CN217819136U - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN217819136U CN217819136U CN202221112944.4U CN202221112944U CN217819136U CN 217819136 U CN217819136 U CN 217819136U CN 202221112944 U CN202221112944 U CN 202221112944U CN 217819136 U CN217819136 U CN 217819136U
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- pressure
- ceramic substrate
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- supporting plate
- pressure sensor
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Abstract
The utility model discloses a pressure sensor, which comprises a shell, wherein a containing cavity and a pressure hole for communicating the containing cavity with the outside are defined in the shell; the ceramic base comprises a ceramic substrate and a supporting plate, the supporting plate is arranged on one side of the ceramic substrate and defines an accommodating space with the ceramic substrate, the ceramic substrate and the supporting plate are integrally formed, the ceramic base is arranged in the accommodating cavity, the ceramic substrate is positioned at the pressure hole, and the ceramic substrate covers the pressure hole to sense pressure; the pressure chip is arranged on the ceramic substrate and positioned in the accommodating space so as to sense a pressure output signal; the external circuit board is arranged on the supporting plate and fixed between the shell and the supporting plate, and the external circuit board is electrically connected with the pressure chip so as to output a pressure output signal of the pressure chip outwards. The pressure sensor has the advantages of strong bearing capacity, high measurement precision, difficult damage, high structural strength and stable structure.
Description
Technical Field
The utility model relates to a pressure sensing technical field, concretely relates to pressure sensor.
Background
In the prior art, most of pressure sensors are made of stainless steel workpieces as body structures, and the parts contacting with a measuring medium are made of stainless steel. Although the stainless steel is used as a body structure for measurement, the pressure bearing capacity is strong, the difficulty of small-range measurement is high, and the precision of small-range measurement is poor. The stainless steel has a large thermal expansion coefficient, high risk of thermal deformation and low thermal conductivity; after a sensor is subjected to a thermal shock experiment and a temperature cycle experiment, damage is easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a pressure sensor, pressure sensor bearing capacity is strong, measurement accuracy is high, difficult damage and structural strength are high, stable in structure.
The pressure sensor comprises a shell, wherein a containing cavity and a pressure hole for communicating the containing cavity with the outside are defined in the shell; the ceramic base comprises a ceramic substrate and a supporting plate, the supporting plate is arranged on one side of the ceramic substrate, an accommodating space is defined between the supporting plate and the ceramic substrate, the ceramic substrate and the supporting plate are integrally formed, the ceramic base is arranged in the accommodating cavity, the ceramic substrate is located at the pressure hole, and the ceramic substrate covers the pressure hole to sense pressure; the pressure chip is arranged on the ceramic substrate and is positioned in the accommodating space so as to sense a pressure output signal; the external circuit board is arranged on the supporting plate and fixed between the shell and the supporting plate, and the external circuit board is electrically connected with the pressure chip so as to output a pressure output signal of the pressure chip outwards.
According to the utility model discloses a some embodiments, pressure sensor still includes glass and carries the thing, glass carries the thing and forms ceramic substrate surface is in order to be used for carrying on the pressure chip.
According to some embodiments of the present invention, the pressure sensor further comprises an electrical connector connecting the pressure chip and the external circuit board.
According to some embodiments of the invention, the housing comprises: a first housing having a receiving groove opened at a top thereof, the pressure hole being formed on the first housing and communicating with the receiving groove; the second shell extends into the accommodating groove from the top of the first shell and defines an accommodating cavity together with the first shell, and the external circuit board is fixed between the second shell and the supporting plate.
According to some embodiments of the invention, the second housing has an external connector for electrical connection with an external device.
According to some embodiments of the invention, the outer connector comprises a contact pin, and the second housing is formed with a receptacle exposing the contact pin.
According to some embodiments of the invention, the ceramic substrate and the housing surround the pressure port sealing connection.
According to some embodiments of the invention, the pressure sensor further comprises a sealing member surrounding the pressure hole and provided between the ceramic substrate and the housing.
According to some embodiments of the invention, the housing is provided with a recess surrounding the pressure hole, the sealing member is located in the recess and pressed between the housing and the ceramic base.
According to some embodiments of the present invention, the ceramic base is further formed thereon with a thick film circuit electrically connected to the pressure chip for assisting in adjusting the output of the pressure output signal of the pressure chip.
According to the utility model discloses pressure sensor, through adopting ceramic base, ceramic base adopts the material to form, when carrying out the test experiment, be difficult for producing the phenomenon of breaking, can improve the accuracy of experimental result, also can reduce the waste of resource in the experimentation, and ceramic deformation is big, can survey the pressure of low range, improve pressure sensor's measurement accuracy, wherein ceramic base is ceramic substrate and backup pad structure as an organic whole promptly for the formation of ceramic substrate, for example ceramic substrate and backup pad sintering form as an organic whole, thereby need not adopt the bonding after forming alone respectively, can simplify pressure sensor's formation technology, also can improve the structural strength and the bearing capacity of ceramic substrate and backup pad, make pressure sensor structure more firm and compact.
Drawings
Fig. 1 is a cross-sectional view of a pressure sensor according to an embodiment of the present invention.
Reference numerals:
100: a pressure sensor;
1: outer shell, 11: first housing, 111: engaging portion, 12: second housing, 121: a clip portion, 122: pin, 123: an insertion hole, 13: accommodation chamber, 14: pressure pipe, 141: pressure hole, 15: a card slot;
2: ceramic base, 21: ceramic substrate, 211: first surface, 212: second surface, 22: support plate, 23: an accommodating space;
31: pressure chip, 32: external circuit board, 33: an electrical connection;
41: seal, 42: and (4) a groove.
Detailed Description
The pressure sensor 100 according to the present invention will be described in detail with reference to the accompanying drawings and the following detailed description.
The pressure sensor 100 according to an embodiment of the present invention is described below with reference to the drawings.
As shown in fig. 1, a pressure sensor 100 according to an embodiment of the present invention may include a housing 1, a ceramic base 2, a pressure chip 31, and an external circuit board 32.
Specifically, the housing 1 defines a containing cavity 13 and a pressure hole 141 for communicating the containing cavity 13 with the outside, the housing 1 forms a protective shell of the pressure sensor 100, and can be used to protect internal device structures, for example, the ceramic base 2, the pressure chip 31 and the external circuit board 32 are all disposed in the containing cavity 13, the housing 1 can protect the ceramic base 2, the pressure chip 31 and the external circuit board 32 from the external environment, and the pressure chip 31 can be a strain gauge such as a strain gauge.
The pressure hole 141 is communicated with an external measured medium, and the pressure of the measured medium can be transmitted to the pressure sensor 100 through the pressure hole 141, wherein the ceramic base 2 is disposed at the pressure hole 141 and can be used for sensing the pressure of the measured medium.
The ceramic base 2 may include a ceramic substrate 21 and a supporting plate 22, the ceramic substrate 21 is disposed at the pressure hole 141 and covers the pressure hole 141 for sensing pressure, that is, the ceramic substrate 21 forms a pressure diaphragm for bearing and sensing pressure, the supporting plate 22 is disposed at one side of the ceramic substrate 21 and defines a receiving space 23 with the ceramic substrate 21, specifically, the ceramic substrate 21 may have a first surface 211 and a second surface 212 facing away from each other, the first surface 211 faces the pressure hole 141 to sense pressure, the supporting plate 22 is disposed at the second surface 212 of the ceramic substrate 21 and defines the receiving space 23 with the second surface 212 of the ceramic substrate 21, the pressure chip 31 is disposed on the ceramic substrate 21 and located in the receiving space 23, the pressure chip 31 may sense pressure of a measured medium sensed by the ceramic substrate 21 and may output a pressure signal, the pressure chip 31 may be protected by the supporting plate 22, and the supporting plate 22 and the ceramic substrate 21 together form the ceramic base 2, and the supporting plate 22 may also be used for bearing and sensing pressure to reduce damage to the pressure diaphragm.
Moreover, the supporting plate 22 can also be used for carrying circuits, for example, an external circuit can be disposed on the supporting plate 22, and the external circuit board 32 is carried by the supporting plate 22, which also facilitates the connection between the external circuit board 32 and the pressure chip 31. As shown in fig. 1, the external circuit board 32 may be mounted on the support plate 22 and fixed between the housing 1 and the support plate 22, and the pressure signal sensed by the pressure chip 31 may be derived by connecting the external circuit board 32 and the pressure chip 31.
Furthermore, the ceramic material is used as a pressure bearing structure, the deformation is large, the pressure of a low range can be tested to improve the output precision, the ceramic material is an insulating material, a sintered circuit can be printed on the surface of the ceramic material, the circuit is convenient to increase in the subsequent operation process, and the operability is strong.
From this according to the utility model discloses pressure sensor 100, through adopting ceramic base 2, ceramic base 2 adopts the material to form, when testing the experiment, be difficult for producing the phenomenon of breaking, can improve the accuracy of experimental result, also can reduce the waste of resource in the experimentation, and ceramic deformation is big, can survey the pressure of low range, improve pressure sensor 100's measurement accuracy, wherein ceramic base 2 is for integrative the formation that ceramic substrate 21 and backup pad 22 are structure as an organic whole, for example ceramic substrate 21 and backup pad 22 can integrative sintering form, thereby need not form the back respectively alone and adopt the bonding, can simplify pressure sensor 100's formation technology, also can improve ceramic substrate 21 and backup pad 22's structural strength and bearing capacity, make pressure sensor 100 structure more firm and compact.
In some embodiments of the present invention, the pressure sensor 100 may further include a glass carrier, the glass carrier is formed on the surface of the ceramic substrate 21 for carrying the pressure chip 31, thereby facilitating the fixing of the pressure chip 31 on the ceramic substrate 21 for sensing pressure through the glass carrier, specifically, the glass may be printed on the second surface 212 of the ceramic substrate 21, and then the pressure chip 31 is placed on the glass for sintering, so as to form the glass carrier and fix the pressure chip 31.
In some embodiments of the present invention, the pressure sensor 100 may further include an electrical connector 33, the electrical connector 33 electrically connects the pressure chip 31 and the external circuit board 32 to realize signal transmission of the pressure chip 31 and the external circuit board 32, optionally, the electrical connector 33 may be an electrical wire, and is electrically connected with the external circuit board 32 and the pressure chip 31 respectively through the electrical wire to realize output transmission of the pressure signal. As shown in fig. 1, the external circuit board 32 may be formed with a through hole to expose the pressure chip 31, and the electrical connector 33 passes through the through hole to connect the pressure chip 31 and the external circuit board 32.
In some embodiments of the present invention, the housing 1 may include a first housing 11 and a second housing 12, the first housing 11 has an accommodating groove with an open top, the pressure hole 141 is formed on the first housing 11 and is communicated with the accommodating groove, as shown in fig. 1, the first housing 11 is hollow to form the accommodating groove, the top of the accommodating groove is open, the pressure hole 141 may be formed at the bottom of the first housing 11, the bottom of the first housing 11 is formed with a pressure pipe 14 extending downward from a bottom wall, and the pressure hole 141 is formed in the pressure pipe 14 and is communicated with the accommodating groove. Optionally, the sidewall of pressure tube 14 may be formed with a detent 15 to facilitate mating connection with other devices.
The second housing 12 extends into the receiving groove from the top of the first housing 11 and defines a receiving cavity 13 together with the first housing 11, the external circuit board 32 is fixed between the second housing 12 and the supporting plate 22, specifically, the lower end of the second housing 12 extends into the receiving groove from the top open opening of the first housing 11 and seals the top open of the first housing 11 to define the receiving cavity 13 together with the inner wall of the receiving groove, wherein the device structures such as the external circuit board 32, the pressure chip 31, the ceramic base 2, and the like can be placed in the receiving groove, and then the first housing 11 and the second housing 12 are mounted, so that the first housing 11 and the second housing 12 form a closed outer shell 1 to protect the device structures such as the pressure chip 31, and so that the pressure sensor 100 can be applied to different environments and prevent the external environment from interfering with and damaging the pressure sensor 100, wherein the first housing 11 and the second housing 12 can be connected by riveting process or can also be connected by glue sealing.
As shown in fig. 1, the external circuit board 32 is disposed on the supporting plate 22, and the second housing 12 extends into the accommodating groove and then can abut against the external circuit board 32, so that not only can the external circuit board 32 be fixed, but also the structure of the pressure sensor 100 can be more compact and fixed. In the example shown in fig. 1, the second housing 12 is formed with a clamping portion 121, a locking portion 111 that is matched with the clamping portion 121 is formed in the receiving groove of the first housing 11, the first housing 11 and the second housing 12 are fixed by matching the clamping portion 121 and the locking portion 111, wherein the first housing 11 may be aluminum, copper, stainless steel, etc., and the second housing 12 may be hard plastic, etc., for which the present invention is not limited in particular.
Optionally, the second housing 12 may have an external connector for electrical connection with an external device, whereby the pressure signal of the pressure sensor 100 may be derived through the external connector, optionally the second housing 12 may form a socket to facilitate connection with an external device. For example, the external connector may include pins 122, and the second housing 12 may be formed with receptacles 123 exposing the pins 122, thereby facilitating a plug-fit and an electrical connection with an external device through the pins 122 and the receptacles 123.
In some embodiments of the present invention, the ceramic substrate 21 and the housing 1 surround the pressure hole 141, that is, the ceramic substrate 21 and the housing 1 are hermetically connected to seal the pressure hole 141, so that the measured medium can be transmitted to the first surface 211 of the ceramic substrate 21 through the pressure hole 141 without contacting other device structures, thereby preventing the measured medium and the external environment from damaging and polluting the device structures inside the pressure sensor 100.
Alternatively, the housing 1 and the ceramic substrate 21 may be connected by glue, for example, glue may be disposed around the pressure hole 141 in the housing 1, by which not only the ceramic substrate 21 and the housing 1 can be connected hermetically, but also the ceramic substrate 21 and the housing 1 can be fixed.
In some examples of the present invention, the pressure sensor 100 may further include a sealing member 41, the sealing member 41 surrounds the pressure hole 141 and is disposed between the ceramic substrate 21 and the housing 1, a connection gap between the ceramic substrate 21 and the housing 1 may be sealed by the sealing member 41 to seal the pressure hole 141, and the sealing member 41 may be formed as a sealing ring surrounding the pressure hole 141. Wherein the sealing member 41 may be compressed between the housing 1 and the second surface 212 of the ceramic substrate 21 to tightly combine the sealing member 41 with the housing 1 and the base, thereby improving the sealing effect, and optionally the sealing member 41 may be formed as a flat gasket.
In other examples of the present invention, as shown in fig. 1, the housing 1 may be provided with a groove 42 surrounding the pressure hole 141, the sealing element 41 is located in the groove 42 and pressed between the housing 1 and the ceramic base 2, the sealing element 41 may be limited by the groove 42, and the tight connection between the sealing element 41, the ceramic base 2 and the housing 1 is realized.
In some embodiments of the present invention, a thick film circuit electrically connected to the pressure chip 31 is further formed on the ceramic base 2 for assisting in adjusting the output of the pressure output signal of the pressure chip 31, and the thick film circuit can be formed on the ceramic substrate 21 by printing and sintering to improve the output effect of the pressure signal.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A pressure sensor, comprising:
the pressure regulating valve comprises a shell, a valve body and a valve body, wherein a containing cavity and a pressure hole which communicates the containing cavity with the outside are defined in the shell;
the ceramic base comprises a ceramic substrate and a supporting plate, the supporting plate is arranged on one side of the ceramic substrate, an accommodating space is defined between the supporting plate and the ceramic substrate, the ceramic substrate and the supporting plate are integrally formed, the ceramic base is arranged in the accommodating cavity, the ceramic substrate is located at the pressure hole, and the ceramic substrate covers the pressure hole to sense pressure;
the pressure chip is arranged on the ceramic substrate and positioned in the accommodating space so as to sense a pressure output signal;
the external circuit board is arranged on the supporting plate and fixed between the shell and the supporting plate, and the external circuit board is electrically connected with the pressure chip so as to output a pressure output signal of the pressure chip outwards.
2. The pressure sensor of claim 1, further comprising a glass carrier formed on the ceramic substrate surface for mounting the pressure chip.
3. The pressure sensor of claim 1, further comprising an electrical connection connecting the pressure chip and the external circuit board.
4. The pressure sensor of claim 1, wherein the housing comprises:
a first housing having an accommodation groove opened at a top, the pressure hole being formed at the first housing
The first shell is communicated with the accommodating groove;
the second shell extends into the accommodating groove from the top of the first shell and defines an accommodating cavity together with the first shell, and the external circuit board is fixed between the second shell and the supporting plate.
5. The pressure sensor of claim 4, wherein the second housing has an external connector for electrical connection with an external device.
6. The pressure sensor of claim 5, wherein the external connector includes a pin, and the second housing is formed with a receptacle exposing the pin.
7. The pressure sensor of claim 1, wherein the ceramic substrate is sealingly connected to the housing around the pressure port.
8. The pressure sensor of claim 7, further comprising a seal surrounding the pressure port and disposed between the ceramic substrate and the housing.
9. The pressure sensor of claim 8, wherein the housing is provided with a groove surrounding the pressure port, and the seal is located within the groove and compressed between the housing and the ceramic base.
10. The pressure sensor of claim 1, wherein the ceramic base further has a thick film circuit formed thereon for electrically connecting with the pressure chip for assisting in adjusting the output of the pressure output signal of the pressure chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221112944.4U CN217819136U (en) | 2022-05-10 | 2022-05-10 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221112944.4U CN217819136U (en) | 2022-05-10 | 2022-05-10 | Pressure sensor |
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| Publication Number | Publication Date |
|---|---|
| CN217819136U true CN217819136U (en) | 2022-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221112944.4U Active CN217819136U (en) | 2022-05-10 | 2022-05-10 | Pressure sensor |
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| CN (1) | CN217819136U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118549015A (en) * | 2024-07-25 | 2024-08-27 | 昆山灵科传感技术有限公司 | Pressure sensor and manufacturing method thereof |
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2022
- 2022-05-10 CN CN202221112944.4U patent/CN217819136U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118549015A (en) * | 2024-07-25 | 2024-08-27 | 昆山灵科传感技术有限公司 | Pressure sensor and manufacturing method thereof |
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