3,芯片3固定在基板2上,并与基板2电连接,壳体包括塑封结构11和芯片敏感区域保护膜12;其中,塑封结构11围绕芯片3设置,且芯片3的敏感区域设置在塑封结构11外部,塑封结构11的底端固定在基板2上;芯片敏感区域保护膜12设置在芯片3的敏感区域上端,且芯片敏感区域保护膜12的端部与塑封结构11密封连接。As shown in Fig. 1, a water-proof and dust-proof pressure sensor includes a package structure formed by a housing and a substrate 2. A chip 3 is arranged inside the package structure. The chip 3 is fixed on the substrate 2 and is electrically connected to the substrate 2. The housing includes a plastic packaging structure 11 and a chip sensitive area protection film 12; wherein the plastic packaging structure 11 is arranged around the chip 3, and the sensitive area of the chip 3 is arranged outside the plastic packaging structure 11, and the bottom end of the plastic packaging structure 11 is fixed on the substrate 2; The sensitive area protection film 12 is arranged on the upper end of the sensitive area of the chip 3, and the end of the chip sensitive area protection film 12 is hermetically connected with the plastic packaging structure 11.
其中,芯片3可以为分立的芯片,例如,芯片3包括两个分立设置的ASIC芯片和MEMS芯片,两个芯片可以并排布置,两个芯片之间通过金属导线连接,在每个芯片的敏感区域上端均设置有芯片敏感区域保护膜12;上述的两个芯片也可采用堆叠的方式布置,如先将ASIC芯片固定在基板2上,再把MEMS芯片固定在ASIC芯片上,两者通过金属导线连接,在ASIC芯片的敏感区域的上端设置芯片敏感区域保护膜12;当然芯片3也可以为集成单芯片, 此时,只需将集成单芯片固定在基板2上,再将芯片敏感区域保护膜12设置在集成单芯片的敏感区域上端。Among them, the chip 3 can be a separate chip. For example, the chip 3 includes two separate ASIC chips and MEMS chips. The two chips can be arranged side by side, and the two chips are connected by metal wires, in the sensitive area of each chip. The upper end is provided with a chip sensitive area protective film 12; the above two chips can also be arranged in a stacked manner. For example, the ASIC chip is fixed on the substrate 2 first, and then the MEMS chip is fixed on the ASIC chip. Connect, set the chip sensitive area protective film 12 on the upper end of the sensitive area of the ASIC chip; of course, the chip 3 can also be an integrated single chip. In this case, it is only necessary to fix the integrated single chip on the substrate 2, and then the chip sensitive area protective film 12 is set at the upper end of the sensitive area of the integrated single chip.
作为本发明的优选实施例,芯片3固定在基板2的中部,芯片3的敏感区域位于芯片3顶端的中部,塑封结构11以基板2的中垂线为中心,对称设置在芯片3的周围。通过上述结构设计,使整个传感器的内部结构更加规整,更便于与终端设备配合使用。As a preferred embodiment of the present invention, the chip 3 is fixed in the middle of the substrate 2, the sensitive area of the chip 3 is located in the middle of the top of the chip 3, and the plastic packaging structure 11 is symmetrically arranged around the chip 3 with the middle perpendicular of the substrate 2 as the center. Through the above structural design, the internal structure of the entire sensor is more regular, and it is more convenient to cooperate with the terminal device.
其中,壳体的形状可为长方体或正方体,也可为带台阶的圆柱体(如图1及图2所示),在此,不对壳体的形状作特别限定。Wherein, the shape of the shell can be a rectangular parallelepiped or a cube, or a stepped cylinder (as shown in Figures 1 and 2). Here, the shape of the shell is not particularly limited.
作为本发明的优选实施例,在芯片敏感区域保护膜12的端部设置有热固连接层121;热固连接层121的底端固定在芯片3上;热固连接层121的顶端与塑封结构11密封连接。通过在芯片敏感区域保护膜12的端部设置热固连接层121,便于将芯片敏感区域保护膜12固定在芯片3上,防止在产品使用过程中,由于芯片敏感区域保护膜12移位,导致芯片敏感区域保护膜12无法对芯片3起到保护作用,而影响产品性能。As a preferred embodiment of the present invention, a thermosetting connection layer 121 is provided at the end of the protective film 12 in the sensitive area of the chip; the bottom end of the thermosetting connection layer 121 is fixed on the chip 3; the top end of the thermosetting connection layer 121 is connected to the plastic packaging structure 11 Seal the connection. By arranging the thermosetting connection layer 121 at the end of the chip sensitive area protective film 12, it is convenient to fix the chip sensitive area protective film 12 on the chip 3, and prevent the chip sensitive area protective film 12 from shifting during the use of the product. The chip sensitive area protective film 12 cannot protect the chip 3 and affects product performance.
其中,优选地,芯片3通过贴片胶5固定在基板2的中部。Among them, preferably, the chip 3 is fixed to the middle of the substrate 2 by a patch adhesive 5.
其中,优选地,芯片敏感区域保护膜12为聚四氟乙烯膜(简称PTFE膜),在PTFE膜的端部设置热固连接层,聚四氟乙烯膜作为“不粘涂层”或“易清洁物料”,具有抗酸抗碱、抗各种有机溶剂的特点,几乎不溶于所有的溶剂。同时,聚四氟乙烯具有耐高温的特点,它的摩擦系数极低,且不会影响芯片3的灵敏度。Among them, preferably, the chip sensitive area protective film 12 is a polytetrafluoroethylene film (PTFE film for short), a thermosetting connection layer is provided at the end of the PTFE film, and the polytetrafluoroethylene film is used as a "non-stick coating" or "easy "Clean material" has the characteristics of resistance to acid, alkali, and various organic solvents, and it is almost insoluble in all solvents. At the same time, PTFE has the characteristics of high temperature resistance, its friction coefficient is extremely low, and will not affect the sensitivity of the chip 3.
作为本发明的优选实施例,芯片3通过金属导线4与基板2电连接,且金属导线4设置在塑封结构11内部。金属导线为常用的电连接方式,但是金属导线在产品使用的过程中,容易被锈蚀,由此,将金属导线设置在塑封结构内部,塑封结构对金属导线形成保护,延长产品使用寿命。As a preferred embodiment of the present invention, the chip 3 is electrically connected to the substrate 2 through a metal wire 4, and the metal wire 4 is arranged inside the plastic packaging structure 11. Metal wires are a common electrical connection method, but metal wires are easily corroded during the use of the product. Therefore, the metal wires are arranged inside the plastic packaging structure, and the plastic packaging structure protects the metal wires and prolongs the service life of the product.
其中,优选地,塑封结构11的材料为环氧塑封料。环氧塑封料(英文简称EMC)是由环氧树脂为基体树脂,以高性能酚醛树脂为固化剂,加入硅微粉等为填料,以及添加多种助剂混配而成的粉状模塑料。塑封过程是用传递成型法将EMC挤压入模腔,并将其中的芯片包埋,同时交联固化成型,成为具有一定结构外型的半导体器件,既能达到防水的效果又可达到防尘的效果,同时对金属导线起到保护作用。Among them, preferably, the material of the plastic packaging structure 11 is an epoxy plastic packaging compound. Epoxy molding compound (EMC for short in English) is a powdery molding compound mixed with epoxy resin as matrix resin, high-performance phenolic resin as curing agent, silicon powder as filler, and various additives. The plastic packaging process uses transfer molding to extrude EMC into the mold cavity, embed the chips in it, and at the same time cross-link and solidify to form a semiconductor device with a certain structural appearance, which can achieve both waterproof and dust-proof effects. At the same time, it protects the metal wires.
其中,优选地,塑封结构11的底端通过粘合剂固定在基板2上,其中,粘合剂为银浆或者锡膏或者环氧胶。Among them, preferably, the bottom end of the plastic encapsulation structure 11 is fixed on the substrate 2 by an adhesive, wherein the adhesive is silver paste, solder paste, or epoxy glue.
作为本发明的优选实施例,基板2的种类优选为BT树脂基板或陶瓷基板。其中,BT树脂是以双马来酰亚胺(BMI)和三嗪为主树脂成份,并加入环氧树脂、聚苯醚树脂(PPE)或烯丙基化合物等作为改性组分,所形成的热固性树脂。当然,基板也可为其它种类的基板,如环氧树脂基板等,在此不作特别限定。As a preferred embodiment of the present invention, the type of the substrate 2 is preferably a BT resin substrate or a ceramic substrate. Among them, BT resin is based on bismaleimide (BMI) and triazine as the main resin components, and epoxy resin, polyphenylene ether resin (PPE) or allyl compounds are added as modified components to form The thermosetting resin. Of course, the substrate may also be other types of substrates, such as epoxy resin substrates, etc., which are not particularly limited herein.
图3-图5示出了根据本发明实施例的防水防尘压力传感器的加工过程。Figures 3 to 5 show the processing process of the waterproof and dustproof pressure sensor according to an embodiment of the present invention.
结合图3-图5,对本发明提供的防水防尘压力传感器的加工方法的具体实施例进行详细描述。With reference to FIGS. 3 to 5, specific embodiments of the processing method of the waterproof and dustproof pressure sensor provided by the present invention will be described in detail.
本发明提供的防水防尘压力传感器的加工方法,包括如下步骤:The processing method of the waterproof and dustproof pressure sensor provided by the present invention includes the following steps:
如图3所示,S1、将芯片3固定在基板2上,得到芯片与基板的第一固定结构。As shown in Fig. 3, S1, the chip 3 is fixed on the substrate 2 to obtain a first fixing structure of the chip and the substrate.
其中,芯片3可以为分立的芯片,例如,芯片3包括两个分立设置的ASIC芯片和MEMS芯片,两个芯片可以并排布置;也可采用堆叠的方式布置;当然,芯片3也可以为集成单芯片(如图3所示),芯片3固定在基板2的优选方式为贴片胶。Among them, the chip 3 may be a separate chip. For example, the chip 3 includes two separate ASIC chips and a MEMS chip. The two chips can be arranged side by side; they can also be arranged in a stacked manner; of course, the chip 3 can also be an integrated single chip. For the chip (as shown in FIG. 3), the preferred way for the chip 3 to be fixed on the substrate 2 is patch glue.
优选地,芯片3通过贴片胶固定在基板2的中部;芯片3的敏感区域位于芯片3顶端的中部。Preferably, the chip 3 is fixed on the middle part of the substrate 2 by patch glue; the sensitive area of the chip 3 is located in the middle part of the top end of the chip 3.
如图4所示,S2、将芯片敏感区域保护膜12覆盖在芯片与基板的第一固定结构的芯片3的敏感区域,得到芯片与基板的第二固定结构。As shown in FIG. 4, S2, the chip sensitive area protective film 12 covers the sensitive area of the chip 3 of the first fixing structure of the chip and the substrate to obtain the second fixing structure of the chip and the substrate.
其中,芯片敏感区域保护膜12为聚四氟乙烯膜(简称PTFE膜),在芯片敏感区域保护膜12的端部设置有热固连接层121;热固连接层121的底端固定在芯片3上。Among them, the chip sensitive area protective film 12 is a polytetrafluoroethylene film (PTFE film for short), and a thermosetting connection layer 121 is provided at the end of the chip sensitive area protection film 12; the bottom end of the thermosetting connection layer 121 is fixed to the chip 3 on.
如图5所示,S3、将芯片与基板的第二固定结构上的芯片3与基板2电连接,得到芯片与基板的第三固定结构。As shown in FIG. 5, S3, the chip 3 and the substrate 2 on the second fixing structure of the chip and the substrate are electrically connected to obtain the third fixing structure of the chip and the substrate.
其中,芯片3与基板2电连接的连接方式为通过金属导线电连接。Wherein, the connection mode of the electrical connection between the chip 3 and the substrate 2 is electrical connection through a metal wire.
如图1所示,S4、通过注塑工艺围绕芯片与基板的第三固定结构上的芯片3进行注塑加工,使芯片与基板的第三固定结构上的芯片3的周围形成塑封结构11,塑封结构11的底部固定在基板2上,芯片敏感区域保护膜12位于塑封结构11的外部,芯片敏感区域保护膜12的端部与塑封结构11密封连 接。As shown in FIG. 1, S4, the chip 3 on the third fixing structure of the chip and the substrate is injection molded through an injection process, so that a plastic packaging structure 11 is formed around the chip 3 on the third fixing structure of the chip and the substrate. The bottom of the chip 11 is fixed on the substrate 2, the chip sensitive area protection film 12 is located outside the plastic packaging structure 11, and the end of the chip sensitive area protection film 12 is hermetically connected to the plastic packaging structure 11.
具体地,芯片敏感区域保护膜12端部的热固连接层121的顶端与塑封结构11连接,注塑结构11的材料为环氧塑封料。通过注塑工艺,塑封后产品的形状可以是长方体或正方体,实现单体防水防尘;也可以是带台阶的圆柱体,此种形态可以套入O型圈配合终端结构进行整体防水防尘。Specifically, the top end of the thermosetting connection layer 121 at the end of the chip sensitive area protective film 12 is connected to the plastic packaging structure 11, and the material of the injection molding structure 11 is epoxy plastic packaging material. Through the injection molding process, the shape of the plastic-encapsulated product can be a rectangular parallelepiped or a cube to achieve a single waterproof and dustproof; it can also be a stepped cylinder. This form can be fitted with an O-ring to cooperate with the terminal structure for overall waterproof and dustproof.
本发明提供的图1所示的防水防尘压力传感器的工作原理为:The working principle of the waterproof and dustproof pressure sensor shown in FIG. 1 provided by the present invention is:
芯片3的敏感区域接收外界的压力变化信号,对压力变化信号进行转换处理,形成数字信号,再将数字信号通过金属导线传输给基板2,在基板2上设置焊盘,焊盘与外部器件电连接,通过焊盘将信号传输出来。The sensitive area of the chip 3 receives the external pressure change signal, converts the pressure change signal to form a digital signal, and then transmits the digital signal to the substrate 2 through a metal wire. The substrate 2 is provided with pads, and the pads are electrically connected to external devices. Connect, and transmit the signal through the pad.
通过在芯片3的敏感区域上端设置芯片敏感区域保护膜12能够有效保护芯片3的敏感区域,避免异物沾到芯片的敏感区域,导致芯片灵敏性降低,从而影响产品性能,通过塑封结构11能够有效保护芯片3与基板2的电连接处,保证产品可实现高可靠性、高等级的防水防尘效果。The chip sensitive area protective film 12 can effectively protect the sensitive area of the chip 3 by arranging the chip sensitive area protection film 12 on the sensitive area of the chip 3 to prevent foreign matter from adhering to the sensitive area of the chip, which will reduce the sensitivity of the chip and affect the product performance. The plastic packaging structure 11 can effectively The electrical connection between the chip 3 and the substrate 2 is protected to ensure that the product can achieve high-reliability, high-level waterproof and dust-proof effects.
如上参照附图以示例的方式描述了根据本发明提出的防水防尘压力传感器及其加工方法。但是,本领域技术人员应当理解,对于上述本发明所提出的防水防尘压力传感器及其加工方法,还可以在不脱离本发明内容的基础上做出各种改进。因此,本发明的保护范围应当由所附的权利要求书的内容确定。As above, the waterproof and dustproof pressure sensor and the processing method thereof according to the present invention are described by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the waterproof and dustproof pressure sensor and its processing method proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the appended claims.
Claims (10)
- 一种防水防尘压力传感器,包括由壳体和基板形成的封装结构,在所述封装结构内部设置有芯片,所述芯片固定在所述基板上,并与所述基板电连接,其特征在于,A water-proof and dust-proof pressure sensor includes a packaging structure formed by a casing and a substrate. A chip is arranged inside the packaging structure, and the chip is fixed on the substrate and electrically connected to the substrate, and is characterized in ,所述壳体包括塑封结构和芯片敏感区域保护膜;其中,The housing includes a plastic packaging structure and a protective film for the sensitive area of the chip; wherein,所述塑封结构围绕所述芯片设置,且所述芯片的敏感区域设置在所述塑封结构外部,所述塑封结构的底端固定在所述基板上;The plastic package structure is arranged around the chip, and the sensitive area of the chip is arranged outside the plastic package structure, and the bottom end of the plastic package structure is fixed on the substrate;所述芯片敏感区域保护膜设置在所述芯片的敏感区域上端,且所述芯片敏感区域保护膜的端部与所述塑封结构密封连接。The chip sensitive area protective film is arranged on the upper end of the sensitive area of the chip, and the end of the chip sensitive area protective film is hermetically connected with the plastic packaging structure.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:在所述芯片敏感区域保护膜的端部设置有热固连接层;其中,A thermosetting connection layer is provided at the end of the protective film in the sensitive area of the chip; wherein,所述热固连接层的底端固定在所述芯片上;The bottom end of the thermosetting connection layer is fixed on the chip;所述热固连接层的顶端与所述塑封结构密封连接。The top end of the thermosetting connecting layer is in hermetically connected with the plastic sealing structure.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:所述芯片固定在所述基板的中部,所述芯片的敏感区域位于所述芯片顶端的中部,所述塑封结构以所述基板的中垂线为中心,对称设置在所述芯片的周围。The chip is fixed in the middle of the substrate, the sensitive area of the chip is located in the middle of the top of the chip, and the plastic packaging structure is symmetrically arranged around the chip with the center perpendicular of the substrate as the center.
- 根据权利要求3所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 3, wherein:所述芯片通过贴片胶固定在所述基板的中部。The chip is fixed on the middle of the substrate by a patch glue.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:所述芯片通过金属导线与所述基板电连接,且所述金属导线设置在所述塑封结构内部。The chip is electrically connected to the substrate through a metal wire, and the metal wire is arranged inside the plastic packaging structure.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:所述塑封结构的材料为环氧塑封料。The material of the plastic packaging structure is epoxy plastic packaging material.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:所述芯片敏感区域保护膜为聚四氟乙烯膜。The protective film for the sensitive area of the chip is a polytetrafluoroethylene film.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:所述塑封结构的底端通过粘合剂固定在所述基板上,其中,所述粘合剂为银浆或者锡膏或者环氧胶。The bottom end of the plastic encapsulation structure is fixed on the substrate by an adhesive, wherein the adhesive is silver paste or solder paste or epoxy glue.
- 根据权利要求1所述的防水防尘压力传感器,其特征在于,The waterproof and dustproof pressure sensor according to claim 1, wherein:所述基板为BT树脂基板或陶瓷基板。The substrate is a BT resin substrate or a ceramic substrate.
- 一种如权利要求1至9任意一项所述的防水防尘压力传感器的加工方法,其特征在于,包括如下步骤:A method for processing a waterproof and dustproof pressure sensor according to any one of claims 1 to 9, characterized in that it comprises the following steps:S1、将芯片固定在基板上,得到芯片与基板的第一固定结构;S1. Fixing the chip on the substrate to obtain a first fixing structure of the chip and the substrate;S2、将芯片敏感区域保护膜覆盖在所述芯片与基板的第一固定结构的芯片的敏感区域,得到芯片与基板的第二固定结构;S2. Cover the sensitive area of the chip of the chip of the first fixing structure of the chip and the substrate with a protective film for the sensitive area of the chip to obtain a second fixing structure of the chip and the substrate;S3、将所述芯片与基板的第二固定结构上的芯片与基板电连接,得到芯片与基板的第三固定结构;S3, electrically connecting the chip and the substrate on the second fixing structure of the chip and the substrate to obtain a third fixing structure of the chip and the substrate;S4、通过注塑工艺围绕所述芯片与基板的第三固定结构上的芯片进行注塑加工,使所述芯片与基板的第三固定结构上的芯片的周围形成塑封结构,所述塑封结构的底部固定在所述基板上,所述芯片敏感区域保护膜位于所述塑封结构的外部,所述芯片敏感区域保护膜的端部与所述塑封结构密封连接。S4. Perform injection molding processing around the chip on the third fixing structure of the chip and the substrate through an injection molding process, so that a plastic encapsulation structure is formed around the chip on the third fixing structure of the chip and the substrate, and the bottom of the plastic encapsulation structure is fixed On the substrate, the chip sensitive area protection film is located outside the plastic packaging structure, and the end of the chip sensitive area protection film is hermetically connected with the plastic packaging structure.
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