CN202352651U - Packaging structure of solid state disk (SSD) - Google Patents
Packaging structure of solid state disk (SSD) Download PDFInfo
- Publication number
- CN202352651U CN202352651U CN 201120397877 CN201120397877U CN202352651U CN 202352651 U CN202352651 U CN 202352651U CN 201120397877 CN201120397877 CN 201120397877 CN 201120397877 U CN201120397877 U CN 201120397877U CN 202352651 U CN202352651 U CN 202352651U
- Authority
- CN
- China
- Prior art keywords
- substrate
- ssd
- electronic component
- base plate
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model provides a packaging structure of a solid state disk (SSD). The packaging structure comprises a base plate, an integrated circuit (IC), a connecting line, an electronic component, a plastic body, non-conductive elargol and a terminal, wherein the IC is stuck on the surface of the base plate by the non-conductive elargol, and is connected with the base plate by the connecting line; the electronic component is welded onto the base plate by solder paste; the terminal is welded on the base plate by a solder; and the base plate and the electronic component arranged on the base plate are wrapped by epoxy resin integrally, so that the plastic body can be formed. After the packaging structure is adopted, the cost of a memory card can be directly reduced.
Description
Technical field
The utility model relates to a kind of encapsulating structure, relates in particular to the encapsulating structure of a kind of SSD.
Background technology
Along with technology develop rapidly, people require increasingly highly to storage, the appearance of SSD has solved the problem of storage; But traditional SSD adopts the SMT paster technique, and element encapsulates separately, and expense is high; And original paper all leaks outside on the surface, and is non-watertight, easily conduction.
Not enough below above-mentioned prior art encapsulating structure exists:
1, original paper encapsulates separately, and expense is high;
2, original paper leaks outside outside, and is non-watertight, easy conductive.
Summary of the invention
The technical problem that the utility model will solve is to avoid the weak point of above-mentioned prior art and the encapsulating structure that proposes a kind of SSD.
The utility model solve the technical problem and can realize through adopting following technical scheme: the encapsulating structure of a kind of SSD is provided, comprises substrate, IC, connecting line, electronic component, plastic body, non-conductive elargol and terminal; Said IC uses non-conductive elargol to be bonded in substrate surface, and is connected with substrate through connecting line; Said electronic component uses tin cream to be welded on the substrate; Said terminal uses solder to be welded on the substrate; Said plastic body places on the substrate, is used for being arranged on the electronic component on the substrate with parcel.
Said electronic component is a surface mounting component, and uses tin cream to be welded on the substrate.
Said terminal uses solder to be welded on the substrate.
Said substrate is wrapped up by epoxy resin together with element integral body on the substrate, forms plastic body.
Compare with prior art, the beneficial effect of the utility model is:
1, adopts this encapsulating structure, can directly reduce the cost of storage card;
2, integral body is rolled into an integral body by plastic body, and waterproof is not perishable.
Description of drawings
To combine accompanying drawing and embodiment that the utility model is described further below, in the accompanying drawing:
Fig. 1 is the utility model encapsulating structure sketch map;
Fig. 2 is the packaged front view of the utility model.
Embodiment
Under combine the preferred embodiment shown in the accompanying drawing to do further to detail.
The encapsulating structure that is used for a kind of SSD of the utility model, as shown in Figure 1, comprise substrate 1, IC 2, connecting line 3, electronic component 4, plastic body 5, non-conductive elargol 6 and terminal 7; Said IC 2 uses non-conductive elargol 6 to be bonded in substrate 1 surface, and is connected with substrate 1 through connecting line 3; Said electronic component 4 uses tin cream to be welded on the substrate 1; Said terminal 7 uses solder to be welded on the substrate 1; Said plastic body 5 places on the substrate 1, is used for being arranged on the electronic component on the substrate 1 with parcel.
Said electronic component 4 as shown in Figure 1 is a surface mounting component, and uses tin cream to be welded on the substrate 1.
Said terminal 7 as shown in Figure 1 uses solder to be welded on the substrate 1.
As shown in Figure 2, said substrate 1 is wrapped up by epoxy resin together with element integral body on the substrate, forms plastic body 5.
Above-mentioned implementation procedure is the preferential implementation procedure of the utility model, and those skilled in the art is within the protection range that the common variation of carrying out on this practical basis and replacement are included in the utility model.
Claims (4)
1. the encapsulating structure of a SSD: comprise substrate, IC, connecting line, electronic component, plastic body, non-conductive elargol and terminal; Said IC uses non-conductive elargol to be bonded in substrate surface, and is connected with substrate through connecting line; Said electronic component uses tin cream to be welded on the substrate; Said terminal uses solder to be welded on the substrate; Said plastic body places on the substrate, is used for being arranged on the electronic component on the substrate with parcel.
2. the encapsulating structure of SSD as claimed in claim 1 is characterized in that:
Said electronic component is a surface mounting component, and uses tin cream to be welded on the substrate.
3. the encapsulating structure of SSD as claimed in claim 1 is characterized in that:
Said terminal uses solder to be welded on the substrate.
4. the encapsulating structure of SSD as claimed in claim 1 is characterized in that:
Said substrate is wrapped up by epoxy resin together with element integral body on the substrate, forms plastic body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120397877 CN202352651U (en) | 2011-10-19 | 2011-10-19 | Packaging structure of solid state disk (SSD) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120397877 CN202352651U (en) | 2011-10-19 | 2011-10-19 | Packaging structure of solid state disk (SSD) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202352651U true CN202352651U (en) | 2012-07-25 |
Family
ID=46541631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120397877 Expired - Lifetime CN202352651U (en) | 2011-10-19 | 2011-10-19 | Packaging structure of solid state disk (SSD) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202352651U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681077A (en) * | 2015-03-05 | 2015-06-03 | 上海磁宇信息科技有限公司 | MRAM (magnetic random access memory)-NAND controller and SMD (surface mount device) SSD (solid state drive) |
| CN105575416A (en) * | 2016-02-26 | 2016-05-11 | 中山市江波龙电子有限公司 | Solid state hard disk storage module, solid state hard disk assembly and solid state hard disk |
-
2011
- 2011-10-19 CN CN 201120397877 patent/CN202352651U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681077A (en) * | 2015-03-05 | 2015-06-03 | 上海磁宇信息科技有限公司 | MRAM (magnetic random access memory)-NAND controller and SMD (surface mount device) SSD (solid state drive) |
| CN104681077B (en) * | 2015-03-05 | 2018-07-31 | 上海磁宇信息科技有限公司 | A kind of MRAM-NAND controllers and patch type solid state disk |
| CN105575416A (en) * | 2016-02-26 | 2016-05-11 | 中山市江波龙电子有限公司 | Solid state hard disk storage module, solid state hard disk assembly and solid state hard disk |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200824 Address after: B203, building of Shenzhen industry university research base, Huazhong University of science and technology, No.9, Yuexing Third Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xintan Technology Co., Ltd Address before: 518000 Guangdong city of Shenzhen province Futian District Shangsha Innovation Science Park 2 Patentee before: DTT TECHNOLOGY CHINA Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120725 |