CN206209776U - Fingerprint recognition semiconductor devices - Google Patents
Fingerprint recognition semiconductor devices Download PDFInfo
- Publication number
- CN206209776U CN206209776U CN201621177935.8U CN201621177935U CN206209776U CN 206209776 U CN206209776 U CN 206209776U CN 201621177935 U CN201621177935 U CN 201621177935U CN 206209776 U CN206209776 U CN 206209776U
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- circuit boards
- fpc circuit
- becket
- recognition chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Credit Cards Or The Like (AREA)
Abstract
The utility model discloses a kind of fingerprint recognition semiconductor devices, and its fingerprint recognition chip is located at FPC circuit boards middle part and is electrically connected by scolding tin, and the fingerprint recognition chip surface opposite with FPC circuit boards is covered with a cover plate；The left end of becket, right-hand member and lower surface bottom are respectively provided with outside outward flange, the upper surface bottom of the becket has inside inward flange, the fingerprint recognition chip is installed in becket and horizontally disposed with inward flange, and the cover plate is covered in fingerprint recognition chip and inward flange top；The rear end of FPC circuit boards has a bending part, and the button key is installed on the lower surface of bending part, the upper surface of this bending part and is disposed with the first adhesive layer, steel disc and the second adhesive layer between the lower surface of FPC circuit boards immediately below fingerprint recognition chip.The utility model effectively increases the accounting of screen effective display area domain, meanwhile, also improve the intensity and reliability of module.
Description
Technical field
The utility model is related to a kind of fingerprint recognition semiconductor devices, belongs to technical field of semiconductor encapsulation.
Background technology
Current fingerprint recognition module is widely used to the electronic product industry such as mobile phone/notebook computer, with reference to attached tradition
Fingerprint module package structure includes：Sealer, component, connector, circuit substrate and fingerprint recognition chip, fingerprint chip
By conductive material and substrate connection, becket passes through glue and substrate connection.
Cover plate for protecting chip, including but not limited to sapphire cover plate, glass cover-plate, ceramic cover plate, there is gold side
, there is shirt rim in category circle, make module that the hole that mobile phone protective glass correspondence module is opened is not fallen out after assembling around the quoit.It is existing
Technology, quoit shirt rim is bonded on FPC by glue.Because there is shirt rim quoit both sides, occupy the more device space.
The content of the invention
The utility model purpose is to provide a kind of fingerprint recognition semiconductor devices, and the fingerprint recognition semiconductor devices is effectively carried
The accounting of screen effective display area domain high, meanwhile, also improve the intensity and reliability of module.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of fingerprint recognition semiconductor devices, including
Fingerprint recognition chip, FPC circuit boards, becket and button key, the fingerprint recognition chip be located at FPC circuit boards middle part and lead to
Scolding tin electrical connection is crossed, the fingerprint recognition chip surface opposite with FPC circuit boards is covered with a cover plate, the fingerprint recognition core
Piece lateral surface and it is provided with fluid sealant between becket medial surface；
The connector is installed on FPC board rear ends, and this connector and fingerprint recognition chip are located at FPC circuit boards respectively
Both sides a, sheet metal is installed on the FPC circuit boards surface opposite with connector, the left end of the becket, right-hand member and lower surface
Bottom is respectively provided with outside outward flange, and the upper surface bottom of the becket has inside inward flange, the fingerprint recognition core
Piece is installed in becket and horizontally disposed with inward flange, and the cover plate is covered in fingerprint recognition chip and inward flange top；
The rear end of the FPC circuit boards has a bending part, and the button key is installed on the lower surface of bending part, this bending
The upper surface in portion and be disposed between the lower surface of FPC circuit boards immediately below the fingerprint recognition chip the first adhesive layer,
Steel disc and the second adhesive layer.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the fingerprint recognition chip form is the length that four sides have the square of rounding, rounded
Square, track type or rhombus.
2. in such scheme, be provided with chamfered section at the left end of the becket, right-hand member and lower end base inner side, it is described in
Flange bottom is provided with chamfered section at inner side.
3. in such scheme, an electronic component is located at FPC circuit boards near the region of connector.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model fingerprint recognition semiconductor devices, the left end of its becket, right-hand member and lower surface bottom be respectively provided with to
Outer outward flange, the upper surface bottom of the becket has inside inward flange, and the fingerprint recognition chip is installed on metal
It is in ring and horizontally disposed with inward flange, the space that fingerprint module takes equipment is reduced, the parts such as the TP of equipment is more filled
Point utilization space, effectively increase the accounting of screen effective display area domain, meanwhile, quoit is toward inner side boss long, it is ensured that gold
Category circle is Nian Jie with FPC firmly；Secondly, the rear end of its FPC circuit board has a bending part, and the button key is installed on bending part
Lower surface, the upper surface of this bending part and sets gradually immediately below the fingerprint recognition chip between the lower surface of FPC circuit boards
Have the first adhesive layer, steel disc and the second adhesive layer, be conducive to reduce module volume, improve production efficiency, meanwhile, also improve
The intensity and reliability of module.
Brief description of the drawings
Accompanying drawing 1 is the structural representation of the utility model fingerprint recognition semiconductor devices；
Accompanying drawing 2 is the partial structural diagram of the utility model fingerprint recognition semiconductor devices.
In the figures above：1st, fingerprint recognition chip；2nd, FPC circuit boards；3rd, connector；4th, becket；5th, cover plate；6th, seal
Glue；7th, outward flange；8th, inward flange；9th, electronic component；10th, chamfered section；11st, button key；12nd, bending part；13rd, first is gluing
Layer；14th, steel disc；15th, the second adhesive layer；16th, sheet metal.
Specific embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of fingerprint recognition semiconductor devices, including fingerprint recognition chip 1, FPC circuit boards 2, connector 3,
Becket 4 and button key 11, the fingerprint recognition chip 1 are located at the middle part of FPC circuit boards 2 and are electrically connected by scolding tin, described
The surface opposite with FPC circuit boards 2 of fingerprint recognition chip 1 is covered with a cover plate 5, the lateral surface of fingerprint recognition chip 1 with
Fluid sealant 6 is provided between the medial surface of becket 4；
The connector 3 is installed on the rear end of FPC circuit boards 2, and this connector 3 and fingerprint recognition chip 1 are located at FPC electricity respectively
The both sides of road plate 2 a, sheet metal 16 is installed on the surface opposite with connector 3 of FPC circuit boards 2, the left end of the becket 4, the right side
End and lower surface bottom are respectively provided with outside outward flange 7, and the upper surface bottom of the becket 4 has inside inward flange 8, institute
State fingerprint recognition chip 1 to be installed in becket 4 and horizontally disposed with inward flange 8, the cover plate 5 is covered in fingerprint recognition chip
1 and the top of inward flange 8；
The rear end of the FPC circuit boards 2 has a bending part 12, and the button key 11 is installed on the following table of bending part 12
Face, the upper surface of this bending part 12 and sets gradually between the lower surface of the underface FPC circuit board 2 of fingerprint recognition chip 1
There are the first adhesive layer 13, the adhesive layer 15 of steel disc 14 and second.
Above-mentioned fingerprint recognition chip 1 is shaped as four sides has the square of rounding.
The left end of above-mentioned becket 4, right-hand member and lower end base are provided with chamfered section 10, the inward flange bottom inside at inner side
Place is provided with chamfered section 10.
One electronic component 9 is located at FPC circuit boards 2 near the region of connector 3.
Embodiment 2：A kind of fingerprint recognition semiconductor devices, including fingerprint recognition chip 1, FPC circuit boards 2, connector 3,
Becket 4 and button key 11, the fingerprint recognition chip 1 are located at the middle part of FPC circuit boards 2 and are electrically connected by scolding tin, described
The surface opposite with FPC circuit boards 2 of fingerprint recognition chip 1 is covered with a cover plate 5, the lateral surface of fingerprint recognition chip 1 with
Fluid sealant 6 is provided between the medial surface of becket 4；
The connector 3 is installed on the rear end of FPC circuit boards 2, and this connector 3 and fingerprint recognition chip 1 are located at FPC electricity respectively
The both sides of road plate 2 a, sheet metal 16 is installed on the surface opposite with connector 3 of FPC circuit boards 2, the left end of the becket 4, the right side
End and lower surface bottom are respectively provided with outside outward flange 7, and the upper surface bottom of the becket 4 has inside inward flange 8, institute
State fingerprint recognition chip 1 to be installed in becket 4 and horizontally disposed with inward flange 8, the cover plate 5 is covered in fingerprint recognition chip
1 and the top of inward flange 8；
The rear end of the FPC circuit boards 2 has a bending part 12, and the button key 11 is installed on the following table of bending part 12
Face, the upper surface of this bending part 12 and sets gradually between the lower surface of the underface FPC circuit board 2 of fingerprint recognition chip 1
There are the first adhesive layer 13, the adhesive layer 15 of steel disc 14 and second.
Above-mentioned fingerprint recognition chip 1 is shaped as the rectangle of rounded.
The left end of above-mentioned becket 4, right-hand member and lower end base are provided with chamfered section 10, the inward flange bottom inside at inner side
Place is provided with chamfered section 10.
During using above-mentioned fingerprint recognition semiconductor devices, the left end of its becket, right-hand member and lower surface bottom be respectively provided with to
Outer outward flange, the upper surface bottom of the becket has inside inward flange, and the fingerprint recognition chip is installed on metal
It is in ring and horizontally disposed with inward flange, the space that fingerprint module takes equipment is reduced, the parts such as the TP of equipment is more filled
Point utilization space, effectively increase the accounting of screen effective display area domain, meanwhile, quoit is toward inner side boss long, it is ensured that gold
Category circle is Nian Jie with FPC firmly；Secondly, the rear end of its FPC circuit board has a bending part, and the button key is installed on bending part
Lower surface, the upper surface of this bending part and sets gradually immediately below the fingerprint recognition chip between the lower surface of FPC circuit boards
Have the first adhesive layer, steel disc and the second adhesive layer, be conducive to reduce module volume, improve production efficiency, meanwhile, also improve
The intensity and reliability of module.
Above-described embodiment only to illustrate technology design of the present utility model and feature, technique is familiar with its object is to allow
Personage will appreciate that content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover protection domain of the present utility model it
It is interior.
Claims (5)
1. a kind of fingerprint recognition semiconductor devices, it is characterised in that：Including fingerprint recognition chip（1）, FPC circuit boards（2）, connection
Device（3）, becket（4）And button key（11）, the fingerprint recognition chip（1）Positioned at FPC circuit boards（2）Middle part simultaneously passes through weldering
Tin is electrically connected, the fingerprint recognition chip（1）With FPC circuit boards（2）Opposite surface is covered with a cover plate（5）, the fingerprint
Identification chip（1）Lateral surface and and becket（4）Fluid sealant is provided between medial surface（6）；
The connector（3）It is installed on FPC circuit boards（2）Rear end, this connector（3）With fingerprint recognition chip（1）It is located at respectively
FPC circuit boards（2）Both sides, a sheet metal（16）It is installed on FPC circuit boards（2）With connector（3）Opposite surface, the metal
Ring（4）Left end, right-hand member bottom be respectively provided with outside outward flange（7）, the becket（4）Upper surface bottom have it is inside
Inward flange（8）, the fingerprint recognition chip（1）It is installed on becket（4）Interior and and inward flange（8）It is horizontally disposed, the cover plate
（5）It is covered in fingerprint recognition chip（1）And inward flange（8）Top；
The FPC circuit boards（2）Rear end have a bending part（12）, the button key（11）It is installed on bending part（12）Under
Surface, this bending part（12）Upper surface be located at fingerprint recognition chip（1）Underface FPC circuit boards（2）Lower surface between
It is disposed with the first adhesive layer（13）, steel disc（14）With the second adhesive layer（15）.
2. fingerprint recognition semiconductor devices according to claim 1, it is characterised in that：The fingerprint recognition chip（1）Shape
Shape is that four sides have the square of rounding, the rectangle of rounded, track type or rhombus.
3. fingerprint recognition semiconductor devices according to claim 1, it is characterised in that：The becket（4）Left end, the right side
Chamfered section is provided with end and lower end base inner side（10）.
4. fingerprint recognition semiconductor devices according to claim 1, it is characterised in that：One electronic component（9）Positioned at FPC
Circuit board（2）Near connector（3）Region.
5. fingerprint recognition semiconductor devices according to claim 1, it is characterised in that：The becket（4）Lower surface
Bottom has outside outward flange（7）, chamfered section is provided with the inward flange bottom inside（10）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621177935.8U CN206209776U (en) | 2016-10-27 | 2016-10-27 | Fingerprint recognition semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621177935.8U CN206209776U (en) | 2016-10-27 | 2016-10-27 | Fingerprint recognition semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206209776U true CN206209776U (en) | 2017-05-31 |
Family
ID=58756832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621177935.8U Expired - Fee Related CN206209776U (en) | 2016-10-27 | 2016-10-27 | Fingerprint recognition semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206209776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
-
2016
- 2016-10-27 CN CN201621177935.8U patent/CN206209776U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110210388A (en) * | 2019-05-31 | 2019-09-06 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| CN110210388B (en) * | 2019-05-31 | 2021-03-09 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170531 Termination date: 20181027 |