CN214373078U

CN214373078U - Air pressure sensor and electronic equipment

Info

Publication number: CN214373078U
Application number: CN202120511791.XU
Authority: CN
Inventors: 李向光; 田峻瑜; 方华斌
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2021-03-10
Filing date: 2021-03-10
Publication date: 2021-10-08
Anticipated expiration: 2031-03-10

Abstract

The present disclosure discloses an air pressure sensor and an electronic device. The air pressure sensor comprises a packaging body, a first chip and a second chip, wherein a first cavity and a second cavity which are isolated from each other are arranged in the packaging body; the first cavity is provided with a first vent hole, and the second cavity is provided with a second vent hole; the orientation of the first vent hole is opposite to the orientation of the second vent hole; the first chip is arranged in the first cavity; the second chip is arranged in the second cavity.

Description

Air pressure sensor and electronic equipment

Technical Field

The present disclosure relates to the field of electronic product technologies, and more particularly, to an air pressure sensor and an electronic device.

Background

With the development of science and technology, various electronic products are required for life of people. Many electronic products have an air pressure sensor, which is a device for measuring ambient air pressure, the air pressure is a physical quantity closely related to people's daily life, and air pressure data can be used to detect height changes in the vertical direction to perform motion monitoring, indoor navigation, weather-assisted prediction and the like, so that the air pressure sensor is widely applied to the fields of intelligent wearing, intelligent home furnishing and the like to measure air pressure information of the position of a product. Due to the diversity and complexity of the use environment of the end product with the air pressure sensor, the end product is generally required to have better waterproof performance, and the air pressure sensor also needs to have waterproof performance correspondingly. Therefore, before shipping, the terminal product with the air pressure sensor needs to perform an effective air tightness test to ensure the normal waterproof function of the terminal product, while most of the existing air pressure sensors only have a function of measuring the external atmospheric pressure but do not have a function of measuring the internal air pressure value of the terminal product, so that the terminal product cannot be assisted in performing the air tightness test before shipping.

In view of the above, a new technical solution is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the present disclosure is to provide a new technical solution for an air pressure sensor and an electronic device.

According to a first aspect of the present disclosure, there is provided an air pressure sensor comprising:

the packaging structure comprises a packaging body, a first cavity and a second cavity, wherein the packaging body is internally provided with the first cavity and the second cavity which are mutually isolated;

the first cavity is provided with a first vent hole, and the second cavity is provided with a second vent hole; the orientation of the first vent hole is opposite to the orientation of the second vent hole;

a first chip disposed within the first cavity;

a second chip disposed within the second cavity.

Optionally, the package includes a substrate and a housing, and the substrate is connected to the housing; the shell comprises a first sub-shell and a second sub-shell which are isolated from each other; the first sub-shell and the substrate are enclosed to form the first cavity; the second sub-shell and the substrate enclose to form the second cavity.

Optionally, the first sub-housing is provided with a through hole far away from the substrate to form the first vent hole; and a through hole is formed in the position of the substrate corresponding to the second cavity to form the second ventilation hole.

Optionally, the first chip and the second chip are electrically connected to the substrate.

Optionally, the housing is made of a metal material or an injection molding material.

Optionally, the exterior of the first sub-housing is provided with a seal proximate to the first vent.

Optionally, the first chip and the second chip each include an ASIC chip and a MEMS chip.

Optionally, a protective adhesive is poured into the first cavity, and the protective adhesive covers the first chip.

According to a second aspect of the present disclosure, there is provided an electronic device comprising the barometric pressure sensor as described in the first aspect.

Optionally, the electronic device has an inner cavity, the second vent hole is disposed towards the inner cavity, and the first vent hole is disposed away from the inner cavity.

According to one embodiment of the disclosure, the air pressure sensor has both a function of measuring an external atmospheric pressure value and a function of measuring an internal air pressure value of an electronic product, so that the air tightness test of the terminal product before delivery can be assisted.

Other features of the present disclosure and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of an air pressure sensor according to one embodiment of the present disclosure.

Description of reference numerals:

101: a first cavity; 102: a second cavity; 103: a first vent hole; 104: a second vent hole; 105: a first chip; 106: a second chip; 107: a substrate; 108: a housing; 109: a gasket; 110: and (5) protective glue.

Detailed Description

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Referring to fig. 1, according to one embodiment of the present disclosure, an air pressure sensor is provided. The air pressure sensor comprises a packaging body, a first chip 105 and a second chip 106, wherein a first cavity 101 and a second cavity 102 which are isolated from each other are arranged in the packaging body; the first cavity 101 is provided with a first vent 103, and the second cavity 102 is provided with a second vent 104; the first ventilation hole 103 is oriented opposite to the second ventilation hole 104; the first chip 105 is disposed in the first cavity 101; the second chip 106 is disposed in the second cavity 102.

In the air pressure sensor provided by the embodiment of the application, two cavities which are isolated from each other are provided, that is, a first cavity 101 and a second cavity 102, and a first vent 103 formed in the first cavity 101 and a second vent 104 formed in the second cavity 102 are opposite in orientation; in practical applications, the first vent hole 103 may be communicated with the external environment, and the external air pressure value is sensed by the first chip 105 disposed in the first cavity 101; in addition, the second vent hole 104 can be communicated with the inside of an electronic product applied to the air pressure sensor, and the air pressure value inside the electronic product is measured through the second chip 106 arranged in the second cavity 102, so that before the electronic product leaves a factory, whether the air tightness of the electronic product is good or not can be judged by applying high pressure to the first vent hole 103 and then measuring the change of the air pressure value inside the electronic product through the second chip 106. Specifically, if the air pressure value inside the electronic product does not change significantly, the electronic product can be considered to have good air tightness, i.e., good water resistance; if the air pressure value of the electronic product is obviously changed, the electronic product is considered to have poor air tightness, namely poor water resistance. To sum up, the air pressure sensor provided by the embodiment of the application has the functions of measuring the external atmospheric pressure value and measuring the internal atmospheric pressure value of the electronic product, so that the terminal product can be assisted to carry out air tightness test before leaving the factory.

Referring to fig. 1, in an embodiment, the package further includes a substrate 107 and a housing 108, wherein the substrate 107 is connected to the housing 108; the housing 108 comprises a first sub-housing and a second sub-housing isolated from each other; the first sub-housing and the substrate 107 enclose to form the first cavity 101; the second sub-housing and the substrate 107 enclose the second cavity 102.

In this specific example, the package body is specifically composed of a substrate 107 and a housing 108, and the housing 108 is divided into two parts, namely a first sub-housing and a second sub-housing; wherein the first sub-housing is connected with the substrate 107 and forms the first cavity 101, and the second sub-housing is connected with the substrate 107 and forms the second cavity 102. Specifically, the first sub-housing and the second sub-housing are connected to each other and isolated from each other, and the first sub-housing and the second sub-housing have a common side wall plate, one side of the side wall plate is a first cavity 101, and the other side of the side wall plate is a second cavity 102; further alternatively, the first sub-housing and the second sub-housing are integrally formed, so that the housing 108 is not only simple to manufacture, but also the housing 108 is easy to install.

Referring to fig. 1, in one embodiment, further, the first sub-housing is provided with a through hole away from the substrate 107 to form the first ventilation hole 103; the substrate 107 is provided with a through hole at a position corresponding to the second cavity 102 to form the second ventilation hole 104.

In this specific example, the first ventilation hole 103 is opened on the first sub-housing, and the first ventilation hole 103 is provided at a position distant from the substrate 107; the second vent 104 is formed on the substrate 107, and the second vent 104 is formed at a position corresponding to the second cavity 102. Thus, the first ventilation hole 103 and the second ventilation hole 104 can be easily oriented oppositely, so that the first chip 105 and the second chip 106 can be matched to realize the above two functions of the air pressure sensor.

Referring to fig. 1, in one embodiment, the first chip 105 and the second chip 106 are electrically connected to the substrate 107. In one embodiment, the first chip 105 and the second chip 106 each include an ASIC chip and a MEMS chip.

More specifically, in the packaging process of the air pressure sensor, first, a first chip 105 and a second chip 106 are both bonded to a substrate 107, wherein the first chip 105 is located in the first cavity 101, and the second chip 106 is located in the second cavity 102; the material of the substrate 107 may be FR4 grade flame-retardant material, BT resin substrate material, ceramic, or the like. The first chip 105 and the second chip 106 each include an ASIC chip and a MEMS chip. The first chip 105 and the second chip 106 may be an integrated single chip or separate chips; for discrete chips, the ASIC chip and the MEMS chip may be stacked, for example, the ASIC chip is bonded to the substrate 107, and then the MEMS chip is bonded to the ASIC chip; for discrete chips, the ASIC chip and the MEMS chip may also be arranged side by side. In the embodiment shown in fig. 1, the first chip 105 and the second chip 106 are both integrated single chips, that is, the ASIC chip and the MEMS chip are integrated into one chip, and during packaging, the integrated single chip is bonded to the substrate 107, and then the integrated single chip and the substrate 107 are wire-bonded by gold wires to achieve electrical conduction.

In one embodiment, the housing 108 is a metal housing or an injection molded housing.

More specifically, the material of the housing 108 may be a metal material or an injection molding material. When the shell 108 is made of metal, the shell 108 and the substrate 107 may be bonded by using solder paste or conductive adhesive; when the housing 108 is made of injection molding material, the housing 108 and the substrate 107 may be bonded by using epoxy glue.

Referring to fig. 1, in one embodiment, further, the exterior of the first sub-housing is provided with a sealing member 109 near the first vent hole 103.

Specifically, alternatively, referring to fig. 1, the sealing element 109 may be an O-ring fitted outside the first sub-housing, and the sealing element is configured to be used for subsequent system-level sealing of the air pressure sensor in an electronic product.

Referring to fig. 1, in an embodiment, a protective adhesive 110 is further filled in the first cavity 101, and the protective adhesive 110 covers the first chip 105.

In this specific example, the specific manner for the air pressure sensor to achieve the waterproof function is to pour the protective glue 110 into the first cavity 101, and further specifically, the protective glue 110 may be, for example, silicone gel. The protective adhesive 110 covers the first chip 105 to protect the first chip 105 from water, so as to prevent external moisture from entering the first cavity 101 and damaging the first chip 105. More specifically, after the protective adhesive 110 is poured into the first cavity 101, the protective adhesive 110 may be defoamed in a vacuum pumping manner before the protective adhesive 110 is cured, and a step-type temperature rise process may be adopted in the curing process of the protective adhesive 110, so that the defoaming is more thorough. It can be understood that the protective adhesive 110 is a silicone gel with very small hardness, and since the protective adhesive 110 has very small hardness, it can precisely transmit the external air pressure change; meanwhile, the protective adhesive 110 can also block external moisture from entering the first cavity 101, so that the first chip 105 has short-circuit and other problems; in practical applications, the external air pressure changes to cause the topography of the protection adhesive 110 to change, and then the appearance is transferred to the first chip 105, so that the first chip 105 senses the external air pressure changes.

According to another embodiment of the present disclosure, there is provided an electronic device including the air pressure sensor as described above.

The electronic device can be, for example, an intelligent wearable device, an intelligent home device, an intelligent terminal device, and the like.

In one embodiment, further, the electronic device has an inner cavity, the second vent hole 104 is disposed toward the inner cavity, and the first vent hole 103 is disposed away from the inner cavity.

In practical applications, specifically, the first vent hole 103 is disposed away from an inner cavity of the electronic device, and the first vent hole 103 is communicated with an external environment, so that an external air pressure value is sensed by the first chip 105 disposed in the first cavity 101; the second vent hole 104 is disposed toward an inner cavity of the electronic device, so as to measure a pressure value inside the electronic product through a second chip 106 disposed in the second cavity 102.

In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.

Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. An air pressure sensor, comprising:

the packaging structure comprises a packaging body, a first cavity (101) and a second cavity (102) which are isolated from each other are arranged in the packaging body;

the first cavity (101) is provided with a first vent hole (103), and the second cavity (102) is provided with a second vent hole (104); the first ventilation hole (103) is oriented in the opposite direction to the second ventilation hole (104);

a first chip (105), the first chip (105) being disposed within the first cavity (101);

a second chip (106), the second chip (106) disposed within the second cavity (102).

2. The air pressure sensor according to claim 1, wherein the package body comprises a substrate (107) and a housing (108), the substrate (107) is connected with the housing (108); the housing (108) comprises a first sub-housing and a second sub-housing which are isolated from each other; the first sub-shell and the substrate (107) enclose to form the first cavity (101); the second sub-shell and the substrate (107) enclose to form the second cavity (102).

3. The air pressure sensor according to claim 2, wherein the first sub-housing is perforated away from the substrate (107) to form the first vent hole (103); the substrate (107) is provided with a through hole at a position corresponding to the second cavity (102) to form the second vent hole (104).

4. The air pressure sensor according to claim 2, wherein the first chip (105) and the second chip (106) are electrically connected to the substrate (107).

5. The air pressure sensor according to claim 2, wherein the housing (108) is a metal housing or an injection molded housing.

6. A gas pressure sensor according to claim 2, characterized in that the exterior of the first sub-housing is provided with a seal (109) near said first venting aperture (103).

7. The air pressure sensor according to claim 1, wherein the first chip (105) and the second chip (106) each comprise an ASIC chip and a MEMS chip.

8. The air pressure sensor according to claim 1, wherein a protective adhesive (110) is poured into the first cavity (101), and the protective adhesive (110) covers the first chip (105).

9. An electronic device, characterized in that the electronic device comprises a barometric pressure sensor according to any of claims 1 to 8.

10. The electronic device of claim 9, wherein the electronic device has an internal cavity, the second vent (104) is disposed toward the internal cavity, and the first vent (103) is disposed away from the internal cavity.