CN101738281B - Improved wind load pressure sensor - Google Patents
Improved wind load pressure sensor Download PDFInfo
- Publication number
- CN101738281B CN101738281B CN 200810244556 CN200810244556A CN101738281B CN 101738281 B CN101738281 B CN 101738281B CN 200810244556 CN200810244556 CN 200810244556 CN 200810244556 A CN200810244556 A CN 200810244556A CN 101738281 B CN101738281 B CN 101738281B
- Authority
- CN
- China
- Prior art keywords
- silicon
- sensitive
- sensitive chip
- pressure
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention discloses an improved wind load pressure sensor, comprising a sensor shell, an oil charge sensitive body and a signal conditioning circuit, wherein, the oil charge sensitive body is composed of a sensitivity body shell in the form of a groove, a silicon integrated sensitive chip and an elastic separation film fixed on the opening of the groove, the ring circumambience of the back pressure face of the silicon integrated sensitive chip is fixed at the bottom of the groove through a fixed supporting ring in a sealing manner, the back pressure face of the silicon integrated sensitive chip is communicated with ambient pressure through a back pressure airway tube, the pressure surface of the silicon integrated sensitive chip is provided with a Wheatstone bridge on which a strain resistor is led to the signal conditioning circuit through an internal lead and a lead column and then is output, the non-pressure surface of the silicon integrated sensitive chip is provided with a temperature sensor, a heating resistor and a constant temperature control circuit controlling the heating resistor according to the temperature sensor, and silicon oil is filled among the elastic separation film, a groove internal ring surface and the pressure surface of the silicon integrated sensitive chip. The invention can control the temperature of the oil charge sensitive body, and eliminate the problem that an oil charge micro-pressure sensor is in fault due to the influence of ambient temperature, thereby realizing high-accuracy survey of wind loads.
Description
Technical field
The present invention relates to a kind of based on the responsive principle of silicon piezoresistance type, in adorn the modified wind load pressure transducer that oil-filled sensitive body is formed, it is the slim micropressure sensor of measuring for the building surface wind load, is mainly used in rugged surroundings ability test and early warning protection systems such as buildings in the field of civil engineering is Anti-Typhoon.
Background technology
Wind load is one of the load that must consider of Architectural Structure Design.Along with development of urbanization, high buildings and large mansions are more and more, and are more and more for the research of building wind load.At present, be used for measuring wind load the influence of building is mainly contained three kinds of modes.(1) wind pressure measurement: the wind pressure that utilizes pressure transducer directly to measure buildings or its model distributes.This method can obtain mean pressure and the fluctuation pressure of partial points, to the localized design of structure helpful (as glass curtain wall etc.), can also obtain the ensemble average load by integration.(2) aeroelastic model test: adopt the aeroelastic model of geometric similarity and dynamic similarity, directly sound attitude load and the response of measurement model.But technical sophistication, the expense costliness, and when the constructure inner structure parameter change, must redesign model and test again.(3) high frequency dynamic scale test: this is a kind of new technology that grows up over nearly 20 years, adopt high natural frequency, highly sensitive high frequency dynamic scale, directly measure static state and the DYNAMIC GENERALIZED load of rigid model, then according to structural parameters, obtain the buildings dynamic response by computing, but its problem also is the expense costliness.
As everyone knows, along with the development of MEMS technology, the silicon piezoresistive pressure sensor becomes tonometric main flow, because its high precision, highly reliable, high frequency response, volume is little, cheap and extensively adopted by the national economy every field.It has 2 outstanding difficulties but in the application that wind load is measured: the one, because wind load is the measurement of slight pressure, the flexible sheet of silicon must be very thin, like this it one not wind resistance blow and drench with rain, decrease ring easily, the 2nd, the integrated sensitive chip pressure-sensitive of silicon area is too little, the measurement of single-point easily and the mean value generation than mistake.Though adopt oil-filled structure can overcome these problems, but the thing followed is that oil-filled back is because the oily error of expanding with heat and contract with cold the integrated sensitive chip of silicon being caused with external environment, be flagrant to slight pressure, the oil-filled core body of volume production is generally all more than 40kPa both at home and abroad, and during little low amount (below 5kPa), the temperature error that oil-filled back produces has no idea to overcome for many years.Therefore the silicon piezoresistive pressure sensor often is not used in industry.
Summary of the invention
In order to overcome above shortcoming, the invention provides a kind of modified wind load pressure transducer, by the inner embedding of oil-filled sensitive body temperature sensor, well heater and a temperature-control circuit, integral body is under the isoperibol that is not subjected to ectocine works, then overcome oil-filled back sensor and varied with temperature the flagrant error that produces, thereby also solved the application difficult problem of silicon piezoresistive pressure sensor in wind load is measured.
Technical scheme of the present invention is such realization: a kind of modified wind load pressure transducer, comprise sensor housing, oil-filled sensitive body and signal conditioning circuit plate, this oil-filled sensitive body is by the sensitive body housing that is groove, the integrated sensitive chip of silicon, Gu supporting ring is formed with the elastomeric isolation film that is sealingly fastened in this groove mouth, the integrated sensitive chip back pressure of this silicon face ring week is sealingly fastened in this bottom portion of groove by solid supporting ring, the integrated sensitive chip back pressure of this silicon face is communicated with ambient pressure by the back pressure wireway on this bottom portion of groove with the back pressure cavity that forms between the supporting ring inner ring surface admittedly, the integrated sensitive chip compression face of this silicon is provided with the sensitizing range of Wheatstone bridge, strain resistor is drawn by internal lead on this Wheatstone bridge, and the stem at the bottom of this groove is exported after patchcord is incorporated into this signal conditioning circuit plate, the non-sensitive district of the integrated sensitive chip compression face of this silicon also is provided with the temperature-sensitive sensor, heating resistor and the constant temperature control circuit that heats according to this temperature-sensitive sensor control, this elastomeric isolation film, the oil-filled chamber that forms between the integrated sensitive chip of groove inner ring surface and silicon is filled with the pressure conductive medium, and:
1) the integrated sensitive chip of this silicon is that monolithic is integrated or mix integrated.
2) this sensor housing is made up of the pedestal that is flat tubulose and the base plate that is sealingly fastened in this base bottom, this sensitive body housing perimembranous is sealingly fastened in the stepped hole of this pedestal by O-ring seal, form inner cavity chamber between this pedestal inner peripheral surface, sensitive body housing bottom surface and the base plate, this signal conditioning circuit plate is fixed in this inner cavity chamber by insulation spacer, and by this pedestal sidepiece signal extension line outputting standard voltage output signal, this back pressure wireway is communicated with this inner cavity chamber, and is communicated with ambient pressure through the kapillary of this pedestal sidepiece.
As a further improvement on the present invention, fixedly there is upper cover plate in this pedestal top ring week, and this upper cover plate is provided with a plurality of wind and rain holes of being convenient to introduce wind load to position that should stepped hole, and this pedestal top-side also is provided with the osculum for the drainage rainwater.
As a further improvement on the present invention, should solid supporting ring be Pyrex glass ring or the GG-17 Pyrex ring with silicon expansion characteristics, perhaps should solid supporting ring for having rise another silicon chip of characteristic of identical heat with the integrated sensitive chip of this silicon, and be fixed in the integrated sensitive chip of this silicon by Si-Si bonding.
As a further improvement on the present invention, the integrated sensitive chip of this silicon pressure drag signal of drawing through this signal regulating panel carry out that performance compensation, differential mode amplify, the zero-bit imbalance and suppress common mode interference after form the normal voltage output signal.
As a further improvement on the present invention, the thickness of this sensor housing is not more than 15mm, and diameter is not more than 50mm, and this oil-filled sensitive body pressure range is not more than 5kPa.
As a further improvement on the present invention, this pressure conductive medium is silicone oil.
Useful technique effect of the present invention is: well-known; when by measuring pressure less than certain pressure; during as 40kPa; just can not adopt oil-filled mode to come the integrated sensitive chip of silicon is protected; its reason is exactly because pressure is too little; the output that the silicone oil of filling is produced by variation of ambient temperature to expand with heat and contract with cold core body is produced is greater than by output that measuring pressure produces, even can destroy the sensitive diaphragm of silicon.The present invention adopts on the integrated sensitive chip of silicon an integrated heating resistor, temperature-sensitive sensor and one to have degenerative constant temperature control circuit, when this wind load working sensor, this heating resistor heats to the integrated sensitive chip of this silicon and then to this oil-filled sensitive body, measure and measuring-signal is input to this by this temperature-sensitive sensor for temperature and have in the degenerative constant temperature control circuit, thereby make this sensor always keep a temperature a little more than environment temperature.The silicone oil volume of pressure conductive medium is not changed with the variation of ambient temperature, guaranteed that oil-filled sensitive body that range is not more than 5kPa can eliminate the influence of variation of ambient temperature, obtain result more accurately;
Simultaneously, the chamber that forms between this elastomeric isolation film and the integrated sensitive chip of this silicon is filled with the pressure conductive medium, avoided the integrated sensitive chip of this silicon directly to contact with test environment, improved the adaptability of sensor to test environment, by back pressure cavity wireway and kapillary the integrated sensitive chip back pressure of this silicon face is communicated with ambient pressure simultaneously, has realized the reference pressure measurement;
Have again because directly and measured what contact is the elastomeric isolation film, and can breaking away from the characteristic of semiconductor silicon, the area of elastomeric isolation film designs, thereby the measurement area of design easily, make measurement result break away from the influence of microcosmic fluctuation, have more broad perspectives, to using value is more arranged on the engineering.
The modified wind load pressure transducer of being formed by this oil-filled sensitive body, the sensitive element that adopts the integrated sensitive chip of silicon to measure as wind load, because it is little that the integrated sensitive chip of silicon has size, characteristics such as response is fast, bandwidth are for the measurement of buildings wind load provides good survey instrument.(height is no more than 15mm owing to this base size is little simultaneously, diameter is less than 50mm), therefore compare with buildings, the sensor profile is ultra-thin, be attached to building surface and do not influence the fluid field of force, the natural frequency height, guaranteed the accuracy of measuring, authenticity, the integrated sensitive chip of silicon has the high sensitivity under the minute-pressure range simultaneously, output signal is big, be convenient to back end signal and handle and gather, consider that the measurement of skyscraper wind load belongs to micro pressure measuring, need a stable reference pressure source, this capillary design is convenient to be connected to a suitable reference pressure source, has improved measuring accuracy and the stability of sensor.
Consider that the wind load sensor often is in the test environment of rainy water, on the pedestal of sensor, not only design the wind and rain hole but also designed osculum, this had both realized the effective measurement to the wind and rain combined load, avoided measuring sensitive element again and was immersed in water for a long time, had prolonged the serviceable life of sensor.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of oil-filled sensitive body described in the present invention;
Fig. 3 is the structural representation of the integrated sensitive chip of silicon described in the present invention;
Fig. 4 is the structural representation of upper cover plate described in the present invention.
And contrast Fig. 1, Fig. 2, Fig. 3 and Fig. 4 make the following instructions:
1---pedestal 31---sensitive body housing
2---upper cover plate 32---stem
3---oil-filled sensitive body 33---back pressure wireway
4---O-ring seal 34---oil-filled chamber
5---signal conditioning circuit plate 35---elastomeric isolation film
6---insulation spacer 36---internal lead
The integrated sensitive chip of 7---kapillary 37---silicon
Gu 8---signal extension line 38---supporting ring
9---base plate
10---patchcord 40---sensitizing range
The non-sensitive district of 11---osculums 41---
12---the wind and rain hole
13---inner cavity chamber
Embodiment
In conjunction with Fig. 1, Fig. 2, Fig. 3 and Fig. 4, below be further described:
A kind of modified wind load pressure transducer, comprise sensor housing, oil-filled sensitive body 3 and signal conditioning circuit plate 5 (as shown in Figure 1), this sensor housing is made up of the pedestal 1 that is flat tubulose and the base plate 9 that is sealingly fastened in this base bottom, this oil-filled sensitive body 3 is by the sensitive body housing 31 that is groove, the integrated sensitive chip 37 of silicon, Gu supporting ring 38 is formed (as shown in Figure 2) with the elastomeric isolation film 35 that is sealingly fastened in this groove mouth, these sensitive body housing 31 perimembranous are sealingly fastened in the stepped hole of this pedestal front end by O-ring seal 4, Kong Ze becomes the pressure-sensitive mouth on this stepped hole because the elastomeric isolation diaphragm is exposed, (see figure 1), integrated 37 back pressure face ring weeks of sensitive chip of this silicon are sealingly fastened in this bottom portion of groove by solid supporting ring 38 bottom surfaces, the integrated sensitive chip back pressure of this silicon face is communicated with inner cavity chamber by back pressure wireway 33 on this bottom portion of groove with the back pressure cavity that forms between the supporting ring inner ring surface admittedly, the integrated sensitive chip compression face of this silicon is provided with the sensitizing range 40 of Wheatstone bridge, strain resistor is drawn by internal lead 36 on this Wheatstone bridge, and the stem 32 at the bottom of this groove and patchcord 10 be incorporated into this signal conditioning circuit plate 5 from this stepped hole bottom after output, the non-sensitive district 41 of the integrated sensitive chip compression face of this silicon also is provided with the temperature-sensitive sensor, heating resistor and the constant temperature control circuit that heats according to this temperature-sensitive sensor control, be provided with the sensitizing range 40 of Wheatstone bridge and be provided with the temperature-sensitive sensor, heating resistor and can be single chip integrated according to the non-sensitive district 41 of the constant temperature control circuit of this temperature-sensitive sensor control heating, also can be that the split mixing is integrated, this elastomeric isolation film, the oil-filled chamber 34 that forms between the integrated sensitive chip compression face of groove inner ring surface and silicon is filled with the silicone oil as the pressure conductive medium, and this pedestal inner peripheral surface, form inner cavity chamber 13 between sensitive body housing bottom and the base plate, this signal conditioning circuit plate is fixed in this inner cavity chamber by insulation spacer 6, and by these pedestal sidepiece signal extension line 8 outputting standard voltage output signals, this inner cavity chamber 13 that is communicated with this back pressure wireway 33 is communicated with ambient pressure through the kapillary 7 of this pedestal sidepiece.
Consider that the wind load sensor often is in the test environment of rainy water, fixedly there is upper cover plate 2 in this pedestal top ring week, position that should stepped hole is provided with a plurality of wind and rain holes 12 (as shown in Figure 4) of being convenient to introduce wind load, the diameter that is positioned at this wind and rain hole of this upper cover plate is not more than 3mm, this pedestal top-side also is provided with the osculum 11 of draining rainwater, this had both realized the effective measurement to the wind and rain combined load, avoid measuring sensitive element again and be immersed in water for a long time, prolonged the serviceable life of sensor.
Should can be Pyrex glass ring or the GG-17 Pyrex with silicon expansion coefficient by solid supporting ring, this Pyrex glass ring is the product of Corning Incorporated (Corning), it is to aim at semiconductor package designs, has the physical property that approaches with silicon, and homemade substitute products are the GG-17 Pyrex; Should also can be made based on MEMS (Micro Electro Mechanical System) silicon body micromachined technology by silicon materials by solid supporting ring.The pressure drag signal that the integrated sensitive chip of this silicon is drawn forms the normal voltage output signal after this plate carries out performance compensation, differential mode amplification, zero-bit imbalance and suppresses common mode interference.The thickness of this sensor housing is not more than 15mm, and diameter is not more than 50mm, and this oil-filled sensitive body pressure range is not more than 5kPa.
The Wheatstone bridge of the integrated sensitive chip of this silicon partly adopts Chinese patent " a kind of Dimesize dynamic piezoresistance, pressure sensor and manufacture method thereof " (patent No. ZL2003101063298) public technology scheme to make.
Modified wind load pressure transducer measuring principle is: when wind load acts on the elastomeric isolation film 35 of oil-filled sensitive body 3 by upper cover plate 2, the wind and rain hole 12 of upper cover plate 2 has filtered the particle of solid shape, big water droplet etc., mainly be that wind action makes elastomeric isolation film 35 produce deformation and make, pressure transmission medium by 34 li of oil-filled chambers, transfer the pressure on the integrated sensitive chip 37 of silicon, Wheatstone bridge on the integrated sensitive chip 37 of silicon changes into electric signal output to pressure signal, and the oil-filled sensitive body that always is in temperature constant state has guaranteed that signal of sensor does not change with the variation of environment temperature, thereby has realized the measurement of high-precision wind load.Because working environment generally with rainwater, is not soaked by rainwater for a long time in order to protect the oil-filled sensitive body 3 that contains the integrated sensitive chip of silicon, in time rainwater is discharged by osculum 11.This kapillary 7 plays the measurement wind load reference pressure is provided.
Claims (7)
1. modified wind load pressure transducer, comprise sensor housing, oil-filled sensitive body (3) and signal conditioning circuit plate (5), it is characterized in that, this oil-filled sensitive body (3) is by the sensitive body housing (31) that is groove, the integrated sensitive chip of silicon (37), Gu supporting ring (38) and the elastomeric isolation film (35) that is sealingly fastened in this groove mouth are formed, the integrated sensitive chip of this silicon (37) back pressure face ring week is sealingly fastened in this bottom portion of groove by solid supporting ring (38), the integrated sensitive chip back pressure of this silicon face is communicated with ambient pressure by the back pressure wireway (33) on this bottom portion of groove with the back pressure cavity that forms between the supporting ring inner ring surface admittedly, the integrated sensitive chip compression face of this silicon is provided with the sensitizing range (40) of Wheatstone bridge, strain resistor is drawn by internal lead (36) on this Wheatstone bridge, and output after stem (32) is incorporated into this signal conditioning circuit plate (5) at the bottom of this groove, also be provided with the temperature-sensitive sensor in the non-sensitive district (41) of the integrated sensitive chip compression face of this silicon, heating resistor and the constant temperature control circuit of controlling this heating resistor according to this temperature-sensitive sensor, this elastomeric isolation film, the oil-filled chamber (34) that forms between the integrated sensitive chip compression face of groove inner ring surface and silicon is filled with the pressure conductive medium, and:
1) the integrated sensitive chip of this silicon is that monolithic is integrated or mix integrated;
2) this sensor housing is made up of the pedestal that is flat tubulose (1) and the base plate (9) that is sealingly fastened in this base bottom, this sensitive body housing (31) perimembranous is sealingly fastened in the stepped hole of this pedestal front end by O-ring seal (4), this pedestal inner peripheral surface, form inner cavity chamber (13) between sensitive body housing bottom surface and the base plate, this signal conditioning circuit plate is fixed in this inner cavity chamber by insulation spacer (6), and by this pedestal sidepiece signal extension line (8) outputting standard voltage output signal, this back pressure wireway (33) is communicated with this inner cavity chamber (13), and is communicated with ambient pressure through the kapillary (7) of this pedestal sidepiece.
2. a kind of modified wind load pressure transducer as claimed in claim 1, it is characterized in that, all fixed cover plates (2) are encircled at this pedestal top, this upper cover plate is provided with a plurality of wind and rain holes (12) of being convenient to introduce wind load to position that should stepped hole, and this pedestal top-side also is provided with for the osculum (11) of draining rainwater.
3. a kind of modified wind load pressure transducer as claimed in claim 1 is characterized in that, this solid supporting ring is Pyrex glass ring or the GG-17 Pyrex with silicon expansion characteristics.
4. a kind of modified wind load pressure transducer as claimed in claim 3 is characterized in that, this solid supporting ring is for having rise another silicon chip of characteristic of identical heat with the integrated sensitive chip of this silicon, and is fixed in the integrated sensitive chip of this silicon by Si-Si bonding.
5. a kind of modified wind load pressure transducer as claimed in claim 3, it is characterized in that the pressure drag signal that the integrated sensitive chip of this silicon is drawn forms the normal voltage output signal after this signal regulating panel carries out sensor characteristic compensation, differential mode amplification, zero-bit imbalance and suppresses common mode interference.
6. a kind of modified wind load pressure transducer as claimed in claim 3 is characterized in that the thickness of this sensor housing is not more than 15mm, and diameter is not more than 50mm, and this oil-filled sensitive body pressure range is not more than 5kPa.
7. a kind of modified wind load pressure transducer as claimed in claim 3 is characterized in that, this pressure conductive medium is silicone oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810244556 CN101738281B (en) | 2008-11-20 | 2008-11-20 | Improved wind load pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810244556 CN101738281B (en) | 2008-11-20 | 2008-11-20 | Improved wind load pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101738281A CN101738281A (en) | 2010-06-16 |
| CN101738281B true CN101738281B (en) | 2013-09-11 |
Family
ID=42462043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810244556 Active CN101738281B (en) | 2008-11-20 | 2008-11-20 | Improved wind load pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101738281B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013100546A1 (en) * | 2011-12-28 | 2013-07-04 | 주식회사 포스코 | Sensor device and cooling system performance evaluation apparatus comprising same |
| CN102620867B (en) * | 2012-04-17 | 2013-09-25 | 南京工业大学 | Field detection method and device for glass temperature stress of glass curtain wall |
| CN103196617B (en) * | 2013-03-21 | 2014-10-15 | 西安交通大学 | Cylinder type ultra-high-pressure sensor of side cavity oil charging structure |
| CN104316093B (en) * | 2014-10-10 | 2017-10-31 | 中广核工程有限公司 | Pressure resistant vessel sensor outgoing line sealing device |
| CN107991351B (en) * | 2017-11-17 | 2020-09-18 | 中国电子科技集团公司第四十八研究所 | Integrated hydrogen sensor and manufacturing method thereof |
| CN108318218B (en) * | 2018-05-14 | 2024-01-16 | 中国空气动力研究与发展中心低速空气动力研究所 | Flexible film type multi-measuring-point pressure measuring belt for low-speed wind tunnel |
| CN109189116B (en) * | 2018-08-14 | 2022-01-14 | 上海华虹宏力半导体制造有限公司 | Temperature maintaining device and method for integrated circuit chip |
| CN110375897A (en) * | 2019-07-30 | 2019-10-25 | 中车长春轨道客车股份有限公司 | A kind of load cell and its constant temperature keep system |
| CN111912560B (en) * | 2020-07-14 | 2021-08-24 | 嘉兴学院 | Wind load pressure sensor equipment |
| CN112378553B (en) * | 2020-11-06 | 2023-01-17 | 北京自动化控制设备研究所 | Silicon piezoresistive pressure sensor with online temperature control calibration and temperature calibration method thereof |
-
2008
- 2008-11-20 CN CN 200810244556 patent/CN101738281B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101738281A (en) | 2010-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101738281B (en) | Improved wind load pressure sensor | |
| EP1883797B1 (en) | Line pressure measurement using differential pressure sensor | |
| Ko et al. | Touch mode capacitive pressure sensors | |
| US4565096A (en) | Pressure transducer | |
| JP4378617B2 (en) | Micro electromechanical sensor | |
| US7150195B2 (en) | Sealed capacitive sensor for physical measurements | |
| EP1359402B1 (en) | Pressure sensor | |
| CN100561156C (en) | The SOI complete silicon structure silicone-oil-filling high-temperature-resistance pressure sensor | |
| CN103454032A (en) | Pressure sensitive core with thermistor | |
| CN102012288B (en) | Composite micro-electro-mechanical system (MEMS) high-temperature resistant ultrahigh-pressure sensor | |
| EP3123134B1 (en) | Span line pressure effect compensation for diaphragm pressure sensor | |
| CN2938053Y (en) | Silicon pressure sensor | |
| CN103983395B (en) | A kind of micropressure sensor and preparation thereof and detection method | |
| CN110595672A (en) | Novel high-accuracy differential pressure transmitter | |
| US10288510B2 (en) | Footed pressure measuring device | |
| CN203178006U (en) | Pressure transducer packaging structure | |
| CN206695932U (en) | Triplex redundance pressure sensor | |
| CN102175305B (en) | Single chip integrated trivector vibration sensor | |
| CN101470034B (en) | Wind load pressure transducer | |
| CN207197705U (en) | Temperature-compensating graphene pressure sensor in a kind of piece | |
| CN203364882U (en) | Temperature and pressure integrated sensitive assembly | |
| CN102539063B (en) | High-pressure sensor chip with SOI (silicon on insulator) rectangular film structure | |
| Sandrimani et al. | Design and simulation of silicon on insulator based piezoresistive pressure sensor | |
| CN109994596A (en) | A kind of high-performance wide-range band temperature sensitive type film chip varistor | |
| CN103196617A (en) | Cylinder type ultra-high-pressure sensor of side cavity oil charging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |