CN111024269B - Planar heat flow sensor for measuring heat flow along wall surface and calibration method thereof - Google Patents
Planar heat flow sensor for measuring heat flow along wall surface and calibration method thereof Download PDFInfo
- Publication number
- CN111024269B CN111024269B CN201911355328.4A CN201911355328A CN111024269B CN 111024269 B CN111024269 B CN 111024269B CN 201911355328 A CN201911355328 A CN 201911355328A CN 111024269 B CN111024269 B CN 111024269B
- Authority
- CN
- China
- Prior art keywords
- heat flow
- sensor
- temperature
- thermopile
- calibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K19/00—Testing or calibrating calorimeters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
Abstract
The invention discloses a planar heat flow sensor for measuring heat flow along a wall surface and a calibration method thereof. The thin film heat flow sensor consists of 3 platinum resistors and 1 thermopile, which is placed between the two outermost platinum resistors. When the static characteristic of the sensor is calibrated, a calibration idea for realizing the measurement of the Seebeck coefficient according to the temperature difference of the cold end and the hot end of the thermoelectric pile and the thermoelectric potential under the condition of small heat flow is provided. And (3) building a calibration device according to a calibration thought, setting the ambient temperature of 40-100 ℃, and simultaneously loading laser with smaller power at the central position of the sensor, so that heat flow is transmitted along the radial direction of the sensor. And when the system is in a stable state, a small temperature difference is formed at the cold end and the hot end of the thermopile, the Seebeck coefficient is obtained through the temperature difference and the output of the corresponding thermoelectric force, and the change relation of the Seebeck coefficient along with the temperature is obtained according to different environmental temperatures, so that the calibration of the Seebeck coefficient is realized.
Description
Technical Field
The invention belongs to the technical field of film heat flow sensors, and relates to a planar heat flow sensor for measuring heat flow along a wall surface and a calibration method thereof.
Background
With the increasing demand for thermal measurement, thermal management, monitoring of the heat transfer process becomes increasingly important in many heat transfer systems. The development of thin film technology provides good working conditions for micro-scale heat transfer measurement, and a thin film heat flow sensor is also created. The thermopile type heat flow sensor is the most common thin film heat flow sensor at present, and is formed by winding a thermopile on a heat resistance layer at the earliest, and the thermopile is used for measuring the heat flux vertically passing through the heat resistance layer. The heat flow sensor has the advantages of quick response, small size, high precision and the like, and is widely applied to heat flow measurement in the fields of aerospace, building energy conservation, medical treatment, agriculture, fuel cells, fire experiments and the like.
Most current heat flow sensors measure heat flow perpendicularly across the sensor surface, and less research is being conducted on sensors that directly measure heat flow along a wall. The planar thermopile type thin film heat flow sensor refers to a sensor in which the hot and cold ends of the thermopile are positioned on the same plane. In order to reduce the dimensions as much as possible, they are generally designed to be circular. In the last decade, NASA developed a thermopile planar heat flux sensor for heat flux measurements on the surface of engine turbine blades. Meanwhile, in the field of thermal analysis, the planar heat flow sensor is also applied to the measurement of sample heat flow in a differential scanning calorimeter.
Although some planar heat flow sensors have been developed and applied, few studies are made on calibration methods thereof, and accurate calibration of thermopile heat flow sensors is one of the difficulties in the thermal engineering field. Thermopile type heat flow sensors, which are commonly applied in the aerospace field, are calibrated using arc lamps or black body furnaces. The methods are complex in device and high in cost, the incident heat flux density is required to be known, the method is not suitable for general field or system calibration, the method is applied to a planar heat flux sensor of a differential scanning calorimeter, calibration is usually carried out based on phase change temperature and phase change enthalpy of a standard substance, and continuous calibration cannot be realized by the calibration method due to the limited types of the standard substance.
Aiming at the problem that the calibration of the thermopile type thin film heat flow sensor is difficult, the invention designs a novel planar thin film heat flow sensor, and realizes the calibration of the static characteristics of the sensor by simulating and analyzing the heat conduction rule of the sensor and combining a laser heating and temperature extrapolation method.
Disclosure of Invention
The invention discloses a planar heat flow sensor capable of realizing heat flow measurement along a wall surface, and provides a sensor connection structure which fixes small-size pins through a metal probe and realizes stable signal output, and meanwhile, the calibration of a sensor Seebeck coefficient is realized by building a sensor static calibration platform.
In order to achieve the purpose, the invention adopts the technical scheme that:
a planar thermopile-type film heat flow sensor with cold and hot junctions on the same plane features that 3 film Pt resistors and a thermopile consisting of multiple Au-Pt thermocouples are plated on the insulating substrate.
The thin film sensor is printed on an alumina ceramic substrate with the thermal conductivity of 36W/m.K, and the substrate is a circular sheet with the diameter of 22mm and the thickness of 0.36 mm.
The film platinum resistors on the film heat flow sensor are in an arc shape and are respectively arranged on two sides of the cold end and the hot end of the thermoelectric pile, the radiuses of the platinum resistors are respectively 1.55mm, 2.55mm and 7.05mm, the width of each platinum resistor is 0.1mm, and the film thickness is 10 micrometers.
The thermopile on the heat flow sensor is formed by connecting 44 gold-platinum thermocouples in series and is arranged on the surface of the substrate in an arc shape. The width of each gold-platinum thermocouple is 0.1mm, and the overlapping areas at the two ends of the electrode respectively form the cold end and the hot end of the thermopile. Wherein, the radius of the arc where the hot end is located is 3.5mm, and the radius of the arc where the cold end is located is 6.5 mm.
The static characteristic calibration method of the film heat flow sensor comprises the following steps:
and a laser heating and temperature extrapolation method is adopted. In order to simulate the actual heat transfer condition, laser is loaded at the center of the sensor to be used as a heat source, and heat flows along the radial direction of the sensor. The main calibration steps are as follows: firstly, laser is loaded at the center of the sensor, and after the laser is absorbed by the center of the sensor surface, heat is transferred to the edge along the center of the sensor. After the system is in thermal balance, the temperature of the cold and hot ends of the thermoelectric stack is deduced according to a certain temperature distribution rule from the temperature of the thin film platinum resistor, and the temperature difference is obtained. And finally, establishing a relation between the temperature difference and the output of the thermopile to realize the static calibration of the sensor.
The experimental system corresponding to the method is mainly divided into four modules, namely a laser generation module, a sensor receiving module, an environment temperature measurement control module and a data acquisition module. The laser generation module comprises a laser generator, a laser controller and an optical bracket. The module mainly realizes the main function of laser vertical fixation, namely fixing a laser to realize vertical light emitting of the laser, and can adjust the laser power, wherein the adjustable range is 0-3000 mW; the sensor receiving module realizes that the sensor signal draws out, puts the sensor on the copper support that the center was hollowed out, because sensor pin size is little, is difficult to draw out the signal line through the welded mode, so use thinner probe to place on the pin and fixed through the keysets. The specific implementation method comprises the following steps: drilling through holes at positions corresponding to the sensor pins on the connecting plate, fixing the probe sleeves, selectively purchasing a sleeve with a line needle to enable signals to be output through a lead, and finally fixing the adapter plate by using screws; the furnace body temperature control system forms an environment temperature measurement control module, realizes the temperature control in the furnace body through a PID algorithm, measures through a thermocouple and provides a constant temperature field of 40-100 ℃ for the calibration of the sensor; the output signal of the sensor is collected by a data acquisition system and fed back to an upper computer for display. The thermopile thermoelectromotive force was measured by Fluke1586A, and the thin film platinum resistance was obtained using the four-wire measurement principle using Fluke 1529.
The invention integrates 3 circular-arc platinum resistors and 1 thermopile on a sensor, wherein two platinum resistors are positioned at the inner side of a hot junction of the thermopile, the other platinum resistor is positioned at the outer side of a cold junction of the thermopile, three platinum resistors are marked as R1, R2 and R3 according to the sequence of the radius from large to small, and R1 and R2 are respectively close to a cold end and a hot end and are used for temperature extrapolation to obtain the temperature of the cold junction and the hot junction.
In the calibration process, different environment temperature changes are realized through furnace body temperature control, heat flow is loaded at the center of the sensor, and Seebeck coefficients corresponding to different environment temperatures are obtained under the condition of small heat flow.
The invention provides a solution for leading out a sensor signal by using a high-temperature resistant metal probe and a corresponding needle sleeve with a wire and fixing the sensor signal by an adapter plate, aiming at solving the problem that the lead is difficult to lead out due to small size and dense intervals of pins of a film heat flow sensor. The high-temperature resistant metal probe is a test needle with a spring inside, the diameter of the measuring part of a needle head can reach the micron level, and the high-temperature resistant metal probe is often used for precise measurement. When the sensor connecting device is built, firstly, in order to transfer heat faster and more uniformly, pure copper with the thermal conductivity coefficient of 381W/m.K is selected as a bracket supporting sensor, and a hole with the diameter of 21mm is dug in the middle for placing the sensor; secondly, selecting a high-temperature-resistant PCB, and punching corresponding holes according to the corresponding positions of the pins on the sensor and the sizes of the pins on the PCB so that the probes with proper specifications can pass through and be welded and fixed with the PCB and the high-temperature-resistant probes. Since the pins of the sensor are concentrated on one side, the same holes are drilled in the PCB board pin holes at symmetrical positions with respect to the origin and fixed with the same probes in order to maintain balance. Drilling a hole with the diameter of 5mm at the central position of the PCB to ensure that laser penetrates through the hole; and finally, the adapter plate is fixed with the copper support through a screw and forms extrusion acting force on the sensor, so that the pins of the sensor are ensured to be in good contact.
The invention has the beneficial effects that:
1. the planar heat flow sensor consists of 3 thin film platinum resistors and 1 thermopile, and realizes the measurement of heat flow along the radial direction of the sensor according to the temperature difference of the cold end and the hot end of the thermopile.
2. The invention provides a lead wire leading-out method suitable for small-size pins, and stable output of measurement signals is realized.
3. When the calibration is carried out, the invention provides a method for realizing the measurement of the corresponding sensor Seebeck coefficient under the temperature by changing the ambient temperature under the condition that small heat flow passes through, thereby realizing the calibration of the sensor.
Drawings
Fig. 1 is a top view of an overall structure of a planar thin film heat flow sensor for measuring heat flow transmitted along a wall.
Fig. 2 is a schematic structural diagram of a calibration experiment platform of a planar thin-film heat flow sensor.
Fig. 3 is a schematic diagram of a signal extraction device of a planar thin-film heat flow sensor.
Fig. 4 is a fitting graph of seebeck coefficients measured at different ambient temperatures.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, the planar heat flow sensor of the present invention is printed on an alumina ceramic substrate 1-1, and is composed of 3 platinum resistors and 1 thermopile. The 3 platinum resistors 1-2, 1-3 and 1-4 are in the shape of circular arcs and are arranged on the surface of the substrate according to different radiuses. The thermopile 1-5 is formed by connecting 44 thermocouples in series, the positive electrode of the thermocouple is gold 1-6, the negative electrode of the thermocouple is platinum 1-7, and the superposed parts of the gold and the platinum form the cold end 1-8 and the hot end 1-9 of the thermopile. During calibration, the resistance value of each thin film platinum resistor is measured through a four-wire system, and the resistance value and two pins for measuring the potential of the thermopile form 12 pins 1-10, and the area of each pin is 0.3mm multiplied by 1 mm.
As shown in fig. 2, the calibration device system of the planar thin-film heat flow sensor is divided into four modules, namely a laser generation module 1, a sensor receiving module 2, an ambient temperature measurement and control module 3, and a data acquisition module 4. When the sensor device is built, the laser 2-1 is fixed by the laser support 2-3 to ensure vertical light emission, and the laser controller 2-2 is connected with the laser to control the output power of the laser. In the sensor receiving module, a furnace 2-4 with a proper furnace chamber size is selected, the sensor is placed in the middle position and connected through a probe so that signals can be normally output. The environment temperature measurement and control system 2-5 realizes the temperature control in the furnace body through a PID algorithm and measures through a thermocouple, provides a constant temperature field of 40-100 ℃ for the calibration of the sensor, and the temperature control precision is +/-0.2 ℃. The data generated by the sensor is collected by the data collecting device 2-6 and transmitted to the upper computer 2-7 for data processing and display.
Aiming at the problems that the planar film heat flow sensor has more pins and small size and a test lead is difficult to lead out, a method for leading out a test signal by a high-temperature-resistant probe with small size is provided. As shown in fig. 3, when the sensor receiving module is assembled, a set of devices for leading out sensor signal wires is arranged in the furnace body besides the environmental temperature required by the furnace body control. In order to ensure good heat transfer performance, copper with high heat conductivity coefficient is selected as a material of the sensor support frame 3-1, the center of the sensor support frame is hollowed, and the sensor 3-2 is placed on the surface and is positioned in the center of the furnace chamber. Selecting a high-temperature-resistant PCB material to design and manufacture a PCB adapter plate with a proper size, punching holes at the corresponding positions of the sensor pins and the laser penetrating positions, fixing the probe sleeve 3-4 and the adapter plate 3-5 in a welding mode, and then installing the high-temperature-resistant probes 3-3 into the needle sleeve to realize the one-to-one correspondence of the sensor pins and the probes. The high-temperature resistant probe is internally provided with a spring. The adapter plate is fixed with the copper support through four screws 3-6, the probe is extruded, and good contact between the probe and the pin is guaranteed.
In the static characteristic calibration experiment of the thin film heat flow sensor, the thermoelectric potential E of the thermocouple has the following relationship with the temperature T:
E＝a0+a1T+a2T2+…+a9T9 (1)
wherein a isiFor the fitting coefficients, i is 0,1.. 9.
When the temperatures of the hot end and the cold end of the thermopile are respectively T1And T2According to the relationship between the output potential and the temperature of the thermopile, the following results are obtained:
Vout＝n·[a1(T1-T2)+a2(T1 2-T2 2)+...+a9(T1 9-T2 9)] (2)
wherein n is a thermoelectric even number of the thermopiles connected in series. Let T be1＝ΔT+T2Δ T → 0, then the above equation can be simplified as:
Vout≈n(a1+2a2T2+3a3T2 2…9a9T2 8)DT (3)
the content in parentheses in the above formula is, by definition, the seebeck coefficient. It can be seen that the seebeck coefficient can be measured by equation (3) when the temperature difference Δ T is small. Under the condition of small temperature difference, different environmental temperatures are provided, and corresponding Seebeck coefficients at different temperatures can be obtained.
The temperature of the cold and hot ends of the thermoelectric stack is obtained by a temperature extrapolation method. The temperature extrapolation method is that when laser is loaded at the center of the sensor, the temperature is substituted into the radius of the cold end and the hot end of the thermoelectric pile to obtain the corresponding temperature value according to the known temperature of two film platinum resistors R1 and R2 combined with a cylinder wall temperature extrapolation model. The cylinder wall calculation model is as follows:
T(r)＝C1 ln r+C2 (4)
the calibration results show that the seebeck coefficient increases with the increase of the ambient temperature in the range of 40 ℃ to 100 ℃ at a temperature difference of about 0.31 ℃, and the measured seebeck coefficient at each ambient temperature is fitted, and the results are shown in fig. 4.
The advantages of the planar heat flow sensor of the present invention include:
(1) a thin film heat flow sensor for measuring heat flow transfer in a plane is realized. Structurally, the cold and hot ends formed by the thermopile for measuring the temperature difference are printed on the same plane, so that heat flow transmission measurement in the plane is realized.
(2) Aiming at the problem of difficult wiring of small-size pins, a method for leading out a test signal wire by using a probe is provided, and the method can be applied to the field of precision measurement and can stably output a test signal.
(3) In the calibration device, the aim of measuring the Seebeck coefficients at different temperatures is fulfilled by controlling the furnace temperature.
(4) A method for accurately measuring the Seebeck coefficient under the condition of passing of small heat flow is provided.
The invention discloses a plane type film heat flow sensor which is used for measuring heat flow transmitted along a wall surface and is prepared on the surface of alumina ceramic by a screen printing technology. The sensor consists of 3 platinum resistors and 1 thermopile. The platinum resistors are arranged in an arc shape with a radius from large to small and are respectively represented as R1, R2, and R3. A thermopile is distributed between R1 and R2, the thermopile is formed by connecting 44 gold platinum thermocouples in series, and the distance between the hot end and the cold end is 3 mm. When the film heat flow sensor is calibrated, the furnace body provides constant ambient temperature of 40-100 ℃, different heat flows are loaded by laser, and the static calibration of the heat flow sensor is realized through the output of the sensor under different ambient temperatures and different laser powers.
Claims (7)
1. A planar film heat flow sensor for realizing heat flow measurement along a wall surface is characterized in that a thermopile for realizing temperature difference measurement is printed on the surface of a substrate, and three circular arc-shaped film platinum resistors are integrated on the substrate to jointly form the planar film heat flow sensor; the thermopile is formed by connecting a plurality of gold-platinum thermocouples in series, and the platinum resistors are three concentric arcs with different radiuses and are distributed on two sides of the cold end and the hot end of the thermopile.
2. The planar thin film heat flow sensor of claim 1, wherein the substrate is an alumina ceramic substrate with a diameter of 22mm, a thickness of 0.36mm, and a thermal conductivity of 36W/m-K.
3. The planar thin film heat flow sensor of claim 1, wherein the three circular arc-shaped thin film platinum resistors have arc radii of 1.55mm, 2.55mm and 7.05mm, each platinum resistor has a width of 0.1mm and a film thickness of 10 μm.
4. The planar thin-film heat flow sensor of claim 3, wherein the thermopile is formed by forty-four gold platinum thermocouples connected in series and arranged on the surface of the substrate in an arc shape; the width of each gold-platinum thermocouple is 0.1mm, and the overlapping areas at the two ends of the electrode respectively form the cold end and the hot end of the thermopile; wherein, the radius of the arc where the hot end is located is 3.5mm, and the radius of the arc where the cold end is located is 6.5 mm.
5. The method of calibrating the planar thin film heat flow sensor of claim 1, wherein:
loading laser to the center of the sensor in a constant temperature field with adjustable temperature, and transferring heat to the edge along the center of the sensor after the laser is absorbed by the center of the surface of the sensor; after heat balance, according to the temperature distribution rule, the temperature of the cold end and the hot end of the thermopile is deduced from the temperature of the thin film platinum resistor, so that the temperature difference is obtained, and the relationship between the temperature difference and the output of the thermopile is established to realize the static calibration of the sensor.
6. The calibration method according to claim 5, characterized in that: the high-temperature-resistant probe and the corresponding needle sleeve are matched together and fixed on the high-temperature-resistant PCB, and the position of the high-temperature-resistant probe corresponds to the position of the pin of the sensor, so that the stable output of the test signal of the sensor is realized.
7. The calibration method according to claim 5, characterized in that:
in the static calibration of the thin film heat flow sensor, the thermoelectric potential E of the thermocouple has the following relationship with the temperature T:
E＝a0+a1T+a2T2+···+a9T9 (1)
wherein a isiAs a fitting coefficient, i ═ 0,1.. 9;
when the temperatures of the hot end and the cold end of the thermopile are respectively T1And T2According to the relationship between the output potential and the temperature of the thermopile, the following results are obtained:
Vout＝n·[a1(T1-T2)+a2(T1 2-T2 2)+...+a9(T1 9-T2 9)] (2)
wherein n is a thermoelectric even number of the thermopiles connected in series; let T be1＝ΔT+T2Δ T → 0, then the above equation is simplified to:
Vout≈n(a1+2a2T2+3a3T2 2···9a9T2 8)ΔT (3)
according to the definition, the content in parentheses in the formula (3) is the seebeck coefficient; when the temperature difference delta T is small, the Seebeck coefficient is measured by the formula (3); under the condition of small temperature difference, different environmental temperatures are provided, and corresponding Seebeck coefficients at different temperatures can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911355328.4A CN111024269B (en) | 2019-12-25 | 2019-12-25 | Planar heat flow sensor for measuring heat flow along wall surface and calibration method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911355328.4A CN111024269B (en) | 2019-12-25 | 2019-12-25 | Planar heat flow sensor for measuring heat flow along wall surface and calibration method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111024269A CN111024269A (en) | 2020-04-17 |
| CN111024269B true CN111024269B (en) | 2020-12-08 |
Family
ID=70213130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911355328.4A Active CN111024269B (en) | 2019-12-25 | 2019-12-25 | Planar heat flow sensor for measuring heat flow along wall surface and calibration method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111024269B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022032580A1 (en) * | 2020-08-13 | 2022-02-17 | 欧菲光集团股份有限公司 | Thermocouple cold-junction compensation circuit, thermocouple assembly and temperature sensor |
| CN113176013B (en) * | 2021-06-02 | 2023-05-12 | 中国空气动力研究与发展中心超高速空气动力研究所 | Thin film thermal resistance heat flow meter for heat flow test and calibration method of coaxial thermocouple |
| CN113640343B (en) * | 2021-08-13 | 2023-04-25 | 中国计量大学 | Differential scanning calorimeter temperature calibration and reconstruction method based on laser power excitation |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE788904A (en) * | 1971-09-17 | 1973-03-15 | Siemens Ag | DEVICE FOR DETERMINING THE AVERAGE TEMPERATURE OF THE INTERNAL WALL AND THE AVERAGE FLOW OF HEAT THROUGH THE WALL OF A MOLD |
| DE29504105U1 (en) * | 1995-03-09 | 1995-04-27 | Viessmann Werke Kg | Temperature sensor |
| GB2497790B (en) * | 2011-12-21 | 2015-01-28 | Olancha Group Ltd | Temperature sensing apparatus and method |
| CN203643055U (en) * | 2013-11-25 | 2014-06-11 | 中国电子科技集团公司第四十八研究所 | Thin-film heat flow sensor for high-temperature large-heat-flow measurement |
| EP2921833B1 (en) * | 2014-03-18 | 2016-12-28 | Mettler-Toledo GmbH | Thermoanalytical sensor and method for its production |
| CN104359574A (en) * | 2014-11-05 | 2015-02-18 | 北京工业大学 | Fuel cell internal temperature-heat flux synchronous measurement sensor |
| JP2017075844A (en) * | 2015-10-14 | 2017-04-20 | 株式会社デンソー | Composite sensor |
| CN108548608A (en) * | 2018-04-19 | 2018-09-18 | 中北大学 | A kind of 3D write-throughs aluminium oxide ceramics film heat flux sensor and preparation method thereof |
| CN109399561B (en) * | 2018-12-19 | 2022-08-30 | 天津工业大学 | Online hydrogen production system and method |
-
2019
- 2019-12-25 CN CN201911355328.4A patent/CN111024269B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111024269A (en) | 2020-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111024269B (en) | Planar heat flow sensor for measuring heat flow along wall surface and calibration method thereof | |
| CN100437042C (en) | Flow sensor | |
| Iervolino et al. | Temperature calibration and electrical characterization of the differential scanning calorimeter chip UFS1 for the Mettler-Toledo Flash DSC 1 | |
| Ji et al. | Transient measurement of temperature distribution using thin film thermocouple array on turbine blade surface | |
| Zhang et al. | A high-precision instrumentation of measuring thermal contact resistance using reversible heat flux | |
| US3138025A (en) | High temperature probe | |
| CN102072916B (en) | Method and device for measuring total hemispherical emissivity of non-metallic material | |
| WO2019051793A1 (en) | Method and apparatus for measuring lateral thermal conductivity of thin film | |
| EP3106852A1 (en) | Heat flux sensor and system with a heat flux sensor | |
| Rajagopal et al. | Fabrication and characterization of thermocouple probe for use in intracellular thermometry | |
| Maglić et al. | The apparatus for thermal diffusivity measurement by the laser pulse method | |
| CN109870406B (en) | Method and system for testing adhesive force of material surface coating | |
| RU2764241C2 (en) | Device for measuring gas velocity or flow | |
| CN203629720U (en) | Thermal paint temperature detection device | |
| Ding et al. | Static characteristics calibration of Pt/Au thin-film thermocouple by means of laser heating and temperature extrapolation method | |
| WO2013085115A1 (en) | Device for measuring heat flux and system for measuring heat flux using same | |
| Sarma et al. | Calibration of a silver thin film gauge for short duration convective step heat load | |
| CN213337417U (en) | Thin film thermoelectric material performance parameter testing device and system | |
| CN109781309B (en) | High-precision calibration device and method for film type heat flow meter | |
| Hager et al. | Microsensors for high heat flux measurements | |
| Rizzo et al. | Calibration methodology for contact heat flux sensors with enhanced accuracy | |
| CN105203825A (en) | Manufacturing method of micro measuring electrode, measuring method of thermoelectrical potential and related device | |
| Li et al. | Highly sensitive flexible heat flux sensor based on a microhole array for ultralow to high temperatures | |
| CN101038312A (en) | Method for measuring surface temperature of micro-hotplate | |
| CN206339310U (en) | The measurement apparatus of smooth surface Temperature Distribution |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |