CN210893495U - Isolated pressure sensor - Google Patents
Isolated pressure sensor Download PDFInfo
- Publication number
- CN210893495U CN210893495U CN201921885788.3U CN201921885788U CN210893495U CN 210893495 U CN210893495 U CN 210893495U CN 201921885788 U CN201921885788 U CN 201921885788U CN 210893495 U CN210893495 U CN 210893495U
- Authority
- CN
- China
- Prior art keywords
- isolation
- pressure sensor
- bottom wall
- capsule
- isolated pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002955 isolation Methods 0.000 claims abstract description 65
- 239000002775 capsule Substances 0.000 claims abstract description 23
- 229920002545 silicone oil Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model provides an isolated pressure sensor belongs to sensor technical field, and at least part is solved current pressure sensor structure complicacy, and the metal barrier film oil charge core of wide application is with high costs among isolated pressure sensor, output is low, to the sensitive field of price, uses difficult scheduling problem in batches, the embodiment of the utility model provides an isolated pressure sensor includes the base, be provided with in the base and hold the chamber, and set up hold the sensor chip subassembly and the isolation diaphragm capsule of intracavity, when pressure is used on the isolation diaphragm capsule, the isolation diaphragm capsule receives the extrusion, and pressure transmission to the pressure information transmission to the outside device that sensor chip subassembly sensed.
Description
Technical Field
The utility model belongs to the technical field of the sensor, concretely relates to isolated pressure sensor.
Background
The sensor is a detection device which can sense measured information, such as pressure, temperature, liquid level and the like, and convert the sensed information into electric signals according to a certain rule so as to meet the requirements of information transmission, processing, display, recording, control and the like. The sensor is generally composed of a sensing element and a conversion element, and is used for converting non-electricity into electricity.
Pressure sensors have been widely used in the fields of industrial automation, aerospace, automotive electronics, biomedicine, consumer electronics, and the like, as key devices for acquiring information. With the continuous development of fields such as unmanned aerial vehicles/robots, automatic driving, industrial 4.0, wearable equipment, artificial intelligence, 5G and the like, the demand for various pressure sensors is continuously increased in the future.
Silicon is a semiconductor material, cannot be in direct contact with conductive media such as water and the like, and is usually required to be isolated by an oil-filled isolation process. The metal isolating membrane oil-filled core body widely applied at present has high cost and low yield, is mainly suitable for the fields of industry and military industry, and cannot be applied in batch in the fields such as constant-pressure water supply, air compressors, small household appliances and the like which are very sensitive to price.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide an isolated pressure sensor, include:
the base is internally provided with an accommodating cavity;
the pressure measuring capsule is arranged in the accommodating cavity and comprises a bearing capsule and an isolation capsule;
the sensor chip assembly is arranged in the bearing diaphragm box and comprises a circuit board, a sensor chip arranged on one side of the circuit board, which faces the isolation diaphragm box, and a connecting terminal arranged on one side of the circuit board, which faces away from the isolation diaphragm box, and penetrates out of the bearing diaphragm box;
and the isolation medium layer is filled in the isolation diaphragm box so as to isolate the sensor chip assembly.
Further, the bearing bellows and the base form an integral structure.
Furthermore, one side of the sensor chip, which faces the isolation diaphragm capsule, is attached to the isolation medium layer.
Furthermore, the medium of the isolation medium layer is silicone oil.
Further, the accommodating cavity comprises a first bottom wall, a first side wall extending from the end of the first bottom wall to the direction close to the bearing bellows and a first top wall extending from the end of the first side wall to the direction far away from the center of the base;
the isolation bellows comprises a second bottom wall, a second side wall and a second top wall, wherein the second side wall extends from the end part of the second bottom wall to the direction close to the bearing bellows, and the second top wall extends from the end part of the second side wall to the direction far away from the center of the isolation bellows; wherein,
the second bottom wall is opposite to the first bottom wall, the second side wall is opposite to the first side wall, and the second top wall is erected on the first top wall.
Further, a gap exists between the second bottom wall and the first bottom wall; and/or the presence of a gas in the gas,
a gap exists between the second sidewall and the first sidewall.
Further, there is no space between the second bottom wall and the first bottom wall; and/or the presence of a gas in the gas,
there is no space between the second sidewall and the first sidewall.
Further, the isolation diaphragm capsule further comprises a protruding portion extending from the second top wall to a direction close to the sensor chip, and the protruding portion abuts against the circuit board.
Furthermore, the isolation diaphragm capsule adopts rubber isolation diaphragm capsule or silica gel isolation diaphragm capsule.
Further, the piezometric capsule and the circuit board are sealed together after being riveted and pressed by the base.
The embodiment of the utility model provides an isolated pressure sensor, simple structure, simple to operate, low in production cost, when pressure acts on the isolation diaphragm box, make the isolation diaphragm box warp, the isolation diaphragm box reappears to the sensor chip subassembly, can detect the pressure value through sensor chip, the sensor chip subassembly is protected to the bearing diaphragm box, the life of extension sensor chip subassembly, the isolation medium layer that the intussuseption of isolation diaphragm box is silicon oil, enlarge medium measuring range, the utility model discloses a binding post is connected with external device electricity and is drawn forth the signal, convenience of customers test, transmission data.
Drawings
Fig. 1 is a schematic structural diagram of the isolated pressure sensor of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, an isolated pressure sensor 100 includes:
a base 110, in which an accommodating cavity 120 is provided;
a pressure bellows 130, the pressure bellows 130 being disposed in the accommodation chamber 120, the pressure bellows 130 including a support bellows 131 and an isolation bellows 132; the sensor chip assembly 140, the sensor chip assembly 140 is disposed in the carrier film box 131, the sensor chip assembly 140 includes a circuit board 141, a sensor chip 142 disposed on a side of the circuit board 141 facing the isolation film box 132, and a connection terminal 143 disposed on a side of the circuit board 141 facing away from the isolation film box 132 and penetrating out of the carrier film box 131; and an isolation dielectric layer 150, wherein the isolation dielectric layer 150 is filled in the isolation diaphragm casing 132 to isolate the sensor chip assembly 140.
Specifically, as shown in fig. 1, in actual use, pressure is applied to the isolation bellows 132, the isolation bellows 132 is pressed, the pressure is transmitted to the protrusion 132d abutting against the sensor chip assembly 140, and the sensor chip 142 senses the protrusion 132d
The transmitted pressure transmits the sensed pressure information to an external device through the connection terminal 143.
The isolated pressure sensor 100 of this embodiment, simple structure is small, simple to operate, low in production cost, and the capsule 131 protection sensor chip subassembly 140 of bearing, extension sensor chip subassembly 140's life reduces use cost simultaneously, and isolation capsule 132 filling medium is the isolation dielectric layer 150 of silicon oil 160, enlarges medium measuring range, and this utility model discloses a signal, convenience of customers test, transmission data are drawn forth to binding post 143 and external device electricity.
Further, the bellows 131 and the base 110 are formed as an integral structure.
Specifically, as shown in fig. 1, the bellows 131 seals with the base 110 to provide a strong structure.
Further, the side of the sensor chip 142 facing the isolation capsule 132 is attached to the isolation medium layer 150.
Specifically, as shown in fig. 1, the sensor chip 142 is attached to the isolation medium layer 150 for sensing the pressure transmitted through the isolation medium layer 150.
Further, the dielectric of the isolation dielectric layer 150 is silicone oil 160.
Specifically, as shown in fig. 1, the silicone oil 160 medium is filled in the isolation medium layer 150, so as to expand the medium measurement range, and it should be noted that, the utility model discloses do not make specific limitation to the medium filled in the isolation medium layer 150, those skilled in the art can also select some other media to fill according to actual need, so as to achieve the effect of expanding the medium measurement range.
Further, the accommodating chamber 120 includes a first bottom wall 121, a first side wall 122 extending from an end of the first bottom wall 121 to a direction close to the bellows 131, and a first top wall 123 extending from an end of the first side wall 122 to a direction away from the center of the base 110;
the isolation bellows 132 includes a second bottom wall 132a, a second side wall 132b extending from an end of the second bottom wall 132a in a direction close to the bellows, and a second top wall 132c extending from an end of the second side wall 132b in a direction away from the center of the isolation bellows 132; wherein,
the second bottom wall 132a is disposed opposite to the first bottom wall 121, the second side wall 132b is disposed opposite to the first side wall 122, and the second top wall 132c is overlapped on the first top wall 123.
Further, a gap exists between the second bottom wall 132a and the first bottom wall 121; and/or the presence of a gas in the gas,
a gap exists between the second sidewall 132b and the first sidewall 122.
Further, there is no space between the second bottom wall 132a and the first bottom wall 121; and/or the presence of a gas in the gas,
the second sidewall 132b is not spaced apart from the first sidewall 122.
It should be noted that, as shown in fig. 1, the positional relationship between the bellows 131 and the isolation bellows 132, the positional relationship between the isolation bellows 132 and the accommodating chamber 120, and the specific values of the gap between the bellows 131 and the isolation bellows 132 are not limited, and the specific values of the gap between the isolation bellows 132 and the accommodating chamber 120 are not limited.
Further, the isolation bellows 132 further includes a projection 132d extending from the second top wall 132c in a direction approaching the sensor chip 142, and the projection 132d abuts against the circuit board 141.
Specifically, as shown in fig. 1, the protrusion 132d abutting against the circuit board 141 transmits the pressure applied to the insulating medium layer 150 to the sensor chip assembly 140, and the sensor chip 142 senses the pressure value.
Further, the isolation bellows 132 is made of rubber or silica gel.
Specifically, as shown in fig. 1, the isolation diaphragm casing 132 is located in the accommodating cavity 120, the isolation diaphragm casing 132 is easily deformed when receiving pressure, the accommodating cavity 120 and the circuit board 141 cooperate to limit the deformation of the isolation diaphragm casing 132, so that the pressure is intensively transmitted to the protrusion 132d, it should be noted that the material of the isolation diaphragm casing 132 is not limited, and those skilled in the art may select other materials according to actual needs.
Further, the pressure bellows 130 and the circuit board 141 are sealed together after being riveted by the base 110.
Specifically, as shown in fig. 1, the components of the present invention are riveted and then packaged together by the base 110.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. An isolated pressure sensor, comprising:
the base is internally provided with an accommodating cavity;
the pressure measuring capsule is arranged in the accommodating cavity and comprises a bearing capsule and an isolation capsule;
the sensor chip assembly is arranged in the bearing diaphragm box and comprises a circuit board, a sensor chip arranged on one side of the circuit board, which faces the isolation diaphragm box, and a connecting terminal arranged on one side of the circuit board, which faces away from the isolation diaphragm box, and penetrates out of the bearing diaphragm box;
and the isolation medium layer is filled in the isolation diaphragm box so as to isolate the sensor chip assembly.
2. The isolated pressure sensor of claim 1, wherein the carrier capsule and the base form a unitary structure.
3. The isolated pressure sensor of claim 1, wherein a side of the sensor die facing the isolation capsule is bonded to the isolation medium layer.
4. An isolated pressure sensor according to claim 3, wherein the medium of the isolating medium layer is silicone oil.
5. The isolated pressure sensor according to any of claims 1 to 4, wherein the receiving chamber comprises a first bottom wall, a first side wall extending from an end of the first bottom wall in a direction toward the carrier capsule, and a first top wall extending from an end of the first side wall in a direction away from a center of the base;
the isolation bellows comprises a second bottom wall, a second side wall and a second top wall, wherein the second side wall extends from the end part of the second bottom wall to the direction close to the bearing bellows, and the second top wall extends from the end part of the second side wall to the direction far away from the center of the isolation bellows; wherein,
the second bottom wall is opposite to the first bottom wall, the second side wall is opposite to the first side wall, and the second top wall is erected on the first top wall.
6. An isolated pressure sensor as claimed in claim 5, wherein a gap exists between said second bottom wall and said first bottom wall; and/or the presence of a gas in the gas,
a gap exists between the second sidewall and the first sidewall.
7. An isolated pressure sensor according to claim 5, wherein there is no space between the second bottom wall and the first bottom wall; and/or the presence of a gas in the gas,
there is no space between the second sidewall and the first sidewall.
8. The isolated pressure sensor of claim 5, wherein the isolation capsule further comprises a projection extending from the second top wall in a direction toward the sensor die, the projection abutting the circuit board.
9. The isolated pressure sensor according to any of claims 1 to 4, wherein the isolation bellows is a rubber isolation bellows or a silica gel isolation bellows.
10. An isolated pressure sensor according to any of claims 1 to 4, wherein the capsule is sealed to the circuit board after being riveted through the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921885788.3U CN210893495U (en) | 2019-11-04 | 2019-11-04 | Isolated pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921885788.3U CN210893495U (en) | 2019-11-04 | 2019-11-04 | Isolated pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210893495U true CN210893495U (en) | 2020-06-30 |
Family
ID=71313004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921885788.3U Active CN210893495U (en) | 2019-11-04 | 2019-11-04 | Isolated pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210893495U (en) |
-
2019
- 2019-11-04 CN CN201921885788.3U patent/CN210893495U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0893676B1 (en) | Combined pressure responsive transducer and temperature sensor apparatus | |
| CN103575454B (en) | It is determined that sensor device and method, the electrochemical energy accumulator and its manufacture method of the pressure of medium inside electrochemical energy accumulator | |
| CN102105769B (en) | Media isolated differential pressure sensor with cap | |
| EP3805710B1 (en) | Temperature-pressure integrated sensor | |
| CN206056854U (en) | Pressure transducer | |
| CN103674098A (en) | Sensor device and method for producing a sensor device for accommodation in a galvanic cell | |
| US4737756A (en) | Electrostatically bonded pressure transducers for corrosive fluids | |
| CN209400124U (en) | Pressure sensor chip and the Multifunction Sensor for being provided with the chip | |
| CN210893495U (en) | Isolated pressure sensor | |
| EP3712585B1 (en) | Pressure sensor | |
| US11852550B2 (en) | Combined temperature and pressure sensing device with improved eletronics protection | |
| CN210089909U (en) | Medium isolation type pressure sensor | |
| CN217819136U (en) | Pressure sensor | |
| CN215296319U (en) | Sensor with a sensor element | |
| CN206399564U (en) | A kind of wireless pressure sensor | |
| CN210741726U (en) | Pressure transmitter | |
| CN115683199A (en) | Sensor with a sensor element | |
| CN219347895U (en) | Liquid level sensor | |
| CN220625561U (en) | Redundancy pressure sensor | |
| CN113788451B (en) | Packaging method of composite range pressure sensing system | |
| CN103575451A (en) | Sensor means and method for determining pressure of medium, and method of manufacturing sensor means | |
| US11226253B2 (en) | High range differential pressure sensor | |
| EP3514517B1 (en) | Pressure sensor media interface with integrated seal and diaphragm | |
| CN215810960U (en) | Sensing device | |
| CN213632499U (en) | Pressure sensor assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. Address before: Building A10, National Integrated Circuit Design Center, No. 777 Jianzhu West Road, Binhu District, Wuxi City, Jiangsu Province, 214072 Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |