CN210628346U - Packaging structure of atomic layer thermopile heat flow sensor - Google Patents
Packaging structure of atomic layer thermopile heat flow sensor Download PDFInfo
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- CN210628346U CN210628346U CN201922230062.2U CN201922230062U CN210628346U CN 210628346 U CN210628346 U CN 210628346U CN 201922230062 U CN201922230062 U CN 201922230062U CN 210628346 U CN210628346 U CN 210628346U
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Abstract
The utility model discloses an atomic layer thermopile thermal current sensor's packaging structure and packaging technology, its packaging structure includes: a base; the packaging sleeve is tightly matched with the base; the sensitive element is fixed on the base, and the outer surface of the sensitive element is flush with the upper end surface of the packaging sleeve; the lead wire hole I is positioned in the base and is arranged at the upper end of the base; the structure of the sensitive element comprises: the strontium titanate wafer is provided with a lead hole II, and the lead hole II is positioned right above the lead hole I; a thermoelectric effect thin film deposited on the strontium titanate wafer; the conductive gold film is deposited on the strontium titanate wafer and is positioned at two ends of the thermoelectric effect film; a wire guide groove opened in the base; silver-colored wire, it is fixed in the metallic channel, and silver-colored wire passes pin hole I and pin hole II, the utility model provides a heat flux sensor packaging structure and packaging technology have avoided the tiny spot facing work degree of difficulty of big depth-diameter ratio, have realized the effective fixed of wire.
Description
Technical Field
The utility model belongs to the technical field of the thermal current sensor, more specifically say, the utility model relates to an atomic layer thermopile thermal current sensor's packaging structure.
Background
The transition of the boundary layer is one of a few basic scientific problems left by the classic mechanics, and is called a 'century problem' together with the turbulence problem. For hypersonic flight, after the hypersonic boundary layer is changed from laminar flow to turbulent flow, the wall surface heat flow and the friction force are both increased sharply. Therefore, theoretical and experimental research on transition of the hypersonic velocity boundary layer is an important means for recognizing the transition mechanism to further control transition. By combining the cognition of the current hypersonic speed boundary layer transition theory research, the evolution and the development of the incoming flow disturbance are considered as the core of the boundary layer transition mechanism. Accordingly, there is also increasing interest in wind tunnel experimental research, such as testing and analysis of high frequency pulsating heat flow. At present, the high-frequency pulsating heat flow at home and abroad is mainly tested by utilizing an atomic layer thermopile heat flow sensor, and the sensor is not available at home. On the basis of obtaining a Sensor sensitive element by referring to the heat measurement principle of a foreign atomic layer thermopile heat flow Sensor (Tim Roediger and the like of the University of Stuttgart, Germany published articles such as a Time-resolved heat transfer measures on the tip wall of a bipolar channel use not only Sensor-Part I, Sensor and benchmark), a Sensor packaging structure is designed, the processing difficulty of small holes with large depth-diameter ratio is avoided, and the effective fixation of a lead is realized. Therefore, the atomic layer thermopile heat flow sensor which can be used in shock tunnel and conventional hypersonic wind tunnel tests is formed.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages which will be described later.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a package structure of an atomic layer thermopile heat flow sensor, including:
a base;
the packaging sleeve is tightly matched with the base; the sensitive element is fixed on the base, and the outer surface of the sensitive element is flush with the upper end surface of the packaging sleeve; a lead hole I provided in the base;
the structure of the sensitive element comprises: the strontium titanate wafer is provided with a lead hole II, and the lead hole II is coincided with the central axis of the lead hole I; a thermoelectric effect thin film deposited on the strontium titanate wafer; the conductive gold film is deposited on the strontium titanate wafer, covers the surface of the strontium titanate wafer on the periphery of the lead hole II and is positioned at two ends of the thermoelectric effect film;
the wire guide groove is formed in the base, and the wire leading hole I is positioned between the sensitive element and the wire guide groove; and the silver wire is fixed in the wire groove, penetrates through the lead hole I and the lead hole II and is electrically communicated with the conductive gold film.
Preferably, the packaging sleeve is one of a polyetheretherketone packaging sleeve, an aluminum nitride ceramic packaging sleeve, a silicon nitride ceramic packaging sleeve and an alumina ceramic packaging sleeve; the base is an aluminum alloy base with an anodized surface.
Preferably, the thermoelectric effect film is one of an yttrium barium copper oxide film and a lanthanum manganese copper oxide film.
Preferably, the wire groove and the silver wire are respectively provided in two, glue is poured into the wire groove, and the silver wire is fixed in the base through the glue.
Preferably, a conductive adhesive is coated between the silver wire and the conductive gold film for realizing the electrical conduction between the silver wire and the conductive gold film.
Preferably, the end face of the silver wire is flush with the outer surface of the sensitive element.
Preferably, the strontium titanate wafer has a diameter of 6mm or less and a thickness of 0.5mm or less; the diameters of the lead hole I and the lead hole II are 0.2 mm.
The utility model discloses at least, include following beneficial effect: the utility model provides a packaging structure of atomic layer thermopile heat flow sensor, the tiny hole processing difficulty of big depth-diameter ratio has been avoided, has effectively realized fixing sensor sensing element, has reached test signal extraction and electrically insulated purpose; and the packaging structure of the packaging structure is simple, strong in operability and convenient to realize.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Description of the drawings:
fig. 1 is a schematic diagram of a package structure of an atomic layer thermopile heat flow sensor provided in the present invention;
fig. 2 is a schematic structural diagram of a sensing element of a package structure of an atomic layer thermopile heat flow sensor according to the present invention.
The specific implementation mode is as follows:
the present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1-2: the utility model discloses a packaging structure of atomic layer thermopile thermal current sensor, include:
a base 3;
the packaging sleeve 2 is tightly matched with the base 3; the sensitive element 1 is fixed on the base 3, and the outer surface of the sensitive element is flush with the upper end face of the packaging sleeve 2; a lead hole i 6 provided in the base 3;
the structure of the sensitive element comprises: the strontium titanate wafer 7 is provided with a lead hole II 10, and the lead hole II 10 is superposed with the central axis of the lead hole I6; a thermoelectric effect thin film 9 deposited on the strontium titanate wafer 7; conductive gold films 8 which are deposited on the strontium titanate wafer 7, cover the surface of the strontium titanate wafer around the lead hole II 10 and are positioned at two ends of the thermoelectric effect film 9;
the lead slot 5 is formed in the base 3, and the lead hole I6 is positioned between the sensitive element 1 and the lead slot 5; and the silver wire 4 is fixed in the wire groove 5, passes through the lead holes I and II and is electrically communicated with the conductive gold film 8.
The working principle is as follows: the packaging structure of the atomic layer thermopile heat flow sensor is used for leading out electric signals directly related to high-frequency heat flow test from a shock wave wind tunnel and a conventional hypersonic speed wind tunnel; the silver wire 4 is communicated with the conductive gold film 8 of the sensitive element 1, and a test signal obtained by sensing of the sensitive element 1 is led out from a shock wave wind tunnel and a conventional supersonic wind tunnel, so that high-frequency pulsating heat flow can be directly obtained; the base 3 provides a fixing mechanism for the sensitive element, and plays a role in fixing, supporting and protecting the sensitive element 1; the packaging sleeve further forms protection for the sensitive element, and achieves the purpose of electric insulation with the experimental model in the using process of the sensor. Under the condition that temperature gradients exist on the upper surface and the lower surface of the thermoelectric effect film 9, a thermoelectric potential which is transverse and vertical to the temperature gradient direction of the upper surface and the lower surface of the thermoelectric effect film 9 is generated due to the transverse Seebeck effect; the obtained atomic layer thermopile heat flow sensor needs to be subjected to static calibration to obtain the sensitivity coefficient of the atomic layer thermopile heat flow sensor, and dynamic response time parameters of the atomic layer thermopile heat flow sensor can be calibrated by using pulse type experimental equipment such as a shock tube.
In the above technical scheme, the package cover 2 is one of a polyetheretherketone package cover, an aluminum nitride ceramic package cover, a silicon nitride ceramic package cover, and an alumina ceramic package cover; the base is an aluminum alloy base with an anodized surface.
In the above technical solution, the thermoelectric effect film 9 is one of an yttrium barium copper oxide film and a lanthanum manganese copper oxide film.
In the above technical solution, the wire groove 5 and the silver wire 4 are respectively provided with two, glue is poured into the wire groove 5, and the silver wire 4 is fixed in the base 3 through the glue.
In the above technical solution, a conductive adhesive is coated between the silver wire 4 and the conductive gold film 8 for realizing the electrical conduction between the silver wire 4 and the conductive gold film 8.
In the technical scheme, the end face of the silver wire 4 is flush with the outer surface of the sensitive element 1.
In the technical scheme, the diameter of the strontium titanate wafer 7 is less than or equal to 6mm, and the thickness of the strontium titanate wafer is less than or equal to 0.5 mm; the diameters of the lead hole I and the lead hole II are 0.2 mm.
The packaging process of the original atomic layer thermopile heat flow sensor packaging structure is as follows: firstly, carrying out anode surface treatment on the aluminum alloy base 3; two lead holes II 10 with the diameter of 0.2mm are formed in the central symmetrical position of the strontium titanate wafer 7, and an yttrium barium copper oxide thin film 9 and a conductive gold film 8 are deposited on the strontium titanate wafer 7 by a physical vapor deposition method, so that a sensitive element 1 of the atomic layer thermopile heat flow sensor is formed; fixing the sensitive element 1 on the aluminum alloy base 3 in a glue bonding mode, and ensuring that the lead hole II 10 is superposed and aligned with the lead hole I6 in the aluminum alloy base 3; the silver wire 4 penetrates through the lead hole I10 and the lead hole II 6, glue is poured into the wire groove 5, the silver wire 4 is fixed in the aluminum alloy base 3, the silver wire 4 is guaranteed to be completely sunk into the wire groove 5, and meanwhile the end face of the silver wire 4 is flush with the outer surface of the sensitive element 1; coating conductive silver adhesive between the silver wire 4 and the conductive gold film 8 for realizing the electric conduction between the silver wire 4 and the conductive gold film 8; sleeving a polyether-ether-ketone packaging sleeve 2 on an aluminum alloy base 3, ensuring that the polyether-ether-ketone packaging sleeve 2 is tightly matched with the aluminum alloy base 3, and enabling the upper end face of the polyether-ether-ketone packaging sleeve 2 to be flush with the outer surface of the sensitive element 1; the polyether-ether-ketone packaging sleeve 2 is used for further protecting the sensitive element 1 and electrically insulating the sensitive element from a test model in the use process of the atomic layer thermopile heat flow sensor; therefore, the packaging structure of the atomic layer thermopile heat flow sensor is packaged and finished.
The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, or described, but rather to cover all modifications, which would come within the scope of the appended claims, and all changes which come within the meaning and range of equivalency of the art are therefore intended to be embraced therein.
Claims (7)
1. A packaging structure of an atomic layer thermopile heat flow sensor, comprising:
a base;
the packaging sleeve is tightly matched with the base; the sensitive element is fixed on the base, and the outer surface of the sensitive element is flush with the upper end surface of the packaging sleeve; a lead hole I provided in the base;
the structure of the sensitive element comprises: the strontium titanate wafer is provided with a lead hole II, and the lead hole II is coincided with the central axis of the lead hole I; a thermoelectric effect thin film deposited on the strontium titanate wafer; the conductive gold film is deposited on the strontium titanate wafer, covers the surface of the strontium titanate wafer on the periphery of the lead hole II and is positioned at two ends of the thermoelectric effect film;
the wire guide groove is formed in the base, and the wire leading hole I is positioned between the sensitive element and the wire guide groove; and the silver wire is fixed in the wire groove, penetrates through the lead hole I and the lead hole II and is electrically communicated with the conductive gold film.
2. The package structure of atomic layer thermopile heat flow sensor of claim 1, wherein said package sleeve is one of a polyetheretherketone package sleeve, an aluminum nitride ceramic package sleeve, a silicon nitride ceramic package sleeve, an alumina ceramic package sleeve; the base is an aluminum alloy base with an anodized surface.
3. The package structure of atomic layer thermopile heat flow sensor of claim 1, wherein said thermoelectric effect film is one of a yttrium barium copper oxide film, a lanthanum manganese copper oxide film.
4. The atomic layer thermopile heat flow sensor package structure of claim 1, wherein the lead slot and the silver lead are respectively provided in two, and the lead slot is filled with glue, and the silver lead is fixed in the base by the glue.
5. The package structure of atomic layer thermopile heat flow sensor according to claim 1, wherein a conductive adhesive is coated between the silver wire and the conductive gold film for realizing electrical conduction between the silver wire and the conductive gold film.
6. The package structure of atomic layer thermopile heat flow sensor according to claim 1, wherein the silver wire end face is flush with the sensing element outer surface.
7. The package structure of atomic layer thermopile heat flow sensor according to claim 1, wherein the strontium titanate wafer has a diameter of 6mm or less and a thickness of 0.5mm or less; the diameters of the lead hole I and the lead hole II are 0.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922230062.2U CN210628346U (en) | 2019-12-13 | 2019-12-13 | Packaging structure of atomic layer thermopile heat flow sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922230062.2U CN210628346U (en) | 2019-12-13 | 2019-12-13 | Packaging structure of atomic layer thermopile heat flow sensor |
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| CN210628346U true CN210628346U (en) | 2020-05-26 |
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| CN201922230062.2U Active CN210628346U (en) | 2019-12-13 | 2019-12-13 | Packaging structure of atomic layer thermopile heat flow sensor |
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