CN204087246U - Passive sound chip card - Google Patents
Passive sound chip card Download PDFInfo
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- CN204087246U CN204087246U CN201420393386.2U CN201420393386U CN204087246U CN 204087246 U CN204087246 U CN 204087246U CN 201420393386 U CN201420393386 U CN 201420393386U CN 204087246 U CN204087246 U CN 204087246U
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Abstract
Passive sound chip card, comprise card middle layer, be arranged at the front printed layers of two sides, card middle layer and back up layer and protective clear layer, card middle layer, front printed layers, back up layer and protective clear layer form the card major of chip card, encapsulation IC module in card major, IC module is electrically connected with the induction antenna be arranged on card middle layer; Card middle layer comprises circuit substrate and middle level layer of PVC, and circuit substrate is embedded in the layer of PVC of middle level, and induction antenna is arranged in the layer of PVC of middle level; Circuit substrate is provided with closing coil, rectification circuit, sound driver IC and piezoelectric ceramics, closing coil is connected with the power pins of sound driver IC, between closing coil and the power pins of sound driver IC, be provided with rectification circuit, the output pin of sound driver IC is connected with piezoelectric ceramics.The utility model can obtain energy in use from read-write equipment, chip card is sounded or music, shows individual character.
Description
Technical field
The utility model belongs to intellective IC card technical field, more particularly, relates to a kind of can sounding or the smart chip card of music.
Background technology
Along with the development of smart card techniques in recent years, all kinds of magnetic stripe card, IC-card have been widely used in the fields such as finance, medical treatment, public transport, security system, telephone communication, social security, card manufacturer is the card attracting more client to use it to issue, the numerous and confused card releasing different structure and pattern.Although present smart chip card pattern is various, but all can not sound, if in transaction Card Reader process, card can send the corresponding sound or music, not only can point out user, demonstrate card individual character, the atmosphere in very multiple-use card place can also be increased, as birthday, red-letter day, the occasion such as celebrating, movable, show fully unusual.
Utility model content
The purpose of this utility model is to provide a kind of smart chip card that can sound, and this smart chip card can utilize the radio-frequency (RF) energy of read-write equipment to allow music circuit operate, and sends the sound or music.
To achieve these goals, the utility model takes following technical solution:
Passive sound chip card, comprise card middle layer, be arranged at the front printed layers of two sides, card middle layer and back up layer and protective clear layer, described card middle layer, front printed layers, back up layer and protective clear layer form the card major of chip card, encapsulation IC module in described card major, described IC module is electrically connected with the induction antenna be arranged on described card middle layer; Described card middle layer comprises circuit substrate and middle level layer of PVC, and described circuit substrate is embedded in the layer of PVC of described middle level, and described induction antenna is arranged in the layer of PVC of described middle level; Described circuit substrate is provided with closing coil, rectification circuit, sound driver IC and piezoelectric ceramics, described closing coil is connected with the power pins of described sound driver IC, between described closing coil and the power pins of described sound driver IC, be provided with rectification circuit, the output pin of described sound driver IC is connected with described piezoelectric ceramics.
The utility model more specifically technical scheme is, described induction antenna is the closing coil of the periphery being wound in described circuit substrate.
The utility model more specifically technical scheme is, described rectification circuit is formed by with the commutation diode that described closing coil is connected and the commutation capacitor in parallel with described closing coil.
From above technical scheme, the card middle layer of the utility model chip card comprises the circuit substrate and middle level layer of PVC that are provided with phonation circuit, circuit substrate is embedded in the layer of PVC of middle level, make circuit substrate can carry out lamination with other layer of PVC and form card major, phonation circuit obtains electric current by closing coil from the radio-frequency (RF) energy of read-write equipment itself, for sound driver IC provides power supply, then piezoelectric ceramics is encouraged to sound, not only can point out user, embody the diversity of card, and power supply need not be set in addition, be user-friendly to, energy-conserving and environment-protective.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment, simple introduction is done below by the accompanying drawing used required in embodiment or description of the prior art, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the decomposition texture schematic diagram of the passive sound chip card of the utility model embodiment;
Fig. 2 is the structural representation in card middle layer;
Fig. 3 is the equivalent circuit diagram of phonation circuit;
Fig. 4 is the pictorial diagram of phonation circuit substrate.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail; when describing the utility model embodiment in detail, for ease of illustrating, represent that the accompanying drawing of device architecture can be disobeyed general ratio and be done partial enlargement; and described schematic diagram is example, it should not limit the scope of the utility model protection at this.It should be noted that, accompanying drawing adopts the form of simplification and all uses non-ratio accurately, only in order to object that is convenient, clearly aid illustration the utility model embodiment.
As depicted in figs. 1 and 2, passive sound chip card of the present utility model comprises front printed layers 1, card middle layer 2, back up layer 3, induction antenna 4, protective clear layer (not shown) and IC module (not shown).Induction antenna is electrically connected with IC module; front printed layers 1 and back up layer 3 are printed with required pattern; front printed layers 1 and back up layer 3 are arranged at the both side surface in card middle layer 2; protective clear layer is arranged at outside front printed layers 1 and back up layer 3; form card major after front printed layers 1, middle layer 2, back up layer 3 and protective clear layer carry out lamination, IC module package is on card major.The structure of IC module of the present utility model, printing lamella, protective clear layer and induction antenna is same as the prior art.
Card middle layer 2 of the present utility model comprises circuit substrate 20 and middle level layer of PVC 21, circuit substrate 20 is embedded in middle level layer of PVC 21, the induction antenna 4 of the present embodiment is for being wound in the closing coil in middle level layer of PVC 21, interact between the closed antenna on induction antenna and circuit substrate, circuit substrate should avoid induction antenna, and induction antenna 4 is wound in the periphery of circuit substrate 20 by the present embodiment.Composition graphs 3 and Fig. 4, circuit substrate is provided with closing coil 20-1, rectification circuit 20-2, sound driver IC20-3 and piezoelectric ceramics 20-4 simultaneously.
Circuit substrate 20 adopt corrosion copper-clad plate technology depict closing coil 20-1, closing coil 20-1 is connected with the power pins of sound driver IC20-3, rectification circuit 20-2 is provided with between closing coil 20-1 and the power pins of sound driver IC20-3, the rectification circuit 20-2 of the present embodiment is formed by with the commutation diode 20-2a that closing coil 20-1 connects and the commutation capacitor 20-2b in parallel with closing coil 20-1, and the output pin of sound driver IC is connected with piezoelectric ceramics 20-4.When chip card and read-write equipment carry out Card read/write, closing coil 20-1 on circuit substrate 20 obtains alternating current from the radiofrequency signal that read-write equipment occurs, alternating current is by being supplied to sound driver IC20-3 after rectification circuit 20-2 rectification, sound driver IC20-3 sends exciting current to piezoelectric ceramics 20-4, and piezoelectric ceramics 20-4 can send sound or the music of setting.
The utility model arranges the circuit substrate for sounding in card middle layer, closing coil on circuit substrate utilizes the radio-frequency (RF) energy of read-write equipment itself to obtain power supply trigger circuit, piezoelectric ceramics in excitation card is sounded, there is no the participation of battery mercury or battery chemistries agent completely, the dull effect of the card technique that breaks traditions, take a step in direction to electronization, not only environmental protection but also fashion.
Be described in detail with the manufacture method of a specific embodiment to the utility model chip card below, the manufacture craft of this chip card comprises the following steps:
Make circuit substrate, circuit substrate arranges closing coil, and open emptiness avoiding hole according to the position of components on circuit board, adopt SMT chip mounter that the patch electronics such as piezoelectric ceramics, sound driver IC element is welded on circuit substrate, the thickness of circuit substrate is 0.1MM; What the present embodiment sound driver IC adopted is great waves electronics corporation model is the driving chip of BTE20121022;
Being embedded by circuit substrate is provided with in the middle level layer of PVC of induction antenna, circuit substrate and middle level layer of PVC is laminated to smooth and bubble-free, makes card middle layer;
Glue spreader is adopted to apply glue on the two sides in card middle layer bonding agent air-dry, to increase the cohesive force of follow-up lamination;
With binder card middle layer and front printed layers, back up layer and protective clear layer stapled according to position contraposition, protective clear layer plays protection card designs effect;
Each for stapled card layer is put on card layer press and is laminated into a card greatly;
By card dinking machine, kilocalorie is die-cut into the card dimensions also upper IC module of encapsulation of standard, namely completes the making of card.
Above embodiment is only in order to illustrate that the technical solution of the utility model is not intended to limit, although be described in detail the utility model with reference to above-described embodiment, those of ordinary skill in the field are to be understood that, still can modify to embodiment of the present utility model or equivalent replacement, and not departing from any amendment of the utility model spirit and scope or equivalent replacement, it all should be encompassed among right of the present utility model.
Claims (3)
1. passive sound chip card, comprise card middle layer, be arranged at the front printed layers of two sides, card middle layer and back up layer and protective clear layer, described card middle layer, front printed layers, back up layer and protective clear layer form the card major of chip card, encapsulation IC module in described card major, described IC module is electrically connected with the induction antenna be arranged on described card middle layer;
It is characterized in that:
Described card middle layer comprises circuit substrate and middle level layer of PVC, and described circuit substrate is embedded in the layer of PVC of described middle level, and described induction antenna is arranged in the layer of PVC of described middle level;
Described circuit substrate is provided with closing coil, rectification circuit, sound driver IC and piezoelectric ceramics, described closing coil is connected with the power pins of described sound driver IC, between described closing coil and the power pins of described sound driver IC, be provided with rectification circuit, the output pin of described sound driver IC is connected with described piezoelectric ceramics.
2. passive sound chip card according to claim 1, is characterized in that: described induction antenna is the closing coil being wound in described circuit substrate periphery.
3. passive sound chip card according to claim 1 and 2, is characterized in that: described rectification circuit is formed by with the commutation diode that described closing coil is connected and the commutation capacitor in parallel with described closing coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420393386.2U CN204087246U (en) | 2014-07-16 | 2014-07-16 | Passive sound chip card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420393386.2U CN204087246U (en) | 2014-07-16 | 2014-07-16 | Passive sound chip card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204087246U true CN204087246U (en) | 2015-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420393386.2U Active CN204087246U (en) | 2014-07-16 | 2014-07-16 | Passive sound chip card |
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| Country | Link |
|---|---|
| CN (1) | CN204087246U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913113A (en) * | 2016-04-13 | 2016-08-31 | 上海哲山科技股份有限公司 | Passive smart card manufacturing method and passive smart card manufactured through same |
-
2014
- 2014-07-16 CN CN201420393386.2U patent/CN204087246U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913113A (en) * | 2016-04-13 | 2016-08-31 | 上海哲山科技股份有限公司 | Passive smart card manufacturing method and passive smart card manufactured through same |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 519070 GEIL Industrial Park, Fuxi mountain, Zhuhai, Guangdong Patentee after: JINBANGDA CO., LTD. Address before: 519070 GEIL Industrial Park, Fuxi mountain, Zhuhai, Guangdong Patentee before: Zhuhai Goldpac Confidental Card Co., Ltd. |