CN204903029U - Piece formula quick response's temperature sensor - Google Patents
Piece formula quick response's temperature sensor Download PDFInfo
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- CN204903029U CN204903029U CN201520285006.8U CN201520285006U CN204903029U CN 204903029 U CN204903029 U CN 204903029U CN 201520285006 U CN201520285006 U CN 201520285006U CN 204903029 U CN204903029 U CN 204903029U
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- temperature
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- temperature sensor
- conducting metal
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Abstract
The utility model relates to a piece formula quick response's temperature sensor, including temperature sensing chip, heat conduction metallic interconnect piece, shell and insulating high heat -conducting layer, temperature sensing chip the two poles of the earth are connected with heat conduction metallic interconnect piece respectively, and heat conduction metallic interconnect piece covers to be connected with it on the surface at the temperature sensing chip, temperature sensing chip and at least this part heat conduction metallic interconnect piece of being connected with the temperature sensing chip seal casedly, and insulating high heat -conducting layer is packed in the shell. This kind of temperature sensor adopts ultra -thin packaging technology, reduces device heat capacity, adopts high heat conduction encapsulating material, even the temperature sensing chip adopts traditional low price material, it is compared with prior art, and response speed promotes 4 times.
Description
Technical field
The utility model relates to the temperature sensor that a kind of nonlinear temperature sensor, particularly a kind of chip respond fast.
Background technology
Along with the continuous progress of science and technology, need the electrical equipment of displays temperature information, electronic product etc., be all widely applied to temperature sensor, at present general division two kinds of temperature sensors: 1, negative temperature coefficient sensor (NTC), it is along with the decline of temperature rising resistance; 2, positive temperature coefficient (PTC) sensor (PTC), it is along with the rising of temperature rising resistance.
Wherein, NTC be mainly utilize two or more the metal oxide such as manganese, copper, silicon, cobalt, iron, nickel, zinc fully to mix, the semiconductor ceramics of the technique such as shaping, sintering, the non-oxide system NTC thermistor material that to have also appeared now with silit, stannic selenide, tantalum nitride etc. be representative.Above-mentioned material price inexpensively, but, to use manufactured by above-mentioned material NTC to be out greater than more than 1 second in the response time of the temperature sensor electronic component produced in conjunction with current technique, very large negative effect brought to the accuracy of its thermometric.
In order to solve the problem, it is found that Pt(platinum) this metal material can solve, but as everyone knows, Pt belongs to noble metal, and the temperature sensor cost produced with it is higher, is unfavorable for widespread use.
Utility model content
An object of the present utility model is to provide a kind of simple and reasonable for structure, the temperature sensor that temperature-sensitive fast response time, cost chip low, applied widely responds fast.
The purpose of this utility model is achieved in that
The temperature sensor that a kind of chip responds fast, comprise temperature-sensitive chip, it is characterized in that: also comprise heat-conducting metal brace, shell and insulation high thermal conductivity layer, described temperature-sensitive chip the two poles of the earth are connected to heat-conducting metal brace, heat-conducting metal brace covers on the surface that temperature-sensitive chip is attached thereto, described temperature-sensitive chip encapsulates in the enclosure with this part heat-conducting metal brace be at least connected with temperature-sensitive chip, and insulation high thermal conductivity layer is filled in the enclosure.
The purpose of this utility model can also adopt following technical measures to solve:
As a kind of scheme more specifically, described heat-conducting metal brace one end is drawn outside shell, to form leg.
The surface that described temperature-sensitive chip is connected with heat-conducting metal brace is also provided with silver coating.Described heat-conducting metal brace is copper sheet.The surface, the two poles of the earth, left and right of described temperature-sensitive chip is connected with heat-conducting metal brace, or the surface, the two poles of the earth up and down of described temperature-sensitive chip is connected with heat-conducting metal brace.
Described shell is glass shell or metal shell.Because glass shell has insulativity, and can thermal shrinkage, so preferably adopt glass shell as the shell of temperature sensor, in production run, the processing mode that heat can be adopted to dry makes glass shell heat shrinkable, reduce the volume of temperature sensor further, be conducive to carrying out good heat trnasfer between ambient temperature and its inner temperature-sensitive chip, promote its temperature-sensitive response time further.
Described shell is hood-like, or described shell is the tubular of upper and lower both ends open.
As another kind of scheme more specifically, be also packaged with plug in described shell, plug inside is conducted electricity with heat-conducting metal brace and is connected.
The beneficial effects of the utility model are as follows:
This kind of temperature sensor adopts ultrathin packaging process, reduces device thermal capacity, adopts high heat conduction encapsulating material, even if temperature-sensitive chip adopts traditional inexpensive material, its compared with prior art, response speed promotes 4 times.
Accompanying drawing explanation
Fig. 1 is the utility model one example structure schematic diagram.
Fig. 2 is another example structure schematic diagram of the utility model.
Fig. 3 is the another example structure schematic diagram of the utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
Embodiment one, shown in Figure 1, the temperature sensor that a kind of chip responds fast, comprise temperature-sensitive chip 3, heat-conducting metal brace 4, shell 1 and insulation high thermal conductivity layer 2, described temperature-sensitive chip 3 the two poles of the earth are connected to heat-conducting metal brace 4, heat-conducting metal brace 4 covers on surface that temperature-sensitive chip 3 is attached thereto (see A arrow place in Fig. 1), described temperature-sensitive chip 3 is encapsulated in shell 1 with this part heat-conducting metal brace 4 be at least connected with temperature-sensitive chip 3, and insulation high thermal conductivity layer 2 is filled in shell 1.
After described temperature-sensitive chip 3 outside surface is provided with silver coating 31, its surface, upper and lower the two poles of the earth is connected with heat-conducting metal brace 4, and heat-conducting metal brace 4 one end is drawn outside shell 1, to form leg.
Described shell 1 is glass shell, and it is the tubular of upper and lower both ends open, so that be set in outside temperature-sensitive chip 3.The external diameter of described shell 1 is 2 to 2.5mm.
Described heat-conducting metal brace 4 is copper sheet.
Described insulation high thermal conductivity layer 2 THICKNESS CONTROL is at 0.1mm.
The making step of said temperature sensor is: 1, temperature-sensitive chip 3 chooses NTC, and on its plated surface silver coating 31; 2, adopt Reflow Soldering mode at temperature-sensitive chip 3 the two poles of the earth welding heat-conducting metal brace 4, and guarantee that heat-conducting metal brace 4 hides (covering) completely outside the surface that temperature-sensitive chip 3 welds with it; 3, the temperature-sensitive chip 3 being welded with heat-conducting metal brace 4 being loaded external diameter is in the glass shell of 2 to 2.5mm, meanwhile, reserves a part of heat-conducting metal brace 4 outside glass shell, to form leg; 4, carry out heat and dry process, make glass shell shrink package; 5, packaged type adopts spraying high temperature insullac, as chip encapsulation process, encapsulation process THICKNESS CONTROL has mobility at 0.1mm(high-temperature insulation paint, can infiltrate into gap between shell and temperature-sensitive chip 3, the described insulation high thermal conductivity layer 2 of the solid rear formation of high-temperature insulation paint).
Embodiment two, is with the difference of embodiment one: shown in Figure 2, and the surface, the two poles of the earth, left and right of described temperature-sensitive chip 3 is connected with heat-conducting metal brace 4.Described shell 1 is in hood-like.
Embodiment three, is with the difference of embodiment one: shown in Figure 3, is also packaged with plug 5 in described shell 1, and inner the conduction with heat-conducting metal brace 4 of plug 5 is connected.
Claims (10)
1. the temperature sensor that responds fast of a chip, comprise temperature-sensitive chip, it is characterized in that: also comprise heat-conducting metal brace, shell and insulation high thermal conductivity layer, described temperature-sensitive chip the two poles of the earth are connected to heat-conducting metal brace, heat-conducting metal brace covers on the surface that temperature-sensitive chip is attached thereto, described temperature-sensitive chip encapsulates in the enclosure with this part heat-conducting metal brace be at least connected with temperature-sensitive chip, and insulation high thermal conductivity layer is filled in the enclosure.
2. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: described heat-conducting metal brace one end is drawn outside shell, to form leg.
3. the temperature sensor that responds fast of chip according to claim 1, it is characterized in that: be also packaged with plug in described shell, plug inside is conducted electricity with heat-conducting metal brace and is connected.
4. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: the surface that described temperature-sensitive chip is connected with heat-conducting metal brace is also provided with silver coating.
5. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: the surface, the two poles of the earth, left and right of described temperature-sensitive chip is connected with heat-conducting metal brace.
6. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: the surface, the two poles of the earth up and down of described temperature-sensitive chip is connected with heat-conducting metal brace.
7. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: described shell is hood-like.
8. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: described shell is the tubular of upper and lower both ends open.
9. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: described heat-conducting metal brace is copper sheet.
10. the temperature sensor that responds fast of chip according to claim 1, is characterized in that: described shell is glass shell or metal shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520285006.8U CN204903029U (en) | 2015-05-06 | 2015-05-06 | Piece formula quick response's temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520285006.8U CN204903029U (en) | 2015-05-06 | 2015-05-06 | Piece formula quick response's temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204903029U true CN204903029U (en) | 2015-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520285006.8U Active CN204903029U (en) | 2015-05-06 | 2015-05-06 | Piece formula quick response's temperature sensor |
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| Country | Link |
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| CN (1) | CN204903029U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111048931A (en) * | 2019-11-18 | 2020-04-21 | 中航光电科技股份有限公司 | Guarantee insulation resistance's under high temperature and high humidity condition glass seals knot socket |
| WO2020244042A1 (en) * | 2019-06-06 | 2020-12-10 | 深圳佰维存储科技股份有限公司 | Memory chip, solid-state hard disk, and temperature control method thereof |
| CN107543629B (en) * | 2017-06-26 | 2023-08-22 | 梅斯法国公司 | Temperature sensor with heat transfer element and method for manufacturing the same |
-
2015
- 2015-05-06 CN CN201520285006.8U patent/CN204903029U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107543629B (en) * | 2017-06-26 | 2023-08-22 | 梅斯法国公司 | Temperature sensor with heat transfer element and method for manufacturing the same |
| WO2020244042A1 (en) * | 2019-06-06 | 2020-12-10 | 深圳佰维存储科技股份有限公司 | Memory chip, solid-state hard disk, and temperature control method thereof |
| CN111048931A (en) * | 2019-11-18 | 2020-04-21 | 中航光电科技股份有限公司 | Guarantee insulation resistance's under high temperature and high humidity condition glass seals knot socket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170606 Address after: 528300, Guangdong District, Foshan City, Ronggui province Shunde Li neighborhood committee, 33 West Bao Chang Road, Tian Fu International Industrial City, three, 15, four, 401, 402, two Patentee after: Foshan city Shunde District kaig Electronic Industrial Co. Ltd. Address before: Shunde District Lunjiao Lunjiao Street industrial zone three northbound 528300 new Xi Guangdong province Foshan City No. 6 Ming Road Industrial Park Patentee before: GUANGDONG MENLO ELECTRIC POWER CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: Room 401 and 402, floor 4, block 15, phase III, tianfulai international industrial city, No. 33, Changbao West Road, Ronggui Rongli neighborhood committee, Shunde District, Foshan City, Guangdong Province Patentee after: Guangdong Shunde Kaige Electronic Industry Co., Ltd Address before: 528300, Guangdong District, Foshan City, Ronggui province Shunde Li neighborhood committee, 33 West Bao Chang Road, Tian Fu International Industrial City, three, 15, four, 401, 402, two Patentee before: FOSHAN SHUNDE KINGGE ELECTRONIC INDUSTRIAL Co.,Ltd. |
|
| CP03 | Change of name, title or address |