CN201219054Y - Paster glass seal type negative temperature coefficient thermistor - Google Patents
Paster glass seal type negative temperature coefficient thermistor Download PDFInfo
- Publication number
- CN201219054Y CN201219054Y CNU2007200574228U CN200720057422U CN201219054Y CN 201219054 Y CN201219054 Y CN 201219054Y CN U2007200574228 U CNU2007200574228 U CN U2007200574228U CN 200720057422 U CN200720057422 U CN 200720057422U CN 201219054 Y CN201219054 Y CN 201219054Y
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- Prior art keywords
- temperature coefficient
- negative temperature
- type negative
- coefficient thermistor
- sensitive chip
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- Expired - Fee Related
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Abstract
The utility discloses a chipping glass-sealed type negative temperature coefficient thermal resistor, belonging to thermistor technology field. It comprises negative temperature coefficient temperature-sensitive chip (1), electrode layer (2) laid at two sides of negative temperature coefficient temperature-sensitive chip (1) and a lead-out sheet (3) fixed on the pair of electrode layer (2). The patch glass-sealed type negative temperature coefficient thermal resistor is column shape, the lead-out sheet (3) is disposed at two sides of resistor, negative temperature coefficient temperature-sensitive chip is provided with glass protection layer at outside. The negative temperature coefficient thermal resistor of the utility can be chipping welded, enlarges use temperature zone, and mainly be used in electric appliance as mobile phone, battery of mobile phone, computer etc.
Description
Technical field
The utility model belongs to the thermistor technology field, is specifically related to a kind of paster glass envelope type negative temperature coefficient thermistor.
Background technology
Negative temperature coefficient thermistor be a kind of be the semiconductive ceramic element that main material is made with the high-purity transition metal oxide, it is to be main material with metal oxides such as manganese, cobalt, nickel and iron, adopts the ceramic process manufacturing to form.These metal oxide materials all have semiconductor property because on electrically conducting manner semi-conducting materials such as all fours germanium, silicon.When temperature was hanged down, the charge carrier of these oxide materials (electronics and hole) number was few, so its resistance value is higher; Along with the rising of temperature, the charge carrier number increases, so resistance value reduces.Therefore it has the characteristic of resistance value respective change with variation of temperature, promptly measures under the power characteristic that resistance value descends with the rising of temperature certain.NTC themistor excursion at room temperature is at 100～1000000 ohm, temperature coefficient-2%～-6.5%.Utilize this characteristic, NTC themistor can be widely used in occasions such as temperature survey, temperature-compensating, inhibition surge current.
Common patch-type temperature coefficient thermistor device welding is mainly used in temperature survey or temperature-compensating in the circuit board, but it uses warm area narrow, can only use in the environment below 120 ℃.
Summary of the invention
In order to solve the problems of the technologies described above, the purpose of this utility model is that a kind of paster glass envelope type negative temperature coefficient thermistor will be provided, equally can paster welding but serviceability temperature can be up to 300 ℃.
The technical solution adopted in the utility model is as follows: a kind of paster glass envelope type negative temperature coefficient thermistor; it comprises the negative temperature coefficient heat-sensitive chip and the pair of electrode layers of the negative temperature coefficient heat-sensitive chip both sides that are laid in and be installed in lead-out tablet on the electrode layer; described paster glass envelope type negative temperature coefficient thermistor is cylindric; described lead-out tablet is located at the resistor two ends, and described negative temperature coefficient heat-sensitive chip outside is provided with glassivation.
The diameter of described paster glass envelope type negative temperature coefficient thermistor is 1.5 ± 0.2cm, and length is 3.6 ± 0.2cm.
Described negative temperature coefficient heat-sensitive chip adopts the oxide powder of manganese, cobalt, nickel, iron to be made.
The material of described electrode layer is silver or silver-colored palladium.
Described lead-out wire adopts the metallic conduction material to form.
The beneficial effects of the utility model are: with respect to common patch-type negative temperature coefficient thermistor, this utility model has adopted glass as protective layer, equally can paster welding and expanded the use warm area.
Description of drawings
Fig. 1 is a front view of the present utility model;
Fig. 2 is that master of the present utility model looks cutaway view;
Fig. 3 is that cutaway view is looked on a left side of the present utility model.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described.
Fig. 1～Fig. 3 is a preferred embodiment of the present utility model.As shown in the figure; the utility model comprises negative temperature coefficient heat-sensitive chip 1 and the pair of electrode layers 2 of negative temperature coefficient heat-sensitive chip 1 both sides that are laid in and be installed in lead-out tablet 3 on the electrode layer 2; paster glass envelope type negative temperature coefficient thermistor is cylindric; described lead-out tablet 3 is located at the resistor two ends, and there is glassivation 4 negative temperature coefficient heat-sensitive chip 1 outside.
Negative temperature coefficient heat-sensitive chip 1 adopts the oxide powder of manganese, cobalt, nickel, iron to be made.The material of electrode layer 2 is silver or silver-colored palladium, and lead-out tablet 3 adopts the metallic conduction material.Negative temperature coefficient heat-sensitive chip 1 is put glassivation 4 with the electrode layer 2 that is connected lead-out tablet 3, and high temperature sintering makes protective layer 4 fusions coat negative temperature coefficient heat-sensitive chip 1 then.
Diameter of the present utility model is 1.5 ± 0.2cm, and length is 3.6 ± 0.2cm.
The utility model has been owing to adopted glass as protective layer, equally can the paster welding and expanded the use warm area, and the serviceability temperature scope can be brought up to 300 ℃.
The utility model is mainly used in electric equipments such as mobile phone, battery of mobile phone, computer.
Claims (4)
1. paster glass envelope type negative temperature coefficient thermistor; it comprises negative temperature coefficient heat-sensitive chip (1) and the pair of electrode layers (2) of negative temperature coefficient heat-sensitive chip (1) both sides that are laid in and be installed in lead-out tablet (3) on the electrode layer (2); it is characterized in that: described paster glass envelope type negative temperature coefficient thermistor is cylindric; described lead-out tablet (3) is located at the resistor two ends, and described negative temperature coefficient heat-sensitive chip (1) outside is provided with glassivation (4).
2. paster glass envelope type negative temperature coefficient thermistor according to claim 1 is characterized in that: the diameter of described paster glass envelope type negative temperature coefficient thermistor is 1.5 ± 0.2cm, and length is 3.6 ± 0.2cm.
3. paster glass envelope type negative temperature coefficient thermistor according to claim 1 and 2 is characterized in that: the material of described electrode layer (2) is silver or silver-colored palladium.
4. paster glass envelope type negative temperature coefficient thermistor according to claim 1 and 2 is characterized in that: described lead-out wire (3) adopts the metallic conduction material to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200574228U CN201219054Y (en) | 2007-09-25 | 2007-09-25 | Paster glass seal type negative temperature coefficient thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200574228U CN201219054Y (en) | 2007-09-25 | 2007-09-25 | Paster glass seal type negative temperature coefficient thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201219054Y true CN201219054Y (en) | 2009-04-08 |
Family
ID=40541889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200574228U Expired - Fee Related CN201219054Y (en) | 2007-09-25 | 2007-09-25 | Paster glass seal type negative temperature coefficient thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201219054Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313339A (en) * | 2023-04-01 | 2023-06-23 | 东莞市科蓬达电子科技有限公司 | NTC patch glass-sealed thermistor and production process |
-
2007
- 2007-09-25 CN CNU2007200574228U patent/CN201219054Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313339A (en) * | 2023-04-01 | 2023-06-23 | 东莞市科蓬达电子科技有限公司 | NTC patch glass-sealed thermistor and production process |
| CN116313339B (en) * | 2023-04-01 | 2024-07-26 | 东莞市科蓬达电子科技有限公司 | NTC patch glass-sealed thermistor and production process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090408 Termination date: 20110925 |