CN209400124U - Pressure sensor chip and the Multifunction Sensor for being provided with the chip - Google Patents
Pressure sensor chip and the Multifunction Sensor for being provided with the chip Download PDFInfo
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- CN209400124U CN209400124U CN201822150734.4U CN201822150734U CN209400124U CN 209400124 U CN209400124 U CN 209400124U CN 201822150734 U CN201822150734 U CN 201822150734U CN 209400124 U CN209400124 U CN 209400124U
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- substrate
- pressure sensor
- sensor chip
- awareness tool
- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000003292 glue Substances 0.000 claims abstract description 31
- 230000008447 perception Effects 0.000 claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000006355 external stress Effects 0.000 abstract 1
- 230000006870 function Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
The utility model provides a kind of pressure sensor chip and the Multifunction Sensor for being provided with the chip, the awareness tool that wherein pressure sensor chip includes substrate and is hung in substrate by linking arm；Awareness tool includes structure backplane and structure backplane the is arranged in perception vibrating diaphragm far from one side of substrate, perceives and forms closed chamber between vibrating diaphragm and structure backplane；Marine glue filled with package awareness tool between awareness tool and substrate.Interference of the external stress to awareness tool can not only be reduced using above-mentioned utility model, can also play the role of waterproof and dustproof, product measurement accuracy height, long service life.
Description
Technical field
The utility model relates to sensor technical fields, more specifically, are related to a kind of pressure sensor chip and setting
There are the pressure sensor and Multifunction Sensor of the chip.
Background technique
MEMS chip full name in English is Micro Electro Mechanical Systems, and Chinese is micro-electro-mechanical systems
System, is the research frontier of the multi-crossed disciplines to grow up in microelectric technique basis.By development in more than 40 years,
Have become one of the great sciemtifec and technical sphere that the world attractes attention.It is related to electronics, machinery, material, physics, chemistry, biology, medicine
Etc. a variety of subjects and technology.
MEMS (Micro Electro Mechanical System) pressure sensor is the pressure sensor based on MEMS technology manufacture.It is actually using
Pressure sensor in, pressure sensor chip (MEMS chip) is usually to be set up directly on substrate, and pass through through-hole and outer
Boundary's conducting, does not have functions of waterproof and dustproof, is easy to overstock dust on perception vibrating diaphragm, reduces the sensitivity of perception vibrating diaphragm.In addition,
Pressure sensor chip is directly encapsulated with substrate, and the deformational stress that will lead to substrate is transferred to pressure sensor chip, reduces core
The measurement accuracy of piece.
Utility model content
In view of the above problems, the purpose of the utility model is to provide a kind of pressure sensor chip and it is provided with the chip
Multifunction Sensor does not have water-proof function to solve the awareness tool of existing pressure sensor chip, is easy overstocked dust
And it is easy to be influenced by extraneous stress variation, the problem for causing product measurement accuracy low.
The pressure sensor chip provided in the utility model embodiment, including substrate and lining is hung on by linking arm
Awareness tool in bottom；Wherein, awareness tool includes structure backplane and is arranged in perception of the structure backplane far from one side of substrate
Vibrating diaphragm perceives and forms closed chamber between vibrating diaphragm and structure backplane；Filled with package awareness tool between awareness tool and substrate
Marine glue.
Furthermore it is preferred that structure be, linking arm by substrate etching formed.
Furthermore it is preferred that structure be that linking arm is provided at least two；Linking arm is in substrate in symmetrical or uniform point
Cloth.
Furthermore it is preferred that structure be that substrate is rectangular parallelepiped structure open at one end, the side wall of substrate forms receiving sense part
The inner cavity of part, marine glue fill into inner cavity and cover awareness tool.
Furthermore it is preferred that structure be that the longitudinal section of structure backplane is " C " shape structure, perception vibrating diaphragm is arranged in structure backplane
Open end；Structure backplane is connect by linking arm with substrate far from one end of perception vibrating diaphragm.
Furthermore it is preferred that structure be to be provided with pad on substrate, the conducting wire for connecting pad and awareness tool passes through waterproof
Glue；The data that awareness tool detects are transferred to external system by conducting wire.
The utility model additionally provides a kind of pressure sensor, including substrate and is disposed on the substrate and pressure as above
Sensor chip；Through-hole corresponding with pressure sensor chip position is provided on substrate.
Furthermore it is preferred that structure be plastic packaging glue is additionally provided on substrate, and plastic packaging glue covering pressure sensor chip lining
Bottom.
Furthermore it is preferred that structure be additionally provided on substrate accommodate pressure sensor chip shell.
The utility model additionally provides a kind of Multifunction Sensor, the acoustic sensor including being disposed on the substrate and such as
On pressure sensor；Wherein, pressure sensor is for detecting extraneous hydraulic pressure or air pressure.
It can be seen from the above technical scheme that pressure sensor chip provided by the utility model and being provided with the more of the chip
Awareness tool is hung in substrate by function sensor by linking arm, and the filling package sense between awareness tool and substrate
Know the marine glue of component, waterproof and dustproof can not only be played the role of, can also reduce awareness tool in application or assembling process
In the external interference that is subject to, reduce its risk that deformation occurs, properties of product are stablized, and detection accuracy is high.
Detailed description of the invention
By reference to the explanation below in conjunction with attached drawing, and with the utility model is more fully understood, this is practical new
The other purposes and result of type will be more clearly understood and understood.In the accompanying drawings:
Fig. 1 is the diagrammatic cross-section according to the pressure sensor chip of the utility model embodiment；
Fig. 2 is the diagrammatic cross-section according to the pressure sensor of the utility model embodiment；
Appended drawing reference therein includes: substrate 11, linking arm 12, awareness tool 13, structure backplane 131, perception vibrating diaphragm
132, pad 14, conducting wire 15, marine glue 16, substrate 17, through-hole 171, plastic packaging glue 18.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific embodiment
For be described in detail the utility model pressure sensor chip structure, below with reference to attached drawing to the utility model
Specific embodiment be described in detail.
Fig. 1 shows the cross-section structure of the pressure sensor chip according to the utility model embodiment.
As shown in Figure 1, the pressure sensor chip of the utility model embodiment, including substrate 11 and pass through linking arm 12
The awareness tool 13 being hung in substrate 11；Wherein, awareness tool 13 includes structure backplane 131 and is arranged in structure backplane
The 131 perception vibrating diaphragms 132 far from 11 side of substrate perceive and form closed chamber between vibrating diaphragm 132 and structure backplane 131；Perception
Marine glue 16 filled with package awareness tool 13 between component 13 and substrate 11；Marine glue 16 can not only be to awareness tool 13
Play the role of waterproof and dustproof, awareness tool 13 can be also isolated with substrate 11, be carried out to pressure sensor chip
When encapsulation, influence of the deformational stress of substrate 11 to awareness tool 13 is reduced by marine glue.
Specifically, linking arm 12 can etch formation on substrate 11, that is, pass through solution, reactive ion or other machinery
Mode is removed on substrate, removes some materials, and the structure that substrate 11 and awareness tool 13 are only connected by linking arm 12 is formed.
The marine glue 16 of filling package awareness tool 13 can be avoided ambient pressure to sense part between awareness tool 13 and substrate 11
The direct impact of part 13, plays buffer function.In addition, the perception vibrating diaphragm 132 of awareness tool 13 is provided towards opening for substrate
Mouth end, enables to awareness tool 13 to contact at the first time and acquires environmental signal, will perceive vibrating diaphragm at present relatively towards substrate
Bottom setting for, can be improved the detection accuracy of chip.
In addition, the pressure sensor chip of the utility model embodiment, linking arm 12 is provided at least two, linking arm
12 can both be symmetric in substrate 11, can also be evenly distributed, symmetrical or be uniformly distributed and can preferably make
Each 12 uniform force of linking arm prevents so that each linking arm 12 is equal to the stress of awareness tool 13 due to perception
The local stress that component 13 is subject to is excessive and reduces the generation of chip measurement accuracy problem.
In a specific embodiment of the utility model, the longitudinal section of structure backplane 131 is " C " shape structure, is had
One open end, perception vibrating diaphragm 132 are arranged at the open end of structure backplane 131, so that structure backplane 131 and perception vibrating diaphragm
Closed chamber is formed between 132, when ambient pressure signal contacts marine glue 16, marine glue 16 is by pressure signal transmission to perception
Vibrating diaphragm 132 forces perception vibrating diaphragm 132 to vibrate, and compresses the indoor gas of closing chamber, then the inspection on cooperation perception vibrating diaphragm 132
Slowdown monitoring circuit realizes the acquisition to current environment pressure data；One end far from perception vibrating diaphragm 132 of structure backplane 131 or it is perpendicular
It is connect to side wall by linking arm 12 with substrate 11, by being arranged linking arm 12 in structure backplane 131 far from perception vibrating diaphragm 132
Side, can also reduce 12 pairs of linking arm perception vibrating diaphragm 132 influences.
In addition, being additionally provided with pad 14 on substrate 11, pad 14 with external system for being electrically connected, inside substrate 11
It is provided with the conducting wire 15 of connection pad 14 and awareness tool 13, conducting wire 15 passes through marine glue 16 and connect with awareness tool 13；Conducting wire
The inside of substrate 11 is arranged in 15 a part, and another part is arranged in marine glue 16, can not only detect awareness tool 13
To environmental data be transferred to external system, additionally it is possible to be effectively protected conducting wire 15, prevent its exposure from corroding in the environment
Or oxidation.
In practical applications, due to the presence of marine glue 16, so that chip has the effect of waterproof and dustproof, based on anti-
This effect of water, the pressure sensor chip of the utility model embodiment, which can not only measure ambient pressure, can also measure the external world
Hydraulic pressure, and then the detection to the depth of water is realized by hydraulic pressure.
Corresponding with above-mentioned pressure sensor chip, the utility model also provides one kind and is provided with above-mentioned pressure sensor core
The pressure sensor of piece.
Specifically, Fig. 2 shows the cross-section structures according to the pressure sensor of the utility model embodiment.
In conjunction with Fig. 1 and Fig. 2 jointly shown in, pressure sensor provided by the utility model, including substrate 17 and setting exist
On substrate 17 and as above pressure sensor chip described in embodiment, is provided with and pressure sensor chip position on substrate 17
Corresponding through-hole 171 is set, through-hole 171 is corresponding with the open end of substrate 11 of above-mentioned pressure sensor chip, and setting through-hole 171 was both
It can guarantee that ambient pressure or hydraulic pressure enter inside pressure sensor chip, and component is perceived by marine glue and is acquired,
It can be controlled again by air-flow or water flow of the hole size to entrance, to avoid ambient pressure or hydraulic pressure to awareness tool
13 impact is excessive, damages awareness tool 13.
Specifically, it is additionally provided on plastic packaging glue 18 in substrate 17, and plastic packaging glue 18 is covered on the whole of pressure sensor chip
The outside of a substrate 11, plastic packaging glue 18 are a kind of colloids that can be played fixed function but also seal, will by plastic packaging glue
Pressure sensor chip is fixed on substrate, can simplify the packaging technology of pressure sensor chip and substrate.
In addition, the pressure sensor of the utility model embodiment, can also use traditional packaging technology, for example, will pressure
The open end of the substrate of sensor chip is fixed on substrate by plastic packaging glue or other modes, is then arranged on substrate and is held
Receive the shell of pressure sensor chip, shell and substrate cooperatively form receiving and protect the cavity of pressure sensor chip.
Corresponding with above-mentioned pressure sensor, the utility model also provides a kind of more function for being provided with above-mentioned pressure sensor
It can sensor.
Specifically, the Multifunction Sensor of the utility model embodiment includes the pressure sensor harmony being disposed on the substrate
Sensor is learned, pressure sensor and acoustic sensor are combined, can be realized the diversification of sensor function.
In practical applications, the Multifunction Sensor in the present embodiment can also include other kinds of sensor, such as
Optical sensor, temperature sensor etc..
By above embodiment as can be seen that provided by the utility model kind of pressure sensor chip and being provided with the core
The Multifunction Sensor of piece, has the advantage that
1, by filling the marine glue of package awareness tool between awareness tool and substrate, water proof and dust proof can either be played
Effect, be also able to solve awareness tool reduced by various aspects stress measurement accuracy even impaired problem.
2, pressure sensor chip is assembled on substrate using plastic packaging glue, assembling product technique can be simplified, avoid ring
Chip is caused to corrode or be aoxidized in border.
3, the sensor of other function and pressure sensor are assemblied together, realize the diversification of sensor function, energy
It is enough more comprehensively to detect external environment.
Described in an illustrative manner above with reference to attached drawing according to the utility model proposes a kind of pressure sensor chip
And it is provided with the Multifunction Sensor of the chip.It will be understood by those skilled in the art, however, that for above-mentioned the utility model institute
A kind of pressure sensor chip that its is proposed and the Multifunction Sensor for being provided with the chip, can also not depart from the utility model
Various improvement are made on the basis of content.Therefore, the protection scope of the utility model should be by appended claims
Hold and determines.
Claims (10)
1. a kind of pressure sensor chip, which is characterized in that be hung in the substrate including substrate and by linking arm
Awareness tool；Wherein,
The awareness tool includes structure backplane and is arranged in perception vibrating diaphragm of the structure backplane far from the one side of substrate,
Closed chamber is formed between the perception vibrating diaphragm and the structure backplane；
Filled with the marine glue for wrapping up the awareness tool between the awareness tool and the substrate.
2. pressure sensor chip as described in claim 1, which is characterized in that
The linking arm is formed by etching over the substrate.
3. pressure sensor chip as described in claim 1, which is characterized in that
The linking arm is provided at least two；
The linking arm is in symmetrical in the substrate or is uniformly distributed.
4. pressure sensor chip as described in claim 1, which is characterized in that
The substrate is rectangular parallelepiped structure open at one end, and the side wall of the substrate forms the inner cavity for accommodating the awareness tool,
The marine glue fills into the inner cavity and covers the awareness tool.
5. pressure sensor chip as described in claim 1, which is characterized in that
The longitudinal section of the structure backplane is " C " shape structure, and the open end of the structure backplane is arranged in the perception vibrating diaphragm；
The structure backplane is fixedly connected by the linking arm with the substrate far from one end of the perception vibrating diaphragm.
6. pressure sensor chip as described in claim 1, which is characterized in that
It is provided with pad over the substrate, the conducting wire for connecting the pad and the awareness tool passes through the marine glue；
The data that the awareness tool detects are transferred to external system by the conducting wire.
7. a kind of pressure sensor, which is characterized in that including substrate and setting on the substrate and such as claim 1 to 6
Described in any item pressure sensor chips；
It is provided with through-hole corresponding with the pressure sensor chip position on the substrate.
8. pressure sensor as claimed in claim 7, which is characterized in that
Plastic packaging glue is additionally provided on the substrate, and the plastic packaging glue covers the substrate of the pressure sensor chip.
9. pressure sensor as claimed in claim 7, which is characterized in that
The shell for accommodating the pressure sensor chip is additionally provided on the substrate.
10. a kind of Multifunction Sensor, which is characterized in that including the acoustic sensor being disposed on the substrate and such as claim
8 or 9 described in any item pressure sensors；Wherein,
The pressure sensor is for detecting extraneous hydraulic pressure or air pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822150734.4U CN209400124U (en) | 2018-12-20 | 2018-12-20 | Pressure sensor chip and the Multifunction Sensor for being provided with the chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822150734.4U CN209400124U (en) | 2018-12-20 | 2018-12-20 | Pressure sensor chip and the Multifunction Sensor for being provided with the chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209400124U true CN209400124U (en) | 2019-09-17 |
Family
ID=67895381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822150734.4U Active CN209400124U (en) | 2018-12-20 | 2018-12-20 | Pressure sensor chip and the Multifunction Sensor for being provided with the chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209400124U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110987280A (en) * | 2019-12-02 | 2020-04-10 | 歌尔科技有限公司 | Waterproof and dustproof pressure sensor and processing method thereof |
| WO2022111133A1 (en) * | 2020-11-30 | 2022-06-02 | 潍坊歌尔微电子有限公司 | Barometric pressure sensor assembly and packaging method therefor |
-
2018
- 2018-12-20 CN CN201822150734.4U patent/CN209400124U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110987280A (en) * | 2019-12-02 | 2020-04-10 | 歌尔科技有限公司 | Waterproof and dustproof pressure sensor and processing method thereof |
| WO2022111133A1 (en) * | 2020-11-30 | 2022-06-02 | 潍坊歌尔微电子有限公司 | Barometric pressure sensor assembly and packaging method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |