CN203191140U - Dielectric isolation packaging structure for pressure sensor - Google Patents
Dielectric isolation packaging structure for pressure sensor Download PDFInfo
- Publication number
- CN203191140U CN203191140U CN 201320178646 CN201320178646U CN203191140U CN 203191140 U CN203191140 U CN 203191140U CN 201320178646 CN201320178646 CN 201320178646 CN 201320178646 U CN201320178646 U CN 201320178646U CN 203191140 U CN203191140 U CN 203191140U
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- China
- Prior art keywords
- pressure sensor
- base
- sensor chip
- package structure
- pressure transducer
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Abstract
The utility model provides a dielectric isolation packaging structure for a pressure sensor. The dielectric isolation packaging structure comprises a tube seat, a tube cap, a pressure sensor chip, a substrate and a fluid tube, wherein the tube seat is provided with a through hole and fixed above the substrate; the pressure sensor chip is bonded on the tube seat and covers the through hole; the pressure sensor chip comprises a back cavity communicated with the through hole; the tube cap is arranged above the tube seat, thus a closed cavity is formed between the tube cap and the tube seat; and the fluid tube is connected below the tube seat and provided with a channel communicated with the through hole. According to the dielectric isolation packaging structure provided by the utility model, the pressure sensor chip is directly bonded on the tube seat, and the pressure back cavity is directly contacted with a to-be-detected fluid via a fluid tube, thus omitting the other dielectric isolation technologies of a series of complex processes such as oil filling; and the structure is compacter.
Description
Technical field
The utility model relates to MEMS (micro electro mechanical system) (MEMS) technical field, relates in particular to a kind of pressure transducer medium insulation package structure.
Background technology
The pressure sensor package technology is to realize the core technology of pressure sensor application.At present in the commercial Application, because the strict demand of applied environment, usually pressure transducer medium insulation package can adopt the medium isolation technology of metallic membrane, be about to presser sensor chip by direct bonding or mode sealing-in that the glass transition is bonding on Can, for sensitive diaphragm is separated with measured medium, be full of silicone oil between pressure chip and metal isolation diaphragm, ambient pressure is delivered on the pressure chip to reach the purpose of test by metallic membrane and silicone oil.Yet, the big and poor stability of this kind packaged type complex process, cost costliness, volume.
The utility model content
The purpose of this utility model is to provide a kind of pressure transducer medium insulation package structure, and its physical dimension is little, with low cost, stability is better.
For achieving the above object, the utility model adopts following technical scheme: a kind of pressure transducer medium insulation package structure, comprise base, pipe cap, pressure sensor chip, substrate and fluid hose, described base is provided with through hole and is fixed on the substrate top, described pressure sensor chip sticks on the base and covers through hole, pressure sensor chip comprises the back of the body chamber that communicates with through hole, the top forms closed cavity between pipe cap and base thereby described pipe cap is located at base, and described fluid hose is connected to the below of base and is provided with the passage that communicates with through hole.
As further improvement of the utility model, the adhesive glue between described pressure sensor chip and the base is silicon rubber.
As further improvement of the utility model, be enclosed with the silicon gel around the described pressure sensor chip.
As further improvement of the utility model, described pipe cap and fluid hose are connected with base by store energy welding.
As further improvement of the utility model, the bore of described fluid hose is greater than through-hole diameter on the base.
As further improvement of the utility model, be connected with between described substrate and the base and can cut down lead-in wire, the described lead-in wire that cuts down has first end that protrudes into closed cavity and is fixed in second end in the substrate.
As further improvement of the utility model, the input on the described pressure sensor chip, output terminal are connected to first end that can cut down lead-in wire by first lead, have connection in the described substrate and can cut down lead-in wire second end and extend to the second extraneous lead.
As further improvement of the utility model, described substrate is PCB substrate or ceramic substrate.
As further improvement of the utility model, described fluid hose is copper pipe or copper nut.
Compared with prior art, the utility model pressure sensor chip directly is affixed on the base, pressure back of the body chamber directly contacts with treating fluid measured by fluid hose, saved as irritating other medium isolation technologies of a series of complicated technologies of wet goods, structure is compacter, encapsulation volume and packaging cost at pressure transducer have remarkable advantages, can solve the difficult problem of low-cost directly tracer liquid pressure and gaseous tension effectively.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing relevant of the present utility model in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Figure 1 shows that the sectional view of the utility model pressure transducer medium insulation package structure first embodiment.
Figure 2 shows that the sectional view of the utility model pressure transducer medium insulation package structure second embodiment.
Figure 3 shows that the sectional view of the utility model pressure transducer medium insulation package structure the 3rd embodiment.
Figure 4 shows that the sectional view of the utility model pressure transducer medium insulation package structure the 4th embodiment.
Embodiment
Be described in detail below with reference to the utility model of each embodiment shown in the drawings.But these embodiment do not limit the utility model, and the conversion on the structure that those of ordinary skill in the art makes according to these embodiment, method or the function all is included in the protection domain of the present utility model.
Embodiment one:
Please join shown in Figure 1ly, the utility model pressure transducer medium insulation package structure comprises pressure sensor chip 1, base 2, can cut down lead-in wire 3, PCB substrate 4, pipe cap 5 and copper nut 6.Described base 2 is provided with through hole 21 in the centre position, described sensor chip 1 comprises upper surface 11 and the back of the body chamber 12 relative with upper surface 11, and sensor chip 1 is pasted on the base 2, carries on the back chamber 12 and communicates with through hole 21 thereby cover through hole 21 and make.It is silicon rubber that sensor chip 1 is pasted glue, paste finish after, recycle silicon is gel-filled around sensor chip 1, has not only transmitted pressure but also has played the effect of sealing.Described silicon rubber, silicon gel have little, soft, the whippy advantage of elastic modulus, thus can be as far as possible little reduce encapsulating material to the influence of chip performance.Thereby described pipe cap 5 is located at the top of base 2 and forms a closed cavity 7 between pipe cap 5 and base 2, and pipe cap 5 had both played sealing function, has also protected pressure sensor chip 1, first lead 8 and silicon gel to damage because being subjected to the external force extrusion and collision well.The described lead-in wire 3 that cuts down runs through base 2, and formation protrudes into first end 31 of cavity 7 and second end 32 in the insertion PCB substrate 4, and particularly, second end 32 is by being fixedly welded in the PCB substrate 4.In the present embodiment, can cut down lead-in wire 3 and have two, be arranged at the both sides of pressure sensor chip 1.Input on described pressure sensor chip 1 upper surface 11, output terminal are connected to first end 31 that can cut down lead-in wire 3 by first lead, 8 bondings respectively, further, be provided with connection in the described PCB substrate 4 and can cut down lead-in wire 3 second ends 32 and extend to the second outside lead 9, like this signal sensed of pressure sensor chip 1 can be by first lead 8, can cut down 3 and second lead 9 that goes between and be delivered to the outside.Described copper nut 6 is connected in the lower surface of base 2, and copper nut 6 has the passage 61 that communicates with through hole 21, and the bore of passage 61 can make things convenient for fluid to enter the back of the body chamber 12 of sensor chip 1 greater than through hole 21 diameters like this.In concrete the use, fluid directly contacts with induction pressure with pressure sensor chip 1 notacoria (not shown) by copper nut 6, and final signal output second lead 9 from the PCB substrate is drawn.Preferably, notacoria is silicon fiml.
Embodiment two:
Please join shown in Figure 2ly, the pressure transducer medium insulation package structure that present embodiment discloses and the key distinction of embodiment one are: replaced PCB substrate 4 in the embodiment one with ceramic substrate 4 ' in the present embodiment.
Embodiment three:
Please join shown in Figure 3ly, the pressure transducer medium insulation package structure that present embodiment discloses and the key distinction of embodiment one are: replaced copper nut 6 in the embodiment one with copper pipe 6 ' in the present embodiment.
Embodiment four:
Please join shown in Figure 4ly, the pressure transducer medium insulation package structure that present embodiment discloses and the key distinction of embodiment three are: replaced PCB substrate 4 in the embodiment three with ceramic substrate 4 ' in the present embodiment.
In above four kinds of embodiments, pressure transducer is silicon piezoresistance type pressure sensor, pipe cap 5 and copper nut 6(copper pipe 6 ') combine by store energy welding and base 2, and copper pipe or copper nut material are brass, can well weld with base, copper pipe directly contacts with the pressure sensor chip notacoria for fluid as fluid hose with copper nut.
The utility model pressure sensor chip directly is affixed on the base, pressure back of the body chamber directly contacts with treating fluid measured by copper pipe or copper nut, be that medium is isolated with the silicon fiml, and saved as irritating other medium isolation technologies of a series of complicated technologies of wet goods, structure is compacter, encapsulation volume and packaging cost at pressure transducer have remarkable advantages, can solve the difficult problem of low-cost directly tracer liquid pressure and gaseous tension effectively.
Be to be understood that, though this instructions is described according to embodiment, but be not that each embodiment only comprises an independently technical scheme, this narrating mode of instructions only is for clarity sake, those skilled in the art should make instructions as a whole, technical scheme in each embodiment also can form other embodiments that it will be appreciated by those skilled in the art that through appropriate combination.
Above listed a series of detailed description only is specifying at feasibility embodiment of the present utility model; they are not in order to limiting protection domain of the present utility model, allly do not break away from equivalent embodiment or the change that the utility model skill spirit does and all should be included within the protection domain of the present utility model.
Claims (9)
1. pressure transducer medium insulation package structure, it is characterized in that, comprise base, pipe cap, pressure sensor chip, substrate and fluid hose, described base is provided with through hole and is fixed on the substrate top, described pressure sensor chip sticks on the base and covers through hole, pressure sensor chip comprises the back of the body chamber that communicates with through hole, the top forms closed cavity between pipe cap and base thereby described pipe cap is located at base, and described fluid hose is connected to the below of base and is provided with the passage that communicates with through hole.
2. pressure transducer medium insulation package structure according to claim 1 is characterized in that the adhesive glue between described pressure sensor chip and the base is silicon rubber.
3. pressure transducer medium insulation package structure according to claim 2 is characterized in that, is enclosed with the silicon gel around the described pressure sensor chip.
4. pressure transducer medium insulation package structure according to claim 1 is characterized in that described pipe cap and fluid hose are connected with base by store energy welding.
5. pressure transducer medium insulation package structure according to claim 1 is characterized in that the bore of described fluid hose is greater than through-hole diameter on the base.
6. according to each described pressure transducer medium insulation package structure in the claim 1 to 5, it is characterized in that, be connected with between described substrate and the base and can cut down lead-in wire, the described lead-in wire that cuts down has first end that protrudes into closed cavity and is fixed in second end in the substrate.
7. pressure transducer medium insulation package structure according to claim 6, it is characterized in that, input on the described pressure sensor chip, output terminal are connected to first end that can cut down lead-in wire by first lead, have connection in the described substrate and can cut down lead-in wire second end and extend to the second extraneous lead.
8. pressure transducer medium insulation package structure according to claim 7 is characterized in that described substrate is PCB substrate or ceramic substrate.
9. pressure transducer medium insulation package structure according to claim 8 is characterized in that described fluid hose is copper pipe or copper nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320178646 CN203191140U (en) | 2013-04-11 | 2013-04-11 | Dielectric isolation packaging structure for pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320178646 CN203191140U (en) | 2013-04-11 | 2013-04-11 | Dielectric isolation packaging structure for pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203191140U true CN203191140U (en) | 2013-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320178646 Expired - Fee Related CN203191140U (en) | 2013-04-11 | 2013-04-11 | Dielectric isolation packaging structure for pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203191140U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103645004A (en) * | 2013-11-27 | 2014-03-19 | 芜湖通和汽车管路系统有限公司 | Pressure sensor chip packaging structure |
| CN104101456A (en) * | 2013-04-11 | 2014-10-15 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric isolation packaging structure |
| CN105157905A (en) * | 2015-07-30 | 2015-12-16 | 武汉飞恩微电子有限公司 | High-precision gas pressure sensor |
| CN105547576A (en) * | 2015-12-08 | 2016-05-04 | 苏州敏芯微电子技术有限公司 | Medium-isolated pressure sensor packaging structure |
| CN107036740A (en) * | 2017-04-14 | 2017-08-11 | 苏州敏芯微电子技术股份有限公司 | A kind of microsensor encapsulating structure and its manufacture craft |
-
2013
- 2013-04-11 CN CN 201320178646 patent/CN203191140U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101456A (en) * | 2013-04-11 | 2014-10-15 | 苏州敏芯微电子技术有限公司 | Pressure sensor dielectric isolation packaging structure |
| CN103645004A (en) * | 2013-11-27 | 2014-03-19 | 芜湖通和汽车管路系统有限公司 | Pressure sensor chip packaging structure |
| CN105157905A (en) * | 2015-07-30 | 2015-12-16 | 武汉飞恩微电子有限公司 | High-precision gas pressure sensor |
| CN105547576A (en) * | 2015-12-08 | 2016-05-04 | 苏州敏芯微电子技术有限公司 | Medium-isolated pressure sensor packaging structure |
| CN107036740A (en) * | 2017-04-14 | 2017-08-11 | 苏州敏芯微电子技术股份有限公司 | A kind of microsensor encapsulating structure and its manufacture craft |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20180411 |