CN104006897A - Fast-response thermosensitive temperature sensor and manufacturing method thereof - Google Patents

Fast-response thermosensitive temperature sensor and manufacturing method thereof Download PDF

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Publication number
CN104006897A
CN104006897A CN201410261630.4A CN201410261630A CN104006897A CN 104006897 A CN104006897 A CN 104006897A CN 201410261630 A CN201410261630 A CN 201410261630A CN 104006897 A CN104006897 A CN 104006897A
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China
Prior art keywords
temperature sensor
packaged glass
thermistor
thermally sensitive
fast
Prior art date
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CN201410261630.4A
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Chinese (zh)
Inventor
钟健能
段兆祥
张发秀
杨俊�
叶健开
唐黎民
柏琪星
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EXSENSE ELECTRONICS TECHNOLOGY Co Ltd
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EXSENSE ELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201410261630.4A priority Critical patent/CN104006897A/en
Publication of CN104006897A publication Critical patent/CN104006897A/en
Pending legal-status Critical Current

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Abstract

The invention belongs to the technical field of sensor products and particularly discloses a fast-response thermosensitive temperature sensor and a manufacturing method of the fast-response thermosensitive temperature sensor. The fast-response thermosensitive temperature sensor comprises a thermistor, a connecting lead and encapsulating glass for encapsulating the thermistor. The encapsulating glass is solid flat-end encapsulating glass with a plane at the bottom. The plane at the bottom of the encapsulating glass is provided with a negative plate. The fast-response thermosensitive temperature sensor is fast in response to temperature, high in sensitivity, good in stability and applicable to various occasions where high sensitivity is required for temperature detection, temperature control, temperature compensation and the like.

Description

A kind of thermally sensitive temperature of response fast sensor and preparation method thereof
Technical field
The invention belongs to product sensor technical field, particularly a kind of thermally sensitive temperature of response fast sensor and preparation method thereof.
Background technology
Along with the development of electronic technology, the further multifunction of various electronics and intellectuality, NTC temperature-sensitive chip variously need to surveying temperature, control, the application of the occasion such as compensation increases day by day.
Due to the sensitivity requirement of detecting temperature, the reaction velocity of NTC temperature sensor has been proposed to more and more higher requirement, require the thermal time constant of NTC temperature sensor as far as possible little.
Thermally sensitive temperature sensor described in prior art, it comprises thermistor and turns glass by the envelope that glass encapsulates thermistor, due to the restriction of manufacture craft, described thermistor is the glass the inside that is encapsulated in sphere-like, and the face of temperature-sensitive contact is a spherical surface body, and temperature-sensitive contact is a contact, contact area is little, the required response time is more, low-response, and therefore it affects the sensitivity of thermally sensitive temperature sensor detecting temperature.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the concrete open a kind of thermally sensitive temperature of response fast sensor, this temperature sensor response temperature is fast, and sensitivity is high, good stability, is applicable to the occasion that the high sensitivity such as various detections to temperature, control, compensation require.
In order to overcome above-mentioned technical purpose, the present invention realizes by following technical scheme:
One of the present invention responds thermally sensitive temperature sensor fast, comprise thermistor, connecting lead wire and for encapsulating the packaged glass of thermistor, described packaged glass is solid and the bottom tack packaged glass that is plane, and the base plane of described packaged glass is provided with egative film.
As the further improvement of above-mentioned technology, described egative film is sheet metal or high-temperature insulation thin slice, and it is close in the base plane of packaged glass.
In the present invention, described connecting lead wire is made by Dumet wire.
The method for making that the invention also discloses quick response thermally sensitive temperature sensor, its concrete steps are:
(1) first thermistor is processed and is welded upper connecting lead wire;
(2) in hot conditions, at the packaged glass of the periphery of thermistor encapsulation upper sphere shape;
(3), by smooth the bottom pad one of the packaged glass of above-mentioned sphere-like resistant to elevated temperatures sheet metal or high-temperature insulation thin slice, utilize the tack packaged glass that under high-temperature heating molten condition, one-tenth bottom is plane;
(4) clean, then after test verification, use.
Temperature range in above-mentioned steps (2) is 580 DEG C-630 DEG C.
Hot melting temperature scope in above-mentioned steps (3) is 580 DEG C-630 DEG C.
Compared with prior art, the invention has the beneficial effects as follows:
(1) the present invention is owing to the packaged glass for encapsulating thermistor is processed into the packaged glass of flat-head shape by traditional sphere-like, in prior art, the packaged glass of sphere-like is because contacting between itself and testee is all a contact, surface of contact is little, be not easy to detecting temperature, be modified into after the packaged glass of flat-head shape, the contact of tack packaged glass base plane energy forming surface, because the thermistor volume of glass-encapsulated is little, and contact area increases, effectively increase the surface of contact of detecting temperature, response time is fast, stable, can feed back to fast link.Response time is fast, highly sensitive, its effectively client prior art those skilled in the art's technology prejudice;
(2) in the present invention, in the base plane of tack packaged glass, be glued with egative film, effectively increase heat transfer efficiency, make sensor detecting temperature more exactly, degree of accuracy is high.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail:
Fig. 1 is quick response thermally sensitive temperature sensor side view of the present invention;
Fig. 2 is quick response thermally sensitive temperature three-dimensional sensor schematic diagram of the present invention;
Fig. 3 is thermistor and connecting lead wire structural representation in the present invention;
Fig. 4 is packaged glass in the present invention (round end glass) structural representation;
Fig. 5 in the present invention is processed into round end packaged glass tack packaged glass structural representation.
Embodiment
One of the present invention responds thermally sensitive temperature sensor fast, comprise thermistor 1, connecting lead wire 2 and for encapsulating the packaged glass of thermistor, described packaged glass is solid and the bottom tack packaged glass 3 that is plane, the base plane of described tack packaged glass 3 is provided with egative film 4, described egative film 4 is sheet metal or high-temperature insulation thin slice, it is close in the base plane of tack packaged glass 3, and described connecting lead wire 2 is made by Dumet wire.
The method for making that the invention also discloses quick response thermally sensitive temperature sensor, its concrete steps are:
(1) as shown in Figure 3, first thermistor 1 is processed and is welded upper connecting lead wire 2;
(2) as shown in Figure 4,, in hot conditions, at the packaged glass of the periphery of thermistor 1 encapsulation upper sphere shape, actual temp scope is 580 DEG C-630 DEG C;
(3) as shown in Figure 5, by the egative film 4 of smooth the bottom pad one of the packaged glass of above-mentioned sphere-like resistant to elevated temperatures sheet metal or high-temperature insulation thin slice, utilize under high-temperature heating molten condition and become the tack packaged glass 3 that bottom is plane, in this step, hot melting temperature scope is 580 DEG C-630 DEG C;
(5) clean, then after test verification, use.
In the present invention, owing to passing through thermistor 1 small volume of glass-encapsulated, and contact area increase, the reaction time is fast, stable, can feed back to fast link.
Below, by the packaged glass of the spheroidite of tack packaged glass of the present invention and prior art (referred to as circle packaged glass) is carried out to experimental data contrast, its actual measurement Data Comparison is as follows:
Getting spherical diameter and be the packaged glass of 0.85mm tests
Table (one)
From upper table (one): the thermistor of the glass-encapsulated of same size specification (diameter is 0.85mm), it is faster that the ratio of making tack is made the reaction time of round end, fast 0.563 second of mean value.
The present invention is not limited to above-mentioned embodiment, every various changes of the present invention or modification are not departed to the spirit and scope of the present invention, if these are changed and within modification belongs to claim of the present invention and equivalent technologies scope, the present invention also means and comprises these changes and modification.

Claims (6)

1. one kind responds thermally sensitive temperature sensor fast, comprise thermistor, connecting lead wire and for encapsulating the packaged glass of thermistor, it is characterized in that: described packaged glass is solid and the bottom tack packaged glass that is plane, and the base plane of described packaged glass is provided with egative film.
2. quick response thermally sensitive temperature sensor according to claim 1, is characterized in that: described egative film is sheet metal or high-temperature insulation thin slice, and it is close in the base plane of packaged glass.
3. quick response thermally sensitive temperature sensor according to claim 1 and 2, is characterized in that: described connecting lead wire is made by Dumet wire.
4. according to the method for making of the quick response thermally sensitive temperature sensor described in claims 1 to 3 any one, its concrete steps are:
(1) first thermistor is processed and is welded upper connecting lead wire;
(2) in hot conditions, at the packaged glass of the periphery of thermistor encapsulation upper sphere shape;
(3), by smooth the bottom pad one of the packaged glass of above-mentioned sphere-like resistant to elevated temperatures sheet metal or high-temperature insulation thin slice, utilize the tack packaged glass that under high-temperature heating molten condition, one-tenth bottom is plane;
(4) clean, then after test verification, use.
5. the method for making of quick response thermally sensitive temperature sensor according to claim 4, its concrete steps are:
Temperature range in above-mentioned steps (2) is 580 DEG C-630 DEG C.
6. the method for making of quick response thermally sensitive temperature sensor according to claim 4, its concrete steps are:
Hot melting temperature scope in above-mentioned steps (3) is 580 DEG C-630 DEG C.
CN201410261630.4A 2014-06-12 2014-06-12 Fast-response thermosensitive temperature sensor and manufacturing method thereof Pending CN104006897A (en)

Priority Applications (1)

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CN201410261630.4A CN104006897A (en) 2014-06-12 2014-06-12 Fast-response thermosensitive temperature sensor and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN201410261630.4A CN104006897A (en) 2014-06-12 2014-06-12 Fast-response thermosensitive temperature sensor and manufacturing method thereof

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105403321A (en) * 2015-12-31 2016-03-16 广东爱晟电子科技有限公司 Solid surface contact type high-sensitivity temperature sensor and manufacture method thereof
CN105424210A (en) * 2015-11-05 2016-03-23 广东爱晟电子科技有限公司 High-sensitivity fluid temperature sensor and manufacturing method therefor
CN105606247A (en) * 2015-12-31 2016-05-25 广东爱晟电子科技有限公司 High-temperature-resistant quick-response thermistor and temperature sensor including the same
CN105606246A (en) * 2015-12-31 2016-05-25 广东爱晟电子科技有限公司 High-temperature-resistant quick-response thermistor and temperature sensor including the same
CN105651411A (en) * 2015-12-30 2016-06-08 中国电子科技集团公司第四十九研究所 High-temperature platinum resistor package structure and preparation method thereof

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JPH0955302A (en) * 1995-08-17 1997-02-25 Ooizumi Seisakusho:Kk High temperature glass sealed thermistor
JP2010237156A (en) * 2009-03-31 2010-10-21 Shibaura Electronics Co Ltd Temperature sensor for measurement
CN202041316U (en) * 2011-03-02 2011-11-16 肇庆爱晟电子科技有限公司 Transparent packaging thermistor temperature sensor
US20130077653A1 (en) * 2011-09-28 2013-03-28 Shibaura Electronics Co., Ltd. Temperature sensor and hydrogen-filled system
CN103411700A (en) * 2013-06-18 2013-11-27 黄川� Platinum wire electrode glass sealed thermistor (NTC) microbead medical sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955302A (en) * 1995-08-17 1997-02-25 Ooizumi Seisakusho:Kk High temperature glass sealed thermistor
JP2010237156A (en) * 2009-03-31 2010-10-21 Shibaura Electronics Co Ltd Temperature sensor for measurement
CN202041316U (en) * 2011-03-02 2011-11-16 肇庆爱晟电子科技有限公司 Transparent packaging thermistor temperature sensor
US20130077653A1 (en) * 2011-09-28 2013-03-28 Shibaura Electronics Co., Ltd. Temperature sensor and hydrogen-filled system
CN103411700A (en) * 2013-06-18 2013-11-27 黄川� Platinum wire electrode glass sealed thermistor (NTC) microbead medical sensor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105424210A (en) * 2015-11-05 2016-03-23 广东爱晟电子科技有限公司 High-sensitivity fluid temperature sensor and manufacturing method therefor
CN105424210B (en) * 2015-11-05 2018-07-06 广东爱晟电子科技有限公司 A kind of highly sensitive fluid temperature sensor and preparation method thereof
CN105651411A (en) * 2015-12-30 2016-06-08 中国电子科技集团公司第四十九研究所 High-temperature platinum resistor package structure and preparation method thereof
CN105651411B (en) * 2015-12-30 2018-06-29 中国电子科技集团公司第四十九研究所 A kind of high temperature platinum resistance encapsulating structure and preparation method thereof
CN105403321A (en) * 2015-12-31 2016-03-16 广东爱晟电子科技有限公司 Solid surface contact type high-sensitivity temperature sensor and manufacture method thereof
CN105606247A (en) * 2015-12-31 2016-05-25 广东爱晟电子科技有限公司 High-temperature-resistant quick-response thermistor and temperature sensor including the same
CN105606246A (en) * 2015-12-31 2016-05-25 广东爱晟电子科技有限公司 High-temperature-resistant quick-response thermistor and temperature sensor including the same
WO2017114085A1 (en) * 2015-12-31 2017-07-06 段兆祥 High-temperature-resistance quick-response thermistor, and temperature sensor made by using same
CN105403321B (en) * 2015-12-31 2019-03-19 广东爱晟电子科技有限公司 A kind of surface of solids contact high sensitivity temperature sensor and preparation method thereof
CN105606247B (en) * 2015-12-31 2019-03-26 广东爱晟电子科技有限公司 A kind of thermistor and its manufactured temperature sensor of high temperature resistant quick response

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Application publication date: 20140827