CN104198078A - Rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and manufacturing method thereof - Google Patents
Rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and manufacturing method thereof Download PDFInfo
- Publication number
- CN104198078A CN104198078A CN201410369424.5A CN201410369424A CN104198078A CN 104198078 A CN104198078 A CN 104198078A CN 201410369424 A CN201410369424 A CN 201410369424A CN 104198078 A CN104198078 A CN 104198078A
- Authority
- CN
- China
- Prior art keywords
- ntc
- glass
- sensitive chip
- temperature
- ntc temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention belongs to the technical field of heat-resistant chip products, and particularly discloses a rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and a manufacturing method thereof. The thermistor comprises an NTC heat-resistant chip, wherein two upper surface electrodes are arranged in parallel on the upper surface of the NTC heat-resistant chip at a certain interval; the lower surface of the NTC heat-resistant chip is an electrode-free surface; leads are welded on the upper surface electrodes respectively; the periphery of the NTC heat-resistant chip is packaged through a glass package layer; the thickness of the upper surface of the NTC heat-resistant chip corresponding to the glass package layer is greater than the thickness of the periphery of the lower surface corresponding to the glass package layer. Through the NTC thermistor, the glass thickness of the electrode-free surface is reduced; during use, a tested object is attached to the electrode-free surface, thereby accelerating the reaction time, increasing the sensitivity, effectively meeting the high sensitivity requirement on temperature detection, and achieving high reliability; moreover, the manufacturing method is simple, and is easy to implement.
Description
Technical field
The invention belongs to temperature-sensitive chip product technical field, particularly a kind of rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor and preparation method thereof.
Background technology
NTC temperature-sensitive chip is owing to having the large and characteristic that progressively reduces along with the rising resistance of temperature of cold-state resistance, temperature sensor temperature sensing, temperature compensation, the temperature-control circuit of taking glass-encapsulated form to form, it plays the variable of temperature is changed into required electronic signal in circuit, makes it to show in display screen.
In prior art, what often adopt is all to carry out the welding of double-face electrode on two surfaces of NTC temperature-sensitive chip, and then encapsulate by glass, and the thickness of glass of encapsulation is centered by NTC temperature-sensitive chip, NTC temperature-sensitive chip surrounding thickness is all the same, and to be close to the distance of object under test larger for NTC temperature-sensitive chip like this, makes NTC temperature-sensitive chip detecting object need to isolate thicker glass, thereby its reaction time is slow, cannot meet rapid-action demand.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, specifically disclose a kind of rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor and preparation method thereof.This NTC thermistor reduces by the thickness of glass of electrodeless, and during use, electrodeless face is close to testee, accelerates the reaction time, and sensitivity is high, can effectively meet the highly sensitive requirement to temperature sensing, and reliability is high, and method for making is simple in addition, is easy to realize.
In order to overcome above-mentioned technical purpose, the present invention realizes by following technical scheme:
A kind of rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor of the present invention, comprise NTC temperature-sensitive chip, on the upper surface of described NTC temperature-sensitive chip side by side and interval be provided with two upper surface electrodes, the lower surface of described NTC temperature-sensitive chip is electrodeless, on described upper surface electrode, be respectively welded with lead-in wire, the periphery of described NTC temperature-sensitive chip encapsulates by glass encapsulating layer, the thickness of the peripheral corresponding glass encapsulating layer of described NTC temperature-sensitive chip upper surface is greater than the thickness of the peripheral corresponding glass-encapsulated layer of lower surface, the thickness of the peripheral corresponding glass encapsulating layer of described NTC temperature-sensitive chip upper surface is greater than the thickness of the peripheral corresponding glass-encapsulated layer of lower surface.
The method for making that the invention also discloses above-mentioned rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor, its concrete steps are:
(1) select NTC temperature-sensitive chip;
(2) upper surface at NTC temperature-sensitive chip is pasted with two spaced upper surface electrodes;
(3) on above-mentioned two upper surface electrodes, in each corresponding welding, go between;
(4) glass bushing in the outer race of NTC temperature-sensitive chip;
(5) the NTC resistance electrodeless one that packages glass bushing is faced down, be placed on and on heat resistance insulating sheet, carry out sinter molding.
As the further improvement of above-mentioned technology, in this sinter molding process its, sintering range value is 255 degrees Celsius to 265 degrees Celsius.
Because NTC resistance electrodeless one faces down, be placed on heat resistance insulating sheet, after sinter molding, the thickness of the peripheral corresponding glass encapsulating layer of temperature-sensitive chip upper surface is greater than the thickness of the peripheral corresponding glass-encapsulated layer of lower surface.
Compared with prior art, the invention has the beneficial effects as follows:
(1) the present invention is due to the upper surface of NTC temperature-sensitive chip is provided with to two upper surface electrodes, lower surface is electrodeless, reduce the thickness of the glass encapsulating layer of electrodeless simultaneously, during use, only electrodeless lower surface need be close to testee, accelerate the reaction time, sensitivity is high, can effectively meet the highly sensitive requirement to temperature sensing, and reliability is high;
(2) method for making of NTC thermistor of the present invention is simple, is easy to realize.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail:
Fig. 1 is rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor structure schematic diagram of the present invention;
Fig. 2 a～Fig. 2 d is NTC thermistor manufacturing process structural drawing of the present invention.
Embodiment
As shown in Figure 1, a kind of rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor 10 of the present invention, comprise NTC temperature-sensitive chip 1, on the upper surface of described NTC temperature-sensitive chip 1 side by side and interval be provided with two upper surface electrodes 2, the lower surface of described NTC temperature-sensitive chip is electrodeless, on described upper surface electrode 2, be respectively welded with lead-in wire 3, the periphery of described NTC temperature-sensitive chip 1 encapsulates by glass encapsulating layer 4, and the thickness H of the peripheral corresponding glass encapsulating layer of described NTC temperature-sensitive chip 1 upper surface is greater than the thickness h of the peripheral corresponding glass-encapsulated layer of lower surface.
The method for making that the invention also discloses above-mentioned rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor, its concrete steps are:
(1) select NTC temperature-sensitive chip 1;
(2) as shown in Figure 2 a, the upper surface at NTC temperature-sensitive chip 1 is pasted with two spaced upper surface electrodes 2;
(3) as shown in Figure 2 b, on above-mentioned two upper surface electrodes 2, in each corresponding welding, go between 3;
(4) glass bushing 5 in the outer race of NTC temperature-sensitive chip 1 as shown in Figure 2 c;
(5) as shown in Figure 2 d, in sintering furnace, glass bushing 5 is carried out to sinter molding, glass bushing 5 correspondences with regard to molten sintering, become glass encapsulating layer 4, in this sintering process, the NTC resistance electrodeless one that packages glass bushing is faced down, be placed on heat resistance insulating sheet and carry out sinter molding, sintering range value is 255 degrees Celsius to 265 degrees Celsius.
The present invention is not limited to above-mentioned embodiment, every various changes of the present invention or modification are not departed to the spirit and scope of the present invention, if these are changed and within modification belongs to claim of the present invention and equivalent technologies scope, the present invention also means and comprises these changes and modification.
Claims (3)
1. a rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor, comprise NTC temperature-sensitive chip, it is characterized in that: on the upper surface of described NTC temperature-sensitive chip side by side and interval be provided with two upper surface electrodes, the lower surface of described NTC temperature-sensitive chip is electrodeless, on described upper surface electrode, be respectively welded with lead-in wire, the periphery of described NTC temperature-sensitive chip encapsulates by glass encapsulating layer, and the thickness of the peripheral corresponding glass encapsulating layer of described NTC temperature-sensitive chip upper surface is greater than the thickness of the peripheral corresponding glass-encapsulated layer of lower surface.
2. the method for making of rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor according to claim 1, its concrete steps are:
(1) select NTC temperature-sensitive chip;
(2) upper surface at NTC temperature-sensitive chip is pasted with two spaced upper surface electrodes;
(3) on above-mentioned two upper surface electrodes, in each corresponding welding, go between;
(4) glass bushing in the outer race of NTC temperature-sensitive chip;
(5) the NTC resistance electrodeless one that packages glass bushing is faced down, be placed on and on heat resistance insulating sheet, carry out sinter molding.
3. the method for making of rapid reaction one side bipolar electrode glass-encapsulated NTC thermistor according to claim 2, is characterized in that: in described step (5), sintering range value is 255 degrees Celsius to 265 degrees Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410369424.5A CN104198078A (en) | 2014-07-30 | 2014-07-30 | Rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410369424.5A CN104198078A (en) | 2014-07-30 | 2014-07-30 | Rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104198078A true CN104198078A (en) | 2014-12-10 |
Family
ID=52083405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410369424.5A Pending CN104198078A (en) | 2014-07-30 | 2014-07-30 | Rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104198078A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261431A (en) * | 2015-11-05 | 2016-01-20 | 广东爱晟电子科技有限公司 | Manufacturing method for radial glass packaged thermistor, and thermistor |
| CN106057386A (en) * | 2016-07-07 | 2016-10-26 | 安徽晶格尔电子有限公司 | Ultrathin NTC (negative temperature coefficient) thermistor with single-side electrodes |
| CN107949778A (en) * | 2015-09-25 | 2018-04-20 | 株式会社村田制作所 | Electronic element assembly and its manufacture method with lead |
| CN114050012A (en) * | 2021-11-08 | 2022-02-15 | 句容市博远电子有限公司 | Thin film type NTC thermistor connection structure |
-
2014
- 2014-07-30 CN CN201410369424.5A patent/CN104198078A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949778A (en) * | 2015-09-25 | 2018-04-20 | 株式会社村田制作所 | Electronic element assembly and its manufacture method with lead |
| CN105261431A (en) * | 2015-11-05 | 2016-01-20 | 广东爱晟电子科技有限公司 | Manufacturing method for radial glass packaged thermistor, and thermistor |
| CN105261431B (en) * | 2015-11-05 | 2018-02-16 | 广东爱晟电子科技有限公司 | The preparation method and thermistor of a kind of radial glass packaged thermosensitive resistor |
| CN106057386A (en) * | 2016-07-07 | 2016-10-26 | 安徽晶格尔电子有限公司 | Ultrathin NTC (negative temperature coefficient) thermistor with single-side electrodes |
| CN114050012A (en) * | 2021-11-08 | 2022-02-15 | 句容市博远电子有限公司 | Thin film type NTC thermistor connection structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104198078A (en) | Rapid response single-side double-electrode glass package NTC (Negative-Temperature-Coefficient) thermistor and manufacturing method thereof | |
| CN101776727B (en) | Method for measuring working junction temperature and thermal resistance of electronic component by utilizing vacuum environment | |
| CN201653950U (en) | Device for measuring working junction temperature and thermal resistance of electronic component | |
| CN105606246A (en) | High-temperature-resistant quick-response thermistor and temperature sensor including the same | |
| CN105527037A (en) | Temperature sensor with novel insulated packaging structure and packaging method thereof | |
| CN102903828B (en) | Packaging effect detection method of organic light emitting diode | |
| CN105023679B (en) | NTC thermistor graphite jig and its application method | |
| CN105403321B (en) | A kind of surface of solids contact high sensitivity temperature sensor and preparation method thereof | |
| CN102288321A (en) | Glass sintered and packaged metal probe quick response temperature sensor and manufacturing method thereof | |
| CN104006897A (en) | Fast-response thermosensitive temperature sensor and manufacturing method thereof | |
| CN105606247B (en) | A kind of thermistor and its manufactured temperature sensor of high temperature resistant quick response | |
| CN204630967U (en) | A kind of automobile-used flat NOx sensor encapsulating structure | |
| CN203940931U (en) | A kind of novel quick response temperature sensor | |
| CN103474502A (en) | Compensating pyroelectric infrared unit detector | |
| CN104167269A (en) | Quick-response temperature-sensitive chip and manufacturing method thereof | |
| CN102842398B (en) | A kind of preparation method of chip Ceramic sensible devices and corresponding product thereof | |
| US20150144615A1 (en) | Brazing method and device for glass kovar combination and oxygen-free copper | |
| CN204903029U (en) | Piece formula quick response's temperature sensor | |
| CN106783653A (en) | Chip internal temperature monitoring apparatus based on multi-chip stacking technique | |
| CN108098254B (en) | A kind of hot-press arrangement and method of liquid-propellant rocket engine end face seal stationary ring | |
| CN105424210A (en) | High-sensitivity fluid temperature sensor and manufacturing method therefor | |
| CN103094143A (en) | Ion implantation monitoring method | |
| CN201849678U (en) | Constant-temperature heating system in packing machine | |
| CN207050881U (en) | Multiple spot mono signal temperature sensor | |
| CN106057386A (en) | Ultrathin NTC (negative temperature coefficient) thermistor with single-side electrodes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141210 |