CN113788451B - Packaging method of composite range pressure sensing system - Google Patents
Packaging method of composite range pressure sensing system Download PDFInfo
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- CN113788451B CN113788451B CN202110913889.2A CN202110913889A CN113788451B CN 113788451 B CN113788451 B CN 113788451B CN 202110913889 A CN202110913889 A CN 202110913889A CN 113788451 B CN113788451 B CN 113788451B
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- electromagnetic shielding
- shell
- pressure sensor
- circuit board
- pressure sensing
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 239000002131 composite material Substances 0.000 title claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
Abstract
The invention provides a packaging method of a composite range pressure sensing system, which comprises the steps of firstly installing electromagnetic shielding shells on pressure sensors with different ranges to realize electromagnetic shielding; secondly, installing the multi-range pressure sensor with the electromagnetic shielding shell on a circuit board in the system; then, a system circuit board provided with a multi-range pressure sensor is arranged in a system structure shell, an air circuit structure is integrally processed on the system structure shell, and sealed electrical connection is performed to the outside; and finally, installing a cover plate structure on the system structure shell, and sealing the system structure to realize the integrated packaging of the pressure sensing system. The method has simple packaging process, effectively avoids the interference of external impurity signals and the signal interference among a plurality of sensors inside, and has high precision index of the pressure sensing system packaged by the method.
Description
Technical Field
The invention belongs to the field of micro-electronics machinery and pressure sensors, and particularly relates to a packaging method of a composite range pressure sensing system.
Background
The silicon piezoresistive pressure technology is a mature pressure sensing technology, and is widely applied to the fields of aerospace, industrial control, consumer electronics and the like based on the advantages of small volume, high sensitivity, small process difficulty and low cost of the silicon piezoresistive pressure sensing device. Silicon piezoresistive pressure sensing systems have been miniaturized, integrated, intelligent, serialized, standardized, and developed toward high reliability by using micromachining and integrating technologies. The composite range type pressure sensor system is a special pressure sensing system, and can realize the function of high-precision pressure measurement in a wide range of the system and expand the application range of the pressure sensing system through the composite cooperative measurement of pressure sensors with different ranges.
When the conventional silicon piezoresistive pressure sensor is installed and applied in a pressure sensing system, the sensor is generally installed somewhere in the system structure, an airtight package and connection are formed between the air tap end of the sensor and the system structure, and the electrical connection between the electrical pin end of the sensor and the circuit board of the system is realized by directly welding the sensor pin on the circuit board. If a conventional pressure sensor package is used, the following problems exist:
(1) The multi-range pressure sensor needs to be packaged into the same gas circuit structure, the structure is complex, and meanwhile, the multi-channel gas tightness packaging between the pressure sensors and the gas circuit structure and between the gas circuit structure and the shell is involved, wherein leakage occurs at one part, so that the whole system is problematic;
(2) After the multi-range pressure sensor is installed on the same gas circuit structure, the multi-range pressure sensor is electrically connected with a circuit board of the system through welding of sensor pins, if the processing error is large, the problem of mismatching or large introduced stress during welding can occur, and if the sensors are connected by adopting flexible wires respectively or adopting flexible circuit boards in a transitional manner, the system structure and the process are complex, and the cost is greatly increased;
(3) When the pressure sensor is directly fixed on the system structure or the gas circuit structure provided with the multi-range composite pressure sensor is arranged on the system structure, an interference signal introduced from the outside to the shell of the system structure is directly transmitted to the pressure sensor, so that the accuracy index of the pressure sensor is affected.
Disclosure of Invention
The invention aims to provide a packaging method of a composite range pressure sensing system with simple packaging technology and high precision index.
In order to solve the technical problems, the invention provides a packaging method for a composite range pressure sensor system, which comprises the following specific implementation steps:
(1) Installing electromagnetic shielding shells on pressure sensors with different measuring ranges to realize electromagnetic shielding;
(2) Mounting a multi-range pressure sensor with an electromagnetic shielding shell to a circuit board in the system;
(3) Installing a system circuit board provided with a multi-range pressure sensor into a system structure shell, and integrally processing a gas circuit structure on the system structure shell to perform sealed electrical connection to the outside;
(4) And installing a cover plate structure on the system structure shell, and sealing the system structure to realize the integrated packaging of the pressure sensing system.
Further, the gas circuit structure integrates a dust separation structure.
Furthermore, the pressure sensor is nested in the electromagnetic shielding shell, and the pressure sensor and the electromagnetic shielding shell form clearance fit and are connected with the electromagnetic shielding shell into a whole.
Furthermore, the electromagnetic shielding shell is formed by machining metal with good conductivity, and the vent holes are as small as possible.
Furthermore, the pressure sensor and the electromagnetic shielding shell are connected into a whole by adopting the processes of gluing, threaded connection and welding.
Furthermore, a circle of mounting support posts are designed at the bottom of the electromagnetic shielding shell, and are electrically communicated with the signal stratum of the circuit board through welding.
Furthermore, the flange plate is designed on the outer edge of the electromagnetic shielding shell, and the electromagnetic shielding shell is installed with the system circuit board through fastening screws, so that connection with signal stratum on the system circuit board is achieved.
Furthermore, the system structure shell and the cover plate structure are regular in installation outline, and integrated packaging is realized in a laser welding mode.
Further, the pressure sensor is in the form of a TO-packaged pressure sensor, and the TO base is designed TO be flange-shaped.
Compared with the prior art, the invention has the remarkable effects that:
(1) The invention provides an integrated packaging method of a pressure sensing system, which has no requirement on the device level packaging of a sensor and the leakage rate level of packaging between the sensor and a gas path structure in the original method, and reduces the difficulty of the packaging process;
(2) The multi-range pressure sensor is directly welded on the system circuit board and uniformly packaged, so that the requirements of strict matching design between the sensor air tap end and the structure package and between the sensor pin end and the circuit board fixed installation are avoided, and great convenience is provided for structural design and process implementation;
(3) According to the invention, the air tap on the system structure uniformly entrains air, the pressure sensor is not in direct contact with the system structure, and the pressure sensor is also provided with the electromagnetic shielding shell structure, so that the signal interference of external impurities and the signal interference among a plurality of sensors in the system structure are effectively avoided, and the accuracy index of the pressure sensing system is improved;
(4) The invention fully utilizes common materials and instruments, has convenient implementation and low cost, and can be widely applied to the packaging technology of the composite range micro pressure sensing system.
Drawings
FIG. 1 is a flow chart of a method of packaging a composite range pressure sensing system provided by the invention;
FIG. 2 is a schematic view of a pressure sensor mounting electromagnetic shielding shell provided in an embodiment of the present invention;
FIG. 3 is a schematic diagram of a multi-range pressure sensor with electromagnetic shield provided by an embodiment of the present invention mounted to a system circuit board;
FIG. 4 is a schematic view of a system circuit board according to an embodiment of the present invention mounted in a system structural housing;
fig. 5 is a schematic view of a system structure housing with a cover plate installed thereon according to an embodiment of the present invention.
In the figure: 1. a pressure sensor; 2. an electromagnetic shield case; 3. a system circuit board; 4. a system structural housing; 5. a filter element structure; 6. sealing the connector; 7. a seal ring; 8. and a cover plate structure. The structure is symmetrical in the figure, tiny accessories such as screws, wires, structural adhesives and the like are not marked, part of processing details are not shown, and the size of the structure in the figure is not the actual size, but is only schematic.
Detailed Description
The following describes a method for packaging a composite range pressure sensing system according to the present invention in detail with reference to the drawings and examples.
Fig. 1 shows a flow of a packaging method of a composite range pressure sensing system provided by the invention, and the method comprises the following steps:
(1) Installing electromagnetic shielding shells on the pressure sensors with different measuring ranges, completing mechanical connection, and ensuring that the electromagnetic shielding shells realize integral envelope on the pressure sensors so as to realize electromagnetic shielding;
(2) Mounting a multi-range pressure sensor with an electromagnetic shielding shell to a circuit board in the system;
(3) Installing a system circuit board provided with a multi-range pressure sensor into a system structure shell, and integrally processing a gas circuit structure on the system structure shell to perform sealed electrical connection to the outside;
(4) And installing a cover plate structure on the system structure shell, and sealing the system structure to realize the integrated packaging of the pressure sensing system.
In some embodiments of the invention, the multi-range pressure sensor is in the form of a mature TO base package, and different range combinations are selected according TO application requirements.
In some embodiments of the invention, the electromagnetic shielding shell is formed by processing metal with good conductivity, such as copper, stainless steel, aluminum and the like, and the pressure sensor is completely enveloped, and the vent hole is as small as possible (about phi 1 mm) so as to realize good electromagnetic shielding function;
in some embodiments of the invention, the pressure sensor is embedded into the electromagnetic shielding shell, and the pressure sensor is connected with the electromagnetic shielding shell by means of gluing, threaded connection, welding and the like.
In some embodiments of the invention, the electromagnetic shielding shell is electrically connected with a circuit board in the system through welding or screw connection, and is electrically connected with a signal stratum in the circuit board; the sensor pins are inserted into corresponding designed jacks in a circuit board in the system, and electric conduction is realized through welding.
In some embodiments of the invention, the system structure shell is integrally processed by metal and is provided with a gas circuit structure, and a filter element structure can be integrated in the gas circuit structure to realize dust isolation of the system;
the external electrical connection of the system can be realized by adopting a mode of installing a sealed external connector, a sealed cable and the like.
In some embodiments of the invention, a sealing ring mounting groove is designed at the structural position of the system structure mounting cover plate, the sealing of the system is realized through sealing of the sealing ring when the cover plate is mounted, and for the structure with smaller volume and more regular mounting outline, the integrated packaging of the system is realized in a laser welding mode.
The invention is further illustrated below in connection with four specific examples.
Example 1
The pressure sensor is in the form of a TO packaged pressure sensor, and the TO base is designed into a flange shape so as TO facilitate subsequent installation. The electromagnetic shielding shell is formed by machining pure copper, and a circle of mounting support posts are designed at the bottom of the electromagnetic shielding shell for subsequent mounting on a circuit board according to the structural design of the sensor base. The pressure sensor 1 is nested in the electromagnetic shielding shell 2, as shown in fig. 2, the two are in clearance fit, the space at the bottom of the sensor after being installed is filled with GD414 silicon rubber, and the pressure sensor and the electromagnetic shielding shell are connected into a whole after standing for 24 hours at room temperature for solidification. According to the application requirements of the pressure sensing system, pressure sensors with different ranges are installed, and in the embodiment, two pressure sensors with different ranges are installed for compounding.
FIG. 3 is a schematic diagram of a multi-range pressure sensor with an electromagnetic shield housing mounted to a system circuit board. Pins of the pressure sensor 1 and support posts of the electromagnetic shielding shell 2 penetrate through jacks correspondingly designed on the system circuit board 3, the support posts are electrically connected with the pins through soldering, the support posts of the electromagnetic shielding shell are connected with signal strata of the system circuit board, the pressure sensor pins are connected with circuit functional layers of the system circuit board, and the installation of the two pressure sensors is completed.
FIG. 4 is a schematic diagram of the installation of a system circuit board into a system structural housing. The system circuit board is installed into the system structure shell 4 through the fastening screw, the sealing ring installation groove is designed on the system structure shell 4, the air channel structure on the system structure shell is formed by integrally processing, the stainless steel dust-proof net type filter element structure 5 is embedded in the air channel, dust-proof of the air channel of the system structure can be realized, the sealing connector 6 is installed on the system structure, and the connector lead is welded with the system circuit board, so that external electrical connection is realized.
Fig. 5 is a schematic view of the structure of the installation cover plate on the system structure shell. The sealing ring 7 is installed in a sealing ring installation groove on the upper edge of the system structure shell, the cover plate structure 8 is installed on the system structure shell through fastening, and the sealing ring is tightly pressed to realize the integral sealing of the system structure.
Example 2
The difference between the embodiment and the embodiment 1 is mainly that the combination and encapsulation of 4 pressure sensors with different measuring ranges are performed, and the feasibility of the invention in combination of more pressure sensors is verified through testing and good system performance.
Example 3
The difference between the embodiment and the embodiment 1 is that the electromagnetic shielding shell is mainly formed by processing stainless steel, the electromagnetic shielding shell and the sensor base are connected through a resistance welding process, a flange is designed on the outer edge of the shielding shell, a circle of screw holes are uniformly arranged, and the electromagnetic shielding shell is installed with the system circuit board through fastening screws, so that the electromagnetic shielding shell is connected with a signal stratum on the system circuit board.
Example 4
The difference between the embodiment and the embodiment 1 is that the sealing of the system structure is realized by the laser welding of the system structure shell and the cover plate structure, the system structure shell and the cover plate structure are made of the same material so as to be convenient for welding, the adopted structure seam profiles are regular rectangles, four corners are chamfered, and the connection and the sealing of the system structure shell and the cover plate structure are realized by the pulse laser welding process.
The specific embodiments of the present invention have been described in detail above, but the protection scope of the present invention is not limited to the above described embodiments, and can be extended to applications of more types of devices according to practical application needs. It will be apparent to those skilled in the art that various modifications and substitutions can be made in the invention without departing from the spirit or scope of the invention.
Claims (8)
1. A method of packaging a composite range pressure sensing system, the method comprising:
(1) Installing electromagnetic shielding shells on pressure sensors with different measuring ranges to realize electromagnetic shielding;
(2) Mounting a multi-range pressure sensor with an electromagnetic shielding shell to a circuit board in the system;
(3) Installing a system circuit board provided with a multi-range pressure sensor into a system structure shell, integrally processing a gas circuit structure on the system structure shell, and integrating a stainless steel dust-proof net type filter element structure in the gas circuit structure to perform sealed electrical connection to the outside;
(4) And installing a cover plate structure on the system structure shell, and sealing the system structure to realize the integrated packaging of the pressure sensing system.
2. The method of claim 1, wherein the pressure sensor is nested in an electromagnetic shield, and the pressure sensor and the electromagnetic shield form a clearance fit and are integrally connected.
3. The packaging method of the composite range pressure sensing system according to claim 2, wherein the electromagnetic shielding shell is formed by machining metal with good conductivity, and the vent hole is as small as possible.
4. The method of claim 2, wherein the pressure sensor and the electromagnetic shielding shell are integrally connected by using an adhesive, a threaded connection or a welding process.
5. The method of claim 4, wherein the electromagnetic shielding shell has a ring of mounting posts arranged at the bottom thereof for electrical communication with the signal layer of the circuit board by soldering.
6. The packaging method of the composite range pressure sensing system according to claim 4, wherein a flange is designed on the outer edge of the electromagnetic shielding shell, and the flange is installed with a system circuit board through fastening screws to realize connection with signal stratum on the system circuit board.
7. The packaging method of the composite range pressure sensing system according to claim 1, wherein the system structure shell and the cover plate structure are regular in installation outline, and integrated packaging is achieved in a laser welding mode.
8. The method of packaging a compound range pressure sensing system of claim 1, wherein the pressure sensor is in the form of a TO-packaged pressure sensor, and the TO-base is flange-like in design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110913889.2A CN113788451B (en) | 2021-08-10 | 2021-08-10 | Packaging method of composite range pressure sensing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110913889.2A CN113788451B (en) | 2021-08-10 | 2021-08-10 | Packaging method of composite range pressure sensing system |
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| Publication Number | Publication Date |
|---|---|
| CN113788451A CN113788451A (en) | 2021-12-14 |
| CN113788451B true CN113788451B (en) | 2024-04-02 |
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| CN202110913889.2A Active CN113788451B (en) | 2021-08-10 | 2021-08-10 | Packaging method of composite range pressure sensing system |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6506313B1 (en) * | 2000-02-01 | 2003-01-14 | Pacific Wave Industries, Inc. | Ultraminiature fiber optic pressure transducer and method of fabrication |
| CN2718545Y (en) * | 2004-07-06 | 2005-08-17 | 浙江三花制冷集团有限公司 | Integrated assembling pressure sensor apparatus |
| KR20130084058A (en) * | 2012-01-16 | 2013-07-24 | (주)미코엠에스티 | Capacitive pressure sensor package and method of fabricating the same |
| CN104944359A (en) * | 2014-03-25 | 2015-09-30 | 中芯国际集成电路制造(上海)有限公司 | MEMS (Micro Electro Mechanical System) device and forming method thereof |
| CN110567632A (en) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | Core body composite silicon piezoresistive pressure sensor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1403612B1 (en) * | 2010-12-22 | 2013-10-31 | St Microelectronics Srl | INTEGRATED ELECTRONIC DEVICE FOR THE MONITORING OF PARAMETERS INSIDE A SOLID STRUCTURE AND A MONITORING SYSTEM USING THIS DEVICE |
| DE102011004577B4 (en) * | 2011-02-23 | 2023-07-27 | Robert Bosch Gmbh | Component carrier, method for producing such a component carrier and component with a MEMS component on such a component carrier |
-
2021
- 2021-08-10 CN CN202110913889.2A patent/CN113788451B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6506313B1 (en) * | 2000-02-01 | 2003-01-14 | Pacific Wave Industries, Inc. | Ultraminiature fiber optic pressure transducer and method of fabrication |
| CN2718545Y (en) * | 2004-07-06 | 2005-08-17 | 浙江三花制冷集团有限公司 | Integrated assembling pressure sensor apparatus |
| KR20130084058A (en) * | 2012-01-16 | 2013-07-24 | (주)미코엠에스티 | Capacitive pressure sensor package and method of fabricating the same |
| CN104944359A (en) * | 2014-03-25 | 2015-09-30 | 中芯国际集成电路制造(上海)有限公司 | MEMS (Micro Electro Mechanical System) device and forming method thereof |
| CN110567632A (en) * | 2019-08-29 | 2019-12-13 | 北京自动化控制设备研究所 | Core body composite silicon piezoresistive pressure sensor |
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| CN113788451A (en) | 2021-12-14 |
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