CN105157905A - High-precision gas pressure sensor - Google Patents
High-precision gas pressure sensor Download PDFInfo
- Publication number
- CN105157905A CN105157905A CN201510459420.0A CN201510459420A CN105157905A CN 105157905 A CN105157905 A CN 105157905A CN 201510459420 A CN201510459420 A CN 201510459420A CN 105157905 A CN105157905 A CN 105157905A
- Authority
- CN
- China
- Prior art keywords
- pressure
- shell
- pcb board
- chip
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to a gas pressure sensor, including an end button with pins, a shell and a sensitive module, the end button and the shell are connected in a sealed manner and are matched at a connecting end to form a sealed accommodating cavity, one end of the shell, which is away from the end button, is provided with a pressure measuring through hole communicated with the accommodating cavity, the sensitive module is arranged in the accommodating cavity and includes a pressure chip and a PCB connected with the pins on the end button, a pressure sensing surface of a pressure chip is fixed on the shell, the reverse side of the pressure chip is connected with the PCB through gold wires, and the pressure chip directly faces the pressure measuring through hole and seals the pressure measuring through hole through the pressure sensing surface. The sensor provided by the invention is high in precision of measured gas pressure, simple in structure and resistant to corrosion.
Description
Technical field
The invention belongs to sensor field, relate to a kind of high-precision gas pressure transducer.
Background technology
Gas pressure sensor is a kind of integrated transducer, in pneumatic control, pressure switch and controller, portable pressure gage and pressure gauge, the fields such as MAP (manifoldabsolutepressuresensor) have a wide range of applications, these fields, except the sensitivity to sensor, stability, life requirement are very high, also require simply packaging technology, cost requirement are cheap, economic and practical.
Existing gas pressure sensor is generally by the oil-filled encapsulation of isolation diaphragm, need stuffing pressure Transfer Medium (as silicone oil) and soldering stainless steel corrugated plate to isolate testing medium and sensor chip, this packaged type Oil feeding process complicated difficult is to control, the characteristic of the heat produced during soldering stainless steel corrugated plate to chip itself has an impact, chip failure can be made time serious, and due to sensor chip be not direct contact measured gas, can have an impact to precision.
Also have a class baroceptor, utilize chip directly to carry out pressure sensor, although sensors with auxiliary electrode precision is high, technique is simple, and when meeting the gas as etchant gas or other muddiness, chip entirety contacts with gas, and its circuit joint face is easily corroded.
Summary of the invention
The object of this invention is to provide a kind of high-precision gas pressure transducer, this sensor to survey the precision of gaseous tension high, structure is simple, corrosion-resistant.
The technical solution adopted in the present invention is:
A kind of high-precision gas pressure transducer, comprise with the terminal of pin, shell and sensing assembly, terminal is connected with body seal and coordinates the cavity volume being formed and seal at link, shell is provided with away from one end of terminal the pressure measurement through hole be communicated with cavity volume, sensing assembly is located in cavity volume, the pcb board that sensing assembly comprises pressure chip and is connected with the pin on terminal, the pressure-sensitive face of described pressure chip is fixed on shell, the back side of pressure chip is connected with pcb board by spun gold, and pressure chip is just sealed by pressure-sensitive face pressure measurement through hole.
As a further improvement on the present invention, the region, gold wire bonding face that described pressure chip is connected with pcb board is the diameter circle of 0.8mm-1.5mm.
As a further improvement on the present invention, described pcb board is provided with frame of plastic, and all regions comprising spun gold surround by plastic crate, and in plastic crate, embedding has the gel of protection spun gold.
As a further improvement on the present invention, the diameter of the inlet end of described pressure measurement through hole is greater than the diameter of pressure measurement end, and the diameter of described pressure measurement end is 0.7mm-1.2mm.
As a further improvement on the present invention, described pcb board and pressure chip are all bonded on shell, described shell is provided with pcb board binding platform, and the end face of described pcb board binding platform is provided with die bonding platform, and described pcb board binding platform end face and die bonding platform bottom junctions are provided with excessive cushion rubber.
As a further improvement on the present invention, described terminal is provided with pin groove away from one end of housing, and pin is located in pin groove.
As a further improvement on the present invention, sealed by plain washer between described terminal and shell, fixing by riveting.
As a further improvement on the present invention, described pcb board and shell are equipped with the direction pilot hole for locating.
The invention has the beneficial effects as follows:
1. tested gas enters from pressure measurement through hole inlet end and directly to contact with the pressure-sensitive face of pressure chip at pressure measurement end and carries out pressure measurement, and without the need to through other medium conducting pressures, the pressure loss is few, measurement is accurate; Gas can not enter cavity in chip pressure-sensitive under sealing, achieves medium isolation, corrosion-resistant; Shell and terminal coordinate formation cavity volume, and pressure chip and pcb board are located in cavity volume, are closed by pressure measurement through hole by pressure chip, and one-piece construction is simple, convenient processing and assembling; Pressure chip is connected with pcb board by the back side, and namely its back side is circuit joint face, and circuit joint face is not stressed the interference of medium.
2. pressure measurement through hole inlet end diameter contributes to greatly fully contacting tested gas, and the pressure measurement end diameter of pressure measurement through hole is little both ensured pressure stability, can reduce again the contact area with pressure chip, protection pressure chip.
3. pin is located in pin groove instead of is located on the end face of terminal, has saved overall volume.
4. terminal and shell are by rivet the uniform force being fixed with and being beneficial to plain washer, effectively can prevent the loosening of terminal and shell.
5. during assembling, shell and pcb board are coordinated by direction discernment hole, convenient for assembly with installation, have saved the time.
Accompanying drawing explanation
Fig. 1 is the front elevation of the embodiment of the present invention.
Fig. 2 is the vertical view of the embodiment of the present invention.
Fig. 3 is the cut-open view of the embodiment of the present invention.
Fig. 4 is the explosive view of the embodiment of the present invention.
Fig. 5 be embodiment of the present invention housing and sensing assembly etc. shaft side figure.
Fig. 6 is the vertical view of embodiment of the present invention housing and sensing assembly.
Fig. 7 is the cut-open view of embodiment of the present invention housing and sensing assembly.
Fig. 8 is the shaft side figure such as grade of embodiment of the present invention housing.
Fig. 9 is the cut-open view of embodiment of the present invention housing.
In figure: 1-terminal; 2-plain washer; 3-sensing assembly; 4-shell; 5-cavity volume; 1A-pin; 3A-conditioning chip; 3B-plastic crate; 3C-spun gold protecting glue; 3D-spun gold; 3E-pcb plate; 3F-pressure chip; Direction pilot hole on 3G-PCB plate; 4A-die bonding platform; 4B-overflows cushion rubber; 4C-pressure measurement through hole; 4D-PCB plate binding platform; Direction pilot hole on 4E-shell.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further illustrated.
As shown in Figures 1 to 4, a kind of high-precision gas pressure transducer, comprise the terminal 1 with pin 1A, shell 4 and sensing assembly 3, terminal 1 is tightly connected with shell 4 and coordinates the cavity volume 5 being formed and seal at link, shell 4 is provided with away from one end of terminal 1 the pressure measurement through hole 4C be communicated with cavity volume 5, sensing assembly 3 is located in cavity volume 5, sensing assembly 3 comprise pressure chip 3F and the pcb plate 3E(that welds with the pin 1A on terminal 1 in the present embodiment, described pcb plate 3E is flexible PCB, pcb plate 3E is also provided with conditioning chip 3A, electric capacity, other Sensitive Apparatus such as resistance), as shown in Figure 3 and Figure 7, in the present embodiment, described pcb plate 3E and pressure chip 3F is all bonded on shell 4, as shown in Figure 9, it is level and smooth that described shell 4 is provided with pcb plate binding platform 4D(end face), it is level and smooth that the end face of pcb plate binding platform 4D is provided with die bonding platform 4A(end face), described pcb plate binding platform 4D end face and die bonding platform 4A bottom junctions are provided with the excessive cushion rubber 4B (groove of a ring shape, the viscose glue overflowed during for depositing bonding), the back side of pcb plate 3E is bonded on pcb plate binding platform 4D, the pressure-sensitive face of pressure chip 3F is bonded on die bonding platform 4A, the back side of pressure chip 3F is connected (in the present embodiment by spun gold 3D with the front of pcb plate 3E, the region, gold wire bonding face that pressure chip 3F is connected with pcb plate 3E is the diameter circle of 0.8mm-1.5mm), pressure chip 3F is just sealed by pressure-sensitive face pressure measurement through hole 4C.
Tested gas enters from pressure measurement through hole 4C inlet end and directly to contact with the pressure-sensitive face of pressure chip 3F at pressure measurement end and carries out pressure measurement, and without the need to through other medium conducting pressures, the pressure loss is few, measurement is accurate; Gas can not enter cavity in chip pressure-sensitive under sealing, achieves medium isolation, corrosion-resistant; Shell 4 and terminal 1 coordinate formation cavity volume 5, and pressure chip 3F and pcb plate 3E is located in cavity volume 5, is closed by pressure measurement through hole 4C by pressure chip 3F, and one-piece construction is simple, convenient processing and assembling; Pressure chip 3F is connected with pcb plate 3E by the back side, and namely its back side is circuit joint face, and circuit joint face is not stressed the interference of medium.
As shown in Fig. 3 to Fig. 7, in the present embodiment, described pcb plate 3E is provided with frame of plastic, and all regions comprising spun gold 3D surround by plastic crate 3B, and in plastic crate 3B, embedding has the gel 3C of protection spun gold 3D.
As shown in Fig. 3, Fig. 7 and Fig. 9, in the present embodiment, the diameter of the inlet end of described pressure measurement through hole 4C is greater than the diameter of pressure measurement end, and the diameter of described pressure measurement end is 0.7mm-1.2mm.Pressure measurement through hole 4C inlet end diameter contributes to greatly fully contacting tested gas, and the pressure measurement end diameter of pressure measurement through hole 4C is little both ensured pressure stability, can reduce again the contact area with pressure chip 3F, protection pressure chip 3F.
As shown in Figure 3, in the present embodiment, described terminal 1 is provided with pin groove away from one end of housing, and pin 1A is located in pin groove.Pin 1A is located in pin groove instead of is located on the end face of terminal 1, has saved overall volume.
As shown in Figure 3 and Figure 4, in the present embodiment, be provided with plain washer 2 between described terminal 1 and the sealing surface of shell 4, sealed between described terminal 1 and shell 4 by plain washer 2, terminal 1 is fixing by riveting with shell 4.Terminal 1 and shell 4 are by rivet the uniform force being fixed with and being beneficial to plain washer 2, and effectively can prevent the loosening of terminal 1 and shell 4, described plain washer 2 ratio of compression is that 25%(can ensure that classification of waterproof herein reaches IP65).
As shown in Figure 5 and Figure 6, described pcb plate 3E is provided with direction pilot hole 3G, as shown in Figure 8 and Figure 9, described shell 4 is also provided with direction pilot hole 4E.During assembling, shell 4 and pcb plate 3E are coordinated by direction discernment hole, convenient for assembly with installation, have saved the time.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (8)
1. a high-precision gas pressure transducer, it is characterized in that: comprise with the terminal of pin, shell and sensing assembly, terminal is connected with body seal and coordinates the cavity volume being formed and seal at link, shell is provided with away from one end of terminal the pressure measurement through hole be communicated with cavity volume, sensing assembly is located in cavity volume, the pcb board that sensing assembly comprises pressure chip and is connected with the pin on terminal, the pressure-sensitive face of described pressure chip is fixed on shell, the back side of pressure chip is connected with pcb board by spun gold, and pressure chip is just sealed by pressure-sensitive face pressure measurement through hole.
2. a kind of high-precision gas pressure transducer as claimed in claim 1, is characterized in that: the region, gold wire bonding face that described pressure chip is connected with pcb board is the diameter circle of 0.8mm-1.5mm.
3. a kind of high-precision gas pressure transducer as claimed in claim 1, is characterized in that: described pcb board is provided with frame of plastic, and all regions comprising spun gold surround by plastic crate, and in plastic crate, embedding has the gel of protection spun gold.
4. a kind of high-precision gas pressure transducer as claimed in claim 1, is characterized in that: the diameter of described pressure measurement through hole inlet end is greater than the diameter of pressure measurement end, and the diameter of described pressure measurement end is 0.7mm-1.2mm.
5. a kind of high-precision gas pressure transducer as claimed in claim 1, it is characterized in that: described pcb board and pressure chip are all bonded on shell, described shell is provided with pcb board binding platform, the end face of described pcb board binding platform is provided with die bonding platform, and described pcb board binding platform end face and die bonding platform bottom junctions are provided with excessive cushion rubber.
6. a kind of high-precision gas pressure transducer as claimed in claim 1, is characterized in that: described terminal is provided with pin groove away from one end of housing, and pin is located in pin groove.
7. a kind of high-precision gas pressure transducer as claimed in claim 1, be is characterized in that: sealed by plain washer between described terminal and shell, fixing by riveting.
8. a kind of high-precision gas pressure transducer as claimed in claim 1, is characterized in that: described pcb board and shell are equipped with the direction pilot hole for locating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510459420.0A CN105157905A (en) | 2015-07-30 | 2015-07-30 | High-precision gas pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510459420.0A CN105157905A (en) | 2015-07-30 | 2015-07-30 | High-precision gas pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105157905A true CN105157905A (en) | 2015-12-16 |
Family
ID=54798841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510459420.0A Pending CN105157905A (en) | 2015-07-30 | 2015-07-30 | High-precision gas pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105157905A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107687869A (en) * | 2016-08-05 | 2018-02-13 | 思科技术公司 | For the method and apparatus for the corrosive environment for monitoring electrical equipment |
| CN111638002A (en) * | 2020-06-11 | 2020-09-08 | 武汉飞恩微电子有限公司 | MEMS pressure sensor oil-filled core and packaging method thereof |
| US12019010B2 (en) | 2022-06-24 | 2024-06-25 | Cisco Technology, Inc. | Method and apparatus for monitoring a corrosive environment for electrical equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914494A (en) * | 2003-12-03 | 2007-02-14 | 霍尼韦尔国际公司 | Isolated pressure transducer |
| US7377177B1 (en) * | 2007-04-13 | 2008-05-27 | Honeywell International Inc. | Pressure sensor method and apparatus |
| CN201476927U (en) * | 2009-08-11 | 2010-05-19 | 襄樊美瑞汽车传感器有限公司 | Air pressure sensor |
| CN203191140U (en) * | 2013-04-11 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | Dielectric isolation packaging structure for pressure sensor |
| CN203231865U (en) * | 2013-04-26 | 2013-10-09 | 陈君杰 | Dielectric isolation pressure sensor based on backside metallization process |
-
2015
- 2015-07-30 CN CN201510459420.0A patent/CN105157905A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914494A (en) * | 2003-12-03 | 2007-02-14 | 霍尼韦尔国际公司 | Isolated pressure transducer |
| US7377177B1 (en) * | 2007-04-13 | 2008-05-27 | Honeywell International Inc. | Pressure sensor method and apparatus |
| CN201476927U (en) * | 2009-08-11 | 2010-05-19 | 襄樊美瑞汽车传感器有限公司 | Air pressure sensor |
| CN203191140U (en) * | 2013-04-11 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | Dielectric isolation packaging structure for pressure sensor |
| CN203231865U (en) * | 2013-04-26 | 2013-10-09 | 陈君杰 | Dielectric isolation pressure sensor based on backside metallization process |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107687869A (en) * | 2016-08-05 | 2018-02-13 | 思科技术公司 | For the method and apparatus for the corrosive environment for monitoring electrical equipment |
| CN107687869B (en) * | 2016-08-05 | 2020-05-19 | 思科技术公司 | Method and device for monitoring the corrosive environment of an electrical apparatus |
| CN111638002A (en) * | 2020-06-11 | 2020-09-08 | 武汉飞恩微电子有限公司 | MEMS pressure sensor oil-filled core and packaging method thereof |
| US12019010B2 (en) | 2022-06-24 | 2024-06-25 | Cisco Technology, Inc. | Method and apparatus for monitoring a corrosive environment for electrical equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101900625B (en) | Design of wet/wet differential pressure sensor based on microelectronic packaging process | |
| US9352958B2 (en) | Physical quantity measurement sensor | |
| US20130098160A1 (en) | Sensor with fail-safe media seal | |
| CN109696273B (en) | Automobile brake boosting vacuum pressure sensor device | |
| CN105466483A (en) | High-precision temperature and pressure sensor | |
| CN111638002A (en) | MEMS pressure sensor oil-filled core and packaging method thereof | |
| US9310266B2 (en) | Strain gauge pressure sensor | |
| CN105157905A (en) | High-precision gas pressure sensor | |
| CN114354033A (en) | Force sensor and manufacturing method thereof | |
| CN108275648A (en) | A kind of pressure sensor packaging structure based on silicon piezoresistance type | |
| CN210089909U (en) | Medium isolation type pressure sensor | |
| CN208780386U (en) | A kind of pressure sensor | |
| CN110174209A (en) | Media-isolated pressure sensor | |
| CN217878130U (en) | Packaging structure of micro differential pressure sensor | |
| KR102242428B1 (en) | Strain gauge pressure sensor | |
| CN217006189U (en) | Pressure sensor assembly and electronic equipment | |
| CN110672259A (en) | Packaging module and pressure sensor adopting same | |
| CN215065001U (en) | Frost crack prevention pressure sensor | |
| CN206399564U (en) | A kind of wireless pressure sensor | |
| CN106461485A (en) | Pressure sensor for detecting a pressure of a liquid medium in a measuring chamber | |
| CN105115659A (en) | Multi-redundancy pressure-sensitive core body | |
| CN212609549U (en) | Novel packaging structure of MEMS pressure sensor | |
| CN213180426U (en) | Pressure sensor | |
| CN220932234U (en) | High temperature resistant force transducer | |
| CN220288842U (en) | Sensor structure, force transducer and measuring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |
|
| RJ01 | Rejection of invention patent application after publication |