CN209400125U - Pressure sensor chip and the Multifunction Sensor for being provided with the chip - Google Patents
Pressure sensor chip and the Multifunction Sensor for being provided with the chip Download PDFInfo
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- CN209400125U CN209400125U CN201822164288.2U CN201822164288U CN209400125U CN 209400125 U CN209400125 U CN 209400125U CN 201822164288 U CN201822164288 U CN 201822164288U CN 209400125 U CN209400125 U CN 209400125U
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- 239000000758 substrate Substances 0.000 claims abstract description 75
- 230000008447 perception Effects 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 5
- 230000006355 external stress Effects 0.000 abstract 1
- 230000006870 function Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- Measuring Fluid Pressure (AREA)
Abstract
The utility model provides a kind of pressure sensor chip and the Multifunction Sensor for being provided with the chip, the awareness tool that wherein pressure sensor chip includes substrate and is hung in substrate by linking arm；Awareness tool includes structure backplane and structure backplane the is arranged in perception vibrating diaphragm far from one side of substrate, perceives and forms closed chamber between vibrating diaphragm and structure backplane；The access road with extraneous conducting is formed between structure backplane and substrate.It can reduce interference of the external stress to awareness tool, product measurement accuracy height, long service life using above-mentioned utility model.
Description
Technical field
The utility model relates to sensor technical fields, more specifically, are related to a kind of pressure sensor chip and setting
There are the pressure sensor and Multifunction Sensor of the chip.
Background technique
MEMS chip full name in English is Micro Electro Mechanical Systems, and Chinese is micro-electro-mechanical systems
System, is the research frontier of the multi-crossed disciplines to grow up in microelectric technique basis.By development in more than 40 years,
Have become one of the great sciemtifec and technical sphere that the world attractes attention.It is related to electronics, machinery, material, physics, chemistry, biology, medicine
Etc. a variety of subjects and technology.
MEMS (Micro Electro Mechanical System) pressure sensor is the pressure sensor based on MEMS technology manufacture.It is actually using
Pressure sensor in, pressure sensor chip (MEMS chip) is usually to be set up directly on substrate；Such structure is easy
The influence for causing pressure sensor chip to be changed by extraneous stress reduces measurement accuracy.For example, because substrate and pressure sensing
The coefficient of expansion of device chip is different, and when the temperature is changed, all parts deformation quantity is different and generates temperature stress, causes chip sense
Know vibrating diaphragm；Furthermore substrate is made to generate deformational stress when external force is on substrate, deformational stress is transmitted to pressure sensor
Chip and make perceive vibrating diaphragm certain deformation occurs.Finally, when being packaged to pressure sensor, the encapsulation stress of product
It can affect to pressure sensor chip.
Utility model content
In view of the above problems, the purpose of the utility model is to provide a kind of pressure sensor chip and it is provided with the chip
Multifunction Sensor is easy the influence changed by extraneous stress to solve existing pressure sensor chip, reduces product and survey
The problem of accuracy of measurement.
The pressure sensor chip provided in the utility model embodiment, including substrate and lining is hung on by linking arm
Awareness tool in bottom；Wherein, awareness tool includes structure backplane and is arranged in perception of the structure backplane far from one side of substrate
Vibrating diaphragm perceives and forms closed chamber between vibrating diaphragm and structure backplane；Pair with extraneous conducting is formed between structure backplane and substrate
Outer tunnel.
Furthermore it is preferred that structure be, access road by substrate etching formed.
Furthermore it is preferred that structure be that linking arm is provided at least two；Linking arm is in substrate in symmetrical or uniform point
Cloth.
Furthermore it is preferred that structure be that the longitudinal section of structure backplane is " C " shape structure, perception vibrating diaphragm is arranged in structure backplane
Open end；Structure backplane is connect by linking arm with substrate far from one end of perception vibrating diaphragm.
Furthermore it is preferred that structure be to be provided with pad on substrate, substrate interior is provided with connection pad and sense part
The conducting wire of part；The data that awareness tool detects are transferred to external system by conducting wire.
The utility model additionally provides a kind of pressure sensor, including substrate and is disposed on the substrate and pressure as above
Sensor chip；Through-hole corresponding with pressure sensor chip position is provided on substrate.
Furthermore it is preferred that structure be plastic packaging glue is additionally provided on substrate, and plastic packaging glue covering pressure sensor chip lining
Bottom.
Furthermore it is preferred that structure be additionally provided on substrate accommodate pressure sensor chip shell.
The utility model additionally provides a kind of Multifunction Sensor, including pressure sensor as above；Wherein, pressure sensing
Device is for detecting extraneous hydraulic pressure or air pressure.
Furthermore it is preferred that structure be further include the acoustic sensor being disposed on the substrate.
It can be seen from the above technical scheme that pressure sensor chip provided by the utility model and being provided with the more of the chip
Function sensor the bottom surface of substrate will be arranged in the access road of external world's conducting, be hung on awareness tool in substrate, can
Reduce the external interference that awareness tool is subject in application or assembling process, reduces its risk that deformation occurs, properties of product are steady
Fixed, detection accuracy is high.
Detailed description of the invention
By reference to the explanation below in conjunction with attached drawing, and with the utility model is more fully understood, this is practical new
The other purposes and result of type will be more clearly understood and understood.In the accompanying drawings:
Fig. 1 is the diagrammatic cross-section according to the pressure sensor chip of the utility model embodiment；
Fig. 2 is the diagrammatic cross-section according to the pressure sensor of the utility model embodiment；
Appended drawing reference therein includes: substrate 11, linking arm 12, awareness tool 13, structure backplane 131, perception vibrating diaphragm
132, pad 14, conducting wire 15, substrate 16, through-hole 161, plastic packaging glue 17.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific embodiment
For be described in detail the utility model pressure sensor chip structure, below with reference to attached drawing to the utility model
Specific embodiment be described in detail.
Fig. 1 shows the cross-section structure according to pressure sensor chip in the utility model embodiment.
As shown in Figure 1, the pressure sensor chip of the utility model embodiment, including substrate 11 and pass through linking arm 12
The awareness tool 13 being hung in substrate 11；Wherein, awareness tool 13 includes structure backplane 131 and is arranged in structure backplane
The 131 perception vibrating diaphragms 132 far from 11 side of substrate perceive and form closed chamber between vibrating diaphragm 132 and structure backplane 131；Structure
The access road with extraneous conducting is formed between backplane 131 and substrate 11, perception vibrating diaphragm 132 is arranged away from access road in structure
On backplane 131, awareness tool 13 is isolated with substrate 11 by access road, is packaged to pressure sensor chip
When, can influence by the deformation at access road isolation liner bottom 11 to awareness tool 13, reduce encapsulation stress to awareness tool
13 influence.
Specifically, access road or linking arm 12 can etch formation on substrate 11, that is, pass through solution, reactive ion
Or other mechanical systems are removed on substrate, remove some materials, are formed and only connect substrate 11 and perception by linking arm 12
The structure of component 13.The bottom that substrate 11 is arranged in access road can be buffered into ambient pressure to sense part by access road
The impact of part 13 enables to perceive in addition, the perception vibrating diaphragm 132 of awareness tool 13 to be provided towards to the open end of substrate
Component 13 contacts at the first time and acquires environmental signal, will perceive vibrating diaphragm at present relatively towards for the setting of the bottom of substrate, energy
Enough improve the detection accuracy of chip.
In addition, the pressure sensor chip of the utility model embodiment, linking arm 12 is provided at least two, linking arm
12 can both be symmetric in substrate 11, can also be evenly distributed, symmetrical or be uniformly distributed and can preferably make
Each 12 uniform force of linking arm prevents so that each linking arm 12 is equal to the stress of awareness tool 13 due to perception
The local stress that component 13 is subject to is excessive and reduces the generation of chip measurement accuracy problem.
In a specific embodiment of the utility model, the longitudinal section of structure backplane 131 is " C " shape structure, is had
One open end, perception vibrating diaphragm 132 are arranged at the open end of structure backplane 131, so that structure backplane 131 and perception vibrating diaphragm
Closed chamber is formed between 132, when vibrating diaphragm is known in ambient pressure contact sense 132, perception vibrating diaphragm 132 can be forced to vibrate, and compress
The indoor gas of closing chamber, then current environment barometric information is adopted in the detection circuit on cooperation perception vibrating diaphragm 132, realization
Collection；Structure backplane 131 one end or its vertical side walls far from perception vibrating diaphragm 132 are connect by linking arm 12 with substrate 11, are led to
It crosses and side of the structure backplane 131 far from perception vibrating diaphragm 132 is arranged in linking arm 12, can also reduce 12 pairs of perception vibrations of linking arm
The influence of film 132.
In addition, being additionally provided with pad 14 on substrate 11, pad 14 with external system for being electrically connected, inside substrate 11
It is provided with the conducting wire 15 of connection pad 14 and awareness tool 13；The inside that substrate 11 is arranged in conducting wire 15 can not only will be perceived
The environmental data that component 13 detects is transferred to external system, additionally it is possible to be effectively protected conducting wire 15, it is prevented to be exposed to environment
Middle generation corrosion or oxidation.
In practical applications, due to forming the access road with extraneous conducting between structure backplane 131 and substrate 11, so that
When entering 11 inside of substrate, a part of gas is passed to outside substrate 11 ambient pressure through access road, thus by external
Channel buffers direct impact of the ambient pressure to awareness tool 13, extends the service life of awareness tool 13.
Corresponding with above-mentioned pressure sensor chip, the utility model also provides one kind and is provided with above-mentioned pressure sensor core
The pressure sensor of piece.
Specifically, Fig. 2 shows the cross-section structures according to the pressure sensor of the utility model embodiment.
In conjunction with Fig. 1 and Fig. 2 jointly shown in, pressure sensor provided by the utility model, including substrate 16 and setting exist
On substrate 16 and as above pressure sensor chip described in embodiment, is provided with and pressure sensor chip position on substrate 16
Corresponding through-hole 161 is set, through-hole 162 is connected to the access road of pressure sensor chip, and setting through-hole 161 can either guarantee outer
Boundary's air pressure enters inside pressure sensor chip, and perceived component is acquired, and can be by hole size to entrance
Air-flow is controlled, to avoid direct impact of the ambient pressure to awareness tool 13.
Specifically, plastic packaging glue 17 is additionally provided on substrate 16, and plastic packaging glue 17 is covered on the whole of pressure sensor chip
The outside of a substrate 11, plastic packaging glue 17 are a kind of colloids that can be played fixed function but also seal, will by plastic packaging glue
Pressure sensor chip is fixed on substrate, can simplify the packaging technology of pressure sensor chip and substrate.
It is found that the pressure sensor of the utility model embodiment, can also use traditional packaging technology, for example, will pressure
The open end of the substrate 11 of sensor chip is fixed on substrate 16, and package pressure is coated with outside pressure sensor chip and is passed
The plastic packaging glue 17 of sensor chip, is then arranged the shell for accommodating pressure sensor chip on substrate 16, and shell and substrate cooperate
Form the cavity for accommodating and protecting pressure sensor chip.
Corresponding with above-mentioned pressure sensor, the utility model also provides a kind of more function for being provided with above-mentioned pressure sensor
It can sensor.
Specifically, the Multifunction Sensor of the utility model embodiment include the pressure sensor that is arranged on substrate 16 and
Pressure sensor and acoustic sensor are combined by acoustic sensor, can be realized the diversification of sensor function.
In practical applications, the Multifunction Sensor in the present embodiment can also include other kinds of sensor, such as
Optical sensor, temperature sensor etc..
By above embodiment as can be seen that provided by the utility model kind of pressure sensor chip and being provided with the core
The Multifunction Sensor of piece, has the advantage that
1, awareness tool is hung on by substrate interior by linking arm, is able to solve awareness tool by various aspects stress
And reduce measurement accuracy even impaired problem.
2, pressure sensor chip is assembled on substrate using plastic packaging glue, assembling product technique can be simplified, avoid ring
Chip is caused to corrode or be aoxidized in border.
3, the sensor of other function and pressure sensor are assemblied together, realize Multifunction Sensor, it can be more
Comprehensive detection external environment.
Described in an illustrative manner above with reference to attached drawing according to the utility model proposes pressure sensor chip and set
It is equipped with the Multifunction Sensor of the chip.It will be understood by those skilled in the art, however, that being proposed for above-mentioned the utility model
Pressure sensor chip and be provided with the Multifunction Sensor of the chip, can also be in the base for not departing from the content of the present invention
Various improvement are made on plinth.Therefore, the protection scope of the utility model should be determined by the content of appended claims.
Claims (10)
1. a kind of pressure sensor chip, which is characterized in that be hung in the substrate including substrate and by linking arm
Awareness tool；Wherein,
The awareness tool includes structure backplane and is arranged in perception vibrating diaphragm of the structure backplane far from the one side of substrate,
Closed chamber is formed between the perception vibrating diaphragm and the structure backplane；
The access road with extraneous conducting is formed between the structure backplane and the substrate.
2. pressure sensor chip as described in claim 1, which is characterized in that
The access road is formed by etching over the substrate.
3. pressure sensor chip as described in claim 1, which is characterized in that
The linking arm is provided at least two；
The linking arm is in symmetrical in the substrate or is uniformly distributed.
4. pressure sensor chip as described in claim 1, which is characterized in that
The longitudinal section of the structure backplane is " C " shape structure, and the open end of the structure backplane is arranged in the perception vibrating diaphragm；
The structure backplane is connect by the linking arm with the substrate far from one end of the perception vibrating diaphragm.
5. pressure sensor chip as described in claim 1, which is characterized in that
It is provided with pad over the substrate, the substrate interior is provided with leading for the connection pad and the awareness tool
Line；
The data that the awareness tool detects are transferred to external system by the conducting wire.
6. a kind of pressure sensor, which is characterized in that including substrate and setting on the substrate and such as claim 1 to 5
Described in any item pressure sensor chips；
It is provided with through-hole corresponding with the pressure sensor chip position on the substrate；The through-hole externally leads to described
Road connection.
7. pressure sensor as claimed in claim 6, which is characterized in that
Plastic packaging glue is additionally provided on the substrate, and the plastic packaging glue covers the substrate of the pressure sensor chip.
8. pressure sensor as claimed in claim 6, which is characterized in that
The shell for accommodating the pressure sensor chip is additionally provided on the substrate.
9. a kind of Multifunction Sensor, which is characterized in that including the described in any item pressure sensors of such as claim 6 to 8.
10. Multifunction Sensor as claimed in claim 9, which is characterized in that further include the acoustics sensor being disposed on the substrate
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822164288.2U CN209400125U (en) | 2018-12-20 | 2018-12-20 | Pressure sensor chip and the Multifunction Sensor for being provided with the chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822164288.2U CN209400125U (en) | 2018-12-20 | 2018-12-20 | Pressure sensor chip and the Multifunction Sensor for being provided with the chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209400125U true CN209400125U (en) | 2019-09-17 |
Family
ID=67895598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822164288.2U Active CN209400125U (en) | 2018-12-20 | 2018-12-20 | Pressure sensor chip and the Multifunction Sensor for being provided with the chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209400125U (en) |
-
2018
- 2018-12-20 CN CN201822164288.2U patent/CN209400125U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |