CN115507967A - Atomic layer thermopile heat flow sensor with improved lead mode - Google Patents

Atomic layer thermopile heat flow sensor with improved lead mode Download PDF

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CN115507967A
CN115507967A CN202211253807.7A CN202211253807A CN115507967A CN 115507967 A CN115507967 A CN 115507967A CN 202211253807 A CN202211253807 A CN 202211253807A CN 115507967 A CN115507967 A CN 115507967A
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heat flow
atomic layer
flow sensor
mode
strontium titanate
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杨凯
朱涛
陶伯万
朱新新
王辉
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University of Electronic Science and Technology of China
Ultra High Speed Aerodynamics Institute China Aerodynamics Research and Development Center
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University of Electronic Science and Technology of China
Ultra High Speed Aerodynamics Institute China Aerodynamics Research and Development Center
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Abstract

The invention discloses an atomic layer thermopile heat flow sensor with an improved lead mode, which relates to the technical field of heat flow sensors and comprises the following components: the base, its inside is provided with two wires along the axis direction, and the terminal surface is provided with the sensing element who meets with the wire before the base, and the sensing element includes: beveling the strontium titanate wafer; the sensitive film is deposited on the induction surface of the chamfered strontium titanate wafer, two ends of the sensitive film are respectively connected with a half I-shaped conductive film, the lower end of the half I-shaped conductive film is connected with a milk nail, the upper end of the lead is connected with the milk nail, and the lower end of the lead extends out of the base. According to the invention, the induction surface of the atomic layer thermopile heat flow sensor is smoother by changing the conductive structure, the influence of the roughness of the induction surface on a local flow field in the test use is weakened, and the deposition of a protective film layer on the induction surface of the sensor at the later stage is facilitated. Meanwhile, the invention improves the sensitivity coefficient of the atomic layer thermopile heat flow sensor, and is convenient for developing and using a sensor with smaller size in the later period.

Description

Atomic layer thermopile heat flow sensor with improved lead mode
Technical Field
The invention belongs to the technical field of heat flow sensors, and particularly relates to an atomic layer thermopile heat flow sensor with an improved lead mode.
Background
The high-frequency pulsating heat flow test is one of the test contents which are focused in the transition test research of the hypersonic speed boundary layer. Meanwhile, the transition test research of the hypersonic velocity boundary layer is very fine, and the hypersonic velocity boundary layer transition test method has high requirements on surface roughness, surface depression or protrusion and the like of a test model. Currently, the testing of high frequency pulsating heat flow relies primarily on atomic layer thermopile heat flow sensors. However, in the current phase, the lead wire of the atomic layer thermopile heat flow sensor is used for punching and threading, and the conductive film and the electrical lead are connected by using conductive silver paste, for example, a novel atomic layer thermopile heat flow sensor disclosed in application No. CN202020839104.2 and an encapsulation structure of the atomic layer thermopile heat flow sensor disclosed in application No. CN201922230062.2 are used for punching and threading, and the conductive film and the electrical lead are connected by using conductive silver paste, but the curing form and thickness of the conductive silver paste cannot be strictly controlled, so that the roughness of the sensing surface of the atomic layer thermopile heat flow sensor is relatively large and the controllable degree is low. In addition, the lead hole punching and threading mode needs to ensure that the lead hole on the beveled strontium titanate wafer is not cracked in the machining process and enough space allowance needs to be reserved on one hand; on the other hand, in order to ensure reliable conductive connection, the requirement of high-frequency electrical signal transmission on large surface area of a conductor and the convenience of sensor packaging operation, a thick wire with the diameter of 0.435mm is selected, and two wire holes which are symmetrically arranged also occupy a certain space. Therefore, the lead structure occupies a space with a diameter of 6mm on the sensing surface of the sensor of at least 2mm, the expansion of the effective length of a single sensitive film of the sensor is limited, the sensitivity coefficient of the atomic layer thermopile heat flow sensor depends on the effective length of the sensitive film, although the effective length of the sensitive film can be increased by adopting a mode of connecting a plurality of sensitive films in series at present. However, the dynamic performance of the multi-film atomic layer thermopile thermal flow sensor is significantly reduced. The sensor with high sensitivity coefficient can sense the measured quantity more finely, so that the small-sized sensor with smooth sensing surface and high sensitivity coefficient can be better applied to the experimental research of transition of the hypersonic velocity boundary layer.
Disclosure of Invention
An object of the present invention is to solve the above problems and/or disadvantages and to provide advantages which will be described later.
In order to achieve the objects and advantages, the invention provides an atomic layer thermopile heat flow sensor with an improved lead mode, which comprises a base, two leads are arranged in the base along the axial direction, a sensing element connected with the leads is arranged on the front end surface of the base, and the structure of the sensing element comprises:
beveling the strontium titanate wafer;
and the sensitive film is deposited on the sensing surface of the obliquely-cut strontium titanate wafer, two ends of the sensitive film are respectively connected with a semi-I-shaped conductive film, the semi-I-shaped conductive film extends downwards along the outer edge of the obliquely-cut strontium titanate wafer and is connected with the milk nail, the upper end of the conductive wire is connected with the milk nail, and the lower end of the conductive wire extends out of the base.
Preferably, the base is an anodized aluminum alloy base.
Preferably, wherein the sensitive film is an yttrium barium copper oxide film.
Preferably, the semi-i-shaped conductive film is a semi-i-shaped conductive gold film.
Preferably, the base is externally packaged with a housing, and the housing is a polyetheretherketone housing.
Preferably, a wire groove is formed in the base, and the wire is fixed in the wire groove by glue.
Preferably, a diamond protective film or an aluminum oxide protective film is deposited on the sensing surface of the chamfered strontium titanate wafer, the semi-I-shaped conductive film and the surface of the sensitive film.
A method for preparing an atomic layer thermopile heat flow sensor with an improved lead mode comprises the following steps:
firstly, processing a chamfered square strontium titanate wafer into a round shape by mechanical processing, and marking the round shape in a specified direction so as to provide a usable reference position for the oriented growth of a subsequent yttrium barium copper oxide film; on the basis, double-sided and side grinding and polishing are carried out on the strontium titanate wafer, and single-sided finish polishing treatment is carried out on the sensing surface of the strontium titanate wafer in an ion beam polishing mode;
fixing the chamfered strontium titanate wafer, generating a half I-shaped conductive film with the width not more than 1mm and the thickness not more than 10 microns at the designated position of the chamfered strontium titanate wafer by utilizing a direct writing spray printing technology at one time, and generating two emulsion nails at the tail end, wherein the length of the half I-shaped conductive film is not more than 0.5mm on the induction surface of the chamfered strontium titanate wafer, and the length of the half I-shaped conductive film is not more than 1mm on the back surface of the chamfered strontium titanate wafer;
thirdly, growing an yttrium barium copper oxide film in an oriented manner at the appointed position of the induction surface of the obliquely-cut strontium titanate wafer by utilizing a metal vapor chemical deposition or laser pulse deposition mode, adjusting and controlling the oxygen content in the molecular formula of the yttrium barium copper oxide to be between 6.5 and 7 by annealing in a pure oxygen normal pressure environment on the basis of controlling the material proportion, the deposition environment air pressure, the atmosphere and the temperature parameters in the early stage, and ensuring that the contact between the yttrium barium copper oxide film and the two semi-I-shaped conductive films is good; if necessary, depositing a diamond protective film or an aluminum oxide protective film on the induction surface of the obliquely-cut strontium titanate wafer after the deposition of the semi-I-shaped conductive film and the yttrium barium copper oxide film is finished;
fixing the sensitive element on the aluminum alloy base in an adhesive mode on the basis that the milk nail is aligned to the wire guide hole in the base, enabling the wire to penetrate through the wire guide hole, and turning the tail end of the wire into a small section for enlarging the contact surface between the wire and the milk nail in a welding mode; filling and sealing part of the wire groove by using glue, welding the wires with the emulsion nail after the glue is cured, filling and sealing the rest part of the wire groove by using the glue after the two wires to be detected are electrically conducted, and ensuring the fixation and the reliable electrical connection of the wires; sealing the aluminum alloy base by using the shell, and filling glue into the cavity at the lower end of the shell until the glue is solidified so as to finish the packaging of the sensor;
step five, obtaining output corresponding to the atomic layer thermopile heat flow sensor in the improved lead wire mode by utilizing a plurality of different power step lasers generated by the heat flow sensor calibration equipment based on the lasers, and performing linear fitting on the output of the atomic layer thermopile heat flow sensor in the improved lead wire mode and the input heat flow determined by the water-cooled Gardon meter by using an input heat flow determined by the water-cooled Gardon meter exposed under the same laser power and adopting a forced zero crossing point linear fitting method shown in the following formula so as to obtain the sensitivity coefficient and the linearity of the atomic layer thermopile heat flow sensor in the improved lead wire mode;
Figure BDA0003889090210000031
wherein k is A Is the sensitivity coefficient, k, of the atomic layer thermopile heat flow sensor with improved lead mode G Is the known nominal sensitivity coefficient of a water-cooled Gardon meter, and eta is the yttrium barium copper oxide film to the monochromatic laserAbsorption rate of (2), V A Is the voltage output, V, of an atomic layer thermopile heat flow sensor in an improved lead wire manner G The voltage output of the water-cooling Gardon meter under the same calibration condition is shown, the superscript i represents the static calibration experiment sequence, and the n represents different heat flow state numbers in the static calibration experiment; the dynamic output of the atomic layer thermopile heat flow sensor in the improved lead mode is obtained under the excitation of a series of sine waveform lasers with different frequencies, and an amplitude-frequency characteristic curve of the sensor is obtained on the basis of normalization of output peak values of the sensor, so that the dynamic calibration of the atomic layer thermopile heat flow sensor in the improved lead mode is completed.
The invention at least comprises the following beneficial effects: according to the atomic layer thermopile heat flow sensor with the improved lead mode, the original mode of punching the lead is changed into the conductive connection relation between the semi-I-shaped conductive film and the milk nail, the sensing surface of the atomic layer thermopile heat flow sensor is relatively smooth and clean through the change of the conductive structure, the influence of the roughness of the sensing surface of the atomic layer thermopile heat flow sensor on a local flow field in test use is weakened, and meanwhile, a protective film layer is conveniently deposited on the sensing surface of the atomic layer thermopile heat flow sensor in the later period.
Meanwhile, due to the change of the conductive structure, the occupied space of a new conductive structure is reduced, the effective length of a single sensitive film is prolonged, and further the atomic layer thermopile heat flow sensor with a larger sensitivity coefficient is obtained.
The change of the conductive structure is convenient for the development of the high-temperature-resistant atomic layer thermopile heat flow sensor in the later period.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
FIG. 1 is a schematic view showing a connection structure of a chamfered strontium titanate wafer, a sensitive film, a semi-I-shaped conductive film and a milk nail;
fig. 2 is a schematic diagram of a cross-sectional structure of an atomic layer thermopile thermal flow sensor with an improved lead wire scheme according to the present invention.
Detailed Description
The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more elements or groups thereof.
Examples
As shown in fig. 1 and fig. 2, the present embodiment provides an atomic layer thermopile heat flow sensor with an improved lead method, including an anodized aluminum alloy base 7, two wires 5 are disposed in a wire groove 8 inside the base along an axial direction, and the wires 5 are fixed in the wire groove 8 by glue; the outside encapsulation of aluminum alloy base 7 has polyetheretherketone shell 6, the preceding terminal surface of aluminum alloy base 7 is provided with the sensing element who meets with wire 5, its characterized in that, the structure of sensing element includes:
beveling the strontium titanate wafer 1;
the lead wire comprises an yttrium barium copper oxide film 2 deposited on the induction surface of the obliquely-cut strontium titanate wafer 1, wherein two ends of the yttrium barium copper oxide film 2 are respectively connected with a half I-shaped conductive gold film 3, the half I-shaped conductive gold film 3 extends downwards along the outer edge of the obliquely-cut strontium titanate wafer 1 and is connected with a milk nail 4, the upper end of the lead wire 5 is connected with the milk nail 4, the lower end of the lead wire extends out of an aluminum alloy base 7, and a diamond protective film or an aluminum oxide protective film is deposited on the induction surface of the obliquely-cut strontium titanate wafer 1, the half I-shaped conductive gold film 3 and the surface of the yttrium barium copper oxide film 2.
The working principle is as follows: the atomic layer thermopile heat flow sensor is used for leading out electric signals directly related to high-frequency heat flow tests from shock tunnel and conventional hypersonic wind tunnel tests; under the condition that temperature gradients exist on the upper surface and the lower surface of the yttrium barium copper oxide film 2, generating a thermoelectric potential which is transverse and vertical to the temperature gradient direction of the upper surface and the lower surface of the yttrium barium copper oxide film 2 due to the transverse Seebeck effect; the lead 5 is conducted with the yttrium barium copper oxide film through the semi-I-shaped conductive film 3 and the milk nail 4, and a test signal obtained by sensing of a sensitive element is led out from a shock tunnel and a conventional supersonic velocity tunnel test, so that high-frequency pulsating heat flow can be directly obtained; the alloy base 7 provides a fixing mechanism for the strontium titanate wafer 1, the yttrium barium copper oxide film 2, the semi-I-shaped conductive film 3 and the emulsion nail 4 in the sensitive element, and plays a role in fixing, supporting and protecting the circular sensitive element; the polyether-ether-ketone shell 6 has the main functions of protecting the insulating layer on the surface of the aluminum alloy base 7 and the lead 5 fixed in the lead groove 8 in the use process of the atomic layer thermopile heat flow sensor, and ensuring good electric insulation between the atomic layer thermopile heat flow sensor and the outside. The diamond protective film or the alumina protective film is used for protecting the semi-I-shaped conductive film 3 and the yttrium barium copper oxide film 2 from being directly exposed to strong flushing air flow and other impurities to form a protective layer for the whole sensitive element. The invention improves the connection mode of the lead and the sensitive film which are originally connected by punching, threading and conductive silver adhesive into the connection mode of the lead and the sensitive film through the semi-I-shaped conductive film and the nipple and the yttrium barium copper oxide film, so that the induction surface of the atomic layer thermopile heat flow sensor is relatively smooth, the influence of the roughness of the induction surface of the atomic layer thermopile heat flow sensor on a local flow field in test use is weakened, and meanwhile, a protective film layer is conveniently deposited on the induction surface of the atomic layer thermopile heat flow sensor at the later stage. Meanwhile, the occupied space of the new conductive structure is reduced, the effective length of a single sensitive film is prolonged, the atomic layer thermopile heat flow sensor with a larger sensitivity coefficient is obtained, and the small-size heat flow sensor is developed conveniently.
A preparation method of an atomic layer thermopile heat flow sensor with an improved lead mode comprises the following steps:
processing a chamfered square strontium titanate wafer into a round shape through mechanical processing, and marking the round shape in a specified direction so as to provide a usable reference position for subsequent yttrium barium copper oxide film oriented growth; on the basis, double-sided and side grinding and polishing are carried out on the strontium titanate wafer, and single-sided finish polishing treatment is carried out on the induction surface of the strontium titanate wafer in an ion beam polishing mode;
fixing the chamfered strontium titanate wafer, generating a half I-shaped conductive film with the width not more than 1mm and the thickness not more than 10 microns at the designated position of the chamfered strontium titanate wafer by utilizing a direct writing spray printing technology at one time, and generating two emulsion nails at the tail end, wherein the length of the half I-shaped conductive film is not more than 0.5mm on the induction surface of the chamfered strontium titanate wafer, and the length of the half I-shaped conductive film is not more than 1mm on the back surface of the chamfered strontium titanate wafer;
thirdly, growing an yttrium barium copper oxide film in an oriented manner at the appointed position of the induction surface of the obliquely-cut strontium titanate wafer by utilizing a metal vapor chemical deposition or laser pulse deposition mode, adjusting and controlling the oxygen content in the molecular formula of the yttrium barium copper oxide to be between 6.5 and 7 by annealing in a pure oxygen normal pressure environment on the basis of controlling the material proportion, the deposition environment air pressure, the atmosphere and the temperature parameters in the early stage, and ensuring that the contact between the yttrium barium copper oxide film and the two semi-I-shaped conductive films is good; if necessary, depositing a diamond protective film or an aluminum oxide protective film on the induction surface of the obliquely-cut strontium titanate wafer after the deposition of the semi-I-shaped conductive film and the yttrium barium copper oxide film is finished;
fixing the sensitive element on the aluminum alloy base in an adhesive mode on the basis that the milk nail is aligned to the wire guide hole in the base, enabling the wire to penetrate through the wire guide hole, and turning the tail end of the wire into a small section for enlarging the contact surface between the wire and the milk nail in a welding mode; filling and sealing part of the wire groove by using glue, welding the wires with the emulsion nail after the glue is cured, filling and sealing the rest part of the wire groove by using the glue after the two wires to be detected are electrically conducted, and ensuring the fixation and the reliable electrical connection of the wires; sealing the aluminum alloy base by using the shell, and filling glue into the cavity at the lower end of the shell until the glue is solidified so as to finish the packaging of the sensor;
step five, obtaining output corresponding to the atomic layer thermopile heat flow sensor in the improved lead wire mode by utilizing a plurality of different power step lasers generated by the heat flow sensor calibration equipment based on the lasers, and performing linear fitting on the output of the atomic layer thermopile heat flow sensor in the improved lead wire mode and the input heat flow determined by the water-cooled Gardon meter by using an input heat flow determined by the water-cooled Gardon meter exposed under the same laser power and adopting a forced zero crossing point linear fitting method shown in the following formula so as to obtain the sensitivity coefficient and the linearity of the atomic layer thermopile heat flow sensor in the improved lead wire mode;
Figure BDA0003889090210000071
wherein k is A Is the sensitivity coefficient, k, of the atomic layer thermopile heat flow sensor with improved lead mode G Is the known nominal sensitivity coefficient of a water-cooled Gardon meter, eta is the absorption rate of the yttrium barium copper oxide film to monochromatic laser, V A Is the voltage output, V, of an atomic layer thermopile heat flow sensor in an improved lead wire manner G The voltage output of the water-cooling Gardon meter under the same calibration condition is shown, the superscript i represents the static calibration experiment sequence, and the n represents different heat flow state numbers in the static calibration experiment; the dynamic output of the atomic layer thermopile heat flow sensor in the improved lead mode is obtained under the excitation of a series of sine waveform lasers with different frequencies, and an amplitude-frequency characteristic curve of the sensor is obtained on the basis of normalization of output peak values of the sensor, so that the dynamic calibration of the atomic layer thermopile heat flow sensor in the improved lead mode is completed.
The number of apparatuses and the scale of the process described herein are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While embodiments of the invention have been described above, it is not intended to be limited to the details shown, described and illustrated herein, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed, and to such extent that such modifications are readily available to those skilled in the art, and it is not intended to be limited to the details shown and described herein without departing from the general concept as defined by the appended claims and their equivalents.

Claims (8)

1. The utility model provides an improve atomic layer thermopile heat flow sensor of lead wire mode, includes the base, and its inside axis direction that is provided with two wires that follows is inside, the preceding terminal surface of base is provided with the sensing element who meets with the wire, its characterized in that, sensing element's structure includes:
beveling the strontium titanate wafer;
and the sensitive film is deposited on the induction surface of the chamfered strontium titanate wafer, two ends of the sensitive film are respectively connected with a half I-shaped conductive film, the half I-shaped conductive film extends downwards along the outer edge of the chamfered strontium titanate wafer and is connected with the milk nail, the upper end of the lead is connected with the milk nail, and the lower end of the lead extends out of the base.
2. The improved lead mode atomic layer thermopile heat flow sensor of claim 1, wherein the base is an anodized aluminum alloy base.
3. The improved wire-mode atomic layer thermopile heat flow sensor of claim 1, wherein said sensitive film is a yttrium barium copper oxide film.
4. The atomic layer thermopile heat flow sensor of claim 1, wherein said semi-i-shaped conductive film is a semi-i-shaped conductive gold film.
5. The atomic layer thermopile thermal flow sensor of claim 1, wherein a housing is encapsulated outside said base, said housing being a polyetheretherketone housing.
6. The atomic layer thermopile heat flow sensor with improved lead wire mode of claim 1, wherein the base has a wire groove formed therein, and the wire is fixed in the wire groove by glue.
7. The improved wire-bond atomic layer thermopile heat flow sensor of claim 1, wherein the sensing surface of the chamfered strontium titanate wafer, the semi-i-shaped conductive film and the sensitive film have diamond protective film or alumina protective film deposited on their surfaces.
8. A method of manufacturing an improved lead-mode atomic layer thermopile thermal flow sensor according to any of claims 1-7 comprising the steps of:
processing a chamfered square strontium titanate wafer into a round shape through mechanical processing, and marking the round shape in a specified direction so as to provide a usable reference position for subsequent yttrium barium copper oxide film oriented growth; on the basis, double-sided and side grinding and polishing are carried out on the strontium titanate wafer, and single-sided finish polishing treatment is carried out on the sensing surface of the strontium titanate wafer in an ion beam polishing mode;
fixing the chamfered strontium titanate wafer, generating a half I-shaped conductive film with the width not more than 1mm and the thickness not more than 10 microns at the designated position of the chamfered strontium titanate wafer by utilizing a direct writing spray printing technology at one time, and generating two emulsion nails at the tail end, wherein the length of the half I-shaped conductive film is not more than 0.5mm on the induction surface of the chamfered strontium titanate wafer, and the length of the half I-shaped conductive film is not more than 1mm on the back surface of the chamfered strontium titanate wafer;
thirdly, growing an yttrium barium copper oxide film in an oriented mode at the appointed position of the induction surface of the chamfered strontium titanate wafer by utilizing a metal vapor chemical deposition or laser pulse deposition mode, adjusting and controlling the oxygen content of the yttrium barium copper oxide molecular formula to be between 6.5 and 7 by annealing in a pure oxygen normal pressure environment on the basis of controlling the material proportion, the deposition environment air pressure, the atmosphere and the temperature parameters in the early stage, and ensuring good contact between the yttrium barium copper oxide film and the two semi-I-shaped conductive films; if necessary, depositing a diamond protective film or an aluminum oxide protective film on the induction surface of the obliquely-cut strontium titanate wafer after the deposition of the semi-I-shaped conductive film and the yttrium barium copper oxide film is finished;
fixing the sensitive element on the aluminum alloy base in an adhesive mode on the basis that the milk nail is aligned to the wire guide hole in the base, enabling the wire to penetrate through the wire guide hole, and turning the tail end of the wire into a small section for enlarging the contact surface between the wire and the milk nail in a welding mode; filling and sealing part of the wire groove by using glue, welding the wires with the emulsion nail after the glue is cured, filling and sealing the rest part of the wire groove by using the glue after the two wires to be detected are electrically conducted, and ensuring the fixation and the reliable electrical connection of the wires; sealing the aluminum alloy base by using the shell, and filling glue into the cavity at the lower end of the shell until the glue is solidified so as to finish the packaging of the sensor;
step five, obtaining output corresponding to the atomic layer thermopile heat flow sensor in the improved lead wire mode by utilizing a plurality of different power step lasers generated by the heat flow sensor calibration equipment based on the lasers, and performing linear fitting on the output of the atomic layer thermopile heat flow sensor in the improved lead wire mode and the input heat flow determined by the water-cooled Gardon meter by using an input heat flow determined by the water-cooled Gardon meter exposed under the same laser power and adopting a forced zero crossing point linear fitting method shown in the following formula so as to obtain the sensitivity coefficient and the linearity of the atomic layer thermopile heat flow sensor in the improved lead wire mode;
Figure FDA0003889090200000021
wherein k is A Is the sensitivity coefficient, k, of the atomic layer thermopile heat flow sensor in the improved lead wire mode G Is the known nominal sensitivity coefficient of a water-cooled Gardon meter, eta is the absorption rate of the yttrium barium copper oxide film to the monochromatic laser, V A Is the voltage output, V, of an atomic layer thermopile heat flow sensor in an improved lead wire manner G The voltage output of the water-cooling Gardon meter under the same calibration condition is shown, the superscript i represents the static calibration experiment sequence, and the n represents different heat flow state numbers in the static calibration experiment; the dynamic output of the atomic layer thermopile heat flow sensor in the improved lead mode is obtained under the excitation of a series of sine waveform lasers with different frequencies, and an amplitude-frequency characteristic curve of the sensor is obtained on the basis of normalization of output peak values of the sensor, so that the dynamic calibration of the atomic layer thermopile heat flow sensor in the improved lead mode is completed.
CN202211253807.7A 2022-10-13 2022-10-13 Atomic layer thermopile heat flow sensor with improved lead mode Pending CN115507967A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116698199A (en) * 2023-08-07 2023-09-05 中国空气动力研究与发展中心超高速空气动力研究所 Radial heat flow sensor based on atomic layer thermopile and installation test method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116698199A (en) * 2023-08-07 2023-09-05 中国空气动力研究与发展中心超高速空气动力研究所 Radial heat flow sensor based on atomic layer thermopile and installation test method thereof
CN116698199B (en) * 2023-08-07 2023-10-03 中国空气动力研究与发展中心超高速空气动力研究所 Radial heat flow sensor based on atomic layer thermopile and installation test method thereof

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