CN112432719B - Thermopile heat flow sensor - Google Patents
Thermopile heat flow sensor Download PDFInfo
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- CN112432719B CN112432719B CN202011232954.7A CN202011232954A CN112432719B CN 112432719 B CN112432719 B CN 112432719B CN 202011232954 A CN202011232954 A CN 202011232954A CN 112432719 B CN112432719 B CN 112432719B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M9/00—Aerodynamic testing; Arrangements in or on wind tunnels
- G01M9/06—Measuring arrangements specially adapted for aerodynamic testing
- G01M9/065—Measuring arrangements specially adapted for aerodynamic testing dealing with flow
Abstract
The invention discloses a novel thermopile heat flow sensor, which comprises: the thermoelectric material I and the thermoelectric material II are stacked in a staggered mode, and an insulating layer is arranged outside each thermoelectric material I and each thermoelectric material II; two nodes I arranged on different sides are exposed on the thermoelectric material I, and two nodes II arranged on different sides are exposed on the thermoelectric material II; the node I and the node II are tightly connected to form a thermocouple node; lead nodes are respectively arranged on two sides of the thermopile heat flow sensor, and the lead nodes are connected with leads; the thermocouple node close to the heat flow is a front-end thermocouple node, the thermocouple node far away from the heat flow is a rear-end thermocouple node, and adjacent front-end and rear-end thermocouple nodes form a thermocouple pair; the lead junction leads out the thermoelectric potential difference generated by the thermocouple pair through the connecting lead. The thermopile heat flow sensor disclosed by the invention has high sensitivity coefficient and high-frequency response heat flow testing capability, and can meet the testing requirements of conventional hypersonic wind tunnel, flight test and shock wind tunnel test.
Description
Technical Field
The invention belongs to the technical field of development of heat flow sensors and heat flow testing, and particularly relates to a thermopile heat flow sensor.
Background
Currently, the heat flow sensors for implementing the heat flow test based on the temperature gradient mainly include Gardon meter, Schmidt-Boelter heat flow meter, thin film thermopile heat flow sensor, atomic layer thermopile heat flow sensor, and the like. Besides the atomic layer thermopile heat flow sensor, the temperature gradient directions of the other three heat flow sensors are parallel to the potential difference direction. The sensitive element of the Gardon meter is mainly a suspended metal sheet, so that the pressure resistance is weak, and a large heat sink body needs to be designed for maintaining a stable temperature difference, so that the miniaturization development of the Gardon meter is restricted. Meanwhile, the miniaturization of the sensitive element of the Gardon meter can greatly reduce the output sensitivity coefficient, so that the heat flow test range is reduced. The Schmidt-Boelter heat flow meter is similar to the thin film thermopile heat flow sensor in structural form, and the main difference lies in that the Schmidt-Boelter heat flow meter can be completed by utilizing the traditional processing and manufacturing means, the thin film thermopile heat flow sensor can be realized by utilizing the modern micro-electro-mechanical processing means such as physical vapor deposition, and the thin film thermopile heat flow sensor has complex processing technology. Correspondingly, compared with a thin film thermopile heat flow sensor, the Schmidt-Boleter heat flow sensor has the advantages that the heat measuring range is narrow and low, the response time is in the order of 30ms, and the unit price is low during batch production; the thin film thermopile heat flow sensor has wide heat measuring range and high unit price due to complex process. In a thin film thermopile heat flow sensor, a temperature sensitive element is a platinum-rhodium platinum microwire thermocouple realized by using a micro electro mechanical processing technology and used for testing the temperature difference of the upper surface and the lower surface of a thermal resistance layer with general heat conduction performance. Accordingly, due to limitations in processes and implementation manners of heat measurement of the sensor, the response time of the heat flow sensor is limited to more than 20 microseconds by the thermal resistance layer with a certain thickness and general heat conduction performance. The atomic layer thermopile heat flow sensor utilizes the transverse Seebeck effect of thermoelectric materials such as yttrium barium copper oxide and the like, an yttrium barium copper oxide film is a temperature-sensitive element and a thermal resistance layer, the response time of the atomic layer thermopile heat flow sensor is within 1 microsecond due to the thickness of the film in hundred nanometers, and the sensitivity coefficient of the output of the sensor is also large enough. However, since the yb-ba-cu oxide thin film is deposited on a single crystal substrate having a certain crystal orientation and poor heat resistance such as strontium titanate or lanthanum manganate, the atomic layer thermopile heat flow sensor has poor resistance to field erosion and temperature, and is not suitable for use in a high-temperature environment for a long time and many times. The novel thermopile heat flow sensor provided by the invention utilizes a conventional thermocouple material to realize a similar transverse Seebeck effect so as to obtain thermoelectric force output under a temperature gradient field, and the novel thermopile heat flow sensor can be used for heat flow test under a long-time or high-temperature environment due to the good heat conductivity of the thermocouple material, and can also be used as a thermal resistance layer, so that the high-frequency response heat flow test capability of the novel thermopile heat flow sensor can be realized through a miniaturization process, and the test requirements under different test environments such as a conventional hypersonic wind tunnel, a flight test, a shock wave wind tunnel test and the like are met.
Disclosure of Invention
An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages described hereinafter.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a thermopile heat flow sensor including:
the thermoelectric material I and the thermoelectric material II are connected between the two thermoelectric materials I, an insulating layer is arranged outside each thermoelectric material I and each thermoelectric material II, and one thermoelectric material I and one thermoelectric material II form a thermoelectric couple pair; the thermoelectric material I and the thermoelectric material II are of sheet structures;
two nodes I arranged on different sides are exposed on the thermoelectric material I, and two nodes II arranged on different sides are exposed on the thermoelectric material II; the node I and the node II are tightly connected to form a thermocouple node, and two adjacent thermocouple nodes are arranged on different sides;
lead nodes for connecting leads are respectively exposed on the thermoelectric material I or the thermoelectric material II on the two outermost sides of the thermopile heat flow sensor, and the lead nodes are connected with the leads;
the thermocouple node close to the heat flow is a front-end thermocouple node, and the thermocouple node far away from the heat flow is a rear-end thermocouple node; when heat flow is input from one side of the front-end thermocouple node, the heat flow direction flows from one side of the front-end thermocouple node to one side of the rear-end thermocouple node; the thermoelectric potential difference is generated by the thermocouple pairs formed by the adjacent front-end thermocouple node and the rear-end thermocouple node, and the thermoelectric potential difference generated by the single thermocouple pair can be multiplied by the plurality of thermocouple pairs formed by staggered stacking; the wire nodes on the two sides of the thermopile heat flow sensor lead out the multiplied heat potential difference through the connecting wires, thereby realizing the purpose of heat flow test.
Preferably, the thermoelectric material i is copper, and the thermoelectric material ii is constantan.
Preferably, the thermoelectric material i is nickel chromium, and the thermoelectric material ii is nickel silicon.
Preferably, the thermoelectric material i is platinum, and the thermoelectric material ii is rhodium platinum.
Preferably, when the total number of the thermoelectric materials i and ii is an even number, the wire is made of the same material as one of the thermoelectric materials i or ii, that is, when the total number of the thermoelectric materials i and ii is 2N, there are N front-end thermocouple nodes and N-1 rear-end thermocouple nodes in the thermopile heat flow sensor, where N is 2,3, N, in order to ensure that the front-end thermocouple nodes and the rear-end thermocouple nodes connected by the same material are the same in number, and therefore when the wire is made of the same material as one of the thermoelectric materials i or ii, there is necessarily and only one wire node as the rear-end thermocouple node; therefore, the thermocouple pairs can be formed between the front-end thermocouple node and the rear-end thermocouple node which are adjacent to each other, and therefore, the stable and multiplied thermal potential difference can be output under the condition of constant input heat flow.
Preferably, when the total number of the thermoelectric materials i and the thermoelectric materials ii is odd, the lead may be made of any conductive metal, that is, when the total number of the thermoelectric materials i and the thermoelectric materials ii is 2N-1, where N is 2,3, N-1 front-end thermocouple nodes and N-1 rear-end thermocouple nodes are provided in the thermopile heat flow sensor, each front-end thermocouple node has a corresponding rear-end thermocouple node, which ensures that a single thermocouple pair generates a thermal potential difference output, and therefore, the lead material connected to the lead node is not limited; meanwhile, the lead joints at two sides of the thermopile heat flow sensor are ensured to be at the same height along the heat flow direction.
Preferably, a high-temperature conductive adhesive is coated between the node I and the node II, and a conductive path is formed after the high-temperature conductive adhesive is cured.
Preferably, the first and second nodes are polished separately, and then the first and second nodes are vacuum diffusion welded to form a conductive path.
The invention at least comprises the following beneficial effects: the novel thermopile heat flow sensor disclosed by the invention is characterized in that two material sheets made of different materials are alternately stacked, and the two material sheets made of different materials are electrically conducted through a thermocouple node, so that a thermopile form is formed to amplify the output of a heat potential difference, and the purpose of increasing the output sensitivity coefficient of the thermopile heat flow sensor is achieved; meanwhile, the sheet thermocouple material is a thermal resistance layer, and can still obtain higher frequency response characteristic under the condition of larger size due to better heat conduction performance. The invention realizes the high-frequency response heat flow testing capability of the thermopile heat flow sensor through a miniaturization process, and can meet the testing requirements of different testing environments such as a conventional hypersonic wind tunnel, a flight test, a shock wind tunnel and the like.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Description of the drawings:
FIG. 1 is a schematic cross-sectional view of a thermopile heat flow sensor according to the present invention, wherein the number of thermocouples is even;
FIG. 2 is a schematic cross-sectional view of a thermopile heat flow sensor according to the present invention, wherein the total number of thermocouples is odd;
FIG. 3 is a schematic diagram of the right side view of FIG. 1;
fig. 4 is a schematic diagram of the left side structure in fig. 1.
The specific implementation mode is as follows:
the present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
It is to be understood that in the description of the present invention, the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are used only for convenience in describing the present invention and for simplification of the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, unless otherwise specifically stated or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are used broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or a communication between two elements, and those skilled in the art will understand the specific meaning of the terms in the present invention specifically.
Further, in the present invention, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacted with the first and second features, or indirectly contacted with the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1-4: the invention relates to a novel thermopile heat flow sensor, which comprises:
the thermoelectric material I1 and the thermoelectric material II 2 are stacked in a staggered mode, the thermoelectric material II 2 is connected between the two thermoelectric materials I1, an insulating layer 3 is arranged outside each thermoelectric material I1 and each thermoelectric material II 2, and one thermoelectric material I1 and one thermoelectric material II 2 form a thermoelectric couple pair; the thermoelectric material I1 and the thermoelectric material II 2 are of sheet structures;
two nodes I4 arranged on different sides are exposed on the thermoelectric material I1, and two nodes II 5 arranged on different sides are exposed on the thermoelectric material II 2; the node I4 and the node II 5 are tightly connected to form a thermocouple node 6, and two adjacent thermocouple nodes 6 are arranged on different sides;
the thermocouple node 6 close to the heat flow is a front-end thermocouple node, and the thermocouple node 6 far away from the heat flow is a rear-end thermocouple node; when heat flow is input from one side (upper surface) of the front-end thermocouple node, the heat flow direction flows from one side of the front-end thermocouple node to one side (lower surface) of the rear-end thermocouple node, a temperature gradient field is formed between the upper surface and the lower surface of the thermopile heat flow sensor, thermocouple pairs are formed between the front-end thermocouple node and the rear-end thermocouple node which are adjacent under the temperature gradient field to generate heat potential difference, the thermoelectric potential difference generated by the single thermocouple pair can be multiplied by a plurality of staggered and stacked thermocouple pairs, and the generated thermoelectric potential difference is led out by the lead wire nodes 7 on two sides of the thermopile heat flow sensor through connecting lead wires, so that the purpose of heat flow testing is realized.
The working principle is as follows: as shown in fig. 1, heat flow is input from the front thermocouple junction side (upper surface), and thus a temperature gradient field is formed between the lower surface and the upper surface of the rear thermocouple junction side. Under the temperature gradient field, thermocouple pairs formed by adjacent front-end thermocouple nodes and rear-end thermocouple nodes generate a thermoelectric potential difference, a plurality of thermocouple pairs formed by repeatedly and alternately stacking the sheet-shaped thermoelectric materials I1 and the sheet-shaped thermoelectric materials II 2 can multiply the thermoelectric potential difference generated by a single thermocouple pair, and lead nodes 7 on two sides of the thermopile heat flow sensor lead out the generated amplified thermoelectric potential difference through connecting leads, so that the purpose of heat flow test is realized. Meanwhile, the sheet-shaped thermoelectric material I and the sheet-shaped thermoelectric material II are thermal resistance layers, and can still obtain higher frequency response characteristics under the condition of larger size with better heat conduction performance, so that the obtained novel thermopile heat flow sensor can obtain preliminary estimation of sensor performance parameters such as sensitivity coefficient, response time and the like through theoretical calculation, and accurate values can be obtained through static and dynamic calibration modes.
In the above technical solution, as shown in fig. 1 and fig. 2, the thermoelectric material i 1 is copper, and the thermoelectric material ii 2 is constantan.
In the technical scheme, the thermoelectric material I1 is nickel chromium, and the thermoelectric material II 2 is nickel silicon.
In the above technical solution, the thermoelectric material i 1 is platinum, and the thermoelectric material ii 2 is rhodium platinum.
In the above technical solution, when the total number of the thermoelectric material i 1 and the thermoelectric material ii 2 is an even number, the lead is made of the same material as one of the thermoelectric material i 1 or the thermoelectric material ii 2, that is, when the total number of the thermoelectric material i and the thermoelectric material ii is 2N, there are N front-end thermocouple nodes and N-1 rear-end thermocouple nodes in the thermopile heat flow sensor, where N is 2,3, N, in order to ensure that the front-end thermocouple nodes and the rear-end thermocouple nodes connected by the same material are the same in number, and therefore when the lead is made of the same material as one of the thermoelectric material i 1 or the thermoelectric material ii 2, there is necessarily and only one lead node 7 that can be used as the rear-end thermocouple node; therefore, a thermocouple pair can be formed between the adjacent front thermocouple junction and the rear thermocouple junction, and therefore, a stable and multiplied thermal potential difference can be output under the condition of constant input heat flow. As shown in fig. 1, there are 5 thermoelectric materials i 1 and 5 thermoelectric materials ii 2, and thus there are 5 front thermocouple nodes and 4 rear thermocouple nodes, and in order to ensure that the number of front and rear thermocouple nodes is the same, when the lead material is one of the thermoelectric materials i 1 or ii 2, only one of the two lead nodes 7 of the thermopile thermal flow sensor will necessarily form a rear thermocouple node. Therefore, the thermocouple pairs can be formed between the front-end thermocouple node and the rear-end thermocouple node which are adjacent to each other, and therefore, the stable and multiplied thermal potential difference can be output under the condition of constant input heat flow.
In the above technical solution, when the total number of the thermoelectric materials i 1 and ii 2 is odd, the lead may be made of any conductive metal, that is, when the total number of the thermoelectric materials i and ii is 2N-1, where N is 2,3, N, there are N-1 front-end thermocouple nodes and N-1 rear-end thermocouple nodes in the thermopile heat flow sensor, and each front-end thermocouple node has a corresponding rear-end thermocouple node, which ensures that a single thermocouple pair generates a thermal potential difference output, so that the lead material connected to the lead node is not limited; meanwhile, the lead joints 7 on both sides of the thermopile heat flow sensor are ensured to be at the same height along the heat flow direction, because the thermoelectric force generated between the two lead joints 7 can be cancelled if the heights of the two lead joints 7 are the same. As shown in FIG. 2, there are 4 thermoelectric materials I1 and 5 thermoelectric materials II 2, and thus there are 4 front thermocouple nodes and 4 rear thermocouple nodes, and the lead wire node 7 in FIG. 2 is located at the middle position of the two sides of the thermopile heat flow sensor and at the same horizontal position.
In the technical scheme, high-temperature conductive adhesive is coated between the node I4 and the node II 5, and a conductive path is formed after the high-temperature conductive adhesive is cured.
In the technical scheme, the node I4 and the node II 5 are respectively polished, and then the node I and the node II form a conductive path through vacuum diffusion welding.
The number of apparatuses and the scale of the process described herein are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (6)
1. A thermopile heat flow sensor, comprising:
the thermoelectric material I and the thermoelectric material II are connected between the two thermoelectric materials I, an insulating layer is arranged outside each thermoelectric material I and each thermoelectric material II, and one thermoelectric material I and one thermoelectric material II form a thermoelectric couple pair; the thermoelectric material I and the thermoelectric material II are of sheet structures;
two nodes I arranged on different sides are exposed on the thermoelectric material I, and two nodes II arranged on different sides are exposed on the thermoelectric material II; the node I and the node II are tightly connected to form a thermocouple node, and two adjacent thermocouple nodes are arranged on different sides;
lead nodes for connecting leads are respectively exposed on the thermoelectric material I or the thermoelectric material II on the two outermost sides of the thermopile heat flow sensor, and the lead nodes are connected with the leads;
the thermocouple node close to the heat flow is a front-end thermocouple node, and the thermocouple node far away from the heat flow is a rear-end thermocouple node; when heat flow is input from one side of the front-end thermocouple node, the heat flow direction flows from one side of the front-end thermocouple node to one side of the rear-end thermocouple node; the thermoelectric potential difference is generated by the thermocouple pairs formed by the adjacent front-end thermocouple node and the rear-end thermocouple node, and the thermoelectric potential difference generated by the single thermocouple pair can be multiplied by the plurality of thermocouple pairs formed by staggered stacking; the wire nodes on the two sides of the thermopile heat flow sensor lead out the multiplied heat potential difference through the connecting wires, thereby realizing the purpose of heat flow test;
when the total number of the thermoelectric materials I and the thermoelectric materials II is even, the conducting wire is made of the same material as one of the thermoelectric materials I or the thermoelectric materials II, namely when the total number of the thermoelectric materials I and the thermoelectric materials II is 2NIn time, the thermopile heat flow sensor hasNA front end thermocouple node andN-1 back-end thermocouple junction, whereinN=2,3...,nIn order to ensure that the front-end thermocouple nodes and the rear-end thermocouple nodes which are connected by the same material are the same in number, when the lead material is the same as one of the thermoelectric material I or the thermoelectric material II, only one lead node is required to be used as the rear-end thermocouple node; therefore, the thermocouple pairs can be formed between every two adjacent front-end thermocouple nodes and rear-end thermocouple nodes, and stable and multiplied thermal potential difference can be output under the condition of constant input heat flow;
when the total number of the thermoelectric materials I and the thermoelectric materials II is odd, the conducting wire can be made of any conductive metal, namely when the total number of the thermoelectric materials I and the thermoelectric materials II is 2N1 when in whichN=2,3...,nAmong thermopile heat flow sensors areN-1 front end thermocouple junction andN1 rear thermocouple nodes, each front thermocouple node has a corresponding rear thermocouple node, which ensures that a single thermocouple pair generates a heat potential difference output, so that the material of a lead connected with the lead node is not limited; meanwhile, the lead joints at two sides of the thermopile heat flow sensor are ensured to be at the same height along the heat flow direction.
2. The thermopile heat flow sensor of claim 1, wherein the thermoelectric material i is copper and the thermoelectric material ii is constantan.
3. The thermopile heat flow sensor of claim 1, wherein said pyroelectric material i is nickel chromium and said pyroelectric material ii is nickel silicon.
4. The thermopile heat flow sensor of claim 1, wherein the pyroelectric material i is platinum and the pyroelectric material ii is rhodium platinum.
5. The thermopile heat flow sensor according to claim 1, wherein a high temperature conductive paste is applied between the junction I and the junction II, and the high temperature conductive paste forms a conductive path after curing.
6. The thermopile heat flow sensor of claim 1, wherein nodes i and ii are polished separately and then vacuum diffusion welded to form the conductive path.
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