CN106225945B - A kind of waterproof and dampproof temperature sensor and preparation method thereof - Google Patents
A kind of waterproof and dampproof temperature sensor and preparation method thereof Download PDFInfo
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- CN106225945B CN106225945B CN201610595884.9A CN201610595884A CN106225945B CN 106225945 B CN106225945 B CN 106225945B CN 201610595884 A CN201610595884 A CN 201610595884A CN 106225945 B CN106225945 B CN 106225945B
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- temperature sensor
- thermistor
- waterproof
- electric wire
- shell
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
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- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a kind of waterproof and dampproof temperature sensor and preparation method thereof, the waterproof and dampproof temperature sensor includes shell, at least one thermistor for being set in shell, the electric wire for being connected to thermistor；The thermistor outer encapsulating has the first encapsulated layer, coats the junction of thermistor and thermistor and electric wire；Embedding has embedding layer between the shell and thermistor；The tail portion that the electric wire exposes to shell is encapsulated with the second encapsulated layer, and exposes the core of electric wire.The gap of the temperature sensor is filled with waterproof layer.Compared with the existing technology, the present invention is encapsulated with the second encapsulated layer in tail portion, prevent moisture from being entered inside temperature sensor from tail portion, and the mode for taking cycle pressurization to depressurize carries out the oil pressure of cell breath, make oil well between each gap of temperature sensor, isolation moisture enters inside temperature sensor, and waterproof and dampproof performance is good, and temperature sensor resistance stability is good, reliability is high.
Description
Technical field
The invention belongs to technical field of electronic components more particularly to a kind of waterproof and dampproof temperature sensor and its preparation sides
Method.
Background technology
By heat sensitive chip as core component, the thermistor and temperature sensor for taking different packing forms to constitute are wide
It is general to be applied to various temperature sensings, temperature-compensating, temperature-control circuit, it plays in circuit and the variable of temperature is converted into institute
The central role of the electronic signal needed.With the development of electronic technology, the further multifunction of various electronic devices and intelligence,
Heat sensitive chip needs the application for the occasions such as being detected, control, compensate to temperature increasingly to increase various.Due to temperature sensor
Have the requirements of one's work in wet environment, to waterproof, it is moisture-proof require it is higher and higher, it is therefore desirable to reinforce the encapsulation of temperature sensor
Leakproofness and waterproof and dampproof performance.
Current temperature sensor includes the heat sensitive chip being arranged in shell, and two groups of leads are provided in heat sensitive chip,
The lead is encapsulated with epoxy encapsulating material, embedding epoxy potting compound in the shell, for curing heat sensitive chip.Prior art system
The moisture-proof wetting resistance of temperature sensor made is poor, is not suitable in moist environmental applications.The encapsulating material and lead of temperature sensor
Lead to short texture in conjunction with bad, moisture is first into the seam between lead and encapsulated layer in water or in high humidity environment
Gap, then heat sensitive chip is stepped into, when heat sensitive chip core has moisture, resistance value will appear decline or unstable state, lead
Temperature sensor cisco unity malfunction is caused, is occurred abnormal.The sensor of this structure cannot meet to the waterproof of temperature sensing
It is required that and lower work, reliability do not reach requirement in water or in high humidity environment.
Invention content
It is an object of the invention to overcome shortcoming and defect in the prior art, a kind of waterproof and dampproof temperature sensor is provided
And preparation method thereof, the temperature sensor waterproof, humidity resistance are good, and unstable or jumping phenomenon will not occur for resistance value stabilization,
And there is higher mechanical strength.
The present invention is achieved by the following technical solutions：A kind of waterproof and dampproof temperature sensor, including shell, be set to
At least one thermistor in shell, the electric wire for being connected to thermistor；The thermistor outer encapsulating has the first encapsulating
Layer coats the junction of thermistor and thermistor and electric wire；Embedding has embedding between the shell and thermistor
Layer；The tail portion that the electric wire exposes to shell is encapsulated with the second encapsulated layer, and exposes the core of electric wire.
Compared with the existing technology, waterproof and dampproof temperature sensor of the invention is encapsulated with the second encapsulated layer in tail portion, prevents
Moisture is entered from tail portion inside temperature sensor, and isolation moisture enters inside temperature sensor, and waterproof and dampproof performance is good, temperature
Resistance of sensor stability is good, reliability is high.
Further, first encapsulated layer, embedding layer and the second encapsulated layer are respectively between thermistor and electric wire
Gap is filled with waterproof layer.
Further, first encapsulated layer, embedding layer and the second encapsulated layer are in epoxy resin, phenolic resin or silicones
Any one.
Further, the waterproof layer is oil.
Further, the thermistor includes heat sensitive chip and is set in heat sensitive chip for connecting drawing for electric wire
Foot；The thermistor is welded to connect by pin and the electric wire.
Further, the heat sensitive chip is NTC heat sensitive chips.
The present invention also provides a kind of preparation methods of waterproof and dampproof temperature sensor, include the following steps：
(1) thermistor and electric wire are welded to connect, then encapsulate encapsulating material, thermistor and pad package is close
Envelope, and carry out high temperature sintering；
(2) thermistor encapsulated is placed in shell, and exposes electric wire, be molded between thermistor and shell
Or embedding potting compound and carry out high temperature sintering；
(3) the tail portion encapsulating encapsulating material that will expose to the electric wire of shell, exposes the core of electric wire, and to encapsulating material into
Row high temperature sintering；
(4) temperature sensor being prepared in step (3) is placed in the compression pump of oil, takes cycle pressurization decompression
Mode carry out the oil pressure of cell breath, make oil well between each gap of temperature sensor.
The preparation method of the waterproof and dampproof temperature sensor of the present invention, is encapsulated with the second encapsulated layer in tail portion, prevents moisture
It is entered inside temperature sensor from tail portion；And be placed in temperature sensor in the compression pump of oil, take cycle pressurization decompression
Mode carry out the oil pressure of cell breath, make oil well between each gap of temperature sensor, isolation moisture enters temperature
Sensor internal is spent, waterproof and dampproof performance is good, and temperature sensor resistance stability is good, reliability is high.
Further, the encapsulating material and potting compound are respectively any one in epoxy resin, phenolic resin or silicones.
Further, the preparation method of the thermistor：After pin is set in heat sensitive chip, temperature-sensitive is encapsulated with encapsulating material
Chip and pin, and expose pin end, for connecting electric wire.
Further, the heat sensitive chip is NTC heat sensitive chips.
In order to better understand and implement, the invention will now be described in detail with reference to the accompanying drawings.
Description of the drawings
Fig. 1 is the cross-sectional view of the structure of the waterproof and dampproof temperature sensor of the present invention.
Fig. 2 is the structural schematic diagram of the waterproof and dampproof temperature sensor of the present invention.
Fig. 3 is the operation chart of the waterproof and dampproof temperature sensor preparation process (4) of the present invention.
Specific implementation mode
It please refers to Fig.1, Fig. 2, is the sectional view and structural schematic diagram of the waterproof and dampproof temperature sensor of the present invention respectively.
The waterproof and dampproof temperature sensor 1 includes shell 2, at least one thermistor 3 being set in shell 2, is connected to temperature-sensitive
The electric wire 4 of resistance 3, the first encapsulated layer 5, embedding layer 6 and the second encapsulated layer 7.The thermistor 3 connects with the welding of electric wire 4
It connects, first encapsulated layer 5 is by thermistor 3 and pad environmental sealing.6 embedding of embedding layer is in shell 2 and temperature-sensitive electricity
Between resistance 3.Second encapsulated layer 7 is encapsulated in electric wire 4 and exposes to the tail portion of shell 2, and exposes the core of electric wire 4.Institute
State the gap filling of the first encapsulated layer 5, embedding layer 6 and the second encapsulated layer 7 respectively between thermistor 3 and electric wire 4 have it is anti-
Water layer.
The shell 2 is made of high temperature resistant material, such as metal, plastic cement, ceramics material, but not limited to this, shell 2 can
To protect thermistor.The thermistor 3 includes heat sensitive chip and is set in heat sensitive chip for connecting drawing for electric wire
Foot.The thermistor 3 is welded to connect by pin and the electric wire 4.
In the present embodiment, epoxy resin, phenolic aldehyde can be selected in first encapsulated layer 5, embedding layer 6 and the second encapsulated layer 7
Other waterproof sealing insulating materials also can be selected in any one in resin or silicones.It is anti-that oil etc. can be selected in the waterproof layer
Water substance.
The preparation method of waterproof and dampproof temperature sensor 1 of the present invention is as follows：
(1) thermistor 3 and electric wire 4 are welded to connect, then encapsulate encapsulating material, thermistor and pad are wrapped up
Sealing, and carry out high temperature sintering；The first encapsulated layer 5 is formed after the encapsulating material solidification sintering；Wherein, the thermistor 3
Preparation method is as follows：After pin is set in heat sensitive chip, heat sensitive chip and pin are encapsulated with encapsulating material, and expose leads ends
Portion, for connecting electric wire；In the present embodiment, the heat sensitive chip is NTC heat sensitive chips；
(2) thermistor 3 encapsulated is placed in shell 2, and exposes electric wire 4, thermistor 3 and shell 2 it
Between be molded or embedding potting compound and carry out high temperature sintering；After potting compound solidification sintering between thermistor 3 and shell 2 shape
At embedding layer 6；
(3) the tail portion encapsulating encapsulating material that will expose to the electric wire 4 of shell 2, exposes the core of electric wire 4, and to encapsulating
Material carries out high temperature sintering；The second encapsulated layer 7 is formed after the encapsulating material solidification sintering；
(4) temperature sensor 1 being prepared in step (3) is placed in the compression pump 8 of oil 81, carries out cell breath
Oil pressure；Referring to Fig. 3, it is the operation chart of step (4).First is carried out to compression pump pressurization a period of time, then subtracted again
It pressure a period of time, moves in circles.By the oil pressure of the cell breath of step (4), make oil well into the first encapsulated layer 5, fill
Inside gap between sealing 6 and the second encapsulated layer 7, make to avoid moisture from entering full of oil in the having the gap of temperature sensor
Temperature sensor, to obtain waterproof and dampproof temperature sensor.
Pass through reliability test (thermal shock by the waterproof and dampproof temperature sensor that the preparation method is prepared
1000 cycles, 100 DEG C of boilings 1000 hours, high temperature and high pressure steam 1000 hours and 0.4MPa hydraulic pressure are tested for 1000 hours),
It is tested front and back each performance parameter variations rate and is respectively less than ± 3%, and the following table 1 is specifically shown in.As shown in Table 1, waterproof of the present invention
The resistance stability of moisture-proof temperature sensor is good, will not occur drift, mutation, resistance decrease phenomena such as, compared with prior art,
The waterproof and dampproof temperature sensor qualification rate of the present invention is high, good reliability.
Performance change (15 groups of samples) before and after the 1 waterproof and dampproof temperature sensor reliability test of the present invention of table
Compared with the existing technology, waterproof and dampproof temperature sensor of the invention is encapsulated with the second encapsulated layer in tail portion, prevents
Moisture is entered from tail portion inside temperature sensor；And be placed in temperature sensor in the compression pump of oil, take cycle to pressurize
The mode of decompression carries out the oil pressure of cell breath, makes oil well between each gap of temperature sensor, isolation moisture into
Enter inside temperature sensor, waterproof and dampproof performance is good, and temperature sensor resistance stability is good, reliability is high.
The invention is not limited in the above embodiments, if the various changes or deformation to the present invention do not depart from the present invention
Spirit and scope, if these changes and deformation belong within the scope of the claim and equivalent technologies of the present invention, then this hair
It is bright to be also intended to comprising these changes and deformation.
Claims (7)
1. a kind of preparation method of waterproof and dampproof temperature sensor, it is characterised in that：Include the following steps：
(1) thermistor and electric wire are welded to connect, then encapsulate encapsulating material, by thermistor and pad environmental sealing,
And carry out high temperature sintering；
(2) thermistor encapsulated is placed in shell, and exposes electric wire, be molded or fill between thermistor and shell
Envelope potting compound simultaneously carries out high temperature sintering；
(3) the tail portion encapsulating encapsulating material that will expose to the electric wire of shell, exposes the core of electric wire, and is carried out to encapsulating material high
Temperature sintering；
(4) temperature sensor being prepared in step (3) is placed in the compression pump of oil, takes the side of cycle pressurization decompression
Formula carries out the oil pressure of cell breath, makes oil well between each gap of temperature sensor.
2. the preparation method of waterproof and dampproof temperature sensor according to claim 1, it is characterised in that：The encapsulating material and
Potting compound is respectively any one in epoxy resin, phenolic resin or silicones.
3. the preparation method of waterproof and dampproof temperature sensor according to claim 1, it is characterised in that：The thermistor
Preparation method：After pin is set in heat sensitive chip, heat sensitive chip and pin are encapsulated with encapsulating material, and expose pin end,
For connecting electric wire.
4. the preparation method of waterproof and dampproof temperature sensor according to claim 3, it is characterised in that：The heat sensitive chip
For NTC heat sensitive chips.
5. a kind of waterproof and dampproof temperature sensor, it is characterised in that：It is prepared by any method of Claims 1 to 4.
6. waterproof and dampproof temperature sensor according to claim 5, it is characterised in that：Including shell, it is set in shell
At least one thermistor, be connected to the electric wire of thermistor, it is characterised in that：The thermistor outer encapsulating has first
Encapsulated layer coats the junction of thermistor and thermistor and electric wire；There is embedding between the shell and thermistor
Embedding layer；The tail portion that the electric wire exposes to shell is encapsulated with the second encapsulated layer, and exposes the core of electric wire.
7. waterproof and dampproof temperature sensor according to claim 6, it is characterised in that：First encapsulated layer, embedding layer
And second encapsulated layer respectively the gap between thermistor and electric wire be filled with waterproof layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610595884.9A CN106225945B (en) | 2016-07-26 | 2016-07-26 | A kind of waterproof and dampproof temperature sensor and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610595884.9A CN106225945B (en) | 2016-07-26 | 2016-07-26 | A kind of waterproof and dampproof temperature sensor and preparation method thereof |
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| CN106225945A CN106225945A (en) | 2016-12-14 |
| CN106225945B true CN106225945B (en) | 2018-10-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021255005A1 (en) * | 2020-06-17 | 2021-12-23 | Tdk Electronics Ag | Sensor with housing and silicone resin filler |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6515944B2 (en) * | 2016-12-20 | 2019-05-22 | 株式会社デンソー | Semiconductor device and method of manufacturing the same |
| CN111174821A (en) * | 2019-11-28 | 2020-05-19 | 北京宇航系统工程研究所 | Temperature and humidity sensor and monitoring system for carrier rocket |
| CN114166805B (en) * | 2021-11-03 | 2024-01-30 | 格力电器（合肥）有限公司 | NTC temperature sensor detection method and device, NTC temperature sensor and manufacturing method |
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| JP2000216003A (en) * | 1999-01-22 | 2000-08-04 | Murata Mfg Co Ltd | Ntc thermistor |
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| CN202048997U (en) * | 2011-05-09 | 2011-11-23 | 肇庆爱晟电子科技有限公司 | Water-proof anti-aging high-reliability temperature sensor |
| CN102636284A (en) * | 2012-05-14 | 2012-08-15 | 花国樑 | NTC (negative temperature coefficient) surface temperature-measuring temperature sensor |
| CN102680127A (en) * | 2012-06-04 | 2012-09-19 | 句容市博远电子有限公司 | Negative temperature coefficient (NTC) temperature sensor |
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| WO2021255005A1 (en) * | 2020-06-17 | 2021-12-23 | Tdk Electronics Ag | Sensor with housing and silicone resin filler |
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| CN106225945A (en) | 2016-12-14 |
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Effective date of registration: 20170224 Address after: 526020 Guangdong Province, Zhaoqing city Duanzhou District Mu Gang Industrial Zone of Tangxia town Applicant after: Zhaoqing AI Sheng Sensor Technology Co Ltd Address before: 526020 Guangdong Province, Zhaoqing city Duanzhou District Mu Gang Industrial Zone of Tangxia town Applicant before: GUANGDONG AISHENG ELECTRONIC TECHNOLOGY CO., LTD. |
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