WO2019201229A1 - 3d direct-writing aluminum oxide ceramic film heat-flow sensor and manufacturing method therefor - Google Patents

3d direct-writing aluminum oxide ceramic film heat-flow sensor and manufacturing method therefor Download PDF

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WO2019201229A1
WO2019201229A1 PCT/CN2019/082819 CN2019082819W WO2019201229A1 WO 2019201229 A1 WO2019201229 A1 WO 2019201229A1 CN 2019082819 W CN2019082819 W CN 2019082819W WO 2019201229 A1 WO2019201229 A1 WO 2019201229A1
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thermocouple
stack
electrode
negative electrode
positive electrode
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PCT/CN2019/082819
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French (fr)
Chinese (zh)
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谭秋林
吕文
刘文倩
吉耀辉
熊继军
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中北大学
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/028—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples using microstructures, e.g. made of silicon

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  • the invention relates to a 3D direct writing type alumina ceramic film heat flow sensor and a manufacturing method thereof, and belongs to the technical field of a film heat flow sensor.
  • the heat flow sensor determines the heat flow parameters through the object by measuring the temperature gradient of the object.
  • the current heat flow sensor is divided into a round foil type and a film type two heat flow sensor.
  • the round foil type heat flow sensor has a long response time, and requires more water than a certain working temperature to make the device bulk; in contrast, the thin film type sensor has a thermoelectric potential output. The signal is weak and difficult to be recognized by the instrument. In addition, the thin film sensing sensitivity is small and the error is large.
  • the patent CN203643055U reports a limited number of thermoelectric reactors for high-temperature and large heat flow measurement.
  • the temperature gradient thermal barrier material has a large thermal gradient, which results in a small temperature gradient, which makes the thermoelectric reactor output potential of the thermoelectric reactor.
  • thermocouple stack of the thin film type heat flow sensor is usually arranged in a single layer, and its sensitivity needs to be further improved.
  • the invention discloses a 3D direct writing type alumina ceramic film heat flow sensor and a manufacturing method thereof, and overcomes the deficiencies of the prior art, and provides a potential signal with high sensitivity, short response time, stable operation and realization in a high temperature environment.
  • a 3D direct writing alumina ceramic film heat flow sensor comprising an upper temperature gradient isolation layer, an upper thermocouple stack, a positive electrode extraction electrode, a connecting member, a micron-sized ceramic substrate. , a lower thermocouple stack, a negative electrode lead-out electrode and a lower temperature gradient isolation layer, the upper surface of the micro-scale ceramic substrate is provided with an upper thermocouple stack generated by 3D printing, and the upper thermocouple stack is coated with an upper temperature gradient isolation layer, micron-scale The lower surface of the ceramic substrate is provided with a lower thermocouple stack generated by 3D printing, and the lower thermocouple stack is coated with a lower temperature gradient isolation layer.
  • the upper thermocouple stack is connected to the lower thermocouple stack through a connecting member, and the positive electrode leads the electrode and the upper thermoelectric The even stack is connected, and the negative electrode is connected to the lower thermocouple stack.
  • the upper thermocouple stack includes an upper positive electrode thermocouple stack and an upper negative electrode thermocouple stack, the upper positive electrode thermocouple stack and the upper negative electrode thermocouple stack are connected, and the positive electrode lead electrode is connected to the upper positive electrode thermocouple stack;
  • the thermocouple stack includes a lower negative electrode thermocouple stack and a lower positive electrode thermocouple stack, and a lower negative electrode thermocouple stack and a lower positive electrode thermocouple stack are connected, and the negative electrode lead electrode is connected to the lower negative electrode thermocouple stack.
  • thermocouple in the upper positive electrode thermocouple stack and a negative electrode thermocouple in the upper negative electrode thermocouple stack are connected in series to form a pair of thermocouples, and a plurality of pairs of thermocouples are connected at the end, and the thermocouple pair is surrounded by the cycle.
  • thermocouple in one of the lower positive electrode thermocouple stacks and a negative electrode thermocouple in the lower negative electrode thermocouple stack form a pair of thermocouples in series, and a plurality of pairs of thermocouples are connected at the end, and the thermocouple pair is surrounded by the loop.
  • thermocouple pair includes a plurality of C-shaped thermocouple rings of different diameters.
  • the number of turns of the C-shaped thermocouple ring is six.
  • thermocouple stack is a platinum-platinum rhodium 10 thermocouple
  • the material selected for the positive electrode lead electrode is platinum
  • the material selected for the negative electrode lead electrode is platinum rhodium 10.
  • thermocouple stack and the lower thermocouple stack is a gold-gold palladium thermocouple
  • the material selected for the positive electrode extraction electrode is gold
  • the material selected for the negative electrode extraction electrode is gold palladium
  • the material used for the connecting member is the same as that used for the positive electrode lead electrode or the negative electrode lead electrode.
  • the above method for manufacturing a 3D direct writing alumina ceramic film heat flow sensor comprises the following steps:
  • micron-sized ceramic substrate coated with the high temperature resistant thermal insulation coating is sintered in a sintering furnace at 500 ° C for 1 hour, and the film sensor is completed.
  • the present invention has the beneficial effects that the present invention uses a micron-sized alumina ceramic substrate and a high melting point metal to enable the heat flow sensor to enable the heat flow sensor to operate at a high response frequency in a high temperature environment;
  • the thickness of the thin film metal obtained by using 3D direct write printing is thin and uniform, not only the process is simple, but also the response frequency of the heat flow sensor is improved and the stable reading of the thermoelectric potential signal is realized; the designed sensor is the lead-out type, and the thin wire is taken out at the low temperature.
  • the zone can realize stable reading of the thermoelectric potential signal; the thermocouple obtained by 3D direct write printing is made into a film loop surrounding series mode, and the dense thermocouple array structure is integrated in 3D in a limited area, and the resistance with low thermal conductivity is selected.
  • the high temperature thermal insulation coating and the thermal insulation of the upper and lower double-layer temperature gradient isolation layer generate a large temperature gradient, and the synergistic effect of the three outputs increases the thermal potential, thereby increasing the sensitivity.
  • Figure 1 is a front elevational view of an embodiment of the present invention.
  • FIG. 2 is a top plan view of an embodiment of the present invention.
  • Figure 3 is an exploded view of an embodiment of the present invention.
  • FIG. 4 is a process flow diagram of a method of fabricating an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of test wiring according to an embodiment of the present invention.
  • 1-upper temperature gradient isolation layer 2-upper positive thermocouple stack, 3-positive extraction electrode, 4-upper negative thermocouple stack, 5-connector, 6-micron ceramic substrate, 7-lower anode thermoelectric Even stack, 8-negative lead-out electrode, 9-lower positive thermocouple stack, 10-down temperature gradient isolation layer, 11-heat flow sensitive area, 12-lead electrode lead-out area, 13-silver wire, 14-thermoelectric potential reading device .
  • a 3D direct write alumina ceramic film heat flow sensor of the present invention comprises an upper temperature gradient isolation layer 1, an upper thermocouple stack, a positive electrode extraction electrode 3, a connecting member 5, and a micron-sized ceramic substrate. 6.
  • thermocouple stack The lower thermocouple stack, the negative electrode lead electrode 8 and the lower temperature gradient isolation layer 10, the upper surface of the micron-sized ceramic substrate 6 is provided with an upper thermocouple stack generated by 3D printing, and the upper thermocouple stack is coated with an upper temperature gradient isolation Layer 1, the lower surface of the micron-sized ceramic substrate 6 is provided with a lower thermocouple stack formed by 3D printing, the lower thermocouple stack is coated with a lower temperature gradient isolation layer 10, and the upper thermocouple stack passes through the connector 5 and the lower thermocouple stack.
  • the positive electrode lead electrode 3 is connected to the upper thermocouple stack
  • the negative electrode lead electrode 8 is connected to the lower thermocouple stack.
  • the material used for the connecting member 5 is the same as that used for the positive electrode lead electrode 3 or the negative electrode lead electrode 8.
  • the material selected for the upper temperature gradient isolation layer 1 and the lower temperature gradient isolation layer 10 is a high temperature heat insulation nano gas phase dioxide fine powder having a thickness of 1 mm.
  • the material selected for the micron-sized ceramic substrate 6 is alumina ceramic.
  • the upper thermocouple stack includes an upper positive electrode thermocouple stack 2 and an upper negative electrode thermocouple stack 4, an upper positive electrode thermocouple stack 2 and an upper negative electrode thermocouple stack 4 connected, a positive electrode lead electrode 3 connected to the upper positive electrode thermocouple stack 2; a lower thermocouple
  • the stack includes a lower negative electrode thermocouple stack 7 and a lower positive electrode thermocouple stack 9, a lower negative electrode thermocouple stack 7 and a lower positive electrode thermocouple stack 9 connected, and a negative electrode lead-out electrode 8 connected to the lower negative electrode thermocouple stack.
  • a positive electrode thermocouple in an upper positive electrode thermocouple stack 2 and a negative electrode thermocouple in an upper negative electrode thermocouple stack 4 form a pair of thermocouples in series, a plurality of pairs of thermocouples are connected in a tail, and a thermocouple pair is circumferentially wound around the micron-sized ceramic substrate 6 The heat flow sensitive area 11 of the upper surface.
  • a positive electrode thermocouple in a lower positive electrode thermocouple stack 9 and a negative electrode thermocouple in a lower negative electrode thermocouple stack 7 form a pair of thermocouples in series, a plurality of pairs of thermocouples are connected at the end, and the thermocouple pair is circumferentially surrounded by the micron-sized ceramic substrate 6 The heat flow sensitive area 11 of the lower surface.
  • the thermocouple pair includes six C-shaped thermocouple rings of different diameters.
  • the thin film thermopile electrode is designed to be surrounded by a plurality of pairs of thermocouple electrodes, so that the thermocouple electrode is covered in a limited area.
  • the area of the thermocouple stack substrate forms a spatial thermocouple electrode array.
  • thermocouple stack When the material selected for the upper thermocouple stack and the lower thermocouple stack is a platinum-platinum rhodium 10 thermocouple, the material selected for the positive electrode lead electrode 3 is platinum, and the material selected for the negative electrode lead electrode 8 is platinum rhodium 10.
  • thermocouple stack and the lower thermocouple stack is a gold-gold palladium thermocouple
  • the material selected for the positive electrode lead electrode 3 is gold
  • the material selected for the negative electrode lead electrode 8 is gold palladium.
  • the present invention further provides a method for fabricating a 3D direct write alumina ceramic film heat flow sensor as described above, comprising the following steps:
  • micron-sized ceramic substrate coated with the high temperature resistant thermal insulation coating is sintered in a sintering furnace at 500 ° C for 1 hour, and the film sensor is completed.
  • the electrodes of the extraction electrode and the thermocouple stack adopt a 3D direct writing process.
  • the micron-sized ceramic substrate 6 provides adhesion and support for the thermocouple stack electrode and the extraction electrode and the lower temperature gradient isolation layer 10, to achieve the thermocouple stack electrode and the extraction electrode process, and to increase the adhesion ability of the lower temperature gradient isolation layer 10, micron
  • the upper surface of the ceramic substrate 6 is polished, and further, the micron-sized ceramic substrate 6 is designed to have a lead-out shape, which is divided into a heat flow sensitive region 11 and an extraction electrode lead-out region 12, and the lead electrode lead-out region 12 is long so that the sensor When the sensitive area is working at a high temperature, the lead-out electrode lead-out area 12 can maintain a lower temperature, and the silver lead 13 can be connected to the lead-out electrode to achieve a stable reading signal.
  • the extraction electrode connected to the cold end region is connected to the thermoelectric potential reading device 14 to stably read the thermoelectric potential signal of the sensor through the silver wire 13.
  • the upper and lower temperature gradient isolation layer is selected from the high-temperature heat-insulating nano-gas phase dioxide powder with a thermal conductivity of 0.03, and the upper and lower temperature gradient isolation layer is covered by the mask printing.
  • thermocouple stack electrode On the thermocouple stack electrode, a part of each pair of thermocouples in the sensor is exposed, directly sensing the external heat flow and temperature, and another part is covered between the temperature gradient isolation layer and the micron-sized ceramic base material, when the sensor is used to test the heat flow At the same time, a large temperature gradient perpendicular to the heat flow will be formed between the thermopile electrode covered with the temperature gradient isolation layer and the exposed thin thermopile electrode, which will cooperate with the dense thermopile electrode formed by circulating in series to make the heat flow sensor large The thermoelectric potential signal increases the test sensitivity.

Abstract

The present invention relates to the technical field of film heat-flow sensors, and provides a 3D direct-writing aluminum oxide ceramic film heat-flow sensor and a manufacturing method therefor having high potential signal and sensitivity and short response time and capable of stably working in a high temperature environment to realize stable reading of a thermoelectric potential signal. The technical solution is as follows: a 3D direct-writing aluminum oxide ceramic film heat-flow sensor comprises an upper temperature gradient isolation layer, an upper thermocouple pile, a positive lead-out electrode, a connector, a micron-order ceramic substrate, a lower thermocouple pile, a negative lead-out electrode, and a lower temperature gradient isolation layer. The upper thermocouple pile generated by 3D printing is formed on the upper surface of the micron-order ceramic substrate. The upper thermocouple pile is coated with the upper temperature gradient isolation layer. The lower thermocouple pile generated by 3D printing is formed on the lower surface of the micron-order ceramic substrate. The lower thermocouple pile is coated with the lower temperature gradient isolation layer. The present invention can be applied to the field of temperature gradient measurement.

Description

一种3D直写式氧化铝陶瓷薄膜热流传感器及其制作方法3D direct writing alumina ceramic film heat flow sensor and manufacturing method thereof 技术领域Technical field
本发明涉及一种3D直写式氧化铝陶瓷薄膜热流传感器及其制作方法，属于薄膜热流传感器技术领域。The invention relates to a 3D direct writing type alumina ceramic film heat flow sensor and a manufacturing method thereof, and belongs to the technical field of a film heat flow sensor.
背景技术Background technique
热流传感器通过测量物体的温度梯度来确定通过物体的热流参数。当前热流传感器分为圆箔式和薄膜式两种热流传感器，圆箔式热流传感器响应时间长，超过一定使用工作温度需要水冷从而使得器件体积较大；相比之下，薄膜式传感器热电势输出信号微弱不易被仪器识别分辨，此外，薄膜式传感灵敏度较小，误差大。专利CN203643055U报道的一种用于高温大热流测量的薄膜热流传感器集成的热电堆数目有限，温度梯度热障层材料因导热系数大从而使得产生的温度梯度很小，使得热电堆热电势输出信号强度受限，进而使得输出灵敏度很小，对数据采集仪器提出了很高要求；另外，该传感器及其引线的制作工艺繁杂，引线在高温下容易软化而接触不良。此外，薄膜式热流传感器的热电偶堆通常布置在单层，其灵敏度有待进一步提高。The heat flow sensor determines the heat flow parameters through the object by measuring the temperature gradient of the object. The current heat flow sensor is divided into a round foil type and a film type two heat flow sensor. The round foil type heat flow sensor has a long response time, and requires more water than a certain working temperature to make the device bulk; in contrast, the thin film type sensor has a thermoelectric potential output. The signal is weak and difficult to be recognized by the instrument. In addition, the thin film sensing sensitivity is small and the error is large. The patent CN203643055U reports a limited number of thermoelectric reactors for high-temperature and large heat flow measurement. The temperature gradient thermal barrier material has a large thermal gradient, which results in a small temperature gradient, which makes the thermoelectric reactor output potential of the thermoelectric reactor. Restricted, and thus the output sensitivity is very small, which puts high demands on the data acquisition instrument; in addition, the manufacturing process of the sensor and its lead is complicated, and the lead is easily softened at a high temperature and the contact is poor. In addition, the thermocouple stack of the thin film type heat flow sensor is usually arranged in a single layer, and its sensitivity needs to be further improved.
发明内容Summary of the invention
本发明一种3D直写式氧化铝陶瓷薄膜热流传感器及其制作方法，克服了现有技术存在的不足，提供了电势信号与灵敏度高、响应时间短、能在在高温环境中稳定工作和实现热电势信号稳定读取的3D直写式氧化铝陶瓷薄膜热流传感器及其制作方法。The invention discloses a 3D direct writing type alumina ceramic film heat flow sensor and a manufacturing method thereof, and overcomes the deficiencies of the prior art, and provides a potential signal with high sensitivity, short response time, stable operation and realization in a high temperature environment. A 3D direct write alumina ceramic film heat flow sensor with stable thermoelectric signal reading and a manufacturing method thereof.
为了解决上述技术问题，本发明采用的技术方案为：一种3D直写式氧化铝陶瓷薄膜热流传感器，包括上温度梯度隔离层、上热电偶堆、正极引出电极、连接件、微米级陶瓷基底、下热电偶堆、负极引出电极和下温度梯度隔离层，微米级陶瓷基底的上表面设有3D打印生成的上热电偶堆，上热电偶堆的上方涂有上温度梯度隔离层，微米级陶瓷基底的下表面设有3D打印生成的下热电偶堆，下热电偶堆的上方涂有下温度梯度隔离层,上热电偶堆通过连接件与下热电偶堆相连，正极引出电极与上热电偶堆相连，负极引出电极与下热电偶堆相连。In order to solve the above technical problem, the technical solution adopted by the present invention is: a 3D direct writing alumina ceramic film heat flow sensor, comprising an upper temperature gradient isolation layer, an upper thermocouple stack, a positive electrode extraction electrode, a connecting member, a micron-sized ceramic substrate. , a lower thermocouple stack, a negative electrode lead-out electrode and a lower temperature gradient isolation layer, the upper surface of the micro-scale ceramic substrate is provided with an upper thermocouple stack generated by 3D printing, and the upper thermocouple stack is coated with an upper temperature gradient isolation layer, micron-scale The lower surface of the ceramic substrate is provided with a lower thermocouple stack generated by 3D printing, and the lower thermocouple stack is coated with a lower temperature gradient isolation layer. The upper thermocouple stack is connected to the lower thermocouple stack through a connecting member, and the positive electrode leads the electrode and the upper thermoelectric The even stack is connected, and the negative electrode is connected to the lower thermocouple stack.
进一步，所述上热电偶堆包括上正极热电偶堆和上负极热电偶堆，上正极热电偶堆和上负极热电偶堆相连，所述正极引出电极与所述上正极热电偶堆相连；所述下热电偶堆包括下负极热电偶堆和下正极热电偶堆，下负极热电偶堆和下正极热电偶堆相连，所述负极引出电极与下负极热电偶堆相连。Further, the upper thermocouple stack includes an upper positive electrode thermocouple stack and an upper negative electrode thermocouple stack, the upper positive electrode thermocouple stack and the upper negative electrode thermocouple stack are connected, and the positive electrode lead electrode is connected to the upper positive electrode thermocouple stack; The thermocouple stack includes a lower negative electrode thermocouple stack and a lower positive electrode thermocouple stack, and a lower negative electrode thermocouple stack and a lower positive electrode thermocouple stack are connected, and the negative electrode lead electrode is connected to the lower negative electrode thermocouple stack.
进一步，一个所述上正极热电偶堆中的正极热电偶与一个所述上负极热电偶堆中的负极热电偶串联形成一对热电偶，多对热电偶收尾相连，热电偶对循环环绕在所述微米级陶瓷基底上表面的热流敏感区域。Further, a positive electrode thermocouple in the upper positive electrode thermocouple stack and a negative electrode thermocouple in the upper negative electrode thermocouple stack are connected in series to form a pair of thermocouples, and a plurality of pairs of thermocouples are connected at the end, and the thermocouple pair is surrounded by the cycle. A heat flow sensitive area on the upper surface of the micron-sized ceramic substrate.
进一步，一个所述下正极热电偶堆中的正极热电偶与一个所述下负极热电偶堆中的负极热电偶串联形成一对热电偶，多对热电偶收尾相连，热电偶对循环环绕在所述微米级陶瓷基底下表面的热流敏感区域。Further, a positive electrode thermocouple in one of the lower positive electrode thermocouple stacks and a negative electrode thermocouple in the lower negative electrode thermocouple stack form a pair of thermocouples in series, and a plurality of pairs of thermocouples are connected at the end, and the thermocouple pair is surrounded by the loop. A heat flow sensitive area on the lower surface of the micron-sized ceramic substrate.
进一步，所述热电偶对包括多个直径不同的C形热电偶圈。Further, the thermocouple pair includes a plurality of C-shaped thermocouple rings of different diameters.
进一步，所述C形热电偶圈的圈数为6个。Further, the number of turns of the C-shaped thermocouple ring is six.
进一步，所述上热电偶堆和所述下热电偶堆选用的材料为铂-铂铑10热电偶，正极引出电极选用的材料为铂，负极引出电极选用的材料为铂铑10。Further, the material selected for the upper thermocouple stack and the lower thermocouple stack is a platinum-platinum rhodium 10 thermocouple, the material selected for the positive electrode lead electrode is platinum, and the material selected for the negative electrode lead electrode is platinum rhodium 10.
进一步，所述上热电偶堆和所述下热电偶堆选用的材料为金-金钯热电偶，正极引出电极选用的材料为金，负极引出电极选用的材料为金钯。Further, the material selected for the upper thermocouple stack and the lower thermocouple stack is a gold-gold palladium thermocouple, the material selected for the positive electrode extraction electrode is gold, and the material selected for the negative electrode extraction electrode is gold palladium.
进一步，所述连接件所用材料与所述正极引出电极或所述负极引出电极所用的材料相同。Further, the material used for the connecting member is the same as that used for the positive electrode lead electrode or the negative electrode lead electrode.
上述的一种3D直写式氧化铝陶瓷薄膜热流传感器的制作方法，包括以下步骤：The above method for manufacturing a 3D direct writing alumina ceramic film heat flow sensor comprises the following steps:
S1.使用3D打印机陶瓷喷嘴对准微米级陶瓷基底上的过孔，使用熔融的金属填充过孔，冷却至室温形成连接件；S1. Using a 3D printer ceramic nozzle to align the via holes on the micro-scale ceramic substrate, filling the via holes with molten metal, and cooling to room temperature to form a connector;
S2.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的上表层打印正极热电偶和正极引出电极，冷却至室温；S2. Using a 3D printer ceramic nozzle to align the positioning, printing the positive electrode thermocouple and the positive electrode lead electrode on the upper surface of the micron-sized ceramic substrate, and cooling to room temperature;
S3.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的上表层打印负极热电偶,使负极热电偶与连接件相连，冷却至室温；S3. Using a 3D printer ceramic nozzle to align the positioning, printing a negative electrode thermocouple on the upper surface of the micron-sized ceramic substrate, connecting the negative electrode thermocouple to the connecting member, and cooling to room temperature;
S4.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的下表层打印负极热电偶和负极引出电极,冷却至室温；S4. Using a 3D printer ceramic nozzle to align the positioning, printing the negative electrode thermocouple and the negative electrode lead electrode on the lower surface of the micron-sized ceramic substrate, and cooling to room temperature;
S5.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的下表层打印正 极热电偶,使正极热电偶与连接件相连，冷却至室温；S5. Using a 3D printer ceramic nozzle to align the positioning, printing a positive thermocouple on the lower surface of the micron-sized ceramic substrate, connecting the positive electrode thermocouple to the connecting member, and cooling to room temperature;
S6.使用相应的掩膜版对准上热电偶堆，涂刷耐高温热保温涂料，覆盖上热电偶堆的全部冷结点，形成上温度梯度隔离层,然后升温至300℃烘干；S6. Align the upper thermocouple stack with the corresponding mask plate, apply the high temperature resistant thermal insulation coating, cover all the cold junctions of the thermocouple stack, form an upper temperature gradient isolation layer, and then heat up to 300 ° C to dry;
S7.使用相应的掩膜版对准下热电偶堆，涂刷耐高温热保温涂料，覆盖下热电偶堆的全部冷结点，形成下温度梯度隔离层，然后升温至300℃烘干；S7. Align the lower thermocouple stack with the corresponding mask, apply the high temperature thermal insulation coating, cover all the cold junctions of the thermocouple stack, form the lower temperature gradient isolation layer, and then heat up to 300 ° C to dry;
S8.将涂刷有耐高温热保温涂料的微米级陶瓷基底在烧结炉里在500℃下烧结1小时成型，薄膜传感器制作完成。S8. The micron-sized ceramic substrate coated with the high temperature resistant thermal insulation coating is sintered in a sintering furnace at 500 ° C for 1 hour, and the film sensor is completed.
与现有技术相比，本发明具有的有益效果为：本发明使用厚度为微米级氧化铝陶瓷基底和高熔点金属使热流传感器能使热流传感器能在工作在高温环境中实现高响应频率工作；使用3D直写打印得到的薄膜金属厚度薄而均匀，不仅工艺简单，而且将提高热流传感器的响应频率和实现热电势信号的稳定读取；设计的传感器为引出式使细线引出电极处在低温区，可实现热电势信号的稳定读取；使用3D直写打印得到的热电偶使其为薄膜循环环绕串联模式，在有限面积内3D集成了密集热电偶阵列结构，选用导热系数很低的耐高温隔热保温涂料和上下双层温度梯度隔离层隔热保温产生大温度梯度，三者协同作用输出热电势增大，从而使得灵敏度增大。Compared with the prior art, the present invention has the beneficial effects that the present invention uses a micron-sized alumina ceramic substrate and a high melting point metal to enable the heat flow sensor to enable the heat flow sensor to operate at a high response frequency in a high temperature environment; The thickness of the thin film metal obtained by using 3D direct write printing is thin and uniform, not only the process is simple, but also the response frequency of the heat flow sensor is improved and the stable reading of the thermoelectric potential signal is realized; the designed sensor is the lead-out type, and the thin wire is taken out at the low temperature. The zone can realize stable reading of the thermoelectric potential signal; the thermocouple obtained by 3D direct write printing is made into a film loop surrounding series mode, and the dense thermocouple array structure is integrated in 3D in a limited area, and the resistance with low thermal conductivity is selected. The high temperature thermal insulation coating and the thermal insulation of the upper and lower double-layer temperature gradient isolation layer generate a large temperature gradient, and the synergistic effect of the three outputs increases the thermal potential, thereby increasing the sensitivity.
附图说明DRAWINGS
图1为本发明实施例的正视图。Figure 1 is a front elevational view of an embodiment of the present invention.
图2为本发明实施例的俯视图。2 is a top plan view of an embodiment of the present invention.
图3为本发明实施例的爆炸视图。Figure 3 is an exploded view of an embodiment of the present invention.
图4为本发明实施例制作方法的工艺流程图。4 is a process flow diagram of a method of fabricating an embodiment of the present invention.
图5为本发明实施例的测试接线示意图。FIG. 5 is a schematic diagram of test wiring according to an embodiment of the present invention.
图中，1-上温度梯度隔离层，2-上正极热电偶堆，3-正极引出电极，4-上负极热电偶堆，5-连接件，6-微米级陶瓷基底，7-下负极热电偶堆，8-负极引出电极，9-下正极热电偶堆，10-下温度梯度隔离层，11-热流敏感区域，12-引出电极引出区域，13-银导线，14-热电势读取设备。In the figure, 1-upper temperature gradient isolation layer, 2-upper positive thermocouple stack, 3-positive extraction electrode, 4-upper negative thermocouple stack, 5-connector, 6-micron ceramic substrate, 7-lower anode thermoelectric Even stack, 8-negative lead-out electrode, 9-lower positive thermocouple stack, 10-down temperature gradient isolation layer, 11-heat flow sensitive area, 12-lead electrode lead-out area, 13-silver wire, 14-thermoelectric potential reading device .
具体实施方式detailed description
下面结合附图对本发明做进一步的说明。The invention will be further described below in conjunction with the accompanying drawings.
如图1-图3所示，本发明一种3D直写式氧化铝陶瓷薄膜热流传感器，包括上温度梯度隔离层1、上热电偶堆、正极引出电极3、连接件5、微米级陶瓷 基底6、下热电偶堆、负极引出电极8和下温度梯度隔离层10，微米级陶瓷基底6的上表面设有3D打印生成的上热电偶堆，上热电偶堆的上方涂有上温度梯度隔离层1，微米级陶瓷基底6的下表面设有3D打印生成的下热电偶堆，下热电偶堆的上方涂有下温度梯度隔离层10,上热电偶堆通过连接件5与下热电偶堆相连，正极引出电极3与上热电偶堆相连，负极引出电极8与下热电偶堆相连。连接件5所用材料与正极引出电极3或负极引出电极8所用的材料相同。As shown in FIG. 1 to FIG. 3, a 3D direct write alumina ceramic film heat flow sensor of the present invention comprises an upper temperature gradient isolation layer 1, an upper thermocouple stack, a positive electrode extraction electrode 3, a connecting member 5, and a micron-sized ceramic substrate. 6. The lower thermocouple stack, the negative electrode lead electrode 8 and the lower temperature gradient isolation layer 10, the upper surface of the micron-sized ceramic substrate 6 is provided with an upper thermocouple stack generated by 3D printing, and the upper thermocouple stack is coated with an upper temperature gradient isolation Layer 1, the lower surface of the micron-sized ceramic substrate 6 is provided with a lower thermocouple stack formed by 3D printing, the lower thermocouple stack is coated with a lower temperature gradient isolation layer 10, and the upper thermocouple stack passes through the connector 5 and the lower thermocouple stack. Connected, the positive electrode lead electrode 3 is connected to the upper thermocouple stack, and the negative electrode lead electrode 8 is connected to the lower thermocouple stack. The material used for the connecting member 5 is the same as that used for the positive electrode lead electrode 3 or the negative electrode lead electrode 8.
上温度梯度隔离层1和下温度梯度隔离层10选用的材料为耐高温隔热保温纳米气相二氧硅化物微粉，厚度1mm。微米级陶瓷基底6选用的材料为氧化铝陶瓷。The material selected for the upper temperature gradient isolation layer 1 and the lower temperature gradient isolation layer 10 is a high temperature heat insulation nano gas phase dioxide fine powder having a thickness of 1 mm. The material selected for the micron-sized ceramic substrate 6 is alumina ceramic.
上热电偶堆包括上正极热电偶堆2和上负极热电偶堆4，上正极热电偶堆2和上负极热电偶堆4相连，正极引出电极3与上正极热电偶堆2相连；下热电偶堆包括下负极热电偶堆7和下正极热电偶堆9，下负极热电偶堆7和下正极热电偶堆9相连，负极引出电极8与下负极热电偶堆相连。The upper thermocouple stack includes an upper positive electrode thermocouple stack 2 and an upper negative electrode thermocouple stack 4, an upper positive electrode thermocouple stack 2 and an upper negative electrode thermocouple stack 4 connected, a positive electrode lead electrode 3 connected to the upper positive electrode thermocouple stack 2; a lower thermocouple The stack includes a lower negative electrode thermocouple stack 7 and a lower positive electrode thermocouple stack 9, a lower negative electrode thermocouple stack 7 and a lower positive electrode thermocouple stack 9 connected, and a negative electrode lead-out electrode 8 connected to the lower negative electrode thermocouple stack.
一个上正极热电偶堆2中的正极热电偶与一个上负极热电偶堆4中的负极热电偶串联形成一对热电偶，多对热电偶收尾相连，热电偶对循环环绕在微米级陶瓷基底6上表面的热流敏感区域11。一个下正极热电偶堆9中的正极热电偶与一个下负极热电偶堆7中的负极热电偶串联形成一对热电偶，多对热电偶收尾相连，热电偶对循环环绕在微米级陶瓷基底6下表面的热流敏感区域11。热电偶对包括6个直径不同的C形热电偶圈。为实现有限面积内薄膜细线热电堆电极的大热电势信号的输出，将薄膜热电堆电极设计为由多对热电偶电极循环环绕串联的结构，使得热电偶电极在有限面积内铺满上下整个热电偶堆基底的面积，形成空间热电偶电极阵列。A positive electrode thermocouple in an upper positive electrode thermocouple stack 2 and a negative electrode thermocouple in an upper negative electrode thermocouple stack 4 form a pair of thermocouples in series, a plurality of pairs of thermocouples are connected in a tail, and a thermocouple pair is circumferentially wound around the micron-sized ceramic substrate 6 The heat flow sensitive area 11 of the upper surface. A positive electrode thermocouple in a lower positive electrode thermocouple stack 9 and a negative electrode thermocouple in a lower negative electrode thermocouple stack 7 form a pair of thermocouples in series, a plurality of pairs of thermocouples are connected at the end, and the thermocouple pair is circumferentially surrounded by the micron-sized ceramic substrate 6 The heat flow sensitive area 11 of the lower surface. The thermocouple pair includes six C-shaped thermocouple rings of different diameters. In order to realize the output of the large thermoelectric potential signal of the thin film thermoelectric stack electrode in a limited area, the thin film thermopile electrode is designed to be surrounded by a plurality of pairs of thermocouple electrodes, so that the thermocouple electrode is covered in a limited area. The area of the thermocouple stack substrate forms a spatial thermocouple electrode array.
当上热电偶堆和下热电偶堆选用的材料为铂-铂铑10热电偶时，正极引出电极3选用的材料为铂，负极引出电极8选用的材料为铂铑10。When the material selected for the upper thermocouple stack and the lower thermocouple stack is a platinum-platinum rhodium 10 thermocouple, the material selected for the positive electrode lead electrode 3 is platinum, and the material selected for the negative electrode lead electrode 8 is platinum rhodium 10.
当上热电偶堆和下热电偶堆选用的材料为金-金钯热电偶，正极引出电极3选用的材料为金，负极引出电极8选用的材料为金钯。When the material of the upper thermocouple stack and the lower thermocouple stack is a gold-gold palladium thermocouple, the material selected for the positive electrode lead electrode 3 is gold, and the material selected for the negative electrode lead electrode 8 is gold palladium.
如图4所示，本发明还提供上述的一种3D直写式氧化铝陶瓷薄膜热流传感器的制作方法，包括以下步骤：As shown in FIG. 4, the present invention further provides a method for fabricating a 3D direct write alumina ceramic film heat flow sensor as described above, comprising the following steps:
S1.使用3D打印机陶瓷喷嘴对准微米级陶瓷基底上的过孔，使用熔融的金 属填充过孔，冷却至室温形成连接件；S1. Align the via holes on the micro-scale ceramic substrate with a ceramic nozzle of the 3D printer, fill the via holes with molten metal, and cool to room temperature to form a connector;
S2.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的上表层打印正极热电偶和正极引出电极，冷却至室温；S2. Using a 3D printer ceramic nozzle to align the positioning, printing the positive electrode thermocouple and the positive electrode lead electrode on the upper surface of the micron-sized ceramic substrate, and cooling to room temperature;
S3.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的上表层打印负极热电偶,使负极热电偶与连接件相连，冷却至室温；S3. Using a 3D printer ceramic nozzle to align the positioning, printing a negative electrode thermocouple on the upper surface of the micron-sized ceramic substrate, connecting the negative electrode thermocouple to the connecting member, and cooling to room temperature;
S4.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的下表层打印负极热电偶和负极引出电极,冷却至室温；S4. Using a 3D printer ceramic nozzle to align the positioning, printing the negative electrode thermocouple and the negative electrode lead electrode on the lower surface of the micron-sized ceramic substrate, and cooling to room temperature;
S5.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的下表层打印正极热电偶,使正极热电偶与连接件相连，冷却至室温；S5. Using a ceramic nozzle of a 3D printer to align the positioning, printing a positive electrode thermocouple on the lower surface of the micron-sized ceramic substrate, connecting the positive electrode thermocouple to the connecting member, and cooling to room temperature;
S6.使用相应的掩膜版对准上热电偶堆，涂刷耐高温热保温涂料，覆盖上热电偶堆的全部冷结点，形成上温度梯度隔离层,然后升温至300℃烘干；S6. Align the upper thermocouple stack with the corresponding mask plate, apply the high temperature resistant thermal insulation coating, cover all the cold junctions of the thermocouple stack, form an upper temperature gradient isolation layer, and then heat up to 300 ° C to dry;
S7.使用相应的掩膜版对准下热电偶堆，涂刷耐高温热保温涂料，覆盖下热电偶堆的全部冷结点，形成下温度梯度隔离层，然后升温至300℃烘干；S7. Align the lower thermocouple stack with the corresponding mask, apply the high temperature thermal insulation coating, cover all the cold junctions of the thermocouple stack, form the lower temperature gradient isolation layer, and then heat up to 300 ° C to dry;
S8.将涂刷有耐高温热保温涂料的微米级陶瓷基底在烧结炉里在500℃下烧结1小时成型，薄膜传感器制作完成。S8. The micron-sized ceramic substrate coated with the high temperature resistant thermal insulation coating is sintered in a sintering furnace at 500 ° C for 1 hour, and the film sensor is completed.
如图5所示，为提高传感器响应频率和热电势的稳定读取信号，引出电极和热电偶堆的电极采用3D直写工艺。微米级陶瓷基底6为热电偶堆电极和引出电极和下温度梯度隔离层10提供附着和支持作用，为实现热电偶堆电极与引出电极工艺，以及增加下温度梯度隔离层10的附着能力，微米级陶瓷基底6上表面抛光处理，此外，微米级陶瓷基底6结构设计为引出式形状，该引出式形状分为热流敏感区域11与引出电极引出区域12，引出电极引出区域12较长使得当传感器敏感区域工作在高温时，引出电极引出区域12能维持较低温度方便使用银导线13连接引出电极实现稳定读取信号。As shown in FIG. 5, in order to improve the stable reading signal of the sensor response frequency and the thermoelectric potential, the electrodes of the extraction electrode and the thermocouple stack adopt a 3D direct writing process. The micron-sized ceramic substrate 6 provides adhesion and support for the thermocouple stack electrode and the extraction electrode and the lower temperature gradient isolation layer 10, to achieve the thermocouple stack electrode and the extraction electrode process, and to increase the adhesion ability of the lower temperature gradient isolation layer 10, micron The upper surface of the ceramic substrate 6 is polished, and further, the micron-sized ceramic substrate 6 is designed to have a lead-out shape, which is divided into a heat flow sensitive region 11 and an extraction electrode lead-out region 12, and the lead electrode lead-out region 12 is long so that the sensor When the sensitive area is working at a high temperature, the lead-out electrode lead-out area 12 can maintain a lower temperature, and the silver lead 13 can be connected to the lead-out electrode to achieve a stable reading signal.
本传感器在工作时，将处在冷端区域的引出电极连接热电势读取设备14通过银导线13稳定读取传感器的热电势信号。为实现有限面积内热电堆的大热电势信号的输出，上下温度梯度隔离层选用导热系数0.03的耐高温隔热保温纳米气相二氧硅化物微粉，上下温度梯度隔离层其通过掩模板印刷覆盖在热电偶堆电极上，导致传感器中每对热电偶一部分外露，直接感应外界热流和温度，另一部分被覆盖埋在温度梯度隔离层与微米级陶瓷基底材料之间，当传感器处在 用于测试热流时，覆盖有温度梯度隔离层热电堆电极与外露的薄热电堆电极之间将形成垂直于热流的大温度梯度，这将与循环环绕串联的而成的密集热电堆电极协同作用使热流传感器大的热电势信号，从而使得测试灵敏度得到提升。When the sensor is in operation, the extraction electrode connected to the cold end region is connected to the thermoelectric potential reading device 14 to stably read the thermoelectric potential signal of the sensor through the silver wire 13. In order to realize the output of the large thermoelectric potential signal of the thermopile in a limited area, the upper and lower temperature gradient isolation layer is selected from the high-temperature heat-insulating nano-gas phase dioxide powder with a thermal conductivity of 0.03, and the upper and lower temperature gradient isolation layer is covered by the mask printing. On the thermocouple stack electrode, a part of each pair of thermocouples in the sensor is exposed, directly sensing the external heat flow and temperature, and another part is covered between the temperature gradient isolation layer and the micron-sized ceramic base material, when the sensor is used to test the heat flow At the same time, a large temperature gradient perpendicular to the heat flow will be formed between the thermopile electrode covered with the temperature gradient isolation layer and the exposed thin thermopile electrode, which will cooperate with the dense thermopile electrode formed by circulating in series to make the heat flow sensor large The thermoelectric potential signal increases the test sensitivity.
尽管已经参照其示例性实施例具体显示和描述了本发明，但是本领域的技术人员应该理解，在不脱离权利要求所限定的本发明的精神和范围的情况下，可以对其进行形式和细节上的各种改变。Although the present invention has been particularly shown and described with reference to the exemplary embodiments thereof, those skilled in the art should understand that the form and details can be made without departing from the spirit and scope of the invention as defined by the appended claims. Various changes on it.

Claims (10)

  1. 一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：包括上温度梯度隔离层(1)、上热电偶堆、正极引出电极(3)、连接件(5)、微米级陶瓷基底(6)、下热电偶堆、负极引出电极(8)和下温度梯度隔离层(10)，微米级陶瓷基底(6)的上表面设有3D打印生成的上热电偶堆，上热电偶堆的上方涂有上温度梯度隔离层(1)，微米级陶瓷基底(6)的下表面设有3D打印生成的下热电偶堆，下热电偶堆的上方涂有下温度梯度隔离层(10),上热电偶堆通过连接件(5)与下热电偶堆相连，正极引出电极(3)与上热电偶堆相连，负极引出电极(8)与下热电偶堆相连。A 3D direct writing alumina ceramic film heat flow sensor, comprising: an upper temperature gradient isolation layer (1), an upper thermocouple stack, a positive electrode extraction electrode (3), a connecting member (5), a micron-sized ceramic substrate ( 6), a lower thermocouple stack, a negative electrode lead electrode (8) and a lower temperature gradient isolation layer (10), the upper surface of the micron-sized ceramic substrate (6) is provided with an upper thermocouple stack generated by 3D printing, and an upper thermocouple stack The upper surface is coated with an upper temperature gradient isolation layer (1), the lower surface of the micron-sized ceramic substrate (6) is provided with a lower thermocouple stack formed by 3D printing, and the lower thermocouple stack is coated with a lower temperature gradient isolation layer (10). The upper thermocouple stack is connected to the lower thermocouple stack through a connection member (5), the positive electrode extraction electrode (3) is connected to the upper thermocouple stack, and the negative electrode extraction electrode (8) is connected to the lower thermocouple stack.
  2. 根据权利要求1所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：所述上热电偶堆包括上正极热电偶堆(2)和上负极热电偶堆(4)，上正极热电偶堆(2)和上负极热电偶堆(4)相连，所述正极引出电极(3)与所述上正极热电偶堆(2)相连；所述下热电偶堆包括下负极热电偶堆(7)和下正极热电偶堆(9)，下负极热电偶堆(7)和下正极热电偶堆(9)相连，所述负极引出电极(8)与下负极热电偶堆相连。A 3D direct write alumina ceramic film heat flow sensor according to claim 1, wherein said upper thermocouple stack comprises an upper positive electrode thermocouple stack (2) and an upper negative electrode thermocouple stack (4). A positive electrode thermocouple stack (2) is connected to the upper negative electrode thermocouple stack (4), the positive electrode extraction electrode (3) is connected to the upper positive electrode thermocouple stack (2); and the lower thermocouple stack includes a lower negative electrode thermocouple The stack (7) is connected to the lower positive electrode thermocouple stack (9), the lower negative electrode thermocouple stack (7) and the lower positive electrode thermocouple stack (9), and the negative electrode lead-out electrode (8) is connected to the lower negative electrode thermocouple stack.
  3. 根据权利要求1所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：一个所述上正极热电偶堆(2)中的正极热电偶与一个所述上负极热电偶堆(4)中的负极热电偶串联形成一对热电偶，多对热电偶收尾相连，热电偶对循环环绕在所述微米级陶瓷基底(6)上表面的热流敏感区域(11)。A 3D direct write alumina ceramic film heat flow sensor according to claim 1, wherein: a positive electrode thermocouple in one of said upper positive electrode thermocouple stacks (2) and one of said upper negative electrode thermocouple stacks ( The negative electrode thermocouples in 4) form a pair of thermocouples in series, and a plurality of pairs of thermocouples are connected in a tail, and the pair of thermocouples circulate around the heat flow sensitive region (11) on the upper surface of the micron-sized ceramic substrate (6).
  4. 根据权利要求1所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：一个所述下正极热电偶堆(9)中的正极热电偶与一个所述下负极热电偶堆(7)中的负极热电偶串联形成一对热电偶，多对热电偶收尾相连，热电偶对循环环绕在所述微米级陶瓷基底(6)下表面的热流敏感区域(11)。A 3D direct write alumina ceramic film heat flow sensor according to claim 1, wherein: a positive electrode thermocouple in one of said lower positive electrode thermocouple stacks (9) and one of said lower negative electrode thermocouple stacks ( The negative electrode thermocouples in 7) form a pair of thermocouples in series, and a plurality of pairs of thermocouples are connected in a tail, and the pair of thermocouples circulate around the heat flow sensitive region (11) on the lower surface of the micron-sized ceramic substrate (6).
  5. 根据权利要求3或4所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：所述热电偶对包括多个直径不同的C形热电偶圈。A 3D direct write alumina ceramic film heat flow sensor according to claim 3 or 4, wherein the thermocouple pair comprises a plurality of C-shaped thermocouple rings of different diameters.
  6. 根据权利要求5所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：所述C形热电偶圈的圈数为6个。A 3D direct write alumina ceramic thin film heat flow sensor according to claim 5, wherein the number of turns of the C-shaped thermocouple ring is six.
  7. 根据权利要求1所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：所述上热电偶堆和所述下热电偶堆选用的材料为铂-铂铑10热电偶， 正极引出电极(3)选用的材料为铂，负极引出电极(8)选用的材料为铂铑10。A 3D direct write alumina ceramic film heat flow sensor according to claim 1, wherein the material of the upper thermocouple stack and the lower thermocouple stack is a platinum-platinum rhodium 10 thermocouple, and a positive electrode. The material selected for the extraction electrode (3) is platinum, and the material selected for the negative electrode extraction electrode (8) is platinum iridium 10.
  8. 根据权利要求1所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：所述上热电偶堆和所述下热电偶堆选用的材料为金-金钯热电偶，正极引出电极(3)选用的材料为金，负极引出电极(8)选用的材料为金钯。A 3D direct write alumina ceramic film heat flow sensor according to claim 1, wherein the material of the upper thermocouple stack and the lower thermocouple stack is a gold-gold palladium thermocouple, and the positive electrode is taken out. The material selected for the electrode (3) is gold, and the material selected for the negative electrode (8) is gold palladium.
  9. 根据权利要求7或8所述的一种3D直写式氧化铝陶瓷薄膜热流传感器，其特征在于：所述连接件(5)所用材料与所述正极引出电极(3)或所述负极引出电极(8)所用的材料相同。A 3D direct write alumina ceramic film heat flow sensor according to claim 7 or 8, characterized in that the material used for the connecting member (5) and the positive electrode lead electrode (3) or the negative electrode lead electrode (8) The materials used are the same.
  10. 一种根据权利要求1-9任一所述的一种3D直写式氧化铝陶瓷薄膜热流传感器的制作方法，其特征在于包括以下步骤：A method for fabricating a 3D direct write alumina ceramic film heat flow sensor according to any one of claims 1-9, comprising the steps of:
    S1.使用3D打印机陶瓷喷嘴对准微米级陶瓷基底上的过孔，使用熔融的金属填充过孔，冷却至室温形成连接件；S1. Using a 3D printer ceramic nozzle to align the via holes on the micro-scale ceramic substrate, filling the via holes with molten metal, and cooling to room temperature to form a connector;
    S2.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的上表层打印正极热电偶和正极引出电极，冷却至室温；S2. Using a 3D printer ceramic nozzle to align the positioning, printing the positive electrode thermocouple and the positive electrode lead electrode on the upper surface of the micron-sized ceramic substrate, and cooling to room temperature;
    S3.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的上表层打印负极热电偶,使负极热电偶与连接件相连，冷却至室温；S3. Using a 3D printer ceramic nozzle to align the positioning, printing a negative electrode thermocouple on the upper surface of the micron-sized ceramic substrate, connecting the negative electrode thermocouple to the connecting member, and cooling to room temperature;
    S4.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的下表层打印负极热电偶和负极引出电极,冷却至室温；S4. Using a 3D printer ceramic nozzle to align the positioning, printing the negative electrode thermocouple and the negative electrode lead electrode on the lower surface of the micron-sized ceramic substrate, and cooling to room temperature;
    S5.使用3D打印机陶瓷喷嘴对准定位，在微米级陶瓷基底的下表层打印正极热电偶,使正极热电偶与连接件相连，冷却至室温；S5. Using a ceramic nozzle of a 3D printer to align the positioning, printing a positive electrode thermocouple on the lower surface of the micron-sized ceramic substrate, connecting the positive electrode thermocouple to the connecting member, and cooling to room temperature;
    S6.使用相应的掩膜版对准上热电偶堆，涂刷耐高温热保温涂料，覆盖上热电偶堆的全部冷结点，形成上温度梯度隔离层,然后升温至300℃烘干；S6. Align the upper thermocouple stack with the corresponding mask plate, apply the high temperature resistant thermal insulation coating, cover all the cold junctions of the thermocouple stack, form an upper temperature gradient isolation layer, and then heat up to 300 ° C to dry;
    S7.使用相应的掩膜版对准下热电偶堆，涂刷耐高温热保温涂料，覆盖下热电偶堆的全部冷结点，形成下温度梯度隔离层，然后升温至300℃烘干；S7. Align the lower thermocouple stack with the corresponding mask, apply the high temperature thermal insulation coating, cover all the cold junctions of the thermocouple stack, form the lower temperature gradient isolation layer, and then heat up to 300 ° C to dry;
    S8.将涂刷有耐高温热保温涂料的微米级陶瓷基底在烧结炉里在500℃下烧结1小时成型，薄膜传感器制作完成。S8. The micron-sized ceramic substrate coated with the high temperature resistant thermal insulation coating is sintered in a sintering furnace at 500 ° C for 1 hour, and the film sensor is completed.
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