CN210741726U - Pressure transmitter - Google Patents

Pressure transmitter Download PDF

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Publication number
CN210741726U
CN210741726U CN201921470395.6U CN201921470395U CN210741726U CN 210741726 U CN210741726 U CN 210741726U CN 201921470395 U CN201921470395 U CN 201921470395U CN 210741726 U CN210741726 U CN 210741726U
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China
Prior art keywords
pressure
pressure transmitter
capsule
circuit board
bottom wall
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CN201921470395.6U
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Chinese (zh)
Inventor
刘同庆
林智敏
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WUXI SENCOCH SEMICONDUCTOR CO Ltd
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WUXI SENCOCH SEMICONDUCTOR CO Ltd
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Abstract

The utility model provides a pressure transmitter, including casing, pressure measurement diaphragm capsule, sensor chip subassembly and pressure transmission layer. Wherein a containing cavity is arranged in the shell. A piezometric capsule is arranged in the accommodating cavity and comprises an inner capsule and an outer capsule. The sensor chip assembly is arranged in the inner membrane box and comprises a circuit board, a chip and a temperature sensitive element, wherein the chip and the temperature sensitive element are respectively positioned on two opposite sides of the circuit board in the thickness direction of the circuit board. The pressure transmission layer is arranged in the outer film box so as to transmit the pressure applied to the outer film box to the sensor chip assembly. The utility model discloses a pressure transmitter can realize the monitoring to pressure and ambient temperature to simple structure, simple to operate, manufacturing cost are lower, are convenient for enlarge pressure transmitter's range of application.

Description

Pressure transmitter
Technical Field
The utility model belongs to the technical field of pressure transmitter, concretely relates to pressure transmitter, especially an isolated pressure transmitter.
Background
The sensor is a detection device which can sense measured information, such as pressure, temperature, liquid level and the like, and convert the sensed information into electric signals according to a certain rule so as to meet the requirements of information transmission, processing, display, recording, control and the like. The sensor is generally composed of a sensing element and a conversion element, and conversion from non-electric quantity information to electric quantity signals is realized.
The silicon piezoresistive pressure transmitter is a sensor which outputs a standard signal. Can be divided into two types according to the structure: a media direct contact sensor and an isolation diaphragm sensor. The isolating membrane sensor seals a sensor chip in silicon oil through an oil filling process, pressure is transmitted to the chip through the metal isolating membrane and the silicon oil, and then the pressure of a medium is detected through signal conversion and calibration.
The isolation diaphragm sensor has wide medium measurement range and high reliability, but the existing isolation diaphragm sensor has high material and production cost and large one-time investment, and limits the application range to a certain extent.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a pressure transmitter.
The utility model provides a pressure transmitter, include:
a housing having an accommodating chamber therein;
the piezometric membrane box is arranged in the accommodating cavity and comprises an inner membrane box and an outer membrane box;
the sensor chip assembly is arranged in the inner membrane box and comprises a circuit board, a chip and a temperature sensitive element, wherein the chip and the temperature sensitive element are respectively positioned on two opposite sides of the circuit board in the thickness direction of the circuit board;
a pressure transfer layer disposed within the outer membrane cartridge to transfer pressure experienced by the outer membrane cartridge to the sensor chip assembly.
Optionally, the chip is disposed on a side of the circuit board facing the outer capsule, and the temperature sensitive element is disposed on a side of the circuit board facing away from the outer capsule.
Optionally, a side of the chip facing the outer capsule is attached to the pressure transmission layer.
Optionally, the sensor chip assembly further includes a connection terminal, a first end of the connection terminal is connected to the circuit board, and a second end of the connection terminal is located outside the pressure transmitter.
Optionally, the medium of the pressure transmission layer is silicone oil.
Optionally, the outer bellows is a rubber bellows or a silica gel bellows.
Optionally, the accommodating cavity comprises a first bottom wall, a first side wall extending from the end of the first bottom wall to the direction close to the inner bellows, and a first top wall extending from the end of the first side wall to the direction far away from the center of the casing;
the outer diaphragm capsule comprises a second bottom wall, a second side wall and a second top wall, wherein the second side wall extends from the end part of the second bottom wall to the direction close to the inner diaphragm capsule, and the second top wall extends from the end part of the second side wall to the direction far away from the center of the outer diaphragm capsule; wherein the content of the first and second substances,
the second bottom wall is opposite to the first bottom wall, the second side wall is opposite to the first side wall, and the second top wall is erected on the first top wall.
Optionally, a gap exists between the second bottom wall and the first bottom wall; and/or the presence of a gas in the gas,
a gap exists between the second sidewall and the first sidewall.
Optionally, the housing is made of a metal material.
Optionally, the inner bellows is integrally formed with the housing.
The utility model provides a pressure transmitter, including casing, pressure measurement diaphragm capsule, sensor chip subassembly and pressure transmission layer. Wherein the casing is internally provided with an accommodating cavity, the piezometric capsule is arranged in the accommodating cavity and comprises an inner capsule box and an outer membrane box, the sensor chip assembly is arranged in the inner membrane box and comprises a circuit board, a chip and a temperature sensitive element which are respectively positioned at two opposite sides of the circuit board in the thickness direction, and the pressure transmission layer is arranged in the outer membrane box so as to transmit the pressure applied to the outer membrane box to the sensor chip assembly. The utility model discloses a pressure transmitter can realize simultaneously to pressure and ambient temperature's monitoring to simple structure, simple to operate, manufacturing cost are lower, are convenient for enlarge pressure transmitter's range of application.
Drawings
Fig. 1 is a schematic structural diagram of the pressure transmitter of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the present invention provides a pressure transmitter 100 comprising a housing 110, a pressure capsule 120, a sensor chip assembly 130, and a pressure transfer layer 140. Wherein the housing 110 is provided with an accommodating chamber 111 therein. A piezometric capsule 120 is disposed in the accommodating chamber 111, and the piezometric capsule 120 includes an inner capsule 121 and an outer capsule 122. The sensor chip assembly 130 is disposed in the inner capsule 121, and includes a circuit board 131, and a chip 132 and a temperature sensitive element 133 respectively located on opposite sides of the circuit board 131 in a thickness direction thereof. A pressure transfer layer 140 is disposed within outer capsule 122 to transfer pressure experienced by outer capsule 122 to sensor chip assembly 130. After the outer bellows 122 senses pressure, the pressure is transmitted to the inner diaphragm casing 121 through the pressure transmission layer 140, so that the pressure measurement is realized, and the temperature sensitive element 133 on the inner diaphragm casing 121 can directly sense the temperature change, so that the pressure and the ambient temperature measurement is realized.
As shown in fig. 1, a chip 132 is disposed on the lower side of the circuit board 131 to sense the pressure applied to the outer capsule, and a temperature sensor 133 is disposed on the upper side of the circuit board 131 to sense the temperature of the environment, so that the pressure and the temperature of the environment can be measured.
As shown in fig. 1, the side of the chip 132 facing the outer capsule 122 is attached to a pressure transfer layer 140 to facilitate more accurate pressure measurement.
As shown in fig. 1, sensor chip assembly 130 further includes a terminal block 134, a first end of terminal block 134 being connected to circuit board 131, and a second end of terminal block 134 being located outside of pressure transmitter 100. The connection terminal 131 can transmit the pressure signal and the temperature signal, for example, to an external control terminal to monitor the pressure and the ambient temperature.
It should be noted that, before use, the pressure transmitter 100 is installed as follows: the sensor integrated chip 130 and the temperature sensitive element 133 are first mounted on the circuit board 131, then the outer capsule 122 is loaded into the housing 110 and then the circuit board 131, after riveting, the medium of the pressure transmission layer 140 is filled into the outer capsule 122, then the medium filling hole (not shown) is sealed by welding, and the connection terminal 134 is welded after cleaning.
Preferably, the medium of the pressure transmission layer 140 is silicone oil.
Specifically, the outer bellows 122 may be a rubber bellows, or a silica gel bellows. The outer bellows 122 can play a role of medium isolation and protect the circuit board 131, and can ensure the normal transmission of the pressure signal. The utility model discloses a pressure transmitter 100 compares with traditional metal barrier film changer, has greatly reduced manufacturing cost.
As shown in fig. 1, the accommodating chamber 111 includes a first bottom wall 111a, a first side wall 111b extending from an end of the first bottom wall in a direction approaching the inner capsule, and a first top wall 111c extending from an end of the first side wall in a direction away from the center of the housing. The outer capsule 122 includes a second bottom wall 122a, a second side wall 122b extending from an end of the second bottom wall in a direction closer to the inner capsule, and a second top wall 122c extending from an end of the second side wall in a direction away from the center of the outer capsule. The second bottom wall 122a is disposed opposite to the first bottom wall 111a, the second side wall 122b is disposed opposite to the first side wall 111b, and the second top wall 122c is erected on the first top wall 111 c. The structural arrangement of the accommodating chamber 111 and the outer film case 122 can ensure the accuracy of pressure transmission and facilitate installation.
As shown in fig. 1, a gap exists between the second bottom wall 122a and the first bottom wall 111a, and a gap exists between the second side wall 122b and the first side wall 111 b.
Preferably, the housing 110 is made of metal.
Preferably, the inner membrane cassette 121 is integrally formed with the housing 110.
The utility model discloses a pressure transmitter can realize simultaneously to pressure and ambient temperature's monitoring to simple structure, simple to operate, manufacturing cost are lower, are convenient for enlarge pressure transmitter's range of application.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (10)

1. A pressure transmitter, comprising:
a housing having an accommodating chamber therein;
the piezometric membrane box is arranged in the accommodating cavity and comprises an inner membrane box and an outer membrane box;
the sensor chip assembly is arranged in the inner membrane box and comprises a circuit board, a chip and a temperature sensitive element, wherein the chip and the temperature sensitive element are respectively positioned on two opposite sides of the circuit board in the thickness direction of the circuit board;
a pressure transfer layer disposed within the outer membrane cartridge to transfer pressure experienced by the outer membrane cartridge to the sensor chip assembly.
2. The pressure transmitter of claim 1 wherein the chip is disposed on a side of the circuit board facing the outer capsule and the temperature sensitive element is disposed on a side of the circuit board facing away from the outer capsule.
3. The pressure transmitter of claim 2 wherein a side of the chip facing the outer capsule is bonded to the pressure transfer layer.
4. The pressure transmitter of any one of claims 1-3, wherein the sensor chip assembly further comprises a terminal, a first end of the terminal being connected to the circuit board, and a second end of the terminal being located outside of the pressure transmitter.
5. Pressure transmitter according to any of claims 1-3, characterized in that the medium of the pressure transmission layer is silicone oil.
6. The pressure transmitter according to any one of claims 1 to 3, wherein the outer bellows is a rubber bellows or a silica gel bellows.
7. The pressure transmitter according to any one of claims 1 to 3, wherein the accommodating chamber includes a first bottom wall, a first side wall extending from an end of the first bottom wall in a direction toward the inner capsule, and a first top wall extending from an end of the first side wall in a direction away from a center of the housing;
the outer diaphragm capsule comprises a second bottom wall, a second side wall and a second top wall, wherein the second side wall extends from the end part of the second bottom wall to the direction close to the inner diaphragm capsule, and the second top wall extends from the end part of the second side wall to the direction far away from the center of the outer diaphragm capsule; wherein the content of the first and second substances,
the second bottom wall is opposite to the first bottom wall, the second side wall is opposite to the first side wall, and the second top wall is erected on the first top wall.
8. The pressure transmitter of claim 7, wherein a gap exists between the second bottom wall and the first bottom wall; and/or the presence of a gas in the gas,
a gap exists between the second sidewall and the first sidewall.
9. The pressure transmitter according to any one of claims 1 to 3, wherein the housing is made of a metal material.
10. Pressure transmitter according to any of claims 1-3, characterized in that the inner bellows is formed integrally with the housing.
CN201921470395.6U 2019-09-05 2019-09-05 Pressure transmitter Active CN210741726U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921470395.6U CN210741726U (en) 2019-09-05 2019-09-05 Pressure transmitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921470395.6U CN210741726U (en) 2019-09-05 2019-09-05 Pressure transmitter

Publications (1)

Publication Number Publication Date
CN210741726U true CN210741726U (en) 2020-06-12

Family

ID=70981787

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921470395.6U Active CN210741726U (en) 2019-09-05 2019-09-05 Pressure transmitter

Country Status (1)

Country Link
CN (1) CN210741726U (en)

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GR01 Patent grant
GR01 Patent grant
CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000

Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd.

Address before: Building A10, No. 777 Jianshe West Road, Binhu District, Wuxi City, Jiangsu Province, 214063, 3rd Floor, Auxiliary Building

Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd.