CN110174209A - Media-isolated pressure sensor - Google Patents
Media-isolated pressure sensor Download PDFInfo
- Publication number
- CN110174209A CN110174209A CN201910561153.6A CN201910561153A CN110174209A CN 110174209 A CN110174209 A CN 110174209A CN 201910561153 A CN201910561153 A CN 201910561153A CN 110174209 A CN110174209 A CN 110174209A
- Authority
- CN
- China
- Prior art keywords
- substrate
- pressure sensor
- media
- shell
- package module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 71
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 208000005189 Embolism Diseases 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 241000238367 Mya arenaria Species 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000012528 membrane Substances 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- -1 brakes Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010705 motor oil Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a kind of media-isolated pressure sensor comprising package module, the package module include substrate；Flexible shell is fixed on the substrate, and the flexible shell and the substrate form accommodating chamber；An at least pressure sensor module is located in the accommodating chamber, and the pressure sensor package module is fixed on the substrate and is electrically connected with the substrate；Media fluid is full of the accommodating chamber；Ambient pressure can be conducted by the flexible shell, the media fluid to the pressure sensor package module.The invention has the advantages that, flexible shell can be effectively prevented corrosive pressure medium and enter in it, and the shortcomings that can be avoided the existing pressure sensor for working as sensitive primary element using metallic membrane, under the premise of equally there is anti-corrosion capability, cost is saved, product size is reduced, it can guarantee the output accuracy of product again, and simple production process, processing step is few, can scale of mass production.
Description
Technical field
The present invention relates to microelectromechanical systems field more particularly to a kind of media-isolated pressure sensors.
Background technique
According to the difference of working principle, pressure sensor can be divided mainly into pressure resistance type, condenser type, resonant mode, piezoelectric type, light
The pressure sensors such as fine formula；Wherein the MEMS piezoresistive pressure sensor based on microelectromechanical systems due to its is small in size, again
Amount is light, high sensitivity, reliable and stable, at low cost, manufacturing process is simple and becomes pressure sensing convenient for many merits such as integrated
The mainstream technology of device chip.
The packing forms of common MEMS piezoresistive pressure sensor be by presser sensor chip by directly bonding or
The mode sealing-in of glass transition bonding realizes electrical connection, pressure on Can or plastic case, then through gold thread or aluminum steel
The direct contact measurement medium of power sensing unit, suitable for the pressure measurement to no corrosivity, clean clean gas medium.
But under environment more severe for application environments such as automobile engine oil, air conditioner coolant, brakes, pollutant is more, to
Surveying medium cannot directly contact with pressure sensor chip.Needing one kind, special encapsulation technology can be by testing medium and pressure
Sensor chip is kept apart, and is able to achieve the function of pressure transmitting.The medium insulation package technology of mainstream includes charging Jie at present
The metal type media isolated pressure sensor of matter liquid, using metallic membrane when sensitive primary element, by the pressure of impression into one
Step is transmitted on MEMS chip.It is had the following disadvantages with the pressure sensor of such design: 1. metallic membrane manufacturing process
Difficulty is complicated, higher cost, and easy to damage, and diaphragm deformation will affect the output accuracy of pressure sensor, also will increase terminal production
The cost of product；2. metallic membrane and the metal ring wall of outer end need to form a shell by welding, welding difficulty is big, and diaphragm is easy
Damage, there are the risk of gas leakage, when soldering not at that time, metal surface can aoxidize so that shell is insecure with substrate bonding,
Media fluid has the risk of leakage.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of media-isolated pressure sensor packaging structures, can
The shortcomings that avoiding the existing pressure sensor metal shell for working as sensitive primary element using metallic membrane equally has anti-corrosion
Under the premise of erosion ability, cost is saved, reduces product size, and can guarantee the output accuracy of product, and production technology letter
Single, processing step is few, can scale of mass production.
To solve the above-mentioned problems, the present invention provides a kind of media-isolated pressure sensors comprising package module,
The package module includes: substrate；Flexible shell is fixed on the substrate, and the flexible shell and the substrate form and hold
Receive chamber；An at least pressure sensor module is located in the accommodating chamber, and the pressure sensor package module is fixed on the base
On plate, and it is electrically connected with the substrate；Media fluid is full of the accommodating chamber；Ambient pressure can by the flexible shell,
The media fluid is conducted to the pressure sensor package module.
Further, the flexible shell is fixed on the substrate by glue-line.
Further, the pressure sensor module includes substrate, protective shell, multiple functional chips, and the substrate is fixed on
On the substrate, the protective shell is fixed over the substrate, and the protective shell and the substrate form cavity, multiple function cores
Piece is located in the cavity, and fixes over the substrate, and the functional chip is electrically connected with the substrate by the substrate,
The protective shell has an aperture, and the media fluid is entered in the cavity by the aperture, and is full of the cavity.
Further, the embolism on the substrate with an at least injection hole and at least one blocking injection hole, is given an account of
Matter liquid injects the accommodating chamber by the injection hole.
Further, the media-isolated pressure sensor further includes metal shell, and the metal shell has placed cavity
And the measured hole being connected to the placed cavity, the package module are sealed in the placed cavity, the flexible shell top
Towards the measured hole.
Further, the side wall of the metal shell compresses the surface that the substrate is not covered by the flexible shell, with close
Seal the package module.
Further, there is a sealing ring between the side wall of the metal shell and the substrate, the metal shell
Side wall and the substrate squeeze the sealing ring, to seal the package module.
Further, one end that the flexible shell is contacted with the substrate has the sealing extended along the substrate, institute
The side wall for stating metal shell compresses the sealing, to seal the package module.
Further, the media-isolated pressure sensor further includes compressing cushion block, and the compression cushion block is located at described put
Set it is intracavitary, and it is described compress cushion block compress the substrate deviate from the soft shell surface.
Further, the metal shell further includes a placement mouth, and the placement mouth is oppositely arranged with the measured hole, sealing
Glue is filling from the putting hole, and to seal the package module, the electric connection line of the package module prolongs from the sealant
Extend to the outside of the media-isolated pressure sensor.
It is an advantage of the current invention that corrosive pressure medium can be effectively prevented into the flexible shell in flexible shell
It is interior, it prevents it from influencing the performance of pressure sensor module, improves the reliability of product, and can be avoided existing using metal
Diaphragm works as the shortcomings that pressure sensor of sensitive primary element, under the premise of equally having anti-corrosion capability, saves cost,
Product size is reduced, and can guarantee the output accuracy of product, and simple production process, processing step is few, can scale of mass production.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first specific embodiment of media-isolated pressure sensor；
Fig. 2 is the structural representation of package module in the first specific embodiment of the isolated pressure sensor of present media
Figure；
Fig. 3 is the knot of pressure sensor module in the first specific embodiment of the isolated pressure sensor of present media
Structure schematic diagram；
Fig. 4 is the structural schematic diagram of the second specific embodiment of the isolated pressure sensor of present media.
Specific embodiment
With reference to the accompanying drawing to the specific embodiment of media-isolated pressure sensor packaging structure provided by the invention
It elaborates.
Fig. 1 is the structural schematic diagram of the first specific embodiment of media-isolated pressure sensor.Referring to Fig. 1, this
Invention media-isolated pressure sensor includes package module 1 and metal shell 2.
Fig. 2 is the structural representation of package module in the first specific embodiment of the isolated pressure sensor of present media
Figure.Referring to Fig. 2, the package module 1 includes substrate 11, flexible shell 12 and an at least pressure sensor module 13.At this
In specific embodiment, the package module 1 includes a pressure sensor module 13.
The substrate 11 includes but is not limited to ceramic circuit board or printed circuit board.The flexible shell 12 is can be in pressure
The nonmetal structure to deform under effect, material include but is not limited to rubber and plastics.Wherein, rubber or plastic material
The advantages of flexible shell 12 is, existing metallic membrane will receive permanent damage under cryogenic liquid medium, and rubber
Or the flexible shell 12 of plastic material can be low temperature resistant, is not damaged under cryogenic liquid medium.The flexible shell 12 can
It is pasted on the substrate 11 by the fixation of glue-line 121.The flexible shell 12 forms accommodating chamber 122 with the substrate 11.
The pressure sensor module 13 is located in the accommodating chamber 122.The pressure sensor package module 13 is fixed
It is electrically connected on the substrate 11, and with the substrate 11.The bottom of the pressure sensor package module 13 is provided with gold
Belong to tie point (not being painted in attached drawing), the metal connection point is electrically connected by conductive solder 14 with the substrate 11.
Fig. 3 is the knot of pressure sensor module in the first specific embodiment of the isolated pressure sensor of present media
Structure schematic diagram.Please refer to figs. 2 and 3, and the pressure sensor module 13 includes substrate 131, protective shell 132 and multiple function cores
Piece.In this embodiment, the pressure sensor module 13 includes a MEMS chip 134 and an asic chip
135.In other specific embodiments of the invention, the functional chip can also include the core that other are used for pressure sensor
Piece.
The substrate 131 is fixed on the substrate 11.The substrate 131 includes but is not limited to ceramic circuit board or printing
Circuit board.The protective shell 132 is fixed on the substrate 131, and the protective shell 132 forms cavity with the substrate 131
133.The protective shell 132 has an aperture 132A.The cavity 133 passes through the aperture 132A and 122 phase of accommodating chamber
It is logical.The MEMS chip 134 and asic chip 135 are located in the cavity 133.The MEMS chip 134 and asic chip 135
It can be fixed on by binder on the substrate 131.
The MEMS chip 134 and asic chip 135 can be electrically connected by the substrate 131 with the substrate 11.At this
In specific embodiment, the MEMS chip 134 and asic chip 135 are electrically connected by plain conductor 136 with the substrate 131
It connects, the substrate 131 is electrically connected with the substrate 11 again, thus by the MEMS chip 134 and asic chip 135 and the base
Plate 11 is electrically connected.
Please continue to refer to Fig. 2, media fluid 15 is full of the accommodating chamber 122.The media fluid 15 includes but is not limited to
The liquid such as silicone oil, water.In this embodiment, the media fluid 15 enters the cavity by the aperture 132A
In 133, and it is full of the cavity 133.The media fluid 15 plays the role of the protection pressure sensor module 13, simultaneously
It can also conducting pressure.
Further, there is an at least injection hole (not being painted in attached drawing) and at least one blocking injection on the substrate 11
The embolism 11A in hole.The embolism 11A is opened, the media fluid 15 is injected in the accommodating chamber 122 by the injection hole,
To the accommodating chamber 122 and the cavity 133 is full of, injection is finished, and the embolism 11A is inserted into the injection hole, with close
Seal the accommodating chamber 122.
When using the media-isolated pressure sensor, ambient pressure is acted on the flexible shell 12, described
Flexible shell 12 deforms so that the media fluid 15 in the accommodating chamber 122 is extruded, and the media fluid 15 passes the pressure
It is directed at the pressure sensor package module 13, to carry out pressure measurement.
The flexible shell 12 can be effectively prevented corrosive pressure medium and enter in the flexible shell 12, prevent it
The performance for influencing pressure sensor module 13, improves the reliability of product.
The shortcomings that media-isolated pressure sensor of the present invention uses flexible shell, can be avoided metal shell,
Under the premise of equally there is anti-corrosion capability, cost is saved, product size is reduced, and can guarantee the output essence of product
Degree, and simple production process, processing step is few, can scale of mass production.
Please continue to refer to Fig. 1, the metal shell 2 is with placed cavity 21 and the measured hole being connected to the placed cavity 21
22.The package module 1 is sealed in the placed cavity 21, and 12 top of flexible shell is towards the measured hole 22.
The side wall of the metal shell 2 compresses the surface that the substrate 11 is not covered by the flexible shell 12, with sealing
The package module 1.In this embodiment, in order to further seal the package module 1, in the metal shell 2
Side wall and the substrate 11 between there is a sealing ring 23, the side wall and the substrate 11 of the metal shell 2 squeeze described
Sealing ring 23, to seal the package module 1.The sealing ring 23 is arranged around the outside of the flexible shell 12.
Further, in this embodiment, the media-isolated pressure sensor further includes compressing cushion block 3, institute
Compression cushion block 3 is stated to be located in the placed cavity 21.The cushion block 3 that compresses compresses the substrate 11 away from the soft shell 12
The edge on surface, so that the package module 1 is fixed.
Further, in this embodiment, the metal shell 2 further includes a placement mouth 24.The placement mouth 24
It is oppositely arranged with the measured hole 22.The package module 1 can be put into the metal shell 2 from the placement mouth 24.Sealing
Glue 4 is filling from the putting hole 24, and the package module 1 is sealed in the metal shell 2.The package module 1
Electric connection line 16 extends to the outside of the media-isolated pressure sensor from the sealant 4, by the Encapsulation Moulds
Block 1 is electrically connected with external device (ED).
The course of work of the isolated pressure sensor of present media is described as follows:
Media-isolated pressure sensor is placed in tested pressure medium.The tested pressure medium can be liquid,
It may be gas.Tested pressure medium passes through the measured hole 22 and acts on the flexible shell 12.The flexible shell 12
Deformation is so that the media fluid 15 in the accommodating chamber 122 is extruded, and the media fluid 15 is by the pressure conduction to the pressure
Force sensor package module 13, the MEMS chip 134 receive the pressure and are inputted after measuring pressure signal by metal wire
To asic chip 134, asic chip 134 calculates external pressure value, to realize media-isolated pressure sensor to pressure
The measurement of power.
Fig. 4 is the structural schematic diagram of the second specific embodiment of the isolated pressure sensor of present media.The present invention
The difference of the second specific embodiment and the first specific embodiment of media-isolated pressure sensor is, the Encapsulation Moulds
The sealing means of block 1 are different.Referring to Fig. 4, in this embodiment, the flexible shell 12 is contacted with the substrate 11
One end there is the sealing 123 that extends along the substrate 11, the side wall of the metal shell 2 compresses the sealing 123, with
Seal the package module 1.Preferably, the sealing 123 of the flexible shell 12 is integrated with the flexible shell 12
Structure, to improve the leakproofness of the media-isolated pressure sensor.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of media-isolated pressure sensor, which is characterized in that including package module, the package module includes:
Substrate；
Flexible shell is fixed on the substrate, and the flexible shell and the substrate form accommodating chamber；
An at least pressure sensor module is located in the accommodating chamber, and the pressure sensor package module is fixed on the base
On plate, and it is electrically connected with the substrate；
Media fluid is full of the accommodating chamber；
Ambient pressure can be conducted by the flexible shell, the media fluid to the pressure sensor package module.
2. media-isolated pressure sensor according to claim 1, which is characterized in that the flexible shell passes through glue-line
It fixes on the substrate.
3. media-isolated pressure sensor according to claim 1, which is characterized in that the pressure sensor module packet
Substrate, protective shell, multiple functional chips are included, the substrate is fixed on the substrate, and the protective shell is fixed on the substrate
On, the protective shell and the substrate form cavity, and multiple functional chips are located in the cavity, and are fixed on the substrate
On, the functional chip is electrically connected with the substrate by the substrate, and the protective shell has an aperture, the media fluid
Entered in the cavity by the aperture, and is full of the cavity.
4. media-isolated pressure sensor according to claim 1, which is characterized in that have at least one on the substrate
The embolism of injection hole and at least one blocking injection hole, the media fluid inject the accommodating chamber by the injection hole.
5. media-isolated pressure sensor according to claim 1, which is characterized in that the media-isolated pressure passes
Sensor further includes metal shell, the measured hole that the metal shell has placed cavity and is connected to the placed cavity, the encapsulation
Module is sealed in the placed cavity, and the flexible shell top is towards the measured hole.
6. media-isolated pressure sensor according to claim 5, which is characterized in that the side wall of the metal shell supports
The surface for pressing the substrate not covered by the flexible shell, to seal the package module.
7. media-isolated pressure sensor according to claim 6, which is characterized in that in the side wall of the metal shell
There is a sealing ring between the substrate, the side wall of the metal shell and the substrate squeeze the sealing ring, with sealing
The package module.
8. media-isolated pressure sensor according to claim 5, which is characterized in that the flexible shell and the base
One end of plate contact has the sealing extended along the substrate, and the side wall of the metal shell compresses the sealing, with close
Seal the package module.
9. media-isolated pressure sensor according to claim 5, which is characterized in that the media-isolated pressure passes
Sensor further includes compressing cushion block, and the compression cushion block is located in the placement cavity, and the compression cushion block compresses the substrate back
Surface from the soft shell.
10. media-isolated pressure sensor according to claim 5, which is characterized in that the metal shell further includes
One places mouth, and the placement mouth is oppositely arranged with the measured hole, and sealant is filling from the putting hole, to seal the encapsulation
Module, the electric connection line of the package module extend to the outer of the media-isolated pressure sensor from the sealant
Portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910561153.6A CN110174209A (en) | 2019-06-26 | 2019-06-26 | Media-isolated pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910561153.6A CN110174209A (en) | 2019-06-26 | 2019-06-26 | Media-isolated pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110174209A true CN110174209A (en) | 2019-08-27 |
Family
ID=67699066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910561153.6A Pending CN110174209A (en) | 2019-06-26 | 2019-06-26 | Media-isolated pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110174209A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110700814A (en) * | 2019-10-28 | 2020-01-17 | 贵州航天凯山石油仪器有限公司 | Method and device for improving sealing reliability of gas well pressure gauge |
| CN113582126A (en) * | 2020-04-30 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and electronic equipment |
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|---|---|---|---|---|
| US5665921A (en) * | 1995-03-31 | 1997-09-09 | Endress & Hauser Gmbh & Co. | Gas tight pressure sensor sealed with flexible metallic adaptor and having ceramic sensor element |
| US6313514B1 (en) * | 1997-06-06 | 2001-11-06 | Infineon Technologies Ag | Pressure sensor component |
| CN102331322A (en) * | 2010-06-21 | 2012-01-25 | 罗伯特·博世有限公司 | Pressure sensor chip |
| CN105021323A (en) * | 2015-07-09 | 2015-11-04 | 瑞声声学科技(深圳)有限公司 | Pressing sensor device |
| CN105547576A (en) * | 2015-12-08 | 2016-05-04 | 苏州敏芯微电子技术有限公司 | Medium-isolated pressure sensor packaging structure |
| CN108225619A (en) * | 2017-12-25 | 2018-06-29 | 广州中国科学院工业技术研究院 | A kind of tactile feel answers finger tip |
| CN210089909U (en) * | 2019-06-26 | 2020-02-18 | 昆山灵科传感技术有限公司 | Medium isolation type pressure sensor |
-
2019
- 2019-06-26 CN CN201910561153.6A patent/CN110174209A/en active Pending
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|---|---|---|---|---|
| US5665921A (en) * | 1995-03-31 | 1997-09-09 | Endress & Hauser Gmbh & Co. | Gas tight pressure sensor sealed with flexible metallic adaptor and having ceramic sensor element |
| US6313514B1 (en) * | 1997-06-06 | 2001-11-06 | Infineon Technologies Ag | Pressure sensor component |
| CN102331322A (en) * | 2010-06-21 | 2012-01-25 | 罗伯特·博世有限公司 | Pressure sensor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110700814A (en) * | 2019-10-28 | 2020-01-17 | 贵州航天凯山石油仪器有限公司 | Method and device for improving sealing reliability of gas well pressure gauge |
| CN113582126A (en) * | 2020-04-30 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and electronic equipment |
| CN113582126B (en) * | 2020-04-30 | 2024-05-10 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and electronic equipment |
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