CN212161859U - Novel atomic layer thermopile heat flow sensor taking metal thin strip as substrate - Google Patents
Novel atomic layer thermopile heat flow sensor taking metal thin strip as substrate Download PDFInfo
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- CN212161859U CN212161859U CN202021470895.2U CN202021470895U CN212161859U CN 212161859 U CN212161859 U CN 212161859U CN 202021470895 U CN202021470895 U CN 202021470895U CN 212161859 U CN212161859 U CN 212161859U
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Abstract
The invention discloses a novel atomic layer thermopile heat flow sensor taking a metal thin strip as a substrate, which comprises: the packaging sleeve is internally fixedly sleeved with a metal matrix, a sensitive element taking a metal thin strip as a film substrate is fixedly arranged on the surface of the metal matrix, wire grooves are formed in two sides of the metal matrix, and silver wires are fixedly arranged in the wire grooves; the structure of the sensitive element comprises: a metal thin strip on which a transition film layer is deposited; a thermoelectric effect film deposited over the transition film layer; conductive films deposited at both ends of the thermoelectric effect thin film; transition inclined planes are arranged on two sides of the metal matrix. The invention utilizes the good heat conduction characteristic and the higher heat capacity of metal, so that the sensor can conduct heat out in time when being used for a long time, and the temperature of the sensor is ensured to be in a controlled range; by utilizing the good flexibility of the metal thin strip, the electric conduction nodes of the conductive film and the silver wires are arranged on the side surface of the metal substrate, so that the influence of an invasive sensor on a local flow field is reduced.
Description
Technical Field
The utility model belongs to the technical field of the thermal current sensor, more specifically say, the utility model relates to an use thin novel atomic layer thermopile thermal current sensor who takes as the basement of metal.
Background
The transition of the boundary layer is one of a few basic scientific problems left by the classic mechanics, and is called a 'century problem' together with the turbulence problem. For hypersonic flight, after the hypersonic boundary layer is changed from laminar flow to turbulent flow, the wall surface heat flow and the friction force are both increased sharply. Therefore, theoretical and experimental research on transition of the hypersonic velocity boundary layer is an important means for recognizing the transition mechanism to further control transition. By combining the cognition of the current hypersonic speed boundary layer transition theory research, the evolution and development of the incoming flow disturbance are considered to be the core of the boundary layer transition mechanism. Accordingly, there is also increasing interest in wind tunnel experimental research, such as testing and analysis of high frequency pulsating heat flow. The heat flow of the conventional hypersonic wind tunnel is not high, but the test time is long, and the temperature accumulation effect is obvious; the flight test is carried out in a real and complete pneumatic environment, the test time is long, the heat flow is high, and the requirement on the high-frequency pulsating heat flow test is very urgent. Currently, the high-frequency pulse heat flow test mainly relies on an atomic layer thermopile heat flow sensor. However, the sensing element of the atomic layer thermopile heat flow sensor mainly uses a strontium titanate sheet as a thermoelectric effect film carrier, and the strontium titanate sheet has poor heat conductivity and small heat capacity, so that the atomic layer thermopile heat flow sensor is not suitable for a long-time high-frequency pulsating heat flow test, even if the heat flow in a test environment is not high; the strontium titanate thin sheet is difficult to process and easy to damage, so that the sensor is directly electrically conducted between a conductive film and a silver wire on the surface of the sensor in a lead mode of transmitting an electric signal sensed by a thermoelectric effect thin film in a mode of brushing conductive silver paste, unevenness in a small area around a lead hole on the surface of the sensor is caused, and local flow field interference is caused. In addition, when the temperature of the sensor is controlled by adopting a water-cooling heat insulation sleeve and other modes, the size of the sensor is inevitably increased greatly, and the interference of a local flow field caused by the sensor is greatly increased for the invasive heat flow testing means. Therefore, the novel metal-based atomic layer thermopile heat flow sensor utilizes the good heat conduction characteristic of metal to conduct heat out in time and the larger heat capacity of the metal matrix, so that the sensitive element is always in a lower temperature range; meanwhile, the contact point of the conductive film and the silver wire can be arranged on the side surface by utilizing the better flexibility of the metal thin strip, and the sensing surface of the sensor is free from surface unevenness caused by coating conductive adhesive. Therefore, the formed induction surface of the novel atomic layer thermopile heat flow sensor is flat, and the requirement of long-time high-frequency pulsating heat flow test in a conventional hypersonic wind tunnel and a flight test can be met.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages which will be described later.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a novel atomic layer thermopile heat flow sensor based on a thin metal strip, comprising:
the packaging sleeve is internally fixedly sleeved with a metal matrix, a sensitive element taking a metal thin strip as a film substrate is fixedly arranged on the surface of the metal matrix, wire grooves are formed in two sides of the metal matrix, and silver wires are fixedly arranged in the wire grooves;
the structure of the sensitive element comprises:
a metal thin strip on which a transition film layer is deposited; a thermoelectric effect thin film deposited over the transition film layer; conductive films deposited at both ends of the thermoelectric effect thin film;
the two sides of the metal substrate are provided with transition inclined planes, the sensitive element deposition conductive film part extends into the wire groove along the transition inclined planes, and the conductive film of the sensitive element is electrically conducted with the silver wire.
Preferably, the metal thin strip is fixed on the surface of the metal base body by high-temperature conductive adhesive.
Preferably, a positioning threaded hole is formed in the side face of the metal base body, a through hole matched with the positioning threaded hole is formed in the packaging sleeve, and the packaging sleeve and the metal base body are positioned and fixed by arranging a jackscrew in the through hole and the positioning threaded hole.
Preferably, the upper end face of the metal base body is provided with a transition fillet.
Preferably, the wire groove is filled with high-temperature glue, and the silver wire is fixed in the wire groove through the high-temperature glue; the silver wire and the conductive film are electrically conducted in a high-temperature silver paste brushing mode.
Preferably, the package sleeve may be one of a silicon nitride ceramic package sleeve, an alumina ceramic package sleeve or a silicon nitride ceramic package sleeve.
Preferably, the thermoelectric effect film may be an yttrium barium copper oxide film or a lanthanum manganese copper oxide film.
The utility model discloses at least, include following beneficial effect: the utility model provides a novel atomic layer thermopile heat flow sensor of metal base can be used for carrying out long-time high frequency pulsation heat flow test under experimental environment such as conventional hypersonic wind tunnel, flight test from this, and its beneficial result is: the metal-based atomic layer thermopile heat flow sensor utilizes the good heat conduction characteristic and the higher heat capacity of metal, so that the sensor can conduct heat out in time when being used for a long time, and the temperature of the sensor is ensured to be within a controlled range; the metal thin strip is used as a substrate of the thermoelectric effect thin film and the conductive film, and the conductive film and the silver wire are arranged on the side surface of the metal matrix by utilizing the good flexibility of the metal thin strip, so that the sensing surface of the sensor is flat, and the influence of an invasive sensor on a local flow field is reduced.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Description of the drawings:
fig. 1 is a schematic structural diagram of a novel atomic layer thermopile thermal flow sensor based on a thin metal strip according to the present invention;
fig. 2 is a schematic structural diagram of the sensing element provided by the present invention;
fig. 3 is a cross-sectional view taken at a-a in fig. 1.
The specific implementation mode is as follows:
the present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
As shown in fig. 1-3: the utility model discloses a use novel atomic layer thermopile heat flow sensor of thin bed of metal as basement, include:
the packaging sleeve 1 is fixedly sleeved with a metal matrix 3, a sensitive element 6 taking a metal thin strip 11 as a film substrate is fixedly arranged on the surface of the metal matrix 3, wire grooves 5 are arranged on two sides of the metal matrix 1, and silver wires 2 are fixedly arranged in the wire grooves 5;
the structure of the sensitive element 6 comprises:
a transition film layer 8 is deposited on the metal thin strip; a thermoelectric effect film 9 deposited over the transition film layer 8; conductive films 10 deposited on both ends of the thermoelectric effect film 9;
transition inclined planes 12 are arranged on two sides of the metal substrate 3, the part of the conductive film 10 deposited on the sensitive element 6 extends into the lead groove 5 along the transition inclined planes 12, and the conductive film 10 of the sensitive element 6 is electrically conducted with the silver lead 2.
The working principle is as follows: the atomic layer thermopile heat flow sensor is used for leading out electric signals directly related to high-frequency heat flow test from a shock wave wind tunnel and a conventional hypersonic speed wind tunnel; under the condition that temperature gradients exist on the upper surface and the lower surface of the thermoelectric effect film 9, a thermoelectric potential which is transverse and vertical to the temperature gradient direction of the upper surface and the lower surface of the thermoelectric effect film 9 is generated due to the transverse Seebeck effect; the silver wire 2 is communicated with the conductive film 10, and the high-frequency pulsating heat flow can be directly obtained by leading out a test signal from a shock wave wind tunnel and a conventional supersonic wind tunnel; the purpose of depositing the transition film layer 8 is to ensure the oriented growth of the thermoelectric effect thin film 9, the electrical insulation between the thermoelectric effect thin film 9 and the metal thin strip 11, and to prevent the metal atoms of the bulk metal thin strip 11 from diffusing into the thermoelectric effect thin film 9. The provision of the transition slope 12 ensures that the silver wire does not protrude from the side of the metal substrate and is in good electrical communication with the conductive film 10. Because the metal thin strip 11 is used as the substrate of the sensitive element 6, the thermopile heat flow sensor of the atomic layer utilizes the good heat conduction characteristic and the higher heat capacity of metal, so that the sensor can conduct heat out in time when being used for a long time, and the temperature of the sensor is ensured to be in a controlled range; the metal thin strip 11 is used as a substrate of the thermoelectric effect film 9 and the conductive film 10, and the good flexibility of the metal thin strip 11 is utilized, so that the conductive nodes of the conductive film 10 and the silver wires 2 are arranged on the side surface of the metal matrix 3, the sensing surface of the sensor is flat, and the influence of an invasive sensor on a local flow field is reduced. The sensitivity coefficient of the novel atomic layer thermopile heat flow sensor obtained by the method needs to be obtained through static calibration, and pulse type experimental equipment such as a shock tube can be used for carrying out dynamic calibration on parameters such as dynamic response time.
In the above technical solution, the metal thin strip 11 is adhered and fixed on the surface of the metal matrix 3 by the high temperature conductive adhesive, and the high temperature conductive adhesive can form good heat conduction and fixation between the metal matrix 3 and the sensitive element 6.
In the technical scheme, the side face of the metal base body 3 is provided with the positioning threaded hole 4, the packaging sleeve is provided with the through hole matched with the positioning threaded hole, and the packaging sleeve 1 and the metal base body 3 are positioned and fixed by arranging the jackscrew in the through hole and the positioning threaded hole 4.
In the above technical solution, the upper end surface of the metal substrate 3 is provided with the transition fillet 7, and the transition fillet 7 is arranged to ensure that the conductive film of the sensitive element 6 can be better transited from the upper surface of the metal substrate 3 to the side surface of the metal substrate 3.
In the technical scheme, high-temperature glue is poured into the lead groove 5, and the silver lead 2 is fixed in the lead groove 5 through the high-temperature glue; the silver wire 2 and the conductive film 10 are electrically conducted by brushing high-temperature silver paste.
In the above technical solution, the package sleeve 1 may be one of a silicon nitride ceramic package sleeve, an alumina ceramic package sleeve or a silicon nitride ceramic package sleeve.
In the above technical solution, the thermoelectric effect film 9 may be an yttrium barium copper oxide film or a lanthanum manganese copper oxide film.
The number of apparatuses and the scale of the process described here are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be apparent to those skilled in the art.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, or described, but rather to cover all modifications, which would come within the scope of the appended claims, and all changes which come within the meaning and range of equivalency of the art are therefore intended to be embraced therein.
Claims (7)
1. A novel atomic layer thermopile heat flow sensor taking a metal thin strip as a substrate is characterized by comprising:
the packaging sleeve is internally fixedly sleeved with a metal matrix, a sensitive element taking a metal thin strip as a film substrate is fixedly arranged on the surface of the metal matrix, wire grooves are formed in two sides of the metal matrix, and silver wires are fixedly arranged in the wire grooves;
the structure of the sensitive element comprises:
a metal thin strip on which a transition film layer is deposited; a thermoelectric effect thin film deposited over the transition film layer; conductive films deposited at both ends of the thermoelectric effect thin film;
the two sides of the metal substrate are provided with transition inclined planes, the sensitive element deposition conductive film part extends into the wire groove along the transition inclined planes, and the conductive film of the sensitive element is electrically conducted with the silver wire.
2. The novel atomic layer thermopile heat flow sensor based on thin metal strip as claimed in claim 1, wherein said thin metal strip is affixed to the surface of the metal substrate by high temperature conductive adhesive.
3. The novel atomic layer thermopile heat flow sensor based on thin metal strip as claimed in claim 1, wherein the metal substrate has a positioning threaded hole on its side, and the package cover has a through hole matching with the positioning threaded hole, and the package cover and the metal substrate are positioned and fixed by disposing a jackscrew in the through hole and the positioning threaded hole.
4. The novel atomic layer thermopile heat flow sensor based on thin metal strip of claim 1, wherein the upper surface of the metal substrate is provided with transition fillets.
5. The novel atomic layer thermopile heat flow sensor based on thin metal strip as claimed in claim 1, wherein the wire groove is filled with high temperature glue, and the silver wire is fixed in the wire groove by the high temperature glue; the silver wire and the conductive film are electrically conducted in a high-temperature silver paste brushing mode.
6. The novel atomic layer thermopile heat flow sensor based on thin metal strip of claim 1, wherein said package can be one of a silicon nitride ceramic package, an alumina ceramic package, or a silicon nitride ceramic package.
7. The novel atomic layer thermopile heat flow sensor based on thin metal strip of claim 1, wherein said pyroelectric effect film can be a yttrium barium copper oxide film or a lanthanum manganese copper oxide film.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021470895.2U CN212161859U (en) | 2020-07-23 | 2020-07-23 | Novel atomic layer thermopile heat flow sensor taking metal thin strip as substrate |
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| CN202021470895.2U CN212161859U (en) | 2020-07-23 | 2020-07-23 | Novel atomic layer thermopile heat flow sensor taking metal thin strip as substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639768A (en) * | 2022-03-22 | 2022-06-17 | 电子科技大学 | Atomic layer thermopile heat flow sensor and batch preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639768A (en) * | 2022-03-22 | 2022-06-17 | 电子科技大学 | Atomic layer thermopile heat flow sensor and batch preparation method thereof |
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