CN214373107U - Air pressure sensor and electronic equipment - Google Patents
Air pressure sensor and electronic equipment Download PDFInfo
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- CN214373107U CN214373107U CN202120511770.8U CN202120511770U CN214373107U CN 214373107 U CN214373107 U CN 214373107U CN 202120511770 U CN202120511770 U CN 202120511770U CN 214373107 U CN214373107 U CN 214373107U
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Abstract
The present disclosure discloses an air pressure sensor and an electronic device. The air pressure sensor comprises a substrate and a shell, wherein the shell is connected with the substrate and encloses to form an accommodating space; the shell is provided with a vent hole; the air pressure sensor also comprises a chip and a breathable waterproof film, wherein the chip is arranged in the accommodating space and is electrically connected with the substrate; the breathable waterproof film is connected with the shell, and the breathable waterproof film is arranged at the vent hole in a covering mode. This baroceptor realizes waterproof function through ventilative waterproof membrane, need not to pour into silica gel in accommodation space, has reduced the complexity of product technology, production efficiency can improve, has avoided the drawback that fills silica gel and bring simultaneously.
Description
Technical Field
The present disclosure relates to the field of electronic product technologies, and more particularly, to an air pressure sensor and an electronic device.
Background
With the development of science and technology, various electronic products are required for life of people. Among them, many electronic products have a barometric pressure sensor, which is a device for measuring ambient barometric pressure and calculates an altitude from a barometric pressure value, and in recent years, the barometric pressure sensor is increasingly used in a consumer electronic terminal to measure barometric pressure information of a location where a product is located. Due to the diversity and complexity of the use environment of the end product with the air pressure sensor, the end product is generally required to have better waterproof performance, and the air pressure sensor also needs to have waterproof performance correspondingly. The traditional waterproof air pressure sensor is characterized in that silicone gel is filled in the product to realize the waterproofness of the product, and although the waterproof function can be realized by the mode, the silicone gel is easy to be infected with foreign matters, so that the performance of the product is influenced; under the condition of high accelerated impact, the silicone gel can generate additional impact on the thin film of the chip in the air pressure sensor, so that the thin film is broken; in addition, the dispensing and glue defoaming processes of the silicone gel-filled product in the packaging process are complex, and the production efficiency is low.
In view of the above, a new technical solution is needed to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
An object of the present disclosure is to provide a new technical solution for an air pressure sensor and an electronic device.
According to a first aspect of the present disclosure, there is provided an air pressure sensor comprising:
the shell is connected with the substrate and encloses to form an accommodating space; the shell is provided with a vent hole;
a chip disposed in the accommodating space and electrically connected to the substrate;
the breathable waterproof film is connected with the shell, and the breathable waterproof film is arranged at the vent hole in a covering mode.
Optionally, the air-permeable waterproof membrane is connected to an outer surface of the housing remote from the receiving space.
Optionally, the breathable waterproof film is made of polytetrafluoroethylene.
Optionally, the air pressure sensor further comprises an air-permeable dust-proof net, and the air-permeable dust-proof net is connected with the surface, far away from the shell, of the air-permeable waterproof film.
Optionally, the air-permeable dust screen is coated with a hydrophobic coating.
Optionally, the breathable dust-proof net is made of polybutylene or polyethylene.
Optionally, a seal is attached to the housing outside the receiving space.
Optionally, a sealing member is connected to a surface of the breathable dust-proof net away from the breathable waterproof membrane.
Optionally, a sealing member is connected to the housing at the outside of the accommodating space and/or the surface of the air-permeable dust-proof net away from the air-permeable waterproof membrane.
According to a second aspect of the present disclosure, there is provided an electronic device comprising the barometric pressure sensor as described in the first aspect.
According to the air pressure sensor provided by one embodiment of the disclosure, the waterproof function is realized through the breathable waterproof membrane, silicone gel does not need to be filled in the accommodating space, the complexity of the product process is reduced, the production efficiency is improved, and the defects caused by filling of silicone gel are avoided.
Other features of the present disclosure and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a first schematic structural diagram of an air pressure sensor according to one embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of an air pressure sensor according to an embodiment of the present disclosure.
Description of reference numerals:
101: a substrate; 102: a housing; 103: an accommodating space; 104: a vent hole; 105: a chip; 1051: an ASIC chip; 1052: an MEMS chip; 106: a breathable waterproof film; 107: a breathable dust screen; 108: an O-shaped sealing ring; 109: a gasket; 110: and (3) an adhesive.
Detailed Description
Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1-2, according to one embodiment of the present disclosure, an air pressure sensor is provided. The air pressure sensor comprises a substrate 101 and a shell 102, wherein the shell 102 is connected with the substrate 101 and encloses to form an accommodating space 103; the shell 102 is provided with a vent hole 104; the air pressure sensor further comprises a chip 105 and a breathable waterproof film 106, wherein the chip 105 is arranged in the accommodating space 103 and is electrically connected with the substrate 101; the air-permeable waterproof membrane 106 is connected to the housing 102, and the air-permeable waterproof membrane 106 is disposed at the vent hole 104 in a covering manner.
In the air pressure sensor provided in the embodiment of the present application, the external air enters the accommodating space 103 through the vent hole 104, and the chip 105 senses the change of the external air pressure. The air pressure sensor according to the embodiment of the present application is configured to provide the air-permeable waterproof film 106 covering the vent hole 104 on the housing 102, so as to prevent external moisture from entering the accommodating space 103 through the vent hole 104 and damaging the chip 105. This baroceptor has adopted a new encapsulation technology scheme to replace waterproof glue embedment scheme, and it realizes waterproof function through ventilative waterproof membrane 106, need not to pour into silica gel in accommodation space 103, has reduced the complexity of product technology, production efficiency can improve, has avoided the drawback that fills silica gel and bring simultaneously. It can be understood that the air-permeable and waterproof membrane 106 has waterproof performance and air-permeable performance, so that the external air can enter the accommodating space 103 through the air-permeable and waterproof membrane 106 and the vent hole 104, and the arrangement of the air-permeable and waterproof membrane 106 does not affect the sensing of the chip 105 on the external air pressure change.
More specifically, in the packaging process of the air pressure sensor, the chip 105 is first bonded to the substrate 101, wherein the substrate 101 may be made of FR 4-grade flame-retardant material, BT resin substrate material, ceramic, or the like. Chip 105 may be an integrated single chip, or a discrete chip; for discrete chips, the chip 105 may specifically include an ASIC chip 1051 and a MEMS chip 1052, in the embodiment shown in fig. 1-2, the ASIC chip 1051 and the MEMS chip 1052 are in a stacked arrangement, specifically, the ASIC chip 1051 is bonded to the substrate 101, and the MEMS chip 1052 is bonded to the ASIC chip 1051; the ASIC chip 1051 is electrically connected to the substrate 101 by wire bonding, and the MEMS chip 1052 is electrically connected to the ASIC chip 1051 by wire bonding. In other embodiments, the ASIC chip 1051 and the MEMS chip 1052 may also take the form of a side-by-side arrangement.
More specifically, the material of the housing 102 may be a metal material or an injection molding material. When the housing 102 is made of metal, the housing 102 and the substrate 101 may be bonded by solder paste or conductive adhesive; when the housing 102 is made of injection molding material, the housing 102 and the substrate 101 may be bonded by using epoxy glue.
Referring to fig. 1-2, in one embodiment, further, the air-permeable waterproof membrane 106 is connected to an outer surface of the housing 102 away from the accommodating space 103.
Connect ventilative waterproof membrane 106 at the surface that the accommodation space 103 was kept away from to casing 102, outside gas reaches vent 104 department again after the filtering action of ventilative waterproof membrane 106 at first like this to effectively stop outside steam to enter into accommodation space 103 via vent 104. Further specifically, the breathable waterproof film 106 may be bonded to the housing 102 using a thermosetting adhesive or a pressure sensitive adhesive. More specifically, the air-permeable waterproof membrane 106 may entirely cover the outer surface of the housing 102 on which the vent hole 104 is formed; it is also possible to set the size of the air-permeable waterproof membrane 106 smaller as long as it is ensured that the air-permeable waterproof membrane 106 can cover the vent hole 104 and be firmly bonded to the case 102.
In one embodiment, the air-permeable waterproof membrane 106 is made of teflon.
The air-permeable and waterproof membrane made of polytetrafluoroethylene has the characteristics of excellent waterproof and air-permeable performance, heat-resistant stability, excellent chemical resistance, insulativity and the like, and is low in cost.
Referring to fig. 1-2, in an embodiment, the air pressure sensor further includes an air-permeable dust-proof net 107, and the air-permeable dust-proof net 107 is connected to a surface of the air-permeable waterproof film 106 away from the housing 102.
In this specific example, after the air-permeable waterproof membrane 106 is adhered to the outer surface of the housing 102, the air-permeable dustproof net 107 is adhered to the surface of the air-permeable waterproof membrane 106 away from the housing 102, the air-permeable dustproof net 107 is disposed to provide the air pressure sensor with both waterproof and dustproof performances, and the air-permeable dustproof net 107 can filter foreign matters such as dust and particles from the outside, so as to prevent the dust and particles from falling onto the air-permeable waterproof membrane 106 to block the air-permeable waterproof membrane 106 and further affect the measurement effect of the air pressure sensor. The air-permeable dust-proof mesh 107 and the air-permeable water-proof membrane 106 may be bonded together with an adhesive 110, and the adhesive 110 may be a thermosetting adhesive or a pressure-sensitive adhesive.
In one embodiment, further, the air-permeable dust screen 107 is coated with a hydrophobic coating.
Specifically, optionally, the hydrophobic solution may be sprayed onto the air-permeable dust-proof net 107, and the arrangement of the hydrophobic coating may effectively prevent liquid water from remaining outside the air-permeable dust-proof net 107 to cause an error in air pressure measurement, so as to ensure that the air pressure sensor may achieve a high-reliability and high-level waterproof and dustproof effect.
In one embodiment, the air-permeable dust-proof net 107 is made of polybutylene or polyethylene.
The breathable dustproof net made of polybutylene or polyethylene has good chemical stability, small water absorption and excellent electrical insulation.
In one embodiment, further, a sealing member is connected to the housing 102 outside the accommodating space 103.
Specifically, as shown in fig. 1, the sealing member may be an O-ring 108 sleeved outside the housing 102, and the O-ring 108 may abut against the substrate 101 in order to make the connection between the O-ring 108 and the housing 102 more tight and stable. The sealing member is arranged for subsequent system-level sealing of the air pressure sensor in an electronic product.
In one embodiment, further, a sealing member is attached to the surface of the air-permeable dust-proof net 107 away from the air-permeable waterproof membrane 106.
Specifically and alternatively, as shown in FIG. 2, the seal may be a gasket 109 attached to the breathable dust screen 107 using a thermosetting adhesive or a pressure sensitive adhesive. Also, the sealing member can be used for subsequent system-level sealing of the air pressure sensor in an electronic product.
In one embodiment, a sealing member is further connected to the housing 102 outside the accommodating space 103 and/or on a surface of the air-permeable dust-proof net 107 away from the air-permeable waterproof membrane 106.
In this particular example, the seal may be provided only on the housing 102, or only on the air-permeable dust screen 107; it is also possible to provide both a seal on the housing 102 and a seal on the air-permeable dust screen 107. For example, the O-ring 108 is sleeved outside the housing 102, and the gasket 109 is adhered to the air-permeable dust-proof mesh 107, so that the system-level sealing effect of the air pressure sensor in subsequent electronic products will be better.
According to another embodiment of the present disclosure, there is provided an electronic device including the air pressure sensor as described above.
The electronic device can be, for example, an intelligent wearable device, an intelligent terminal device, and the like.
In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.
Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.
Claims (10)
1. An air pressure sensor, comprising:
the circuit board comprises a substrate (101) and a shell (102), wherein the shell (102) is connected with the substrate (101) and encloses to form an accommodating space (103); the shell (102) is provided with a vent hole (104);
a chip (105), the chip (105) being disposed within the accommodation space (103) and forming an electrical connection with the substrate (101);
a breathable waterproof membrane (106), the breathable waterproof membrane (106) being connected with the housing (102), and the breathable waterproof membrane (106) being disposed at the vent hole (104) in a covering manner.
2. An air pressure sensor according to claim 1, characterized in that the air-permeable, water-proof membrane (106) is connected to an outer surface of the housing (102) remote from the receiving space (103).
3. The air pressure sensor according to claim 1, wherein the air-permeable, waterproof membrane (106) is an air-permeable, waterproof membrane made of polytetrafluoroethylene.
4. The air pressure sensor according to claim 1, further comprising an air-permeable dust-proof mesh (107), wherein the air-permeable dust-proof mesh (107) is connected to a surface of the air-permeable waterproof membrane (106) remote from the housing (102).
5. The air pressure sensor according to claim 4, wherein the air-permeable dust screen (107) is coated with a hydrophobic coating.
6. The air pressure sensor according to claim 4, wherein the air-permeable dust-proof net (107) is an air-permeable dust-proof net made of polybutylene or polyethylene.
7. The air pressure sensor according to claim 1, characterized in that a seal is connected to the housing (102) outside the receiving space (103).
8. The air pressure sensor according to claim 4, wherein a seal is attached to a surface of the air-permeable dust-proof mesh (107) remote from the air-permeable waterproof membrane (106).
9. The air pressure sensor according to claim 4, characterized in that a seal is connected to the housing (102) outside the receiving space (103) and/or to a surface of the air-permeable dust-proof net (107) remote from the air-permeable water-proof membrane (106).
10. An electronic device, characterized in that the electronic device comprises a barometric pressure sensor according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120511770.8U CN214373107U (en) | 2021-03-10 | 2021-03-10 | Air pressure sensor and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120511770.8U CN214373107U (en) | 2021-03-10 | 2021-03-10 | Air pressure sensor and electronic equipment |
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| CN214373107U true CN214373107U (en) | 2021-10-08 |
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| CN202120511770.8U Active CN214373107U (en) | 2021-03-10 | 2021-03-10 | Air pressure sensor and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115656341A (en) * | 2022-11-03 | 2023-01-31 | 江苏光微半导体有限公司 | Quantum sound wave sensor based on MEMS technology and array voiceprint system |
| WO2023185372A1 (en) * | 2022-03-30 | 2023-10-05 | 青岛歌尔智能传感器有限公司 | Combined sensor packaging structure and packaging method |
-
2021
- 2021-03-10 CN CN202120511770.8U patent/CN214373107U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023185372A1 (en) * | 2022-03-30 | 2023-10-05 | 青岛歌尔智能传感器有限公司 | Combined sensor packaging structure and packaging method |
| CN115656341A (en) * | 2022-11-03 | 2023-01-31 | 江苏光微半导体有限公司 | Quantum sound wave sensor based on MEMS technology and array voiceprint system |
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