CN203760462U - Fingerprint identification chip packaging module - Google Patents
Fingerprint identification chip packaging module Download PDFInfo
- Publication number
- CN203760462U CN203760462U CN201320864175.8U CN201320864175U CN203760462U CN 203760462 U CN203760462 U CN 203760462U CN 201320864175 U CN201320864175 U CN 201320864175U CN 203760462 U CN203760462 U CN 203760462U
- Authority
- CN
- China
- Prior art keywords
- identification
- fingerprint chip
- encapsulation module
- bearer bar
- chip encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000005538 encapsulation Methods 0.000 claims description 61
- 239000004020 conductor Substances 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 9
- 230000003068 static effect Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000002054 transplantation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
An embodiment of the utility model provides a chip package module is discerned to fingerprint, chip package module is discerned to fingerprint includes base plate, fingerprint and discerns chip and bearer bar. The substrate has an upper surface defining a working area and a peripheral area around the working area, wherein the substrate includes at least one grounding pad exposed on the upper surface. The fingerprint identification chip is arranged on the upper surface of the substrate and is positioned in the working area. The protective frame is arranged on the upper surface of the substrate and in the peripheral region, the protective frame is electrically connected with the grounding pad, and the protective frame surrounds the fingerprint identification chip. Therefore, when a finger or other object contacts the sensing region of the fingerprint identification chip, the protective frame bears the force applied by a part of the finger or other object, so that the protective frame can be used for enhancing the overall structural strength of the fingerprint identification chip packaging module.
Description
Technical field
The utility model relates to a kind of identification of fingerprint chip encapsulation module, and particularly relates to the identification of fingerprint chip encapsulation module with bearer bar.
Background technology
Common identification of fingerprint chip encapsulation module mainly comprises substrate, chip and adhesive body at present.Chip is arranged on substrate and with electrical property of substrate and is connected, and adhesive body is covered on the surface and segment chip of substrate, and exposes the sensing area of chip.
In general,, in the time of the sensing area of finger contact chip, chip will bear the strength that comes from finger.According to this, chip is easy because repeatedly meet with stresses, and causes chip to produce crack.In addition, the sensing area of human body or other object contact chips all may produce static discharge (electrostatic discharge, ESD), and then easily chip is caused damage.
Utility model content
The utility model embodiment provides a kind of identification of fingerprint chip encapsulation module, and its bearer bar is installed in identification of fingerprint chip around.
The utility model embodiment provides a kind of identification of fingerprint chip encapsulation module, and described identification of fingerprint chip encapsulation module comprises substrate, identification of fingerprint chip and bearer bar.Substrate has a upper surface and upper surface defines working region and is positioned at the neighboring area of the surrounding of working region, and wherein substrate comprises at least one ground mat, and ground mat is exposed to upper surface.Identification of fingerprint chip is positioned at working region.Bearer bar is disposed at the upper surface of substrate, and bearer bar and ground mat are electrically connected.
Further, the material of bearer bar is metal material.
Further, bearer bar is a lead frame.
Further, bearer bar comprises multiple frame sections and a bottom portion, and frame section is connected with bottom portion, and identification of fingerprint chip configuration is on bearer bar, and frame section is around the surrounding of identification of fingerprint chip, and bottom portion is disposed at upper surface.
Further, frame section is each other at a distance of a spacing, to form an opening between at least two frame sections.
Further, bearer bar is formed with a fluting, and identification of fingerprint chip configuration is in upper surface and be positioned at fluting.
Further, identification of fingerprint chip encapsulation module also comprises multiple electronic components, and electronic component arrangements is in the upper surface of substrate.
Further, bottom portion has a storage tank, and storage tank exposes upper surface and in order to holding electronic element.
Further, identification of fingerprint chip encapsulation module also comprises an electric conducting material, and electric conducting material binds bearer bar and substrate.
Further, bearer bar also comprises a pin portion, and pin portion is connected with bottom portion.
In sum, the utility model embodiment provides a kind of identification of fingerprint chip encapsulation module.Identification of fingerprint chip encapsulation module comprises substrate, identification of fingerprint chip and bearer bar.Bearer bar comprises multiple frame sections and a bottom portion, and wherein, frame section is connected with bottom portion.Frame section is around the surrounding of identification of fingerprint chip, and do not contact with identification of fingerprint chip, and bottom portion is disposed at the upper surface of substrate.These frame sections can be at a distance of a spacing, to form opening between at least two frame sections each other.Can cover wire by the material of these opening perfusion insulating barriers.In addition, also can pour into an insulating material and be covered in by opening the top of identification of fingerprint chip.Bottom portion can have storage tank, and storage tank exposes the upper surface of substrate with holding electronic element.
In the time of finger or the sensing area of other object contact identification of fingerprint chips, bearer bar is born Toe Transplantation for Segmental Finger or other object applied force amounts, thereby bearer bar can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module.In addition, bearer bar can also transmit the static of pointing or other objects bring by ground mat, thereby bearer bar can provide the purposes of identification of fingerprint chip electro-static discharge protection.
In addition; for the configuration design of different electronic components with take the overall construction intensity demand of identification of fingerprint chip encapsulation module into account; bearer bar can be by slotting accommodating identification of fingerprint chip, thereby bearer bar can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module and finger or the static that brings of other objects are transmitted by ground mat.
In order further to understand the technology that the utility model is taked, refer to following relevant detailed description of the present utility model, graphic, believe feature of the present utility model and feature, when being goed deep into thus and concrete understanding, but appended graphic and annex only provide with reference to and explanation use, be not used in addition limitr of the utility model.
Brief description of the drawings
Figure 1A is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the first embodiment.
Figure 1B is the generalized section that in Figure 1A, P-P section along the line illustrates.
Fig. 2 is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the second embodiment.
Fig. 3 is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the 3rd embodiment.
[symbol description]
100,200,300 identification of fingerprint chip encapsulation modules
110 substrates
112 ground mats
120 identification of fingerprint chips
120a sensing area
130,230,330 bearer bars
130a, 230a frame section
130b, 230b bottom portion
140 electric conducting materials
150 electronic components
160 insulating barriers
The upper packaging body of 170a
170b lower package body
180 pin frames
230c pin portion
A1 working region
A2 neighboring area
D1 storage tank
H1 fluting
N1 opening
W1 wire
S1 upper surface
S2 lower surface
Embodiment
Figure 1A is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the first embodiment, and Figure 1B is the generalized section that in Figure 1A, P-P section along the line illustrates.Refer to Figure 1A and Figure 1B, identification of fingerprint chip encapsulation module 100 comprises substrate 110, identification of fingerprint chip 120 and bearer bar 130, and wherein bearer bar 130 and identification of fingerprint chip 120 are all disposed on substrate 110.
The support plate (carrier) of substrate 110 in order to configure as identification of fingerprint chip 120 and various electronic component 150.Substrate 110 has a upper surface S1 and lower surface S2, and upper surface S1 defines a working region A1 and and is positioned at working region A1 neighboring area A2 around.Substrate 110 comprises at least one ground mat 112, and ground mat 112 is exposed to upper surface S1.In practice, substrate 110 can be circuit board or flexible printed wiring board (flexible printed circuit board, FPCB), and these ground mats 112 and the circuit (not shown) that is positioned at upper surface S1 can arrange according to the configuration needs of identification of fingerprint chip 120.
It is upper that identification of fingerprint chip 120 is disposed at bearer bar 130b, and bearer bar 130 is disposed at the upper surface S1 of substrate 110, and identification of fingerprint chip 120 is positioned at working region A1.Identification of fingerprint chip 120 has a sensing area 120a, and sensing area 120a is positioned on the active surface (active surface) of identification of fingerprint chip 120.In the utility model embodiment, identification of fingerprint chip 120 is electrically connected with routing mode (wire bonding) and substrate 110 by wire W1.But, identification of fingerprint chip 120 can be to be also otherwise electrically connected with substrate 110, for example, be that the circuit of chip bonding mode (flip chip) or other method for packing and substrate 110 is electrically connected.The utility model is not limited the configuration mode of identification of fingerprint chip 120.
Bearer bar 130 is disposed at the upper surface S1 of substrate 110.Bearer bar 130 comprises multiple frame section 130a and a 130b of bottom portion, and wherein, frame section 130a and the 130b of bottom portion are connected.Frame section 130a is around identification of fingerprint chip 120 surroundings, and can not contact with identification of fingerprint chip 120, and the 130b of bottom portion is disposed at the upper surface S1 of substrate 110.In the present embodiment, these frame sections 130a can be that to form opening N1 between at least two frame section 130a, and the 130b of bottom portion is disposed at working region A1 and neighboring area A2 at a distance of a spacing each other.
What deserves to be explained is, in other embodiment, can pour into insulating material (not shown) by opening N1 and be covered in identification of fingerprint chip 120 tops, so that identification of fingerprint chip encapsulation module 100 forms a capacitive touch chip module or infrared induction touch-control chip module.In addition, for the configuration design of different electronic component 150, the 130b of bottom portion can be formed with storage tank D1, and storage tank D1 exposes the upper surface S1 of substrate 110 and in order to holding electronic element 150.But, the utility model is not limited the quantity of storage tank D1.
Bearer bar 130 is electrically connected with ground mat 112.In addition, and bearer bar 130 can be used as a part for signal line, confession ground circuit and electric first circuit, so bearer bar 130 has the function that circuit connects.The material of bearer bar 130 is metal material or alloy material; for example, dilval, copper alloy etc., and in the present embodiment; bearer bar 130 can be a lead frame (Lead Frame), and bearer bar 130 can form via punching press (stamping).In addition, bearer bar 130 can be to process punching production in mode in flakes, then made through cutting again.
What deserves to be explained is; in the time of finger or the sensing area 120a of other object contact identification of fingerprint chips 120; bearer bar 130 can be born Toe Transplantation for Segmental Finger or other object applied force amounts, thereby bearer bar 130 can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module 100.In addition, bearer bar 130 can also transmit the static of pointing or other objects bring by ground mat 112, thereby bearer bar 130 can provide the purposes of identification of fingerprint chip 120 electrostatic discharge protectives.
Bearer bar 130 can be electrically connected with ground mat 112 by electric conducting material 140, and binds with substrate 110.Specifically, electric conducting material 140 is positioned at upper surface S1, and electric conducting material 140 also can be disposed on ground mat 112.Electric conducting material 140 can bind with substrate 110 in order to bind bearer bar 130; and bearer bar 130 and ground mat 112 are electrically connected; wherein electric conducting material 140 can be elargol, scolding tin, copper cream, aeolotropic conductive film (Anisotropic Conductive Film, ACF) or other electric conducting materials.
Electronic component 150 is disposed at upper surface S1 above or lower surface S2, and is electrically connected with substrate 110.What deserves to be explained is, electronic component 150 can comprise multiple all kinds, is also that the kind of these electronic components 150 is also incomplete same.Electronic component 150 can be multiple incomplete same electronic components, for example, be chip, transistor, diode, electric capacity, inductance or other high frequencies, radio frequency (Radio frequency, RF) element etc.As shown in Figure 1A, electronic component 150 can comprise different kinds, but all represents with electronic component 150 at this.But, the kind to electronic component 150 and allocation position are not limited the utility model.
The working region A1 that insulating barrier 160 is disposed at upper surface S1 goes up and is covered on wire W1 and part identification of fingerprint chip 120.Specifically, insulating barrier 160 is resin material, for example, be silicon resin glue (Silicon) or epoxide-resin glue.By ink-jetting style (spray), the printing of steel plate frictioning or precise glue dispensing mode, insulating barrier 160 is covered in to wire W1 and does not cover the sensing area 120a of identification of fingerprint chip 120.
The neighboring area A2 that upper packaging body 170a is disposed at upper surface S1 goes up and is covered in the electronic component 150 that is disposed at upper surface S1, and lower package body 170b is disposed at lower surface S2 and be covered in the electronic component 150 and the substrate 110 that are disposed at lower surface S2.What deserves to be explained is, upper packaging body 170a and lower package body 170b are mould sealing, in order to avoid the producing unnecessary situation such as electric connection or short circuit between electronic component 150.Upper packaging body 170a and lower package body 170b can be the prepreg bed of materials (Preimpregnated Material) with stickiness, and wherein the prepreg bed of material is for example the materials such as glass fibre prepreg (Glass fiber prepreg), carbon fibre initial rinse material (Carbon fiber prepreg), ceramic material (as alundum (Al2O3)) or epoxy resin.
Identification of fingerprint chip encapsulation module 100 can also comprise a pin frame 180, and pin frame 180 is disposed at the lower surface S2 of substrate 110.Pin frame 180 can be served as the pin of identification of fingerprint chip encapsulation module 100 and extraneous electric connection.But, the utility model is not limited pin frame 180.
Fig. 2 is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the second embodiment.The identification of fingerprint chip encapsulation module 200 of the second embodiment and the identification of fingerprint chip encapsulation module of the first embodiment 100 the two structural similarity, effect is identical, for example, identification of fingerprint chip encapsulation module 200 with the same substrate 110 that all comprises of identification of fingerprint chip encapsulation module 100.Below by the identification of fingerprint chip encapsulation module 200 of only introducing and the two difference of identification of fingerprint chip encapsulation module 100, it is no longer repeated for identical feature.
Refer to Fig. 2, bearer bar 230 also comprises the 230c of pin portion, if the 230c of pin portion ground signalling pin can be connected with the 130b of bottom portion, if other signal pins, can with the connection (not shown) of surperficial S1.What deserves to be explained is, the 230c of pin portion can be served as the pin of identification of fingerprint chip encapsulation module 200 and extraneous electric connection, thereby identification of fingerprint chip encapsulation module 200 is able to be electrically connected with the external world by the 230c of pin portion.
In addition, electronic component 150 can be to be only disposed at upper surface S1, and therefore identification of fingerprint chip encapsulation module 200 can not comprise lower package body 170b.
Fig. 3 is the structural representation of the identification of fingerprint chip encapsulation module of the utility model the 3rd embodiment.The identification of fingerprint chip encapsulation module 300 of the 3rd embodiment and the identification of fingerprint chip encapsulation module of the first embodiment 100 the two structural similarity, effect is identical, identification of fingerprint chip encapsulation module 300 all comprise substrate 110 same with identification of fingerprint chip encapsulation module 100 for example.Below by the identification of fingerprint chip encapsulation module 300 of only introducing and the two difference of identification of fingerprint chip encapsulation module 100, it is no longer repeated for identical feature.
For the configuration design of different electronic component 150 with take the overall construction intensity demand of identification of fingerprint chip encapsulation module 300 into account, the shape of bearer bar 330 can have multiple variation.Refer to Fig. 3; in the present embodiment; bearer bar 330 is formed with a fluting H1, and identification of fingerprint chip 120 is disposed at the upper surface S1 of substrate 110 and sensing area 120a is positioned at fluting H1 scope, and that electric conducting material 140 is positioned at the neighboring area A2 of upper surface S1 is upper and can be round working region A1.Bearer bar 330 can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module 100 and the static of pointing or other objects bring transmitted by ground mat 112.
In sum, the utility model embodiment provides a kind of identification of fingerprint chip encapsulation module.Identification of fingerprint chip encapsulation module comprises substrate, identification of fingerprint chip and bearer bar.Bearer bar comprises multiple frame sections and a bottom portion, and wherein, frame section and bottom portion are connected.Frame section is around the surrounding of identification of fingerprint chip, and do not contact with identification of fingerprint chip, and bottom portion is disposed at the upper surface of substrate.These frame sections can be at a distance of a spacing, to form opening between at least two frame sections each other.Can cover wire by the material of these opening perfusion insulating barriers.In addition, also can pour into an insulating material and be covered in by opening the top of identification of fingerprint chip.Bottom portion can have storage tank, and storage tank exposes the upper surface of substrate with holding electronic element.
In the time of finger or the sensing area of other object contact identification of fingerprint chips, bearer bar is born Toe Transplantation for Segmental Finger or other object applied force amounts, thereby bearer bar can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module.In addition, bearer bar can also transmit the static of pointing or other objects bring by ground mat, thereby bearer bar can provide the purposes of identification of fingerprint chip electro-static discharge protection.
In addition; for the configuration design of different electronic components with take the overall construction intensity demand of identification of fingerprint chip encapsulation module into account; bearer bar can be by slotting accommodating identification of fingerprint chip, thereby bearer bar can be in order to strengthen the overall construction intensity of identification of fingerprint chip encapsulation module and finger or the static that brings of other objects are transmitted by ground mat.
The foregoing is only embodiment of the present utility model, it is not in order to limit scope of patent protection of the present utility model.Any those of ordinary skill in the art, not departing from spirit of the present utility model and scope, the change of doing and the equivalence of retouching are replaced, and are still in scope of patent protection of the present utility model.
Claims (10)
1. an identification of fingerprint chip encapsulation module, is characterized in that, described identification of fingerprint chip encapsulation module comprises:
One substrate, described substrate has a upper surface and described upper surface and defines a working region and and be positioned at the neighboring area of the surrounding of described working region, and described substrate comprises at least one ground mat, and described ground mat is exposed to described upper surface;
One identification of fingerprint chip, described identification of fingerprint chip is positioned at described working region; And
One bearer bar, described bearer bar is disposed at described upper surface, and described bearer bar and described ground mat are electrically connected.
2. identification of fingerprint chip encapsulation module according to claim 1, is characterized in that, the material of described bearer bar is metal material.
3. identification of fingerprint chip encapsulation module according to claim 1, is characterized in that, described bearer bar is a lead frame.
4. identification of fingerprint chip encapsulation module according to claim 1; it is characterized in that; described bearer bar comprises multiple frame sections and a bottom portion; described frame section is connected with described bottom portion; described identification of fingerprint chip configuration is on described bearer bar; described frame section is around the surrounding of described identification of fingerprint chip, and described bottom portion is disposed at described upper surface.
5. identification of fingerprint chip encapsulation module according to claim 4, is characterized in that, described frame section is each other at a distance of a spacing, to form an opening between at least two frame sections.
6. identification of fingerprint chip encapsulation module according to claim 1, is characterized in that, described bearer bar is formed with a fluting, and described identification of fingerprint chip configuration is in described upper surface and be positioned at described fluting.
7. identification of fingerprint chip encapsulation module according to claim 4, is characterized in that, described identification of fingerprint chip encapsulation module also comprises multiple electronic components, and described electronic component arrangements is in the upper surface of described substrate.
8. identification of fingerprint chip encapsulation module according to claim 7, is characterized in that, described bottom portion has a storage tank, and described storage tank exposes described upper surface and in order to accommodating described electronic component.
9. identification of fingerprint chip encapsulation module according to claim 1, is characterized in that, described identification of fingerprint chip encapsulation module also comprises an electric conducting material, and described electric conducting material binds described bearer bar and described substrate.
10. identification of fingerprint chip encapsulation module according to claim 4, is characterized in that, described bearer bar also comprises a pin portion, and described pin portion is connected with described bottom portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102223387 | 2013-12-11 | ||
| TW102223387U TWM475697U (en) | 2013-12-11 | 2013-12-11 | Package module of fingerprint recognition chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203760462U true CN203760462U (en) | 2014-08-06 |
Family
ID=51255705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320864175.8U Expired - Fee Related CN203760462U (en) | 2013-12-11 | 2013-12-25 | Fingerprint identification chip packaging module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203760462U (en) |
| TW (1) | TWM475697U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269393A (en) * | 2014-09-15 | 2015-01-07 | 江苏长电科技股份有限公司 | Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof |
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN105607774A (en) * | 2015-12-28 | 2016-05-25 | 联想(北京)有限公司 | Information processing device and method |
| TWI574186B (en) * | 2015-02-03 | 2017-03-11 | 宸鴻科技（廈門）有限公司 | Touch control device |
-
2013
- 2013-12-11 TW TW102223387U patent/TWM475697U/en unknown
- 2013-12-25 CN CN201320864175.8U patent/CN203760462U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104269393A (en) * | 2014-09-15 | 2015-01-07 | 江苏长电科技股份有限公司 | Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof |
| TWI574186B (en) * | 2015-02-03 | 2017-03-11 | 宸鴻科技（廈門）有限公司 | Touch control device |
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN105607774A (en) * | 2015-12-28 | 2016-05-25 | 联想(北京)有限公司 | Information processing device and method |
| CN105607774B (en) * | 2015-12-28 | 2019-05-31 | 联想(北京)有限公司 | A kind of information processing unit and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM475697U (en) | 2014-04-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 Termination date: 20161225 |
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| CF01 | Termination of patent right due to non-payment of annual fee |