CN212161860U - Novel atomic layer thermopile heat flow sensor taking bulk metal as sensitive element substrate - Google Patents
Novel atomic layer thermopile heat flow sensor taking bulk metal as sensitive element substrate Download PDFInfo
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- CN212161860U CN212161860U CN202021470910.3U CN202021470910U CN212161860U CN 212161860 U CN212161860 U CN 212161860U CN 202021470910 U CN202021470910 U CN 202021470910U CN 212161860 U CN212161860 U CN 212161860U
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Abstract
The utility model discloses an use novel atomic layer thermopile thermal current sensor of cubic metal as sensing element basement, include: the packaging sleeve is internally provided with a massive metal substrate; a transition film layer and a thermoelectric effect film are deposited above the massive metal substrate, and two ends of the thermoelectric effect film are respectively connected with the lead gold film; the silver wire is fixedly arranged in the wire groove, and the lead gold film is electrically communicated with the silver wire. The atomic layer thermopile heat flow sensor of the utility model utilizes the good heat conduction characteristic and the higher thermal capacity of metal, so that the sensor can conduct heat in time when being used for a long time, and the temperature of the sensor is ensured to be within a controlled range; by utilizing the good reworkable characteristic of metal, the electric conduction node of the lead gold film and the silver wire is arranged on the side surface of the massive metal substrate, the sensing surface of the sensor is smooth, and the influence of an invasive sensor on a local flow field is reduced; the sensor sensing elements are more compact overall, reducing the dimensional redundancy required for machining.
Description
Technical Field
The utility model belongs to the technical field of the thermal current sensor, more specifically say, the utility model relates to an use novel atomic layer thermopile thermal current sensor of cubic metal as sensing element basement.
Background
The transition of the boundary layer is one of a few basic scientific problems left by the classic mechanics, and is called a 'century problem' together with the turbulence problem. For hypersonic flight, after the hypersonic boundary layer is changed from laminar flow to turbulent flow, the wall surface heat flow and the friction force are both increased sharply. Therefore, theoretical and experimental research on transition of the hypersonic velocity boundary layer is an important means for recognizing the transition mechanism to further control transition. By combining the cognition of the current hypersonic speed boundary layer transition theory research, the evolution and development of the incoming flow disturbance are considered to be the core of the boundary layer transition mechanism. Accordingly, wind tunnel experiments and flight test research are also increasingly concerned with testing and analysis of high frequency pulsating heat flow, for example. The heat flow of the conventional hypersonic wind tunnel is not high, but the test time is long, and the temperature accumulation effect is obvious; the flight test is carried out in a real and complete pneumatic environment, the test time is long, the heat flow is high, and the requirement on the high-frequency pulsating heat flow test is very urgent. Currently, the high-frequency pulse heat flow test mainly relies on an atomic layer thermopile heat flow sensor. However, the sensing element of the atomic layer thermopile heat flow sensor mainly uses a strontium titanate sheet as a thermoelectric effect film carrier, and the strontium titanate sheet has poor heat conductivity and small heat capacity, so that the atomic layer thermopile heat flow sensor is not suitable for a long-time high-frequency pulsating heat flow test, even if the heat flow in a test environment is not high; the strontium titanate thin sheet is difficult to process and easy to damage, so that the sensor is directly electrically connected between a lead gold film and a silver wire on the surface of the sensor in a lead mode of transmitting an electric signal sensed by a thermoelectric effect thin film in a mode of brushing conductive silver paste, unevenness in a small area around a lead hole on the surface of the sensor is caused, and local flow field interference is caused. In addition, when the temperature of the sensor is controlled by adopting a water-cooling heat insulation sleeve and other modes, the size of the sensor is inevitably increased greatly, and the interference of a local flow field caused by the sensor is greatly increased for the invasive heat flow testing means. Therefore, the bulk metal is used as the sensitive element substrate, the good heat conduction characteristic of the bulk metal is utilized to conduct heat out in time, and the bulk metal has larger heat capacity, so that the thermoelectric effect film is always in a lower temperature range; meanwhile, the contact point of the lead gold film and the silver wire can be arranged on the side surface by utilizing the good processing characteristic of metal, and the integrity of the sensitive element is better. Therefore, the formed induction surface of the novel atomic layer thermopile heat flow sensor is flat, and the requirement of long-time high-frequency pulsating heat flow test in a conventional hypersonic wind tunnel and a flight test can be met.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages which will be described later.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a novel atomic layer thermopile heat flow sensor having a bulk metal as a sensing element substrate, comprising:
the packaging sleeve is internally fixedly sleeved with a massive metal substrate;
a transition film layer and a lead gold film are deposited above the massive metal substrate, a thermoelectric effect film is deposited above the transition film layer, and two ends of the thermoelectric effect film are respectively connected with the lead gold film;
and the lead groove is arranged on the side surface of the blocky metal substrate, a silver lead is fixedly arranged in the lead groove, and the lead gold film is transited to the side surface of the blocky metal substrate to be electrically communicated with the silver lead.
Preferably, a positioning threaded hole is formed in the side face of the massive metal substrate, a through hole matched with the positioning threaded hole is formed in the packaging sleeve, and the packaging sleeve and the massive metal substrate are positioned and fixed by arranging a jackscrew in the through hole and the positioning threaded hole.
Preferably, the upper end face of the bulk metal substrate is provided with a transition fillet.
Preferably, the wire groove is filled with high-temperature glue, and the silver wire is fixed in the wire groove through the high-temperature glue; the silver wire and the lead gold film are electrically conducted in a high-temperature silver paste brushing mode.
Preferably, the package sleeve may be one of a silicon nitride ceramic package sleeve, an alumina ceramic package sleeve or a silicon nitride ceramic package sleeve.
Preferably, the bulk metal substrate may be one of a nickel-based alloy steel substrate, a nickel metal substrate, a nickel-tungsten alloy substrate, a copper metal substrate, and a silver metal substrate.
Preferably, the thermoelectric effect film may be an yttrium barium copper oxide film or a lanthanum manganese copper oxide film.
The utility model discloses at least, include following beneficial effect: the utility model provides an use novel atomic layer thermopile heat flow sensor of cubic metal as sensing element basement can be used for carrying out long-time high frequency pulsation heat flow test under experimental environment such as conventional hypersonic wind tunnel, flight test from this, and its beneficial result is: the massive metal is used as the substrate of the sensitive element, and the good heat conduction characteristic and the higher heat capacity of the metal are utilized, so that the sensor can conduct heat out in time when being used for a long time, and the temperature of the sensor is ensured to be within a controlled range; the massive metal is used as a sensitive element substrate, and the good reworkable characteristic of the metal is utilized, so that the electric conduction node of the lead gold film and the silver wire is arranged on the side surface of the massive metal substrate, the sensing surface of the sensor is flat, and the influence of an invasive sensor on a local flow field is reduced; the sensor sensitive element is more compact on the whole, the size redundancy required by machining is reduced, and the sensor can be designed to be smaller in size.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Description of the drawings:
fig. 1 is a schematic top view of a novel atomic layer thermopile thermal flow sensor using bulk metal as a substrate of a sensing element according to the present invention;
fig. 2 is a schematic cross-sectional view taken along line a-a in fig. 1.
The specific implementation mode is as follows:
the present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1-2: the utility model discloses an use novel atomic layer thermopile heat flow sensor of massive metal as sensing element basement, include:
the packaging sleeve 1 is internally and fixedly sleeved with a massive metal substrate 6;
a transition film layer 7 and a lead gold film 5 are deposited on the bulk metal substrate 6, a thermoelectric effect film 8 is deposited on the transition film layer 7, and two ends of the thermoelectric effect film 8 are respectively connected with the lead gold film 5;
and the lead groove 3 is arranged on the side surface of the blocky metal substrate 6, the silver lead 2 is fixedly arranged in the lead groove 3, and the lead gold film 5 is transited to the side surface of the blocky metal substrate 6 to be electrically conducted with the silver lead 2.
The working principle is as follows: the atomic layer thermopile heat flow sensor is used for leading out electric signals directly related to high-frequency heat flow test from a shock wave wind tunnel and a conventional hypersonic speed wind tunnel; under the condition that the upper surface and the lower surface of the thermoelectric effect film 8 have temperature gradients, a thermoelectric potential which is transverse and vertical to the temperature gradient direction of the upper surface and the lower surface of the thermoelectric effect film 8 is generated due to the transverse Seebeck effect; the silver wire 2 is communicated with the lead wire gold film 5, and the high-frequency pulsating heat flow can be directly obtained by leading out a test signal from a shock wave wind tunnel and a conventional supersonic speed wind tunnel; the purpose of depositing the transition film layer 7 is to ensure the epitaxial growth of the pyroelectric effect film 8, the electrical insulation between the pyroelectric effect film 8 and the bulk metal substrate 6, and to prevent the diffusion of metal atoms of the bulk metal substrate 6 into the pyroelectric effect film 8. The thermopile heat flow sensor of the atomic layer uses the massive metal as the substrate of the sensitive element, and utilizes the good heat conduction characteristic and the higher heat capacity of the metal, so that the sensor can conduct heat out in time when being used for a long time, and the temperature of the sensor is ensured to be in a controlled range; the massive metal is used as a sensitive element substrate, and the good reworkable characteristic of the metal is utilized, so that the electric conduction node of the lead gold film and the silver wire is arranged on the side surface of the massive metal substrate, the sensing surface of the sensor is flat, and the influence of an invasive sensor on a local flow field is reduced; the sensor sensitive element is more compact on the whole, the size redundancy required by machining is reduced, and the sensor can be designed to be smaller in size. The sensitivity coefficient of the novel atomic layer thermopile heat flow sensor obtained by the method needs to be obtained through static calibration, and pulse type experimental equipment such as a shock tube can be used for carrying out dynamic calibration on parameters such as dynamic response time.
In the technical scheme, the lateral surface of the massive metal substrate 6 is provided with the positioning threaded hole 4, the encapsulation sleeve is provided with the through hole matched with the positioning threaded hole 4, and the encapsulation sleeve 1 and the massive metal substrate 6 are positioned and fixed by arranging the jackscrew in the through hole and the positioning threaded hole 4.
In the above technical solution, the transition fillet 9 is arranged on the upper end surface of the bulk metal substrate 6, and this arrangement is to ensure that the lead gold film 5 is well transited from the upper surface of the bulk metal substrate 6 to the side surface of the bulk metal substrate 6.
In the technical scheme, the wire groove 3 is filled with high-temperature glue, and the silver wire 2 is fixed in the wire groove 3 through the high-temperature glue; the silver wire 2 and the lead gold film 5 are electrically conducted in a high-temperature silver paste brushing mode.
In the above technical solution, the package sleeve 1 may be one of a silicon nitride ceramic package sleeve, an alumina ceramic package sleeve or a silicon nitride ceramic package sleeve.
In the above technical solution, the bulk metal substrate 6 may be one of a nickel-based alloy steel substrate, a nickel metal substrate, a nickel-tungsten alloy substrate, a copper metal substrate, and a silver metal substrate.
In the above technical solution, the thermoelectric effect film 8 may be an yttrium barium copper oxide film or a lanthanum manganese copper oxide film.
The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, or described, but rather to cover all modifications, which would come within the scope of the appended claims, and all changes which come within the meaning and range of equivalency of the art are therefore intended to be embraced therein.
Claims (7)
1. A novel atomic layer thermopile heat flow sensor taking bulk metal as a sensitive element substrate is characterized by comprising:
the packaging sleeve is internally fixedly sleeved with a massive metal substrate;
a transition film layer and a lead gold film are deposited above the massive metal substrate, a thermoelectric effect film is deposited above the transition film layer, and two ends of the thermoelectric effect film are respectively connected with the lead gold film;
and the lead groove is arranged on the side surface of the blocky metal substrate, a silver lead is fixedly arranged in the lead groove, and the lead gold film is transited to the side surface of the blocky metal substrate to be electrically communicated with the silver lead.
2. The novel atomic layer thermopile heat flow sensor using bulk metal as a sensitive element substrate according to claim 1, wherein a positioning threaded hole is formed in a side surface of the bulk metal substrate, a through hole matched with the positioning threaded hole is formed in the encapsulation sleeve, and positioning and fixing of the encapsulation sleeve and the bulk metal substrate are realized by arranging a jackscrew in the through hole and the positioning threaded hole.
3. The novel atomic layer thermopile heat flow sensor based on bulk metal as claimed in claim 1, wherein the bulk metal substrate has transition rounded corners on its top surface.
4. The novel atomic layer thermopile heat flow sensor taking bulk metal as a sensitive element substrate according to claim 1, wherein the wire groove is filled with high temperature glue, and the silver wire is fixed in the wire groove through the high temperature glue; the silver wire and the lead gold film are electrically conducted in a high-temperature silver paste brushing mode.
5. The novel atomic layer thermopile heat flow sensor based on bulk metal as a sensing element according to claim 1, wherein said package can be one of silicon nitride ceramic package, alumina ceramic package or silicon nitride ceramic package.
6. The novel atomic layer thermopile heat flow sensor based on bulk metal as a sensing element substrate of claim 1, wherein said bulk metal substrate is one of a nickel alloy steel substrate, a nickel metal substrate, a nickel tungsten alloy substrate, a copper metal substrate, and a silver metal substrate.
7. The novel atomic layer thermopile heat flow sensor based on bulk metal as claimed in claim 1, wherein said pyroelectric effect film can be yttrium barium copper oxide film or lanthanum manganese copper oxide film.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114526844A (en) * | 2022-02-22 | 2022-05-24 | 无锡物联网创新中心有限公司 | Thermal parameter self-testing method for thermopile sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114526844A (en) * | 2022-02-22 | 2022-05-24 | 无锡物联网创新中心有限公司 | Thermal parameter self-testing method for thermopile sensor |
| CN114526844B (en) * | 2022-02-22 | 2023-03-28 | 无锡物联网创新中心有限公司 | Thermal parameter self-testing method for thermopile sensor |
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