CN114112087A - Array type atomic layer thermopile heat flow sensor - Google Patents
Array type atomic layer thermopile heat flow sensor Download PDFInfo
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- CN114112087A CN114112087A CN202111340423.4A CN202111340423A CN114112087A CN 114112087 A CN114112087 A CN 114112087A CN 202111340423 A CN202111340423 A CN 202111340423A CN 114112087 A CN114112087 A CN 114112087A
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- BTGZYWWSOPEHMM-UHFFFAOYSA-N [O].[Cu].[Y].[Ba] Chemical group [O].[Cu].[Y].[Ba] BTGZYWWSOPEHMM-UHFFFAOYSA-N 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 17
- 238000012360 testing method Methods 0.000 abstract description 7
- 230000004044 response Effects 0.000 abstract description 6
- 230000001360 synchronised effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/028—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples using microstructures, e.g. made of silicon
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention relates to the field of aerospace aerodynamic ground test, and discloses an array type atomic layer thermopile heat flow sensor, which comprises a sensor base, a signal leading-out end, a sensitive layer substrate and a sensitive layer, wherein the signal leading-out end is arranged on the sensor base; a plurality of grooves are arrayed on the sensor base, and sensitive layer substrates are bonded in the grooves; a sensitive layer is deposited on the sensitive layer substrate; two ends of the sensitive layer are respectively connected with a signal leading-out end; the sensitive layer is connected with external measuring equipment through a signal leading-out terminal. The invention effectively solves the problems of complex mounting structure and low resolution ratio of a single-point sensor array arrangement mode in the prior art, can realize multi-point synchronous measurement, and has high spatial resolution ratio and high heat flow frequency response.
Description
Technical Field
The invention belongs to the field of aerospace aerodynamic ground testing, and particularly relates to an array type atomic layer thermopile heat flow sensor.
Background
In the fields of aviation, aerospace, energy, construction and other national economy, heat flow measurement plays an important role, is a key measurement technology, and is a subject worthy of research. Particularly in the field of aerospace, the acquisition of the heat flow parameters on the surface of the aircraft can provide important reference data for the research of the flow mechanism on the surface of the aircraft and the design optimization of the aircraft. In the hypersonic aerodynamic heat problem, the sizes of surface heat flow and friction are closely related to the flow state of a boundary layer, and the theory and experimental research of the hypersonic boundary layer are important means for understanding the transition mechanism. By developing the research of the array type high-frequency response heat flow measuring method, the key information of the propagation and evolution of high-frequency disturbance waves in the hypersonic boundary layer and the mutual interference between the high-frequency disturbance waves and the evolution can be obtained.
Before 2010, sensors applied in the field of heat flow measurement at home and abroad mainly comprise a thin film thermal resistor, a thermocouple, a coaxial thermocouple and the like, and the heat flow rate is calculated by utilizing the change of temperature or temperature difference of a measuring point along with time according to a semi-infinite assumed base material heat transfer model. The greatest disadvantages of these sensors are the following two aspects:
firstly, from the noise source of data, the heat flow rate calculated through the time gradient of the temperature cannot avoid the interference of a temperature measurement noise signal, so that the signal-to-noise ratio of a heat flow measurement result is difficult to improve;
from the view of the measurement time of the sensor, whether the film sensor or the coaxial thermocouple, the substrate/material thickness limits the heat flow measurement time, so that the application flexibility of the sensor is limited to a great extent.
By utilizing the thermoelectric anisotropy characteristic in the high-temperature superconducting material film, a mathematical model of the YBCO heat flow sensor is established by utilizing Seebeck tensor for the first time in the year of Lengfellner equal to 1991, and the advantages that the Atomic Layer Thermopile (ALTP) technology can directly measure the heat flow rate and the like are proved. In 2007, Rodiger, university of Stegat, developed static and dynamic calibration methods for atomic layer thermopiles in doctor's paper, evaluated uncertainty of heat flow measurement, and simultaneously proved advantages of the sensor in frequency response range and measurement uncertainty through low-speed, supersonic and high-supersonic speed tests.
Compared with the traditional method for indirectly measuring heat flow through temperature measurement, the atomic layer thermopile technology can directly convert the heat flow rate through the potential difference between two ends of the sensor by using a sensitivity coefficient, thereby avoiding the heat flow rate measurement deviation caused by temperature signal noise and a calculation process, and having higher frequency response characteristic.
At present, heat flow sensors developed based on atomic layer thermopile technology at home and abroad are single-point sensors, and in the field of aerospace aerodynamic ground testing, heat flow rate data in a certain area on the surface of a model are required to be acquired. The mode of arranging a plurality of single-point sensors in an array in the measurement area not only has a complex installation structure, but also has lower resolution.
Disclosure of Invention
The invention provides an array type atomic layer thermopile heat flow sensor, aiming at solving the problems that the installation structure adopting a single-point sensor array arrangement mode in the prior art is complex and the resolution ratio is low.
The invention adopts the specific scheme that: an array atomic layer thermopile heat flow sensor comprises a sensor base, a signal leading-out end, a sensitive layer substrate and a sensitive layer; a plurality of grooves are arrayed on the sensor base, and sensitive layer substrates are bonded in the grooves; a sensitive layer is deposited on the sensitive layer substrate; two ends of the sensitive layer are respectively connected with a signal leading-out end; the sensitive layer is connected with external measuring equipment through a signal leading-out terminal.
The sensor base is made of an alumina ceramic material.
The sensor base is connected with the measured component through a threaded fastener, and the end face of one side of the sensitive layer on the sensor is flush with the edge of the surface of the measured component.
The signal leading-out end consists of conductive paste solidified at two ends of the sensitive layer and a metal lead.
The metal lead wires penetrate through the small holes in the grooves arrayed on the sensor base, are bonded with the sensor base through adhesive, and are in reliable conductive connection with the sensitive layer through conductive paste.
A through hole is formed in the sensitive layer substrate; the through holes in the sensitive layer substrate are respectively coaxially aligned with the through holes in the grooves, so that the metal lead can continuously pass through the through holes in the sensor base and the through holes in the sensitive layer substrate.
The sensitive layer substrate is a strontium titanate material.
The sensitive layer is made of yttrium barium copper oxide, is deposited between two through holes on the outer end face of the sensitive layer substrate through a vacuum magnetron sputtering coating process, is 200 nm-500 nm thick, and is reliably electrically connected with the metal lead through conductive slurry.
The shape of the sensor is fan-shaped.
Compared with the prior art, the invention has the following beneficial effects:
a plurality of grooves are arrayed on a sensor base, and sensitive layer substrates are bonded in the grooves; a sensitive layer is deposited on the sensitive layer substrate; two ends of the sensitive layer are respectively connected with a signal leading-out end; the sensitive layer is connected with external measuring equipment through a signal leading-out end, and compared with the traditional single-point atomic layer thermopile measuring method, the multi-point synchronous measurement can be realized, the spatial resolution is high, and the heat flow frequency response is high.
On the other hand, the invention has simple structure and easy processing; the threaded fasteners are adopted for connection, so that the installation is convenient; compared with the traditional single-point atomic layer thermopile measuring method, the method can realize multi-point synchronous measurement and has high spatial resolution; the shape design of the sensor base can be carried out according to the shape of a measured component, and the method is suitable for measuring the high-frequency disturbance signal of transition of aerodynamic heat and a boundary layer of the hypersonic aircraft in the field of aerospace.
Drawings
FIG. 1 is a three-dimensional block diagram of an array atomic layer thermopile thermal flow sensor of the present invention;
FIG. 2 is a schematic structural diagram of a sensing unit of the array atomic layer thermopile heat flow sensor of the present invention.
Wherein the reference numerals are respectively:
1. a sensor base; 2. a sensing unit; 3. a sensitive layer substrate; 4. a sensitive layer; 5. and a metal lead.
Detailed Description
The invention is further described with reference to the following figures and detailed description.
The invention provides an array type atomic layer thermopile heat flow sensor. The sensor mainly comprises a sensor base 1, a signal leading-out end, a sensitive layer substrate 3, a sensitive layer 4 and the like, wherein the sensitive layer substrate, the sensitive layer and the signal leading-out end form a sensitive unit, and one sensitive unit is arranged in each groove on the sensor base.
The sensor base is made of alumina ceramic materials, serves as a packaging and supporting structure of the whole sensor, and is connected with a measured component through a threaded fastener. The shape of the sensor base can be designed according to the shape of a component to be measured, for example, the shape of the sensor base for measuring the heat flow of the wind tunnel test of the hypersonic aircraft needs to be designed according to the shape of a wind tunnel test model, so that the interference or influence of the sensor base on a flow field is reduced to the minimum.
And a plurality of grooves with the same overall dimension are arrayed on the sensor base and used for mounting the sensitive layer substrate. The depth of the groove is consistent with the height of the sensitive layer substrate, and the edge of the outer end face can be kept flush after the sensitive layer substrate is placed into the groove. Two through holes with the aperture of 0.5mm are formed at the bottom of each groove and are used for mounting metal leads 5.
The sensitive layer substrate is made of strontium titanate materials and is bonded in the groove through an adhesive. Two through holes with the aperture of 0.5mm are also formed on the sensitive layer substrate. When the sensitive layer substrate is arranged in the groove of the sensor base, the two through holes on the sensitive layer substrate are respectively coaxially aligned with the two through holes in the groove, so that the metal lead can continuously pass through the through holes on the sensor base and the through holes on the sensitive layer substrate.
The metal lead is bonded in the through hole of the sensor base through adhesive, and one side end face of the metal lead is flush with the outer end face of the sensitive layer base. The sensitive layer is made of yttrium barium copper oxide material, is deposited between the two through holes on the outer end surface of the sensitive layer substrate through a vacuum magnetron sputtering coating process, has the thickness of 200 nm-500 nm, and is reliably electrically connected with the metal lead through conductive slurry. The metal lead and the conductive paste form a signal leading-out end to play a role in transmitting electric signals.
The sensor base shown in fig. 1 is designed according to the appearance of a hypersonic wind tunnel aircraft wing rudder gap interference area measurement test model, and the measurement surface of the sensor base is a fan-shaped plane, so that the high spatial resolution multipoint measurement of the heat flow of the interference area near the rudder shaft can be realized.
A plurality of grooves with the same overall dimension are arranged on a sensor base in an array manner along the radial direction and the annular direction and used for mounting a sensitive layer substrate, the typical dimension of the groove interval is 3mm in the radial direction, and 5 mm-5.3 mm in the annular direction. The typical size of the groove is 4mm in length, 2mm in width and 0.5mm in depth, the typical size of the groove is consistent with the external dimension of the sensitive layer substrate, and the edge of the outer end face of the sensitive layer substrate can be kept flush after the sensitive layer substrate is placed in the groove.
The invention solves the problems of complex mounting structure and low resolution ratio of a single-point sensor array arrangement mode in the prior art, can realize multi-point synchronous measurement, and has the advantages of high spatial resolution ratio and high heat flow frequency response.
Claims (9)
1. An array atomic layer thermopile heat flow sensor is characterized in that the sensor comprises a sensor base, a signal leading-out end, a sensitive layer substrate and a sensitive layer; a plurality of grooves are arrayed on the sensor base, and sensitive layer substrates are bonded in the grooves; a sensitive layer is deposited on the sensitive layer substrate; two ends of the sensitive layer are respectively connected with a signal leading-out end; the sensitive layer is connected with external measuring equipment through a signal leading-out terminal.
2. The array atomic layer thermopile heat flow sensor of claim 1, wherein the material of the sensor base is an alumina ceramic material.
3. The array atomic layer thermopile heat flow sensor of claim 1, wherein the signal terminals are made of conductive paste and metal leads cured on both ends of the sensitive layer.
4. The array atomic layer thermopile heat flow sensor according to claim 1, wherein the sensing layer has through holes formed on its substrate; the through holes in the sensitive layer substrate are respectively coaxially aligned with the through holes in the grooves, so that the metal lead can continuously pass through the through holes in the sensor base and the through holes in the sensitive layer substrate.
5. The array atomic layer thermopile heat flow sensor of claim 1, wherein the sensitive layer substrate is a strontium titanate material.
6. The array type atomic layer thermopile heat flow sensor according to claim 1, wherein the sensitive layer is a yttrium barium copper oxide material, the sensitive layer is deposited between two through holes on the outer end face of the substrate of the sensitive layer through a vacuum magnetron sputtering coating process, the thickness of the sensitive layer is 200nm to 500nm, and the sensitive layer and the metal lead wire are reliably electrically connected through conductive paste.
7. The array atomic layer thermopile heat flow sensor according to claim 2, wherein the sensor base is connected to the measured component by a threaded fastener, and the end surface of the sensor on the side of the sensitive layer is flush with the edge of the surface of the measured component.
8. The array atomic layer thermopile heat flow sensor of claim 3, wherein the metal leads extend through the holes in the plurality of grooves arranged in an array on the sensor base, and are bonded to the sensor base by an adhesive, and then are electrically connected to the sensitive layer by an electrically conductive paste.
9. The array atomic layer thermopile thermal flow sensor according to any one of claims 1-8, wherein the sensor is fan shaped.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111340423.4A CN114112087A (en) | 2021-11-12 | 2021-11-12 | Array type atomic layer thermopile heat flow sensor |
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| CN202111340423.4A CN114112087A (en) | 2021-11-12 | 2021-11-12 | Array type atomic layer thermopile heat flow sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117871027A (en) * | 2024-03-11 | 2024-04-12 | 中国航空工业集团公司沈阳空气动力研究所 | Columnar heat flow sensor and array preparation method thereof |
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