CN212609549U - Novel packaging structure of MEMS pressure sensor - Google Patents
Novel packaging structure of MEMS pressure sensor Download PDFInfo
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- CN212609549U CN212609549U CN202021491918.8U CN202021491918U CN212609549U CN 212609549 U CN212609549 U CN 212609549U CN 202021491918 U CN202021491918 U CN 202021491918U CN 212609549 U CN212609549 U CN 212609549U
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Abstract
The utility model relates to a novel MEMS pressure sensor's packaging structure, include: a peripheral circuit board; the packaging module is packaged with an MEMS pressure sensor chip for detecting pressure and is arranged on the peripheral circuit board; one end of the connector is connected to the peripheral circuit board, and the other end of the connector is connected to external electricity for realizing the electric connection between the packaging structure of the novel MEMS pressure sensor and the external electricity; and the shell is used for packaging the peripheral circuit board and the packaging module.
Description
Technical Field
The utility model relates to a sensor field, concretely relates to novel MEMS pressure sensor's packaging structure.
Background
A MEMS (Micro-electro Mechanical Systems) pressure sensor is a thin film element that can be used to detect pressure. In the prior art, packaging a MEMS pressure sensor is a core technology for implementing the application of the pressure sensor. In the current industrial application, when the pressure sensor is prepared, the problem of low production efficiency exists, which is not beneficial to the popularization and the application of the pressure sensor, and the price of the pressure sensor can be improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel MEMS pressure sensor's packaging structure, simple structure, easily processing.
In order to solve the above technical problem, the following provides a novel package structure of a MEMS pressure sensor, including: a peripheral circuit board; the packaging module is packaged with an MEMS pressure sensor chip for detecting pressure and is arranged on the peripheral circuit board; one end of the connector is connected to the peripheral circuit board, and the other end of the connector is connected to external electricity for realizing the electric connection between the packaging structure of the novel MEMS pressure sensor and the external electricity; and the shell is used for packaging the peripheral circuit board and the packaging module.
Optionally, the package module includes a substrate, and the MEMS pressure sensor chip is mounted on an upper surface of the substrate.
Optionally, an ASIC conditioning chip is further packaged in the packaging module, and the ASIC conditioning chip is disposed on the upper surface of the substrate and is bonded to the MEMS pressure sensor chip through a lead.
Optionally, a first air inlet is formed in the surface of the substrate, and the position of the first air inlet corresponds to the position of the MEMS pressure sensor chip.
Optionally, the encapsulation module further includes: the protection outer frame is arranged on the upper surface of the substrate and surrounds the MEMS pressure sensor chip; and the upper cover is arranged above the protective outer frame and is arranged at the top of the protective outer frame.
Optionally, a through hole is formed in the surface of the upper cover, and the position of the through hole corresponds to the position of the MEMS pressure sensor chip.
Optionally, a space surrounded by the protection outer frame and the upper cover is filled with a pouring sealant, and the pouring sealant covers the MEMS pressure sensor chip.
Optionally, the MEMS pressure sensor chip includes a MEMS micro differential pressure sensor chip.
Optionally, the connector includes pins for connecting to external electrical connections, and the peripheral circuit board includes input/output pads connected to the pins of the connector.
Optionally, the package module passes the calibration test.
The utility model provides a neotype MEMS pressure sensor's packaging structure is owing to adopted encapsulation module is with MEMS pressure sensor chip package in the module, can utilize current ripe packaging technology to realize mass encapsulation production to can realize mass calibration and test.
Drawings
Fig. 1 is a schematic flow chart illustrating the steps of a preparation method according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a novel MEMS pressure sensor package structure according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a novel MEMS pressure sensor package structure according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a package module according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a package module according to an embodiment of the present invention.
Detailed Description
Research shows that one important reason for low production efficiency in the preparation of pressure sensors is that, due to the strict requirements of application environments, the pressure sensors are usually packaged in a manner that the MEMS pressure sensor is sealed in a metal tube or a plastic shell by means of direct bonding or glass transition bonding, then a PCB is bonded, a peripheral calibration circuit is soldered, and the like. However, the packaging method uses a deep cavity structure, has the disadvantages of complex structure, complex process, high cost, difficulty in batch test and calibration, poor consistency and the like, and is difficult to package and calibrate in a large scale automatically, which seriously affects the production efficiency of the pressure measuring device.
The package structure of the MEMS pressure sensor according to the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 2 to 5, in order to solve the above technical problem, in this embodiment, a novel package structure of a MEMS pressure sensor is provided, which includes: a peripheral circuit board 203; a packaging module ( reference numerals 106 and 205 in fig. 2 and 3, respectively) packaged with a MEMS pressure sensor chip ( reference numerals 301 and 401 in fig. 4 and 5, respectively) for detecting pressure and mounted to the peripheral circuit board 203; connectors (the reference numbers in fig. 2 and 3 are 110 and 207, respectively), one end of which is connected to the peripheral circuit board 203, and the other end of which is connected to the external electrical, for electrically connecting the packaging structure of the novel MEMS pressure sensor with the external electrical; and the shell is used for packaging the peripheral circuit board and the packaging module.
In this specific embodiment, the novel MEMS pressure sensor package structure employs the package module to package the MEMS pressure sensor chip in a package module, which can realize mass package production by using the existing mature package process, and can realize mass calibration and testing.
In one embodiment, the package module includes a substrate 303, and the MEMS pressure sensor chip is mounted on an upper surface of the substrate 303. In one embodiment, the MEMS pressure sensor die is bonded to the substrate 303 using a die attach adhesive such as silicone rubber or epoxy.
In one embodiment, the substrate 303 is a ceramic substrate. In fact, other materials with corrosion resistance may be selected as required to prepare the substrate 303.
In the embodiment shown in fig. 4, a ceramic substrate is used, and a solder connection point 309 is formed on the upper surface of the ceramic substrate. The solder joints 309 are used for electrically connecting to the peripheral circuit board, and the MEMS pressure sensor chip 301 is electrically connected to the pads of the ceramic substrate through leads 310.
In a specific embodiment, the size of the substrate 303 of the package module is slightly larger than the size of the housing, and the surface of the peripheral circuit board is provided with a notch, and the size of the notch is larger than the size of the housing of the package module and smaller than the size of the substrate 303, so that the housing of the package module can pass through the notch, and the substrate 303 is prevented from passing through the notch, thereby clamping the package module to the surface of the substrate 303. In this embodiment, the front surface of the substrate 303 contacts with the bottom surface of the peripheral circuit board, the front surface of the substrate 303 is provided with a soldering pin, the bottom surface of the peripheral circuit board is provided with a pad or a pin corresponding to the soldering pin on the front surface of the substrate 303, the soldering pin on the front surface of the substrate 303 of the package module is soldered to the peripheral circuit board in an aligned manner, and the package module and the peripheral circuit board are bonded and connected together by soldering tin.
In one embodiment, after the package module and the peripheral circuit board are interconnected, a protective agent may be poured into the gap between the notch and the package module to protect the corresponding solder joints of the package module and the peripheral circuit board from corrosion.
In this embodiment, the peripheral circuit board to which the package module is soldered is attached to a housing, and then corresponding pads on the peripheral circuit board to which the package module is soldered are connected to corresponding pins of the connector.
In one embodiment, the novel package structure of the MEMS pressure sensor can be used to detect the pressure of a measurement medium in a pipeline, including the pressure of a gas transported in the pipeline. The housing can fix and seal the novel packaging structure of the MEMS pressure sensor on a pipeline. Such as fig. 2 and 3, wherein the housing is shaped to facilitate contact of the backing membrane with a measurement medium in the conduit. During measurement, a measuring medium enters the first air inlet hole through the second air inlet hole at the bottom of the shell, so that the measuring medium enters the packaging module and acts on a back membrane of the silicon piezoresistive pressure sensor, and the piezoresistive pressure sensor can sense the gas pressure in a pipeline.
Referring to fig. 3, the shape of the housing 201 is different from that of the housing shown in fig. 2. The packaging module 205 is adhered to the peripheral circuit board 203 with the peripheral electronic component 204 by solder, and the bonding pads on the peripheral circuit board 203 are welded to the pins 206 of the connector 209 by the leads 207, so that the novel packaging structure of the MEMS pressure sensor and the external electrical interconnection are realized. In the embodiment shown in fig. 3, a seal ring 202 is further included, the seal ring 202, the peripheral circuit board 203 with the soldered wires, and the connector 209 are all placed in the housing 201, and the connector 209, the peripheral circuit board 203, and the seal ring 202 are fixed in the housing 201 by riveting and crimping. During measurement, a measurement medium directly contacts with a back film of the MEMS pressure sensor chip in the package module 205 through the second air inlet hole 208 of the housing 201 to sense pressure, and finally, an obtained detection signal is led out from the lead 207 and the lead pin 206 through a pad on the peripheral circuit board 203.
In a specific embodiment, the package module is a package module subjected to a calibration test, so that the occurrence of the failure condition of the package module verified after the installation of the novel packaging structure of the MEMS pressure sensor can be avoided, the rejection rate of the connector, the shell and the like can be reduced, and the purpose of low cost can be achieved.
Referring to fig. 4 and 5, in the embodiment shown in fig. 4 and 5, the MEMS pressure sensor die (labeled 301 and 401 in fig. 4 and 5, respectively) is bonded to the substrate 303 (labeled 303 and 403 in fig. 4 and 5, respectively) by a MEMS die bond adhesive (labeled 312 and 412 in fig. 4 and 5, respectively).
In a specific embodiment, an ASIC conditioning chip is further packaged in the packaging module, and is used for conditioning a detection signal output by the MEMS pressure sensor chip. The ASIC conditioning chip is arranged on the upper surface of the substrate 303 and is connected with the MEMS pressure sensor chip in a bonding mode through a lead.
Referring to fig. 4, in the embodiment shown in fig. 4, the package module includes not only the MEMS pressure sensor chip 301 but also an ASIC conditioning chip 302. The ASIC conditioning chip 302 is fixed on the ceramic substrate by an ASIC chip die attach glue 313, the leads on the MEMS pressure sensor chip 301 and the ASIC conditioning chip 302 are interconnected by a lead 310 by wire bonding, and both the MEMS pressure sensor chip 301 and the ASIC conditioning chip 302 are mounted on the upper surface of the substrate 303. When the pouring sealant is used for protecting the upper surface of the MEMS pressure sensor chip 301, the pouring sealant also covers the upper surface of the ASIC conditioning chip 302 to protect the ASIC conditioning chip 302.
In one embodiment, a first air inlet hole is formed on the surface of the substrate 303, and the position of the first air inlet hole corresponds to the position of the MEMS pressure sensor chip.
In one embodiment, the top cover 306 is bonded to the protective casing 305 by an adhesive to achieve an environmental seal with respect to the packaged module.
In one embodiment, the top cover surface is provided with a through hole 307, and the position of the through hole corresponds to the position of the MEMS pressure sensor chip.
In a specific embodiment, the back film is disposed on the bottom surface of the MEMS pressure sensor chip, the metal lead is disposed on the front surface of the MEMS pressure sensor chip, when the device works, the measured measurement medium respectively acts on the back film and the front film of the MEMS pressure sensor chip 301 through the first air inlet 304 and the through hole 307 to sense a pressure difference, and finally the obtained detection signal is led out through the soldering connection point of the peripheral circuit board on the ceramic substrate.
In this specific embodiment, the toxic gas or corrosive gas detected by the packaging structure of the MEMS pressure sensor does not corrode or affect the metal lead wire or the like disposed on the front surface of the MEMS pressure sensor chip, and the service life of the MEMS pressure sensor chip can be effectively prolonged, thereby prolonging the service life of the packaging structure of the MEMS pressure sensor.
In one embodiment, the package module further comprises: the protective outer frame is arranged on the upper surface of the substrate 303 and surrounds the MEMS pressure sensor chip; and the upper cover is arranged above the protective outer frame and is arranged at the top of the protective outer frame. Reference is made here to fig. 4 and 5, where the protective casing is marked 305 and 405 in fig. 4 and 5, respectively, and the cover is marked 306 and 406 in fig. 4 and 5, respectively.
In a specific embodiment, a space surrounded by the protection outer frame and the upper cover is filled with a pouring sealant, and the pouring sealant covers the MEMS pressure sensor chip.
In one embodiment, the potting adhesive used comprises a fluorine-containing silica gel. When the fluorine-containing silica gel is used as the pouring sealant, the packaging module has the characteristics of high packaging strength, pressure impact resistance, vapor and oil permeation resistance, corrosion resistance, and the like, and the medium compatibility and reliability of the packaging module are greatly improved.
In one embodiment, a space formed by the protective outer frame and the upper cover is filled with a pouring sealant (labeled 308 and 408 in fig. 4 and 5, respectively), and the pouring sealant covers the upper surface of the MEMS pressure sensor chip but is spaced from the bottom surface of the upper cover.
In this specific embodiment, the potting adhesive protects the front surface of the MEMS pressure sensor chip, so that the measurement medium can be effectively isolated, and the corrosion of the measurement medium to the metal wiring on the front surface of the MEMS pressure sensor chip is avoided.
In one embodiment, the MEMS pressure sensor die comprises a MEMS micro-differential pressure sensor die. In one embodiment, the MEMS pressure sensor chip packaged in the package module is a silicon piezoresistive pressure sensor, and the pressure in the highly corrosive gas and oil gas environment can be directly measured by using the silicon piezoresistive pressure sensor.
In one embodiment, the connector includes pins for connecting to external electrical connections, and the peripheral circuit board includes input/output pads connected to the pins of the connector.
Referring to fig. 2 and 3, in the embodiment shown in fig. 2 and 3, the packaging structure of the novel MEMS pressure sensor includes a packaging module ( reference numerals 106 and 205 in fig. 2 and 3, respectively), the packaging module is internally packaged with a MEMS pressure sensor chip, the MEMS pressure sensor chip is a MEMS micro differential pressure sensor chip, the surface of the housing ( reference numerals 101 and 201 in fig. 2 and 3, respectively) is provided with a second air inlet hole ( reference numerals 111 and 208 in fig. 2 and 3, respectively), the connector ( reference numerals 110 and 207 in fig. 2 and 3, respectively) includes a lead pin ( reference numerals 109 and 206 in fig. 2 and 3, respectively) for connecting to external electrical equipment, the peripheral circuit board ( reference numerals 103 and 203 in fig. 2 and 3, respectively) is provided with input and output pads for inputting and outputting electrical energy from the external, the connector comprises a pin, the peripheral circuit board is connected with the pin through soldering tin, and the input and output bonding pad is connected with a pin of the connector in a welding or direct insertion mode.
In the embodiment shown in fig. 2, the package module 106 is flipped over by solder bonding to a peripheral circuit board 103 with peripheral electronic components 107. The peripheral circuit board 103 is implemented by a PCB board, and input/output pads on the peripheral circuit board 103 are soldered to pins 109 of a connector 110 by solder 108, so as to implement the novel MEMS pressure sensor package structure and external electrical interconnection. Also, in the embodiment shown in fig. 2, the substrate 303 of the encapsulation module 106 is fixed to the housing 101 by PCB adhesive 102, so as to realize measurement end air inlet sealing. In the embodiment shown in fig. 2, the housing 101 includes a top cover 105, and the top cover 105 is bonded to other components of the housing 101 by a top cover adhesive 104 to provide an environmental seal for the packaged module 106. During measurement, a measurement medium directly contacts with a back membrane of the MEMS micro differential pressure sensor chip in the packaging module 106 through a second air inlet hole 111 of the casing 101 to sense pressure, and finally obtained detection signals are led out from a lead pin 109 through a bonding pad on the peripheral circuit board 103.
Please refer to fig. 1, which is a schematic flow chart illustrating a manufacturing method according to an embodiment of the present invention.
In this embodiment, a method for manufacturing a novel package structure of a MEMS pressure sensor is provided, which includes the following steps: s11 providing a peripheral circuit board and a MEMS pressure sensor chip for detecting pressure; s12, packaging the MEMS pressure sensor chip to form a packaging module; s13 mounting the package module to the peripheral circuit board; s14 connecting the peripheral circuit board to a connector for connecting the peripheral circuit board to outside electricity; s15, forming a housing enclosing the peripheral circuit board, the connector being exposed to the housing.
In this specific embodiment, the manufacturing method of the novel MEMS pressure sensor package structure firstly packages the MEMS pressure sensor chip to form a package module, and then utilizes the existing mature package process to realize mass package production, which is beneficial to mass calibration and testing, and has the advantages of small overall dimension, low cost, good compatibility of oil gas and corrosive gas medium, and better stability and reliability.
In one embodiment, the packaging of the MEMS pressure sensor chip to form a packaged module includes the following steps: providing a substrate 303; securing the MEMS pressure sensor die to the upper surface of the substrate 303; forming a shell on the upper surface of the substrate 303, wherein the MEMS pressure sensor chip is positioned in the range of a cage of the shell; and pouring a pouring sealant into the shell, wherein the pouring sealant covers the upper surface of the MEMS pressure sensor chip.
In one embodiment, the MEMS pressure sensor die is bonded to the substrate 303 using a die attach adhesive such as silicone rubber or epoxy. And when pouring the pouring sealant into the shell, the used pouring sealant comprises fluorine-containing silica gel. When the fluorine-containing silica gel is used as the pouring sealant, the packaging module has the characteristics of high packaging strength, pressure impact resistance, vapor and oil permeation resistance, corrosion resistance, and the like, and the medium compatibility and reliability of the packaging module are greatly improved.
In one embodiment, when the housing is covered on the upper surface of the substrate 303, the method includes the following steps: forming a protective outer frame on the upper surface of the substrate 303, wherein the MEMS pressure sensor chip is surrounded by the protective outer frame; and after the pouring of the pouring sealant is finished, an upper cover is arranged above the protective outer frame, and the MEMS pressure sensor chip is covered below the upper cover. Thus, the pouring of the pouring sealant can be conveniently carried out.
Referring to fig. 4, in the embodiment shown in fig. 4, the MEMS pressure sensor chip 301 is a MEMS micro-differential pressure sensor chip, and the substrate 303 is a ceramic substrate. The MEMS pressure sensor chip 301 is bonded to the ceramic substrate by the MEMS die attach adhesive 312. The protective outer frame 305 is bonded to the ceramic substrate by an adhesive 311. The potting adhesive 308 is poured into the protective casing 305 so as to cover the MEMS pressure sensor chip 301, thereby protecting the MEMS pressure sensor chip 301 from corrosion. The upper cover 306 is bonded to the protective outer frame 305 by an adhesive to achieve environmental sealing of the package module. When the MEMS pressure sensor chip is in work, a measuring medium is in contact with a back membrane and a front membrane of the MEMS pressure sensor chip 301 through the first air inlet holes 304 and the through holes 307 to induce pressure difference, and finally obtained detection signals are led out through welding connection points of a peripheral circuit board on a ceramic substrate.
In this embodiment, the top cover surface of the housing is also provided with an air inlet hole which is communicated with the outside atmosphere. Moreover, even if the front surface of the MEMS pressure sensor chip 301 is protected by the potting adhesive, pressure measurement can still be achieved because the MEMS pressure sensor chip 301 still deforms under the condition of the potting adhesive.
In fig. 4, a soldering connection point 309 is formed on the upper surface of the ceramic substrate for electrically connecting with the peripheral circuit board, and the MEMS pressure sensor chip 301 is electrically connected with a pad of the ceramic substrate through a lead 310.
In fact, other materials with corrosion resistance may be selected as required to prepare the substrate 303.
In this embodiment, the back film is disposed on the bottom surface of the MEMS pressure sensor chip, and the metal leads and the like are disposed on the front surface of the MEMS pressure sensor chip. Therefore, when the back membrane is used for sensing and measuring pressure, toxic gas or corrosive gas and the like detected by the packaging structure of the novel MEMS pressure sensor cannot corrode or influence the metal lead wire and the like arranged on the front surface of the MEMS pressure sensor chip, the service life of the MEMS pressure sensor chip can be effectively prolonged, and the service life of the packaging structure of the novel MEMS pressure sensor is prolonged.
In addition, in the specific embodiment, the front surface of the MEMS pressure sensor chip is also protected by the potting adhesive, so that the measurement medium is further prevented from corroding metal wires and the like on the front surface of the MEMS pressure sensor chip, and effective measurement medium isolation can be achieved.
In one embodiment, the MEMS pressure sensor chip packaged in the package module is a silicon piezoresistive pressure sensor, and the pressure in the highly corrosive gas and oil gas environment can be directly measured by using the silicon piezoresistive pressure sensor.
In the specific embodiment shown in fig. 5, there is only one MEMS pressure sensor chip 401, i.e., a MEMS micro differential pressure sensor chip, in the package module, the MEMS micro differential pressure sensor chip is bonded to a substrate 403 through a MEMS die attach adhesive 412, and the substrate 403 is a ceramic substrate. The housing includes a protective outer frame 405 and an upper cover 406, and the protective outer frame 405 is mounted to the upper surface of the ceramic substrate 403 by an adhesive 411. A welding connection point 409 is formed on the upper surface of the ceramic substrate 403 for electrically connecting with the peripheral circuit board. The through hole 407 is formed on the surface of the upper cover 406, and the first gas inlet hole 404 is formed on the surface of the ceramic substrate. The protective outer frame 405 is also filled with a potting adhesive 408 for protecting the MEMS pressure sensor chip 401, and the MEMS pressure sensor chip 401 is electrically connected to the bonding pad of the ceramic substrate 403 through a lead 410.
In some embodiments, not only the MEMS pressure sensor chip but also an ASIC (Application Specific Integrated Circuit) conditioning chip is packaged in the packaging module, and is used for conditioning a detection signal output by the MEMS pressure sensor chip. In this embodiment, the preparation method further comprises the steps of: providing an ASIC conditioning chip, attaching the MEMS pressure sensor chip to the ASIC conditioning chip prior to attaching the MEMS pressure sensor chip to the upper surface of the substrate 303, and the ASIC conditioning chip is also attached to the upper surface of the substrate 303.
Referring to fig. 4, in the embodiment shown in fig. 4, the package module includes not only the MEMS pressure sensor chip 301 but also an ASIC conditioning chip 302. The ASIC conditioning chip 302 is fixed on the ceramic substrate by an ASIC chip die attach glue 313, the leads on the MEMS pressure sensor chip 301 and the ASIC conditioning chip 302 are interconnected by a lead 310 by wire bonding, and both the MEMS pressure sensor chip 301 and the ASIC conditioning chip 302 are mounted on the upper surface of the substrate 303. When the pouring sealant is used for protecting the upper surface of the MEMS pressure sensor chip 301, the pouring sealant also covers the upper surface of the ASIC conditioning chip 302 to protect the ASIC conditioning chip 302.
In this embodiment, the MEMS pressure sensor chip, the ASIC conditioning chip, and the bonding pad on the substrate 303 are interconnected, and then a protective outer frame and an upper cover are bonded to the upper surface of the substrate 303, and the MEMS pressure sensor chip and the ASIC conditioning chip are packaged in a cavity formed by the protective outer frame and the upper cover.
In a specific embodiment, the size of the substrate 303 is slightly larger than that of the housing, and a notch is formed in the surface of the peripheral circuit board, and the size of the notch is larger than that of the housing of the package module and smaller than that of the substrate 303, so that the housing of the package module can pass through the notch, and the substrate 303 is prevented from passing through the notch, thereby clamping the package module to the surface of the substrate 303. In this embodiment, the front surface of the substrate 303 contacts with the bottom surface of the peripheral circuit board, the front surface of the substrate 303 is provided with a soldering pin, the bottom surface of the peripheral circuit board is provided with a pad or a pin corresponding to the soldering pin on the front surface of the substrate 303, the soldering pin on the front surface of the substrate 303 of the package module is soldered to the peripheral circuit board in an aligned manner, and the package module and the peripheral circuit board are bonded and connected together by soldering tin.
In one embodiment, after the package module and the peripheral circuit board are interconnected, a protective agent may be poured into the gap between the notch and the package module to protect the corresponding solder joints of the package module and the peripheral circuit board from corrosion.
In this embodiment, the peripheral circuit board to which the package module is soldered is attached to a housing, and then corresponding pads on the peripheral circuit board to which the package module is soldered are connected to corresponding pins of the connector.
In one embodiment, the novel package structure of the MEMS pressure sensor is used for detecting the pressure of a measurement medium in a pipeline, including the pressure of a gas transported in the pipeline. The housing can fix and seal the novel packaging structure of the MEMS pressure sensor on a pipeline. Such as fig. 2 and 3, wherein the housing is shaped to facilitate contact of the backing membrane with a measurement medium in the conduit. During measurement, a measuring medium enters the first air inlet hole through the second air inlet hole at the bottom of the shell, so that the measuring medium enters the packaging module and acts on a back membrane of the silicon piezoresistive pressure sensor, and the piezoresistive pressure sensor can sense the gas pressure in a pipeline.
Referring to fig. 3, the shape of the housing 201 is different from that of the housing shown in fig. 2. The packaging module 205 is adhered to the peripheral circuit board 203 with the peripheral electronic component 204 by solder, and the bonding pads on the peripheral circuit board 203 are welded to the pins 206 of the connector 209 by the leads 207, so that the novel packaging structure of the MEMS pressure sensor and the external electrical interconnection are realized. In the embodiment shown in fig. 3, a seal ring 202 is further included, the seal ring 202, the peripheral circuit board 203 with the soldered wires, and the connector 209 are all placed in the housing 201, and the connector 209, the peripheral circuit board 203, and the seal ring 202 are fixed in the housing 201 by riveting and crimping. During measurement, a measurement medium directly contacts with a back film of the MEMS pressure sensor chip in the package module 205 through the second air inlet hole 208 of the housing 201 to sense pressure, and finally, an obtained detection signal is led out from the lead 207 and the lead pin 206 through a pad on the peripheral circuit board 203.
In one embodiment, before the packaging module is mounted to the peripheral circuit board, the method further includes the following steps: and carrying out calibration test on the packaging module. In this embodiment, since the surface of the substrate 303 is provided with a first air inlet hole for air inlet, the MEMS pressure sensor chip packaged in the package module can be subjected to calibration test through the first air inlet hole.
In the specific embodiment, the packaging module is assembled in the shell after the calibration test, so that the probability of failure of recalibration after assembly is avoided, the rejection rate of the connector, the shell and the like is reduced, and the aim of low cost is fulfilled.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A novel packaging structure of a MEMS pressure sensor is characterized by comprising:
a peripheral circuit board;
the packaging module is packaged with an MEMS pressure sensor chip for detecting pressure and is arranged on the peripheral circuit board;
one end of the connector is connected to the peripheral circuit board, and the other end of the connector is connected to external electricity for realizing the electric connection between the packaging structure of the novel MEMS pressure sensor and the external electricity;
and the shell is used for packaging the peripheral circuit board and the packaging module.
2. The novel packaging structure of the MEMS pressure sensor as claimed in claim 1, wherein the packaging module comprises a substrate, and the MEMS pressure sensor chip is mounted on the upper surface of the substrate.
3. The novel packaging structure of the MEMS pressure sensor as claimed in claim 2, wherein an ASIC conditioning chip is further packaged in the packaging module, and the ASIC conditioning chip is disposed on the upper surface of the substrate and is connected to the MEMS pressure sensor chip by bonding via a wire.
4. The novel packaging structure of the MEMS pressure sensor as claimed in claim 2, wherein the substrate surface is provided with a first air inlet hole, and the position of the first air inlet hole corresponds to the position of the MEMS pressure sensor chip.
5. The novel MEMS pressure sensor package structure of claim 2, wherein the package module further comprises:
the protection outer frame is arranged on the upper surface of the substrate and surrounds the MEMS pressure sensor chip;
and the upper cover is arranged above the protective outer frame and is arranged at the top of the protective outer frame.
6. The novel packaging structure of the MEMS pressure sensor as claimed in claim 5, wherein the top cover surface is provided with through holes, and the positions of the through holes correspond to the positions of the MEMS pressure sensor chip.
7. The packaging structure of the MEMS pressure sensor as claimed in claim 5, wherein a space surrounded by the protection frame and the top cover is filled with a potting adhesive, and the potting adhesive covers the MEMS pressure sensor chip.
8. The novel MEMS pressure sensor package structure of claim 1, wherein the MEMS pressure sensor die comprises a MEMS micro-differential pressure sensor die.
9. The MEMS pressure sensor package structure of claim 1, wherein the connector includes pins for connecting to external electrical connections, and the peripheral circuit board includes input/output pads connected to the pins of the connector.
10. The novel packaging structure of MEMS pressure sensor as claimed in claim 1, wherein the packaging module is a packaging module that passes calibration test.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021383000 | 2020-07-14 | ||
| CN2020213830001 | 2020-07-14 |
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| CN212609549U true CN212609549U (en) | 2021-02-26 |
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| CN202021491918.8U Active CN212609549U (en) | 2020-07-14 | 2020-07-24 | Novel packaging structure of MEMS pressure sensor |
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