CN205488108U - IC inverse bonding paster infrared receiving terminal - Google Patents
IC inverse bonding paster infrared receiving terminal Download PDFInfo
- Publication number
- CN205488108U CN205488108U CN201521139810.1U CN201521139810U CN205488108U CN 205488108 U CN205488108 U CN 205488108U CN 201521139810 U CN201521139810 U CN 201521139810U CN 205488108 U CN205488108 U CN 205488108U
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- CN
- China
- Prior art keywords
- pcb board
- packing colloid
- pcb
- inverse bonding
- receiving terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Light Receiving Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a IC inverse bonding paster infrared receiving terminal. It include a setting at the PCB of bottom board, its characterized in that: the top of PCB board is equipped with IC and chip, the IC lower surface is in the same place through inverse bonding mode and PCB board upper surface rigid coupling, the inside of PCB board be provided with a plurality of for PCB board centrosymmetric PCB conductive electrode, the chip passes through the gold thread electricity and connects PCB conductive electrode, encapsulation colloid is installed to the top of PCB board, encapsulation colloid comprises upper encapsulation colloid and the encapsulation colloid of lower floor, upper strata encapsulation colloid sets up one side or centre at lower floor encapsulation colloid top. The utility model discloses in, adopting the SMD operation of PCB board, IC adopts the inverse bonding connected mode, need not to weld the gold thread, plants the shielding in need not, and no external light disturbs, has improved receiving range and sensitivity.
Description
Technical field
This utility model relates to ic component field, particularly relates to a kind of IC inverse bonding paster infrared receiving terminal.
Background technology
Infrared receiving terminal is mostly direct insertion at present, for improving anti-light interference performance and the receiving range of product, in generally individually using
Plant shielding or outer planting iron-clad mode, and on market, existing paster reception head is SOP packaged type, and anti-light dry for improving product
Disturb ability and receiving range, be also adopted by interplantation shielding mode and outer planting iron-clad mode.Therefore prior art needs interplantation shielding mode
The problem such as solve that product is insensitive by the ambient light reaction that causes of interference with outer planting iron-clad and receiving range is short.As in the market
Double ball pasters of common employing SOP packaged type receive head, product interplantation protected type, need to weld a plurality of gold thread to connect each PIN
Foot, IC puts mode for the side of facing up, and IC surface need to add screening cover to prevent light interference from causing receiving range poor, sensitivity
Differing from, this Product jointing needs bonding machines to complete, and product easily causes bonding wire to open a way because of Reflow Soldering excessively because epoxy resin expands with heat and contract with cold.
Utility model content
This utility model provides a kind of IC inverse bonding paster infrared receiving terminal, overcomes and needs interplantation shielding mode with outer in prior art
Plant iron-clad to solve product by the ambient light reaction that causes of interference is insensitive and receiving range is short, poor sensitivity, easily because crossing Reflow Soldering
Because epoxy resin expands with heat and contract with cold the problem causing bonding wire to open a way.
The purpose of this utility model is achieved through the following technical solutions:
A kind of IC inverse bonding paster infrared receiving terminal, including a pcb board being arranged on bottom, it is characterised in that: at described PCB
Plate be arranged over IC and chip, described IC lower surface is fixed together with pcb board upper surface by inverse bonding mode；Described
Being internally provided with of pcb board is multiple relative to described pcb board centrosymmetric PCB conductive electrode, and described chip is by gold thread electricity
Connect described PCB conductive electrode；At the packing colloid that is arranged above of described pcb board, described packing colloid is by upper strata packaging plastic
Body and lower floor's packing colloid composition, described upper strata packing colloid is arranged on side or the centre at lower floor's packing colloid top.
Described upper strata packing colloid is semi-circular structure, and described upper strata packing colloid and lower floor's packing colloid use epoxy resin pressing mold
Integrated molding.
Compared with prior art, this utility model embodiment at least has the advantage that
In this utility model embodiment, using the SMD operation of pcb board, emphasis is that IC uses inverse bonding mode, it is not necessary to welding gold
Line；Owing to IC uses inverse bonding mode to connect, IC surface contacts with pcb board, it is not necessary to interplantation shielding mode and outer planting iron-clad are i.e.
The problem such as can solve that product is insensitive by the ambient light reaction that causes of interference and receiving range is short.And IC inverse bonding design so that cross back
Fluid welding good stability, because pcb board is close on IC surface, it is not necessary to interplantation shielding again, without ambient light interference, receiving range and sensitive
Degree improves.
Accompanying drawing explanation
The internal structure schematic diagram of a kind of IC inverse bonding paster infrared receiving terminal that Fig. 1 provides for this utility model embodiment；
The internal structure top view of a kind of IC inverse bonding paster infrared receiving terminal that Fig. 2 provides for this utility model embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model, the technical scheme in this utility model is clearly and completely described,
Obviously, described embodiment is only a part of embodiment of the present utility model rather than whole embodiments.Based on this reality
By the embodiment in novel, the every other reality that those of ordinary skill in the art are obtained under not making creative work premise
Execute example, broadly fall into the scope of this utility model protection.
As shown in Figure 1-2, a kind of IC inverse bonding paster infrared receiving terminal proposed for this utility model embodiment, including a setting
Pcb board 1 in bottom, it is characterised in that: being arranged over IC2 and chip 3 at pcb board 1, IC2 lower surface is by falling
Weldering mode is fixed together with pcb board 1 upper surface；Multiple relative to pcb board 1 center being internally provided with of pcb board 1
Symmetrical PCB conductive electrode 4, chip 3 electrically connects PCB conductive electrode 4 by gold thread 5；Being arranged above of pcb board 1
Packing colloid, packing colloid is made up of upper strata packing colloid 6 and lower floor's packing colloid 7, and upper strata packing colloid 6 is arranged on lower floor
The side at packing colloid 7 top or centre.
Preferably, upper strata packing colloid 6 is semi-circular structure, and upper strata packing colloid 6 and lower floor's packing colloid 7 use asphalt mixtures modified by epoxy resin
Fat pressing mold integrated molding.
Below the course of processing of this product is described as follows:
The solid IC point glue of some glue solid chip baking bonding wire molding baking cutting test tape package.
Compared with prior art, this utility model embodiment has the advantage that
In this utility model embodiment, using the SMD operation of pcb board, emphasis is that IC uses inverse bonding mode, it is not necessary to welding gold
Line；Owing to IC uses inverse bonding mode to connect, IC surface contacts with pcb board, it is not necessary to interplantation shielding mode and outer planting iron-clad are i.e.
The problem such as can solve that product is insensitive by the ambient light reaction that causes of interference and receiving range is short.And IC inverse bonding design so that cross back
Fluid welding good stability, because pcb board is close on IC surface, it is not necessary to interplantation shielding again, without ambient light interference, receiving range and sensitive
Degree improves.
The above, only this utility model preferably detailed description of the invention, but protection domain of the present utility model is not limited to
This, any those familiar with the art in the technical scope that this utility model discloses, the change that can readily occur in or
Replace, all should contain within protection domain of the present utility model.Therefore, protection domain of the present utility model should be wanted with right
The protection domain seeking book is as the criterion.
Claims (2)
1. an IC inverse bonding paster infrared receiving terminal, including a pcb board (1) being arranged on bottom, it is characterised in that:
Be arranged over IC (2) and chip (3) at described pcb board (1), described IC (2) lower surface by inverse bonding mode with
Pcb board (1) upper surface is fixed together；Multiple relative to described pcb board being internally provided with of described pcb board (1)
(1) centrosymmetric PCB conductive electrode (4), described chip (3) electrically connects described PCB conductive electrode by gold thread (5)
(4)；At the packing colloid that is arranged above of described pcb board (1), described packing colloid by upper strata packing colloid (6) and
Lower floor's packing colloid (7) form, described upper strata packing colloid (6) be arranged on lower floor's packing colloid (7) top side or in
Between.
2. IC inverse bonding paster infrared receiving terminal as claimed in claim 1, it is characterised in that: described upper strata packing colloid (6)
Epoxy resin pressing mold integrated molding is used for semi-circular structure, described upper strata packing colloid (6) and lower floor's packing colloid (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521139810.1U CN205488108U (en) | 2015-12-31 | 2015-12-31 | IC inverse bonding paster infrared receiving terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521139810.1U CN205488108U (en) | 2015-12-31 | 2015-12-31 | IC inverse bonding paster infrared receiving terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488108U true CN205488108U (en) | 2016-08-17 |
Family
ID=56663129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521139810.1U Active CN205488108U (en) | 2015-12-31 | 2015-12-31 | IC inverse bonding paster infrared receiving terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488108U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935663A (en) * | 2017-02-24 | 2017-07-07 | 江苏欧密格光电科技股份有限公司 | A kind of paster infrared receiving terminal |
| CN111009113A (en) * | 2019-12-26 | 2020-04-14 | 哈尔滨海格科技发展有限责任公司 | Novel SMD infrared remote control receiver device |
-
2015
- 2015-12-31 CN CN201521139810.1U patent/CN205488108U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935663A (en) * | 2017-02-24 | 2017-07-07 | 江苏欧密格光电科技股份有限公司 | A kind of paster infrared receiving terminal |
| CN111009113A (en) * | 2019-12-26 | 2020-04-14 | 哈尔滨海格科技发展有限责任公司 | Novel SMD infrared remote control receiver device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |