CN206332018U - The encapsulating structure of fingerprint recognition module - Google Patents
The encapsulating structure of fingerprint recognition module Download PDFInfo
- Publication number
- CN206332018U CN206332018U CN201621178670.3U CN201621178670U CN206332018U CN 206332018 U CN206332018 U CN 206332018U CN 201621178670 U CN201621178670 U CN 201621178670U CN 206332018 U CN206332018 U CN 206332018U
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- CN
- China
- Prior art keywords
- fingerprint recognition
- circuit boards
- fpc circuit
- recognition chip
- connector
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of encapsulating structure of fingerprint recognition module, including fingerprint recognition chip, FPC circuit boards, becket and button key, connector is installed on FPC board rear ends, this connector and fingerprint recognition chip are located at FPC circuit boards both sides respectively, the through hole bar and the through hole positioned at through hole bar both sides for the insertion of fingerprint recognition chip are provided with becket, the FPC circuits front edge of board upper surface is provided with least two illuminator, and at least two illuminator is distributed in fingerprint recognition chip both sides；There is one second bending part the rear end of the FPC circuit boards, and the connector for being connected with mainboard is installed on the second bending part and is connected by gum layer with the rear end of FPC circuit boards, and the connector and fingerprint recognition chip are positioned at the same side of FPC circuit boards.The utility model convenient use person distinguishes, especially at night, improves fingerprint module pattern displaying effect, also ensures that quoit is Nian Jie with FPC firmly.
Description
Technical field
The utility model is related to a kind of encapsulating structure of fingerprint recognition module, belongs to technical field of semiconductor encapsulation.
Background technology
Current fingerprint recognition module is widely used to the electronic product industry such as mobile phone/notebook computer, conventional fingerprint mould
Group encapsulating structure includes：Becket, cover sheet, fingerprint recognition chip, circuit substrate, reinforcement steel disc, connector and electronics member
Device.Cover sheet is covered in fingerprint chip surface, and fingerprint chip passes through glue by conductive material and substrate connection, becket
With substrate connection.Cover sheet is covered in fingerprint chip surface, and fingerprint chip is led to by conductive material and substrate connection, becket
Cross glue and substrate connection.But, existing fingerprint recognition module does not have pattern display function, so as to be not easy to distinguish and tie up
Shield.
The content of the invention
The utility model purpose is to provide a kind of encapsulating structure of fingerprint recognition module, the encapsulation knot of the fingerprint recognition module
Structure convenient use person distinguishes, especially at night, improves fingerprint module pattern displaying effect, also ensures that quoit glues with FPC
Connect firmly.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of encapsulating structure of fingerprint recognition module,
Including fingerprint recognition chip, FPC circuit boards, becket and button key, the fingerprint recognition chip is located at and FPC circuit boards middle part
And electrically connected by scolding tin, the fingerprint recognition chip surface opposite with FPC circuit boards is covered with a cover plate；
The connector is installed on FPC board rear ends, and this connector and fingerprint recognition chip are located at FPC circuit boards respectively
The through hole bar and the through hole positioned at through hole bar both sides for the insertion of fingerprint recognition chip, the FPC are provided with both sides, the becket
Circuit front edge of board upper surface is provided with least two illuminator, and at least two illuminator is distributed in fingerprint recognition chip both sides,
And in the through hole of this illuminator insertion becket, there is clear area or translucent areas on the cover plate；
The rear end of the FPC circuit boards has one first bending part, and the button key is installed on the following table of the first bending part
Face, the upper surface of this first bending part is connected by adhesive layer with the lower surface positioned at FPC circuit boards immediately below fingerprint recognition chip
Connect；
There is one second bending part the rear end of the FPC circuit boards, and the connector for being connected with mainboard is installed on
It is connected on second bending part and by gum layer with the rear end of FPC circuit boards, the connector and fingerprint recognition chip are located at FPC
The same side of circuit board.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the fingerprint recognition chip form has the square of rounding, the length of rounded for four sides
Square, track type or rhombus.
2. in such scheme, the metal ring shape has the square of rounding, the length of rounded for circular, four sides
Square, track type or rhombus.
3. in such scheme, electronic component is located at FPC circuit boards close to the region of connector.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
1. it is provided with the encapsulating structure of the utility model fingerprint recognition module, its becket for the insertion of fingerprint recognition chip
Through hole bar and the through hole positioned at through hole bar both sides, the FPC circuit front edge of board upper surface is provided with least two illuminator, institute
State at least two illuminator to be distributed in fingerprint recognition chip both sides, and the through hole of this illuminator insertion becket, on the cover plate
With clear area or translucent areas, convenient use person distinguishes, especially at night, can both increase and transmit new carrier, also carry
High fingerprint module pattern displaying effect；Secondly, the rear end of its FPC circuit board has a bending part, and the button key is installed on
The lower surface of bending part, the upper surface of this bending part is by adhesive layer and positioned at FPC circuit boards immediately below fingerprint recognition chip
Lower surface is connected, and is conducive to reducing the volume of module, is improved production efficiency.
2. there is a bending part encapsulating structure of the utility model fingerprint recognition module, the rear end of its FPC circuit board, use
It is installed on bending part and is connected by gum layer with the rear end of FPC circuit boards in the connector being connected with mainboard, the connection
Device and fingerprint recognition chip are located at the same side of FPC circuit boards, and its module need to only carry out a SMT process, put into tool
Quantity is fewer, and SMT device resources utilize higher, and the SMT working times are reduced, and production efficiency is improved, and cost is relatively low；Next, its
The rear end of FPC circuit boards has a bending part, and the button key is installed on the lower surface of bending part, and the upper surface of this bending part leads to
Cross adhesive layer to be connected with positioned at the lower surface of FPC circuit boards immediately below fingerprint recognition chip, be conducive to reducing the volume of module, carry
High efficiency.
Brief description of the drawings
Accompanying drawing 1 is the structural representation of the encapsulating structure of the utility model fingerprint recognition module；
Accompanying drawing 2 is the partial structural diagram one of the encapsulating structure of the utility model fingerprint recognition module；
Accompanying drawing 3 is the partial structural diagram two of the encapsulating structure of the utility model fingerprint recognition module.
In the figures above：1st, fingerprint recognition chip；2nd, FPC circuit boards；3rd, connector；4th, becket；5th, cover plate；6th, light
Body；7th, through hole bar；8th, through hole；9th, electronic component；11st, button key；12nd, the first bending part；13rd, adhesive layer；14th, the second bending
Portion；15th, gum layer.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of encapsulating structure of fingerprint recognition module, including fingerprint recognition chip 1, FPC circuit boards 2, connection
Device 3, becket 4 and button key 11, the fingerprint recognition chip 1 are located at being electrically connected in the middle part of FPC circuit boards 2 and by scolding tin,
The fingerprint recognition chip 1 surface opposite with FPC circuit boards 2 is covered with a cover plate 5；
The connector 3 is installed on the rear end of FPC circuit boards 2, and this connector 3 and fingerprint recognition chip 1 are located at FPC electricity respectively
It is provided with the both sides of road plate 2, the becket 4 for the through hole bar 7 of the insertion of fingerprint recognition chip 1 and positioned at the logical of the both sides of through hole bar 7
Hole 8, the front end upper surface of FPC circuit boards 2 is provided with least two illuminator 6, and at least two illuminator 6 is distributed in fingerprint
In the both sides of identification chip 1, and the through hole 8 of this illuminator 6 insertion becket 4, there is clear area or translucent on the cover plate 5
Area；
The rear end of the FPC circuit boards 2 has one first bending part 12, and the button key 11 is installed on the first bending part 12
Lower surface, the upper surface of this first bending part 12 by adhesive layer 13 with positioned at the underface FPC circuit boards of fingerprint recognition chip 1
2 lower surface connection；
There is one second bending part 14 rear end of the FPC circuit boards 2, and the connector 3 for being connected with mainboard is pacified
Loaded on being connected on the second bending part 14 and by gum layer 15 with the rear end of FPC circuit boards 2, the connector 3 and fingerprint recognition
Chip 1 is located at the same side of FPC circuit boards 2.
Above-mentioned fingerprint recognition chip 1, which is shaped as four sides, has the square of rounding；Above-mentioned becket 4 is shaped as rounded
Rectangle.
Electronic component 9 is located at FPC circuit boards 2 close to the region of connector 3.
Embodiment 2：A kind of encapsulating structure of fingerprint recognition module, including fingerprint recognition chip 1, FPC circuit boards 2, connection
Device 3, becket 4 and button key 11, the fingerprint recognition chip 1 are located at being electrically connected in the middle part of FPC circuit boards 2 and by scolding tin,
The fingerprint recognition chip 1 surface opposite with FPC circuit boards 2 is covered with a cover plate 5；
The connector 3 is installed on the rear end of FPC circuit boards 2, and this connector 3 and fingerprint recognition chip 1 are located at FPC electricity respectively
It is provided with the both sides of road plate 2, the becket 4 for the through hole bar 7 of the insertion of fingerprint recognition chip 1 and positioned at the logical of the both sides of through hole bar 7
Hole 8, the front end upper surface of FPC circuit boards 2 is provided with least two illuminator 6, and at least two illuminator 6 is distributed in fingerprint
In the both sides of identification chip 1, and the through hole 8 of this illuminator 6 insertion becket 4, there is clear area or translucent on the cover plate 5
Area；
The rear end of the FPC circuit boards 2 has one first bending part 12, and the button key 11 is installed on the first bending part 12
Lower surface, the upper surface of this first bending part 12 by adhesive layer 13 with positioned at the underface FPC circuit boards of fingerprint recognition chip 1
2 lower surface connection；
There is one second bending part 14 rear end of the FPC circuit boards 2, and the connector 3 for being connected with mainboard is pacified
Loaded on being connected on the second bending part 14 and by gum layer 15 with the rear end of FPC circuit boards 2, the connector 3 and fingerprint recognition
Chip 1 is located at the same side of FPC circuit boards 2.
Above-mentioned fingerprint recognition chip 1 is shaped as the rectangle of rounded；Above-mentioned becket 4 is shaped as circle.
Using above-mentioned fingerprint recognition module encapsulating structure when, its convenient use person distinguishes, especially at night, both can be with
The new carrier of increase transmission, also improves fingerprint module pattern displaying effect；Secondly, the rear end of its FPC circuit board has a folding
Turn of bilge, the button key is installed on the lower surface of bending part, and the upper surface of this bending part is by adhesive layer and positioned at fingerprint recognition
The lower surface connection of FPC circuit boards, is conducive to reducing the volume of module, improves production efficiency immediately below chip.
Above-described embodiment is only to illustrate technical concept of the present utility model and feature, and its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover protection domain of the present utility model it
It is interior.
Claims (4)
1. a kind of encapsulating structure of fingerprint recognition module, it is characterised in that：Including fingerprint recognition chip（1）, FPC circuit boards（2）、
Connector（3）, becket（4）And button key（11）, the fingerprint recognition chip（1）Positioned at FPC circuit boards（2）Middle part simultaneously leads to
Cross scolding tin electrical connection, the fingerprint recognition chip（1）With FPC circuit boards（2）Opposite surface is covered with a cover plate（5）；
The connector（3）It is installed on FPC circuit boards（2）Rear end, this connector（3）With fingerprint recognition chip（1）It is located at respectively
FPC circuit boards（2）Both sides, the becket（4）On be provided with for fingerprint recognition chip（1）Embedded through hole bar（7）With positioned at logical
Hole bar（7）The through hole of both sides（8）, the FPC circuit boards（2）Front end upper surface is provided with least two illuminator（6）, it is described extremely
Few 2 illuminators（6）It is distributed in fingerprint recognition chip（1）Both sides, and this illuminator（6）Embedded becket（4）Through hole（8）
It is interior, the cover plate（5）It is upper that there is clear area or translucent areas；
The FPC circuit boards（2）Rear end have one first bending part（12）, the button key（11）It is installed on the first bending part
（12）Lower surface, this first bending part（12）Upper surface pass through adhesive layer（13）With positioned at fingerprint recognition chip（1）Under just
Square FPC circuit boards（2）Lower surface connection；
The FPC circuit boards（2）Rear end have the second bending part（14）, for the connector being connected with mainboard（3）Install
In the second bending part（14）Go up and pass through gum layer（15）With FPC circuit boards（2）Rear end connection, the connector（3）And finger
Line identification chip（1）Positioned at FPC circuit boards（2）The same side.
2. the encapsulating structure of fingerprint recognition module according to claim 1, it is characterised in that：The fingerprint recognition chip
（1）Being shaped as four sides has the square, track type or rhombus of rounding.
3. the encapsulating structure of fingerprint recognition module according to claim 1, it is characterised in that：Electronic component（9）It is located at
FPC circuit boards（2）Close to connector（3）Region.
4. the encapsulating structure of fingerprint recognition module according to claim 1, it is characterised in that：The becket（4）Shape
There is the square, track type or rhombus of rounding for circular, four sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621178670.3U CN206332018U (en) | 2016-10-27 | 2016-10-27 | The encapsulating structure of fingerprint recognition module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621178670.3U CN206332018U (en) | 2016-10-27 | 2016-10-27 | The encapsulating structure of fingerprint recognition module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206332018U true CN206332018U (en) | 2017-07-14 |
Family
ID=59287444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621178670.3U Expired - Fee Related CN206332018U (en) | 2016-10-27 | 2016-10-27 | The encapsulating structure of fingerprint recognition module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206332018U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731694A (en) * | 2017-11-07 | 2018-02-23 | 苏州科阳光电科技有限公司 | A kind of assemble method of bio-identification module, bio-identification module and mobile terminal |
| CN107877876A (en) * | 2017-12-15 | 2018-04-06 | 昆山建皇光电科技有限公司 | LGA products automatic assembling and packaging technology |
| CN108664898A (en) * | 2018-04-19 | 2018-10-16 | 蚌埠华特科技有限公司 | A kind of fingerprint module group assembling method improving gap |
| CN110692064A (en) * | 2019-04-04 | 2020-01-14 | 深圳市汇顶科技股份有限公司 | Fingerprint module, electronic equipment and packaging method |
-
2016
- 2016-10-27 CN CN201621178670.3U patent/CN206332018U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731694A (en) * | 2017-11-07 | 2018-02-23 | 苏州科阳光电科技有限公司 | A kind of assemble method of bio-identification module, bio-identification module and mobile terminal |
| CN107731694B (en) * | 2017-11-07 | 2023-12-01 | 苏州科阳光电科技有限公司 | Assembly method of biological recognition module, biological recognition module and mobile terminal |
| CN107877876A (en) * | 2017-12-15 | 2018-04-06 | 昆山建皇光电科技有限公司 | LGA products automatic assembling and packaging technology |
| CN108664898A (en) * | 2018-04-19 | 2018-10-16 | 蚌埠华特科技有限公司 | A kind of fingerprint module group assembling method improving gap |
| CN108664898B (en) * | 2018-04-19 | 2021-06-08 | 蚌埠华特科技有限公司 | Fingerprint module assembly method for improving gap |
| CN110692064A (en) * | 2019-04-04 | 2020-01-14 | 深圳市汇顶科技股份有限公司 | Fingerprint module, electronic equipment and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170714 Termination date: 20181027 |