CN109827671A - A kind of thermocouple forming method - Google Patents
A kind of thermocouple forming method Download PDFInfo
- Publication number
- CN109827671A CN109827671A CN201910182519.9A CN201910182519A CN109827671A CN 109827671 A CN109827671 A CN 109827671A CN 201910182519 A CN201910182519 A CN 201910182519A CN 109827671 A CN109827671 A CN 109827671A
- Authority
- CN
- China
- Prior art keywords
- thermocouple
- probes
- cathode
- positive
- forming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a kind of thermocouple forming methods, comprising the following steps: A, the thermocouple integrated monolithic by aluminum oxide ceramic substrate；B, it is encapsulated in centre by high temperature seal, sealing materials with the ultra-thin aluminum oxide ceramic piece of the identical triangular structure of two panels, forms " sandwich " structure；C, medium thick film compound is carried out on temperature-sensitive point surface manage insulation blocking；" sandwich " structure borne is assembled into protection ceramic tube later；D, it is finally assembled in metal shell with holes, forms film thermocouple product.The forming method that the present invention uses is designed using triangular structure, and thermocouple temperature-sensitive point is arranged at vertex angle, it can be achieved that the small thermal capacity of temperature-sensitive point and small size, guarantee the fast-response technical requirements of sensor.Meanwhile thermocouple triangular structure designs, and can realize environment resistant vibration and thermal current impact capacity to greatest extent, realizes the robust design of sensor structure.
Description
Technical field
The present invention relates to technical field of motors, specially a kind of thermocouple forming method.
Background technique
Thermocouple is common temperature element in temperature measuring instrument, it directly measures temperature, and temperature signal is converted
At thermo-electromotive force signal, the temperature of measured medium is converted by electric meter (secondary meter).The shape of various thermocouples is normal
It is far from it because of needs, but their basic structure is roughly the same, usually by thermode, insulation sleeve protection pipe and wiring
The major parts such as box composition, usually matches with display instrument, recording apparatus and electronic controller.In industrial processes
In, temperature is to need one of measurement and the important parameter controlled.In temperature measurement, thermocouple using extremely wide, it has
There is many advantages, such as structure is simple, easily manufactured, measurement range is wide, precision is high, inertia is small and output signal is convenient for teletransmission.Separately
Outside, since thermocouple is a kind of active sensor, when measurement, is not required to additional power source, and use is very convenient, so being often used as surveying
Measure the temperature of stove, the gas in pipeline or liquid and the surface temperature of solid.
Current thermocouple complex forming technology can not effectively improve the performance of thermocouple.
Summary of the invention
The purpose of the present invention is to provide a kind of thermocouple forming methods, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the invention provides the following technical scheme: a kind of thermocouple forming method, including following step
It is rapid:
A, by the thermocouple integrated monolithic of aluminum oxide ceramic substrate；
B, in being encapsulated in the ultra-thin aluminum oxide ceramic piece of the identical triangular structure of two panels by high temperature seal, sealing materials
Between, form " sandwich " structure；
C, medium thick film compound is carried out on temperature-sensitive point surface manage insulation blocking；" sandwich " structure borne is assembled into protection pottery later
In porcelain tube；
D, it is finally assembled in metal shell with holes, forms film thermocouple product.
Preferably, the sandwich structure includes upper substrate, lower substrate and electrode base board, and the upper substrate and lower substrate are equal
Using ultra-thin aluminum oxide ceramic piece, the electrode base board is arranged between upper substrate and lower substrate.
Preferably, the electrode base board includes substrate body, and the substrate body center is engraved structure, the hollow out knot
First thermocouple probes are set above structure, the second thermocouple probes, the first thermocouple electricity are set below the engraved structure
Pole includes the first thermocouple cathode and the first thermocouple anode, and the first thermocouple cathode and the first thermocouple anode top connect
Meeting place is the first hot thermocouple node；Second thermocouple probes include that the second thermocouple cathode and the second thermocouple are positive,
The second thermocouple cathode and the second thermocouple anode top junction are the second hot thermocouple node；First thermocouple
Electrode and the second thermocouple probes have platinum rhodium material to be made.
Preferably, in the step C protect ceramic tube include tube body, the tube wall annular be evenly distributed with 4 it is convex
Item, the tube wall are equipped with wear-resistant protective layer, and the inboard wall of tube body is equipped with polishing figure layer；First passage is equipped in the tube body
And second channel, the tube body use alumina ceramic tube.
Compared with prior art, the beneficial effects of the present invention are: the forming method that the present invention uses utilizes triangular structure
Design, thermocouple temperature-sensitive point are arranged at vertex angle, it can be achieved that the small thermal capacity of temperature-sensitive point and small size, guarantee the fast of sensor
Response technology requirement.Meanwhile thermocouple triangular structure designs, and can realize environment resistant vibration and thermal current impact energy to greatest extent
Power realizes the robust design of sensor structure.
Detailed description of the invention
Fig. 1 is sandwich structure schematic diagram of the present invention；
Fig. 2 is sandwich structure electrode base board structural schematic diagram of the present invention；
Fig. 3 is ceramic tube cross-sectional view of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of technical solution referring to FIG. 1-2: a kind of thermocouple forming method, comprising the following steps:
A, by the thermocouple integrated monolithic of aluminum oxide ceramic substrate；
B, in being encapsulated in the ultra-thin aluminum oxide ceramic piece of the identical triangular structure of two panels by high temperature seal, sealing materials
Between, form " sandwich " structure；
C, medium thick film compound is carried out on temperature-sensitive point surface manage insulation blocking；" sandwich " structure borne is assembled into protection pottery later
In porcelain tube；
D, it is finally assembled in metal shell with holes, forms film thermocouple product.
In the present invention, sandwich structure includes upper substrate 1, lower substrate 2 and electrode base board 3, the upper substrate 1 and lower substrate
2 are all made of ultra-thin aluminum oxide ceramic piece, and the electrode base board 3 is arranged between upper substrate 1 and lower substrate 2；Electrode base board 3
Including substrate body 4,4 center of substrate body is engraved structure 5, and the first thermocouple electricity is arranged above the engraved structure 5
Pole 6, the second thermocouple probes 7 are arranged below the engraved structure 5, and first thermocouple probes 6 are negative including the first thermocouple
The positive 9 top junctions of pole 8 and the first thermocouple anode 9, the first thermocouple cathode 8 and the first thermocouple are the first thermoelectricity
Even hot junction 10；Second thermocouple probes 7 include the second thermocouple cathode 11 and the second thermocouple anode 12, described second
Thermocouple cathode 11 and the positive 12 top junctions of the second thermocouple are the second hot thermocouple node 13；The first thermocouple electricity
Pole 6 and the second thermocouple probes 7 have platinum rhodium material to be made.In the present invention, two pairs of heat are designed on the front and back sides of substrate body
Electrode forms redundancy structure, improves the precision of measurement, while also avoiding in measurement process since some electrode occurs
Failure and the case where be unable to complete measurement.And the engraved structure in substrate body, it is to reduce through substrate body from first
Thermocouple is transmitted to the heat on the second thermocouple, and two pairs of thermocouples is avoided to interact and cause the inaccuracy of measurement result.
As shown in figure 3, protecting ceramic tube in the present invention, in step C includes tube body 14, the outer wall circular of the tube body 14 is uniform
4 raised lines 15 are distributed with, 14 outer wall of tube body is equipped with wear-resistant protective layer 16, and 14 inner wall of tube body is equipped with polishing figure layer 17；
First passage and second channel are equipped in the tube body 14, the tube body 14 uses alumina ceramic tube.The present invention uses anti-
Protecting ceramic tube has excellent high temperature resistant and wear-resisting property, long service life.
In conclusion the forming method that the present invention uses is designed using triangular structure, thermocouple temperature-sensitive point is arranged in triangle
Shape vertex guarantees the fast-response technical requirements of sensor, it can be achieved that the small thermal capacity of temperature-sensitive point and small size.Meanwhile thermocouple
Triangular structure design can realize environment resistant vibration and thermal current impact capacity to greatest extent, realize the strong of sensor structure
Type design.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of thermocouple forming method, it is characterised in that: the following steps are included: A, by the thermoelectricity of aluminum oxide ceramic substrate
Even integrated monolithic；B, pass through high temperature seal, sealing materials for its envelope with the ultra-thin aluminum oxide ceramic piece of the identical triangular structure of two panels
Mounted in centre, " sandwich " structure is formed；C, medium thick film compound is carried out on temperature-sensitive point surface manage insulation blocking；Later by " three
Mingzhi " structure borne is assembled into protection ceramic tube；D, it is finally assembled in metal shell with holes, forms film thermocouple and produce
Product.
2. a kind of thermocouple forming method according to claim 1, it is characterised in that: the sandwich structure includes upper base
Plate (1), lower substrate (2) and electrode base board (3), the upper substrate (1) and lower substrate (2) are all made of ultra-thin aluminum oxide ceramic
Piece, the electrode base board (3) are arranged between upper substrate (1) and lower substrate (2).
3. a kind of thermocouple forming method according to claim 2, it is characterised in that: the electrode base board (3) includes base
Plate ontology (4), substrate body (4) center are engraved structure (5), and the first thermocouple is arranged above the engraved structure (5)
The second thermocouple probes (7) are arranged below the engraved structure (5) in electrode (6), and first thermocouple probes (6) include the
One thermocouple cathode (8) and the first thermocouple are positive (9), the first thermocouple cathode (8) and the first thermocouple positive (9) top
End junction is the first hot thermocouple node (10)；Second thermocouple probes (7) include the second thermocouple cathode (11) and
Positive (12) the top junction of second thermocouple anode (12), the second thermocouple cathode (11) and the second thermocouple is second
Hot thermocouple node (13)；First thermocouple probes (6) and the second thermocouple probes (7) have platinum rhodium material to be made.
4. a kind of thermocouple forming method according to claim 2, it is characterised in that: the electrode base board (3) includes base
Plate ontology (4), substrate body (4) center are engraved structure (5), and the first thermocouple is arranged above the engraved structure (5)
The second thermocouple probes (7) are arranged below the engraved structure (5) in electrode (6), and first thermocouple probes (6) include the
One thermocouple cathode (8) and the first thermocouple are positive (9), the first thermocouple cathode (8) and the first thermocouple positive (9) top
End junction is the first hot thermocouple node (10)；Second thermocouple probes (7) include the second thermocouple cathode (11) and
Positive (12) the top junction of second thermocouple anode (12), the second thermocouple cathode (11) and the second thermocouple is second
Hot thermocouple node (13)；First thermocouple probes (6) and the second thermocouple probes (7) have platinum rhodium material to be made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910182519.9A CN109827671A (en) | 2019-03-12 | 2019-03-12 | A kind of thermocouple forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910182519.9A CN109827671A (en) | 2019-03-12 | 2019-03-12 | A kind of thermocouple forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109827671A true CN109827671A (en) | 2019-05-31 |
Family
ID=66868970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910182519.9A Pending CN109827671A (en) | 2019-03-12 | 2019-03-12 | A kind of thermocouple forming method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109827671A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114777942A (en) * | 2022-04-12 | 2022-07-22 | 哈尔滨理工大学 | Forming method of triangular thin-film thermocouple |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158416A (en) * | 1995-10-30 | 1997-09-03 | 赫罗伊斯传感器有限公司 | Resistance thermometer |
| DE10238628A1 (en) * | 2002-08-19 | 2004-03-11 | Temperaturmeßtechnik Geraberg GmbH | Ceramic insulated high temperature sensor for engine management system combustion gas monitoring has ceramic insert around inner conductor |
| CN101311691A (en) * | 2007-05-21 | 2008-11-26 | 大洋电机工业株式会社 | Temperature tester based on film type temperature sensor and its manufacture method |
-
2019
- 2019-03-12 CN CN201910182519.9A patent/CN109827671A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1158416A (en) * | 1995-10-30 | 1997-09-03 | 赫罗伊斯传感器有限公司 | Resistance thermometer |
| DE10238628A1 (en) * | 2002-08-19 | 2004-03-11 | Temperaturmeßtechnik Geraberg GmbH | Ceramic insulated high temperature sensor for engine management system combustion gas monitoring has ceramic insert around inner conductor |
| CN101311691A (en) * | 2007-05-21 | 2008-11-26 | 大洋电机工业株式会社 | Temperature tester based on film type temperature sensor and its manufacture method |
Non-Patent Citations (1)
| Title |
|---|
| 梁小龙: "临氢反应器超长热电偶套管的结构及制造", 《石油化工设备技术》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114777942A (en) * | 2022-04-12 | 2022-07-22 | 哈尔滨理工大学 | Forming method of triangular thin-film thermocouple |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101819074B (en) | Diaphragm type heat-flow density sensor and manufacturing method thereof | |
| CN103712721B (en) | A kind of SOI piezoelectric strain gauge and preparation method thereof | |
| CN105675160B (en) | The W-Re film thermocouple sensor and preparation method of the group of film containing high temperature protection | |
| CN108562381B (en) | Thin film sensor for measuring heat flow in high-temperature environment and manufacturing method thereof | |
| CN107543618A (en) | Circle foil radiant heat flux measurement apparatus based on fexible film thermoelectric pile | |
| CN105043643A (en) | High-temperature pressure sensor and manufacturing method thereof | |
| CN109827671A (en) | A kind of thermocouple forming method | |
| CN113551810A (en) | Water-cooling dynamic heat flow sensor | |
| CN102507036A (en) | MMW (millimeter wave) power sensor and calorimeter provided with same | |
| CN203519207U (en) | Heat flux sensor | |
| CN209979088U (en) | Novel film thermocouple | |
| CN105021650A (en) | Device for measuring heat conduction coefficient by means of guarded hot plate method | |
| CN210441993U (en) | Temperature detector based on thermoelectric effect | |
| US10455643B2 (en) | Thick film element having covering layer with high heat conductivity | |
| CN110044511A (en) | High-stability length extension mode quartz temperature sensor adopting non-contact electrode | |
| CN101520351A (en) | Heat-variable surface shearing stress sensor | |
| CN202109997U (en) | Fuel cell internal transient temperature distribution sensor | |
| CN107101726B (en) | High-temperature-resistant radiation sensor based on T-shaped thermocouple stack and manufacturing method thereof | |
| CN206656812U (en) | A kind of sensor for measurement surface transient temperature | |
| CN100348953C (en) | Heat measuring type micro flow sensor | |
| CN111609951B (en) | Conformal preparation method of thick film heat flow meter and product | |
| CN207197705U (en) | Temperature-compensating graphene pressure sensor in a kind of piece | |
| US11419186B2 (en) | Thick film element having coated substrate with high heat conductivity | |
| CN113091956B (en) | Double-layer thermal resistance type thin film thermopile type heat flowmeter and preparation method | |
| CN209541901U (en) | Thermopile structure in novel high-power laser detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190531 |