CN105224926A - Fingerprint recognition module installation method and fingerprint recognition module mounting structure - Google Patents
Fingerprint recognition module installation method and fingerprint recognition module mounting structure Download PDFInfo
- Publication number
- CN105224926A CN105224926A CN201510649141.0A CN201510649141A CN105224926A CN 105224926 A CN105224926 A CN 105224926A CN 201510649141 A CN201510649141 A CN 201510649141A CN 105224926 A CN105224926 A CN 105224926A
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- chip
- fixed area
- becket
- recognition module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000009434 installation Methods 0.000 title claims abstract description 21
- 239000000565 sealant Substances 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 229920000297 Rayon Polymers 0.000 claims abstract description 24
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 239000006071 cream Substances 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The invention discloses a kind of fingerprint recognition module installation method and fingerprint recognition module mounting structure, described fingerprint recognition module installation method comprises: provide a circuit board, described circuit board has chip fixed area and around the adhesive area around described chip fixed area, and is positioned at the becket fixed area of described adhesive area week side; There is provided a fingerprint recognition chip, described fingerprint recognition chip is welded in described chip fixed area through surface mount process, all sides of described fingerprint recognition chip and described adhesive area form angle; Filling with sealant in described angle; Viscose glue is set at described becket fixed area, described metal ring is located at described fingerprint recognition chip week side, and is adhered on described becket fixed area.Described fluid sealant can stop liquid to enter gap between described fingerprint recognition chip and described circuit board, thus improves the connection fixing of described fingerprint recognition chip and described circuit board, thus improves the usability of fingerprint recognition module.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of fingerprint recognition module installation method and fingerprint recognition module mounting structure.
Background technology
The mounting process of current fingerprint recognition module is through SMT (SurfaceMountTechnology by fingerprint recognition chip and becket, surface mounting technology) be welded on circuit board, or utilize ACF (AnisotropicConductiveFilm, anisotropy conductiving glue) to be adhered on circuit board.
Adopting SMT technique fingerprint recognition chip and becket to be all welded in circuit board easily causes liquid to flow into gap place between fingerprint recognition chip and circuit board, and butt welding point is corroded, and affects soldering reliability, or directly causes solder joint to rupture; Further, fingerprint recognition chip is depended merely on solder joint and is fixed, and adhesion is not good, easily makes fingerprint recognition chip come off, thus affect the usability of fingerprint recognition module when fingerprint recognition module is subject to enormous impact power.
Just fingerprint recognition chip and becket fit in circuit board and there is the not good and bonding unsteady problem of electric conductivity to adopt ACF glue mode, due between fingerprint recognition chip and circuit board be by ACF conducting particles to realize electrical property be communicated with, but the number of conducting particles is limited after all, and affect by processing procedure, conducting particles and circuit board and fingerprint recognition chip differ good contact surely, and therefore electrical property connection reliability is poor; Simultaneously due to the corrosion-resistant of ACF, flow into the gap place between fingerprint recognition chip and circuit board at liquid, easily cause ACF to be corroded, thus affect the integrity problem of fingerprint recognition module.
Therefore current fingerprint recognition module installation method easily causes the problems such as fingerprint recognition module is not firm, usability is not good.
Summary of the invention
The invention provides a kind of fingerprint recognition module installation method and the fingerprint recognition module mounting structure that can improve usability.
The invention provides a kind of fingerprint recognition module installation method, wherein, described fingerprint recognition module installation method comprises:
There is provided a circuit board, described circuit board has chip fixed area and around the adhesive area around described chip fixed area, and is positioned at the becket fixed area of described adhesive area week side;
There is provided a fingerprint recognition chip, described fingerprint recognition chip is welded in described chip fixed area through surface mount process, all sides of described fingerprint recognition chip and described adhesive area form angle;
Filling with sealant in described angle;
Viscose glue is set at described becket fixed area, described metal ring is located at described fingerprint recognition chip week side, and is adhered on described becket fixed area.
Wherein, after the step that a circuit board is provided, and before the step that a fingerprint recognition chip is provided, print solder paste on described chip fixed area.
Wherein, provide in the step of a fingerprint recognition chip, between the periphery of described fingerprint recognition chip and described chip fixed area, there is gap.
Wherein, in described angle filling with sealant step in, described fluid sealant is also filled in described gap.
Wherein, provide in the step of a circuit board, described becket fixed area is marked off conducting resinl district and insulating gel district;
Arrange in the step of viscose glue at described becket fixed area, conductive viscose is set in described conducting resinl district, insulation viscose glue is set in described insulating gel district.
The present invention also provides a kind of fingerprint recognition module mounting structure, wherein, described fingerprint recognition module mounting structure comprises circuit board, fingerprint recognition chip and becket, described circuit board comprises installed surface, described installed surface comprises chip fixed area, around adhesive area and the becket fixed area being arranged at described adhesive area week side of all sides of described chip fixed area, described fingerprint recognition chip is fixed on described chip fixed area, all sides of described fingerprint recognition chip and described adhesive area form angle, filling with sealant in described angle, described metal ring is located at described fingerprint recognition chip week side, and be fixed on described becket fixed area.
Wherein, tin cream is welded with between described fingerprint recognition chip and described chip fixed area.
Wherein, there is gap between the periphery of described fingerprint recognition chip and described chip fixed area, described fluid sealant is also filled in described gap.
Wherein, described becket comprises the bottom surface fitting in described becket fixed area, and is sheathed on the medial surface of described fingerprint recognition chip, and the angle between described bottom surface and described medial surface arranges groove, the described fluid sealant of collecting in described groove.
Wherein, described becket fixed area comprises conducting resinl district and is connected to the insulating gel district in described conducting resinl district, bonding conductive viscose between described conducting resinl district and described becket, bonding insulation viscose glue between described insulating gel district and described becket.
Fingerprint recognition module installation method of the present invention and fingerprint recognition module mounting structure, by all sides and the described adhesive area formation angle region of described fingerprint recognition chip, filling with sealant in described angle region, thus make described fluid sealant that liquid can be stoped to enter gap between described fingerprint fingerprint recognition chip and described circuit board, thus improve the connection fixing of described fingerprint recognition chip and described circuit board, thus improve the usability of fingerprint recognition module.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of fingerprint recognition module mounting structure provided by the invention;
Fig. 2 is the vertical view of the circuit board of the fingerprint recognition module mounting structure of Fig. 1;
Fig. 3 is the schematic flow sheet of fingerprint recognition module installation method provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1 and Fig. 2, a kind of fingerprint recognition module mounting structure 100 provided by the invention, described fingerprint recognition module mounting structure 100 comprises circuit board 10, fingerprint recognition chip 20 and becket 30.Described circuit board 10 comprises installed surface 11, and described installed surface 11 comprises chip fixed area 111, around the adhesive area 112 of described chip fixed area 111 weeks sides and the becket fixed area 113 around described adhesive area 112 setting.Described fingerprint recognition chip 20 is fixed on described chip fixed area 112, and all sides of described fingerprint recognition chip 20 and described adhesive area 112 form angle region (sign), filling with sealant 112a in described angle region.Described becket 30 is sheathed on described fingerprint recognition chip 20 weeks sides, and is fixed on described becket 30 fixed area.
Angle region is formed by all sides of described fingerprint recognition chip 20 and described adhesive area 112, filling with sealant 112a in described angle region, thus make described fluid sealant 112a that liquid can be stoped to enter gap between described fingerprint fingerprint recognition chip 20 and described circuit board 10, thus improve the connection fixing of described fingerprint recognition chip 20 and described circuit board 10, thus improve the usability of fingerprint recognition module 100.
In present embodiment, described circuit board 10 is printed circuit board (PCB).Described circuit board 10 comprises the bottom surface 12 that installed surface 11 is arranged with relative described installed surface 11.Described installed surface 11 installs described fingerprint recognition chip 20 and described becket 30, and described bottom surface 12 is for being fixed on terminal, and described terminal can be mobile phone or panel computer or notebook computer etc.Described installed surface 11 is provided with the circuit connecting described fingerprint recognition chip 20 and described becket 30, concrete, described chip fixed area 111 and described becket fixed area 113 are provided with the incoming end of this circuit, thus when described fingerprint recognition chip 20 and described becket 30 are individually fixed in described chip fixed area 111 and described becket fixed area 113, realize described circuit board 10 and described fingerprint recognition chip 20, and described becket 30 is electrically connected.More specifically, described chip fixed area 111 is rectangular.Described adhesive area 112 is connected to the surrounding of described chip fixed area 111.Described becket fixed area 113 can be connected to described adhesive area 112, also can and described adhesive area 112 between setting space.In other embodiments, described circuit board can also be flexible PCB.
In present embodiment, the rectangular tabular of described fingerprint recognition chip 20.Described fingerprint recognition chip 20 comprises bottom surface 21 and is connected to the side 22 of described bottom surface 21, described bottom surface 21 correspondence is covered in described chip fixed area 111, thus described side 22 is arranged in angle with described adhesive area 112, thus the sealing of described fluid sealant 112a to described fingerprint recognition chip 20 and described circuit board 10 is improved, thus effectively prevent the bottom surface 21 of fingerprint recognition chip 20 described in liquid corrosion, thus improve the serviceable life of fingerprint recognition module.In other embodiments, described fingerprint recognition chip 20 can also be circular plate.
In present embodiment, described becket 30 is rectangular ring.Described becket 30 is sheathed on all sides of described fingerprint recognition chip 20, and described becket 30 comprises the bottom surface 31 fitting in described becket fixed area 113, and is sheathed on the medial surface 32 of described fingerprint recognition chip 20 weeks sides.Be adhesively fixed by viscose glue between bottom surface 31 and described becket fixed area 113 described in described bottom surface 31, and utilize viscose glue to realize being electrically connected described circuit board 10.Side 22 clearance fit of described medial surface 32 and described fingerprint recognition chip 20, thus facilitate the installation of described becket 30.In other embodiments, described becket 30 can also be rounded ring-type.
Further, tin cream 20a is welded with between described fingerprint recognition chip 20 and described chip fixed area 111.Concrete, described fingerprint recognition chip 20 is welded on described chip fixed area 111 through surface mounting technology, described chip fixed area 111 prints described tin cream 20a, then by after described tin cream 20a heating and melting, described fingerprint recognition chip 20 is positioned on described chip fixed area 111, thus described fingerprint recognition chip 20 utilizes described tin cream 20a to be welded on described chip fixed area 111, and described fingerprint recognition chip 20 is electrically connected through described tin cream 20a and described circuit board 10, thus increase the electric connection performance of described fingerprint recognition chip 20 and described circuit board 10.
Further, there is gap 111a between the periphery of described fingerprint recognition chip 20 and described chip fixed area 111, described fluid sealant 112a is also filled in described gap 111a.
Concrete, when described fingerprint recognition chip 20 is welded in described chip fixed area 111, owing to there is tin cream 20a between described fingerprint recognition chip 20 and described chip fixed area 111, thus after described tin cream 20a solidifies, separated by described tin cream 20a between the bottom surface 21 of described fingerprint recognition chip 20 and described chip fixed area 111, thus there is gap between described bottom surface 21 and described chip fixed area 111.By there is described gap 111a between described bottom surface 21 and described chip fixed area 111, thus increase the heat dispersion of described fingerprint recognition chip 20.Simultaneously, when filling described fluid sealant 112a in described angle, described fluid sealant 112a is filled in described gap 111a, thus utilize described fluid sealant 112a to stop liquid to enter in described gap 111a, thus prevent described tin cream 20a to be corroded, thus increase the electrical connection properties of described fingerprint recognition chip 20 and described circuit board 10 and firm performance, the serviceable life of described fingerprint recognition module mounting structure 100 is improved.
Further, described becket 30 comprises the bottom surface 31 fitting in described becket fixed area 113, and being sheathed on the medial surface 32 of described fingerprint recognition chip 20, the angle between described bottom surface 31 and described medial surface 32 arranges groove 33, the described fluid sealant 112a of collecting in described groove 33.
Concrete, described groove 33 is bevelling, because described medial surface 32 to be less than the width of described adhesive area 112 apart from described side 22, therefore the angle between described medial surface 32 and described bottom surface 31 arranges described groove 33, make between described becket 30 and described fingerprint recognition chip 20, have sufficient space to hold described fluid sealant 112a, thus ensure the sealing property of described fingerprint recognition chip 20 and described circuit board 10.In other embodiments, described groove 33 can also be rectangular recess.
Further, described becket fixed area 113 comprises conducting resinl district 113a and is connected to the insulating gel district 113b of described conducting resinl district 113a, bonding conductive viscose 30a between described conducting resinl district 113a and described becket 30, bonding insulation viscose glue 30b between described insulating gel district 113b and described becket 30.
Concrete, described becket fixed area 113 comprises the insulating gel district 113b that two described conducting resinl district 113a and two be oppositely arranged are oppositely arranged.Two described conduction suburb 113a and two interlaced settings of described insulating gel district 113b, and enclose the surrounding of described adhesive area 112.Utilize described conductive viscose 30a to be adhered between described becket 30 and described circuit board 10 thus ensure the electrical connection properties between described becket 30 and described circuit board 10, utilize described insulation viscose glue 30b to be adhered between described becket 30 and described circuit board 10 simultaneously, thus ensure the firm performance of described becket 30 and described circuit board 10, thus improve the usability of described fingerprint recognition module 100.
See also Fig. 1, Fig. 2 and Fig. 3, the present invention also provides a kind of fingerprint recognition module installation method, and described fingerprint recognition module installation method comprises:
S01 a: circuit board 10 is provided, described circuit board 10 has chip fixed area 111 and around the adhesive area 112 around described chip fixed area 111, and around the becket fixed area 113 around described adhesive area 112.In present embodiment, described becket fixed area 113 is marked off conducting resinl district 113a and the insulating gel district 113b being connected to described conducting resinl district 113a.
S02: print solder paste 20a on described chip fixed area 111.
In present embodiment, be printed in by described tin cream 20a on described chip fixed area 111, described tin cream 20a is molten condition.
S03: provide a fingerprint recognition chip 20, is welded in described chip fixed area 111 by described fingerprint recognition chip 20 through surface mount process, and all sides and the described adhesive area 112 of described fingerprint recognition chip 20 form angle.In present embodiment, tin cream 20a on described circuit board 10 is heated, tin cream 20a is in a liquid state, thus described fingerprint recognition chip 20 is mounted on described chip fixed area 111, after described tin cream 20a solidifies, realize described fingerprint recognition chip 20 and be welded on described chip fixed area 111.Meanwhile, in order to ensure the thermal diffusivity of described fingerprint recognition chip 20, preset clearance 111a between the periphery and described circuit board 10 of described fingerprint recognition chip 20, utilizes described gap 111a to increase the area of dissipation of described fingerprint recognition chip 20.
S04: filling with sealant 112a in described angle.In present embodiment, can be utilize glue spraying equipment to spray described fluid sealant 112a in described angle, in described gap 111a, spray described fluid sealant 112a simultaneously, thus increase the barrier propterty to described fingerprint recognition chip 20.
S05: arrange viscose glue at described becket fixed area 113, is sheathed on described fingerprint recognition chip 20 weeks sides, and is adhered on described becket fixed area 113 by described becket 30.In present embodiment, because described becket fixed area 113 comprises conducting resinl district 113a and insulating gel district 113b, when therefore described becket 30 being adhered on described becket fixed area 113, at described conducting resinl district 113a, conductive viscose 30a is set, at described insulating gel district 113b, insulation viscose glue 30b is set, thus utilize described conductive viscose 30a and described insulation viscose glue 30b bonding described becket 30 simultaneously, thus ensure that the electrical connection properties of described becket 30 and described circuit board 10 and firm switching performance.
Fingerprint recognition module installation method of the present invention and fingerprint recognition module mounting structure, by all sides and the described adhesive area formation angle of described fingerprint recognition chip, filling with sealant in described angle, thus make described fluid sealant that liquid can be stoped to enter gap between described fingerprint fingerprint recognition chip and described circuit board, thus improve the connection fixing of described fingerprint recognition chip and described circuit board, thus improve the usability of fingerprint recognition module.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a fingerprint recognition module installation method, is characterized in that, described fingerprint recognition module installation method comprises:
There is provided a circuit board, described circuit board has chip fixed area and the adhesive area around described chip fixed area, and around the becket fixed area that described adhesive area is arranged;
There is provided a fingerprint recognition chip, described fingerprint recognition chip is welded in described chip fixed area through surface mount process, all sides of described fingerprint recognition chip and described adhesive area form angle region;
Filling with sealant in described angle region;
Viscose glue is set at described becket fixed area, described metal ring is located at described fingerprint recognition chip week side, and is adhered on described becket fixed area.
2. fingerprint recognition module installation method according to claim 1, is characterized in that, after the step that a circuit board is provided, and before the step that a fingerprint recognition chip is provided, and print solder paste on described chip fixed area.
3. fingerprint recognition module installation method according to claim 1, is characterized in that, provides in the step of a fingerprint recognition chip, there is gap between the periphery of described fingerprint recognition chip and described chip fixed area.
4. fingerprint recognition module installation method according to claim 3, is characterized in that, in described angle filling with sealant step in, described fluid sealant is also filled in described gap.
5. fingerprint recognition module installation method according to claim 1, is characterized in that, provides in the step of a circuit board, and described becket fixed area is marked off conducting resinl district and insulating gel district;
Arrange in the step of viscose glue at described becket fixed area, conductive viscose is set in described conducting resinl district, insulation viscose glue is set in described insulating gel district.
6. a fingerprint recognition module mounting structure, it is characterized in that, described fingerprint recognition module mounting structure comprises circuit board, fingerprint recognition chip and becket, described circuit board comprises installed surface, described installed surface comprises chip fixed area, around described chip fixed area week side adhesive area and the becket fixed area that arranges around described adhesive area, described fingerprint recognition chip is fixed on described chip fixed area, all sides of described fingerprint recognition chip and described adhesive area form angle region, filling with sealant in described angle region, described metal ring is located at described fingerprint recognition chip week side, and be fixed on described becket fixed area.
7. fingerprint recognition module mounting structure according to claim 6, is characterized in that, is welded with tin cream between described fingerprint recognition chip and described chip fixed area.
8. fingerprint recognition module mounting structure according to claim 6, is characterized in that, there is gap between the periphery of described fingerprint recognition chip and described chip fixed area, described fluid sealant is also filled in described gap.
9. fingerprint recognition module mounting structure according to claim 6, it is characterized in that, described becket comprises the bottom surface fitting in described becket fixed area, and be sheathed on the medial surface of described fingerprint recognition chip, angle between described bottom surface and described medial surface arranges groove, the described fluid sealant of collecting in described groove.
10. fingerprint recognition module mounting structure according to claim 6, it is characterized in that, described becket fixed area comprises conducting resinl district and is connected to the insulating gel district in described conducting resinl district, bonding conductive viscose between described conducting resinl district and described becket, bonding insulation viscose glue between described insulating gel district and described becket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649141.0A CN105224926B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649141.0A CN105224926B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105224926A true CN105224926A (en) | 2016-01-06 |
| CN105224926B CN105224926B (en) | 2017-11-14 |
Family
ID=54993886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510649141.0A Expired - Fee Related CN105224926B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105224926B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN105512648A (en) * | 2016-01-21 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognizing and sensing device |
| CN105635366A (en) * | 2016-01-26 | 2016-06-01 | 广东欧珀移动通信有限公司 | Mobile terminal |
| CN105763681A (en) * | 2016-03-22 | 2016-07-13 | 广东欧珀移动通信有限公司 | Fingerprint-sensing assembly for terminal and terminal equipped with same |
| CN106127195A (en) * | 2016-08-30 | 2016-11-16 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
| CN106384105A (en) * | 2016-10-29 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Manufacturing method of fingerprint recognition module |
| CN106599791A (en) * | 2016-11-16 | 2017-04-26 | 江西合力泰科技有限公司 | Biological recognition module set installation structure and installation method thereof |
| CN106650627A (en) * | 2016-11-16 | 2017-05-10 | 江西合力泰科技有限公司 | Biological recognition module installation structure and installation method thereof |
| CN106778483A (en) * | 2016-11-16 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of bio-identification module with keypress function and its manufacture method |
| CN106778513A (en) * | 2016-11-15 | 2017-05-31 | 深圳天珑无线科技有限公司 | The automatic assembly method and system of a kind of fingerprint module becket |
| CN106845465A (en) * | 2017-04-17 | 2017-06-13 | 信利光电股份有限公司 | A kind of fingerprint recognition module and terminal device |
| CN106952353A (en) * | 2017-02-22 | 2017-07-14 | 苏州祥弘源电子科技有限公司 | A kind of installation method of easy-to-dismount artificial intelligence fingerprint recognition machine |
| CN107094365A (en) * | 2016-02-18 | 2017-08-25 | 深圳市汇顶科技股份有限公司 | Module and its assemble method |
| CN107742108A (en) * | 2017-01-03 | 2018-02-27 | 广东欧珀移动通信有限公司 | Support, cover plate assembly and terminal for fingerprint recognition component |
| US20180173931A1 (en) * | 2016-12-20 | 2018-06-21 | Primax Electronics Ltd. | Fingerprint identifying module |
| CN109152196A (en) * | 2018-07-25 | 2019-01-04 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117817A (en) * | 2006-10-31 | 2008-05-22 | Toshiba Corp | Semiconductor part mounting sheet member, printed wiring board, and electronic device |
| CN203760462U (en) * | 2013-12-11 | 2014-08-06 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module |
| CN104050445A (en) * | 2014-04-08 | 2014-09-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, packaging method for fingerprint identification device and intelligent terminal |
| CN204650549U (en) * | 2015-06-09 | 2015-09-16 | 江西合力泰科技有限公司 | The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket |
-
2015
- 2015-10-09 CN CN201510649141.0A patent/CN105224926B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117817A (en) * | 2006-10-31 | 2008-05-22 | Toshiba Corp | Semiconductor part mounting sheet member, printed wiring board, and electronic device |
| CN203760462U (en) * | 2013-12-11 | 2014-08-06 | 新东亚微电子股份有限公司 | Fingerprint identification chip packaging module |
| CN104050445A (en) * | 2014-04-08 | 2014-09-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, packaging method for fingerprint identification device and intelligent terminal |
| CN204650549U (en) * | 2015-06-09 | 2015-09-16 | 江西合力泰科技有限公司 | The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512648A (en) * | 2016-01-21 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognizing and sensing device |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN105635366A (en) * | 2016-01-26 | 2016-06-01 | 广东欧珀移动通信有限公司 | Mobile terminal |
| CN107094365A (en) * | 2016-02-18 | 2017-08-25 | 深圳市汇顶科技股份有限公司 | Module and its assemble method |
| CN107094365B (en) * | 2016-02-18 | 2019-10-29 | 深圳市汇顶科技股份有限公司 | Mould group and its assemble method |
| CN105763681A (en) * | 2016-03-22 | 2016-07-13 | 广东欧珀移动通信有限公司 | Fingerprint-sensing assembly for terminal and terminal equipped with same |
| CN105763681B (en) * | 2016-03-22 | 2019-02-05 | Oppo广东移动通信有限公司 | For the fingerprint sensing component of communication terminal and with its communication terminal |
| US10049259B2 (en) | 2016-08-30 | 2018-08-14 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for fabricating the same, and mobile terminal |
| US10133913B2 (en) | 2016-08-30 | 2018-11-20 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint module, method for fabricating the same, and mobile terminal |
| WO2018041145A1 (en) * | 2016-08-30 | 2018-03-08 | Guangdong Oppo Mobile Telecommunications Corp.,Ltd. | Fingerprint module, method for fabricating the same, and mobile terminal |
| CN106127195A (en) * | 2016-08-30 | 2016-11-16 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
| CN106384105A (en) * | 2016-10-29 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Manufacturing method of fingerprint recognition module |
| CN106778513A (en) * | 2016-11-15 | 2017-05-31 | 深圳天珑无线科技有限公司 | The automatic assembly method and system of a kind of fingerprint module becket |
| CN106650627A (en) * | 2016-11-16 | 2017-05-10 | 江西合力泰科技有限公司 | Biological recognition module installation structure and installation method thereof |
| CN106599791B (en) * | 2016-11-16 | 2023-06-23 | 江西合力泰科技有限公司 | Biological identification module mounting structure and mounting method thereof |
| CN106778483B (en) * | 2016-11-16 | 2023-08-22 | 江西合力泰科技有限公司 | Biological recognition module with key function and manufacturing method thereof |
| CN106778483A (en) * | 2016-11-16 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of bio-identification module with keypress function and its manufacture method |
| CN106599791A (en) * | 2016-11-16 | 2017-04-26 | 江西合力泰科技有限公司 | Biological recognition module set installation structure and installation method thereof |
| US10089517B2 (en) * | 2016-12-20 | 2018-10-02 | Primax Electronics Ltd. | Fingerprint identifying module |
| US20180173931A1 (en) * | 2016-12-20 | 2018-06-21 | Primax Electronics Ltd. | Fingerprint identifying module |
| CN107742108A (en) * | 2017-01-03 | 2018-02-27 | 广东欧珀移动通信有限公司 | Support, cover plate assembly and terminal for fingerprint recognition component |
| CN106952353A (en) * | 2017-02-22 | 2017-07-14 | 苏州祥弘源电子科技有限公司 | A kind of installation method of easy-to-dismount artificial intelligence fingerprint recognition machine |
| CN106845465A (en) * | 2017-04-17 | 2017-06-13 | 信利光电股份有限公司 | A kind of fingerprint recognition module and terminal device |
| CN109152196A (en) * | 2018-07-25 | 2019-01-04 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105224926B (en) | 2017-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105224926A (en) | Fingerprint recognition module installation method and fingerprint recognition module mounting structure | |
| US20110188214A1 (en) | Method for connection of flexible circuit boards to rigid circuit board, device for connection thereof, printed circuit board assembly, and electronic apparatus | |
| CN102570404A (en) | Protective circuit module of battery units, and auxiliary printed circuit board | |
| JP3625778B2 (en) | Printed circuit board for mounting coin-type electrical elements | |
| CN108432073A (en) | circuit structure and electrical junction box | |
| CN103369828A (en) | Circuit board system | |
| KR20160054655A (en) | Surface mounted thermal fuse for electronic device | |
| CN106707662A (en) | Camera structure | |
| WO2016056302A1 (en) | Window glass structure for vehicle | |
| CN217363615U (en) | Radiator for intelligent terminal | |
| WO2010070779A1 (en) | Anisotropic conductive resin, substrate connecting structure and electronic device | |
| CN2862364Y (en) | Combined structure for solder and terminal or solder and circuit board | |
| CN107071108A (en) | Connection component and mobile terminal | |
| CN202026529U (en) | Printed circuit board | |
| CN2798348Y (en) | Electrical connector | |
| CN105205473A (en) | Fingerprint recognition sensor and production method thereof | |
| CN210093654U (en) | Double-sided PCB with stable bonding pad structure | |
| CN205829401U (en) | A kind of vibrating motor soft board assembly | |
| CN107660085B (en) | Circuit board assembly and manufacturing method thereof, circuit board jointed board and mobile terminal | |
| CN106793466B (en) | circuit board and mobile terminal | |
| CN105430896A (en) | Flexible circuit board and mobile terminal | |
| CN205080565U (en) | Fingerprint identification sensor | |
| CN205987528U (en) | Printed circuit board assembly easily dispels heat | |
| CN203399405U (en) | Novel circuit board convenient to weld | |
| CN212876176U (en) | Paster pasting board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171114 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |