CN204650549U - The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket - Google Patents
The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket Download PDFInfo
- Publication number
- CN204650549U CN204650549U CN201520392042.4U CN201520392042U CN204650549U CN 204650549 U CN204650549 U CN 204650549U CN 201520392042 U CN201520392042 U CN 201520392042U CN 204650549 U CN204650549 U CN 204650549U
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- China
- Prior art keywords
- fingerprint recognition
- becket
- bonding agent
- recognition module
- circuit board
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Abstract
The utility model relates to the laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket, comprise becket, line module, articulamentum, line module comprises fingerprint recognition chip and flexible circuit board, fingerprint recognition chips welding is at flexible circuit board upper surface, articulamentum comprises a conductive material and a bonding agent, bonding agent surrounds described conductive material, conductive material conducting becket and flexible circuit board, the bonding described becket of bonding agent and flexible circuit board, its mode adopting bonding agent bonding is fitted becket, and conductive region is located in the encirclement of bonding agent adhesion area, conductive region can be hidden, conductive region is made to be subject to the protection of bonding agent, reduce the risk of oxidation open circuit.Meanwhile, the thickness controllability of bonding agent is high, can improve the consistency of thickness of product, and structure is simple, is worthy to be popularized.
Description
Technical field
The utility model relates to technical field of electronic products, particularly relates to the laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket.
Background technology
At present, electronic product (as mobile phone) has started to attempt importing fingerprint identification function, and provide the correlation technique of the fingerprint recognition module of this function and production technology to be all in the imperfection stage for consumer electronics products such as mobile phones, wherein, the laminating of becket and flexible circuit board is one of them.
Utility model content
In order to solve the technical matters of above-mentioned existence; the utility model provides the laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket; its mode adopting bonding agent bonding is fitted becket; and conductive region is located in the encirclement of bonding agent adhesion area; conductive region can be hidden; make conductive region be subject to the protection of bonding agent, reduce the risk of oxidation open circuit.Meanwhile, the thickness controllability of bonding agent is high, can improve the consistency of thickness of product, and concrete technical scheme is:
A laminating apparatus for fingerprint recognition module becket, comprises becket, flexible circuit board, it is characterized in that: comprise articulamentum, and described articulamentum comprises a conductive material and a bonding agent, and described bonding agent surrounds described conductive material.
A kind of fingerprint recognition module, comprise becket, line module, described line module comprises fingerprint recognition chip and flexible circuit board, and described fingerprint recognition chips welding is at flexible circuit board upper surface,, it is characterized in that: the laminating apparatus also comprising above-mentioned fingerprint recognition module becket.
Further: described conductive material conducting becket and a flexible circuit board.
Further: the bonding described becket of a described bonding agent and described flexible circuit board.
Further: a described conductive material is tin cream, elargol or conducting paste.
Further: a described bonding agent is low-temperature hot melt adhesive or epoxide-resin glue.
Further: above-mentioned fingerprint recognition module also comprises reinforcing chip, and described reinforcing chip is pasted on flexible circuit board lower surface by alite paste.
The beneficial effect that the utility model is compared with prior art had is: its mode adopting bonding agent bonding is fitted becket; and conductive region is located in the encirclement of bonding agent adhesion area; conductive region can be hidden; make conductive region be subject to the protection of bonding agent, reduce the risk of oxidation open circuit.Meanwhile, the thickness controllability of bonding agent is high, can improve the consistency of thickness of product.
Accompanying drawing explanation
Fig. 1 is the laminating apparatus structural representation of a kind of fingerprint recognition module becket of the present utility model.
Fig. 2 is the structural representation of a kind of fingerprint recognition module of the utility model.
Fig. 3 is the cut-open view along A-A direction in Fig. 2.
Embodiment
Below by specific embodiment, and 1,2,3 pair of the technical solution of the utility model is described in further detail by reference to the accompanying drawings.
The laminating apparatus of a kind of fingerprint recognition module becket shown in Fig. 1, comprises becket 1, flexible circuit board 32, comprises articulamentum 2, and described articulamentum 2 comprises conductive material 21 and a bonding agent 22, and described bonding agent 22 surrounds described conductive material 21.
A described conductive material 21 conducting becket 1 and flexible circuit board 32.
The bonding described becket 1 of a described bonding agent 22 and described flexible circuit board 32.
A described conductive material 21 is tin cream, elargol or conducting paste.
A described bonding agent 22 is low-temperature hot melt adhesive or epoxide-resin glue.
A kind of fingerprint recognition module of Fig. 2 and Fig. 3, comprise becket 1, line module 3, described line module 3 comprises fingerprint recognition chip 31 and flexible circuit board 32, described fingerprint recognition chip 31 is welded on flexible circuit board 32 upper surface, also comprise above-mentioned articulamentum 2, described articulamentum 2 comprises conductive material 21 and a bonding agent 22, described bonding agent 22 surrounds described conductive material 21, conductive material 21 conducting becket 1 and flexible circuit board 32, the bonding described becket 1 of bonding agent 22 and described flexible circuit board 32, one conductive material 21 is tin cream, elargol or conducting paste, bonding agent 22 is low-temperature hot melt adhesive or epoxide-resin glue.
Above-mentioned fingerprint recognition module also comprises reinforcing chip 33, and described reinforcing chip 33 is pasted on flexible circuit board 32 lower surface by alite paste.
It adopts the bonding mode of bonding agent 22 to fit becket 1, and is located at by conductive region in the encirclement of bonding agent 22 adhesion area, can hide conductive region, make conductive region be subject to the protection of bonding agent 22, reduces the risk of oxidation open circuit.Meanwhile, the thickness controllability of bonding agent 22 is high, can improve the consistency of thickness of product.
The above; be only the utility model preferably embodiment; but the utility model protection domain is not limited thereto, is equal to according to the technical solution of the utility model and inventive concept thereof and replaces or change, all should be encompassed within protection domain of the present utility model.
Claims (7)
1. a laminating apparatus for fingerprint recognition module becket, comprises becket, and flexible circuit board is characterized in that: comprise articulamentum, and described articulamentum comprises a conductive material and a bonding agent, and described bonding agent surrounds described conductive material.
2. the laminating apparatus of fingerprint recognition module becket according to claim 1, is characterized in that: described conductive material conducting becket and a flexible circuit board.
3. the laminating apparatus of fingerprint recognition module becket according to claim 1, is characterized in that: the bonding described becket of a described bonding agent and described flexible circuit board.
4. the laminating apparatus of fingerprint recognition module becket according to claim 1, is characterized in that: a described conductive material is tin cream, elargol or conducting paste.
5. the laminating apparatus of fingerprint recognition module becket according to claim 1, is characterized in that: a described bonding agent is low-temperature hot melt adhesive or epoxide-resin glue.
6. a fingerprint recognition module, comprise becket, line module, described line module comprises fingerprint recognition chip and flexible circuit board, described fingerprint recognition chips welding, at flexible circuit board upper surface, characterized by further comprising the laminating apparatus of the arbitrary described fingerprint recognition module becket of the claims 1-5.
7. fingerprint recognition module according to claim 6, it is characterized in that: described line module also comprises reinforcing chip, described reinforcing chip is pasted on flexible circuit board lower surface by alite paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520392042.4U CN204650549U (en) | 2015-06-09 | 2015-06-09 | The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520392042.4U CN204650549U (en) | 2015-06-09 | 2015-06-09 | The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204650549U true CN204650549U (en) | 2015-09-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520392042.4U Expired - Fee Related CN204650549U (en) | 2015-06-09 | 2015-06-09 | The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204650549U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN105722339A (en) * | 2016-02-29 | 2016-06-29 | 江西合力泰科技有限公司 | Metal ring mounting method for biological recognition module |
| CN105893983A (en) * | 2016-05-03 | 2016-08-24 | 湖北三赢兴电子科技有限公司 | Fingerprint recognition module group |
| CN106648220A (en) * | 2016-11-16 | 2017-05-10 | 江西合力泰科技有限公司 | Curved surface bio-identification module and manufacturing method thereof |
| CN106650552A (en) * | 2015-10-30 | 2017-05-10 | 深圳指芯智能科技有限公司 | Metal ring for fingerprint identification sensor, and preparation method and application thereof |
| CN106682654A (en) * | 2017-03-09 | 2017-05-17 | 江西合力泰科技有限公司 | Biological recognition module with wire drawing effect |
| CN106778483A (en) * | 2016-11-16 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of bio-identification module with keypress function and its manufacture method |
| CN106845465A (en) * | 2017-04-17 | 2017-06-13 | 信利光电股份有限公司 | A kind of fingerprint recognition module and terminal device |
-
2015
- 2015-06-09 CN CN201520392042.4U patent/CN204650549U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
| CN106650552A (en) * | 2015-10-30 | 2017-05-10 | 深圳指芯智能科技有限公司 | Metal ring for fingerprint identification sensor, and preparation method and application thereof |
| CN106650552B (en) * | 2015-10-30 | 2019-09-13 | 深圳指芯智能科技有限公司 | A kind of fingerprint Identification sensor becket and its preparation method and application |
| CN105722339A (en) * | 2016-02-29 | 2016-06-29 | 江西合力泰科技有限公司 | Metal ring mounting method for biological recognition module |
| CN105893983A (en) * | 2016-05-03 | 2016-08-24 | 湖北三赢兴电子科技有限公司 | Fingerprint recognition module group |
| CN106648220A (en) * | 2016-11-16 | 2017-05-10 | 江西合力泰科技有限公司 | Curved surface bio-identification module and manufacturing method thereof |
| CN106778483A (en) * | 2016-11-16 | 2017-05-31 | 江西合力泰科技有限公司 | A kind of bio-identification module with keypress function and its manufacture method |
| CN106648220B (en) * | 2016-11-16 | 2023-06-23 | 江西合力泰科技有限公司 | Curved surface biological recognition module and manufacturing method thereof |
| CN106778483B (en) * | 2016-11-16 | 2023-08-22 | 江西合力泰科技有限公司 | Biological recognition module with key function and manufacturing method thereof |
| CN106682654A (en) * | 2017-03-09 | 2017-05-17 | 江西合力泰科技有限公司 | Biological recognition module with wire drawing effect |
| CN106845465A (en) * | 2017-04-17 | 2017-06-13 | 信利光电股份有限公司 | A kind of fingerprint recognition module and terminal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150916 |
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| CF01 | Termination of patent right due to non-payment of annual fee |