CN105224926B - Fingerprint recognition module installation method and fingerprint recognition module mounting structure - Google Patents
Fingerprint recognition module installation method and fingerprint recognition module mounting structure Download PDFInfo
- Publication number
- CN105224926B CN105224926B CN201510649141.0A CN201510649141A CN105224926B CN 105224926 B CN105224926 B CN 105224926B CN 201510649141 A CN201510649141 A CN 201510649141A CN 105224926 B CN105224926 B CN 105224926B
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- chip
- area
- becket
- fixed area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000009434 installation Methods 0.000 title claims abstract description 21
- 239000000565 sealant Substances 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 229920000297 Rayon Polymers 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 239000006071 cream Substances 0.000 claims description 16
- 239000004568 cement Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The invention discloses a kind of fingerprint recognition module installation method and fingerprint recognition module mounting structure, the fingerprint recognition module installation method includes：A circuit board is provided, the circuit board has chip fixed area and around the adhesive area around the chip fixed area, and the becket fixed area positioned at the adhesive area the week side of boss；One fingerprint recognition chip is provided, the fingerprint recognition chip is welded in the chip fixed area through surface mount process, the week side of boss of the fingerprint recognition chip and the adhesive area form angle；The filling with sealant in the angle；Viscose glue is set in the becket fixed area, the metal ring is located at the fingerprint recognition chip the week side of boss, and be adhered on the becket fixed area.The fluid sealant can prevent liquid from entering the gap between the fingerprint fingerprint recognition chip and the circuit board, so as to improve the connection fixing of the fingerprint recognition chip and the circuit board, so as to improve the performance of fingerprint recognition module.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of fingerprint recognition module installation method and fingerprint recognition module
Mounting structure.
Background technology
The mounting process of fingerprint recognition module is through SMT (Surface Mount by fingerprint recognition chip and becket at present
Technology, surface mounting technology) it is welded on circuit board, or utilize ACF (Anisotropic Conductive
Film, anisotropy conductiving glue) it is adhered on circuit board.
Fingerprint recognition chip and becket are welded in into circuit board using SMT techniques easily causes liquid to flow into fingerprint knowledge
At other gap between chip and circuit board, butt welding point is corroded, and influences soldering reliability, or is directly resulted in solder joint and broken
Split；Also, fingerprint recognition chip depends merely on solder joint to fix, and adhesion is bad, in fingerprint recognition module by enormous impact force
In the case of fingerprint recognition chip is come off, so as to influence the performance of fingerprint recognition module.
Fingerprint recognition chip and becket will be fitted in circuit board using ACF glue mode, and electric conductivity to be present bad and viscous
Connect unsteady problem, due to be between fingerprint recognition chip and circuit board by ACF conducting particles come realize electrical property connect,
But the number of conducting particles is limited after all, and influenceed by processing procedure, conducting particles differs with circuit board and fingerprint recognition chip
Surely good contact, therefore electrical property connection reliability is poor；Simultaneously because ACF corrosion-resistant, fingerprint is flowed into liquid
At gap between identification chip and circuit board, easily cause ACF to be corroded, asked so as to influence the reliability of fingerprint recognition module
Topic.
Therefore current fingerprint recognition module installation method easily causes that fingerprint recognition module is not firm, performance is bad
The problems such as.
The content of the invention
The present invention provides a kind of fingerprint recognition module installation method that can improve performance and fingerprint recognition module peace
Assembling structure.
The present invention provides a kind of fingerprint recognition module installation method, wherein, the fingerprint recognition module installation method includes：
There is provided a circuit board, the circuit board has chip fixed area and around the sealing around the chip fixed area
Area, and the becket fixed area positioned at the adhesive area the week side of boss；
A fingerprint recognition chip is provided, the fingerprint recognition chip is welded in into the chip through surface mount process fixes
Area, the week side of boss of the fingerprint recognition chip and the adhesive area form angle；
The filling with sealant in the angle；
Viscose glue is set in the becket fixed area, the metal ring is located at the fingerprint recognition chip the week side of boss, and
It is adhered on the becket fixed area.
Wherein, after the step of providing a circuit board, and before the step of providing a fingerprint recognition chip, in institute
State print solder paste on chip fixed area.
Wherein, there is provided in the step of a fingerprint recognition chip, periphery and the chip of the fingerprint recognition chip are fixed
Gap between area be present.
Wherein, in the angle the step of filling with sealant, the fluid sealant is also filled up in the gap.
Wherein, there is provided in the step of a circuit board, the becket fixed area is marked off into conducting resinl area and insulating cement area；
In the step of becket fixed area sets viscose glue, conductive viscose is set in the conducting resinl area, described
Insulating cement area sets insulation viscose glue.
The present invention also provides a kind of fingerprint recognition module mounting structure, wherein, the fingerprint recognition module mounting structure bag
Include circuit board, fingerprint recognition chip and becket, the circuit board includes mounting surface, the mounting surface include chip fixed area,
Around the adhesive area and the becket fixed area for being arranged at the adhesive area the week side of boss, the fingerprint of the chip fixed area the week side of boss
Identification chip is fixed on the chip fixed area, and the week side of boss of the fingerprint recognition chip and the adhesive area form angle, institute
Filling with sealant in angle is stated, the metal ring is located at the fingerprint recognition chip the week side of boss, and is fixed on the becket and consolidates
Determine area.
Wherein, it is welded with tin cream between the fingerprint recognition chip and the chip fixed area.
Wherein, gap between the periphery of the fingerprint recognition chip and the chip fixed area be present, the fluid sealant is also
It is filled in the gap.
Wherein, the becket includes fitting in the bottom surface of the becket fixed area, and is sheathed on the fingerprint and knows
The medial surface of other chip, the angle between the bottom surface and the medial surface set groove, housed in the groove described close
Sealing.
Wherein, the becket fixed area includes conducting resinl area and is connected to the insulating cement area in the conducting resinl area, described
Conductive viscose is bonded between conducting resinl area and the becket, insulating sticky is bonded between the insulating cement area and the becket
Glue.
The fingerprint recognition module installation method and fingerprint recognition module mounting structure of the present invention, passes through the fingerprint recognition core
The week side of boss of piece and the adhesive area form angle region, filling with sealant in the angle region, so that the fluid sealant
Liquid can be prevented to enter the gap between the fingerprint fingerprint recognition chip and the circuit board, known so as to improve the fingerprint
The connection fixing of other chip and the circuit board, so as to improve the performance of fingerprint recognition module.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the required accompanying drawing used in embodiment will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of fingerprint recognition module mounting structure provided by the invention；
Fig. 2 is the top view of the circuit board of Fig. 1 fingerprint recognition module mounting structure；
Fig. 3 is the schematic flow sheet of fingerprint recognition module installation method provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is carried out clear
Chu, it is fully described by.
Refer to Fig. 1 and Fig. 2, a kind of fingerprint recognition module mounting structure 100 provided by the invention, the fingerprint recognition mould
Group mounting structure 100 includes circuit board 10, fingerprint recognition chip 20 and becket 30.The circuit board 10 includes mounting surface 11,
The mounting surface 11 include chip fixed area 111, around the week side of boss of chip fixed area 111 adhesive area 112 and around
The becket fixed area 113 that the adhesive area 112 is set.The fingerprint recognition chip 20 is fixed on the chip fixed area 112
On, the week side of boss and the adhesive area 112 of the fingerprint recognition chip 20 form angle region (not indicating), in the angle region
Filling with sealant 112a.The becket 30 is sheathed on the week side of boss of fingerprint recognition chip 20, and is fixed on the becket 30
Fixed area.
Angle region, the angle region are formed by the week side of boss and the adhesive area 112 of the fingerprint recognition chip 20
Interior filling with sealant 112a, so that the fluid sealant 112a can prevent liquid from entering the fingerprint fingerprint recognition chip 20
Gap between the circuit board 10, it is firm so as to improve the connection of the fingerprint recognition chip 20 and the circuit board 10
Property, so as to improve the performance of fingerprint recognition module 100.
In present embodiment, the circuit board 10 is printed circuit board (PCB).The circuit board 10 is including mounting surface 11 and relatively
The bottom surface 12 that the mounting surface 11 is set.The fingerprint recognition chip 20 and the becket 30 are installed on the mounting surface 11,
The bottom surface 12 is used to be fixed on terminal, and the terminal can be mobile phone or tablet personal computer or notebook computer etc..It is described
Mounting surface 11 is provided with the circuit for connecting the fingerprint recognition chip 20 and the becket 30, specifically, the chip is fixed
Area 111 and the becket fixed area 113 are provided with the incoming end of the circuit, so as in the fingerprint recognition chip 20 and institute
When stating becket 30 and being individually fixed in the chip fixed area 111 and the becket fixed area 113, the circuit board 10 is realized
It is electrically connected with the fingerprint recognition chip 20, and the becket 30.More specifically, the chip fixed area 111 is in
Rectangle.The adhesive area 112 is connected to the surrounding of the chip fixed area 111.The becket fixed area 113 can be connection
In the adhesive area 112, spacing can also be set between the adhesive area 112.In other embodiments, the circuit board
It can also be flexible PCB.
In present embodiment, the 20 rectangular tabular of fingerprint recognition chip.The fingerprint recognition chip 20 includes bottom surface
21 and the side 22 of the bottom surface 21 is connected to, the bottom surface 21 is corresponding to be covered in the chip fixed area 111, so as to the side
Face 22 is set with the adhesive area 112 in angle, so that the fluid sealant 112a is to the fingerprint recognition chip 20 and institute
The sealing for stating circuit board 10 improves, so as to effectively prevent the bottom surface 21 of fingerprint recognition chip 20 described in liquid corrosion, so as to improve
The service life of fingerprint recognition module.In other embodiments, the fingerprint recognition chip 20 can also be circular plate.
In present embodiment, the becket 30 is rectangular ring.The becket 30 is sheathed on the fingerprint recognition core
The week side of boss of piece 20, the becket 30 includes fitting in the bottom surface 31 of the becket fixed area 113, and is sheathed on the finger
The medial surface 32 of the week side of boss of line identification chip 20.Pass through described in the bottom surface 31 between bottom surface 31 and the becket fixed area 113
Viscose glue is adhesively fixed, and is realized using viscose glue and be electrically connected with the circuit board 10.The medial surface 32 and the fingerprint recognition core
The gap of side 22 of piece 20 coordinates, so as to facilitate the installation of the becket 30.In other embodiments, the becket 30
It can also be rounded ring-type.
Further, it is welded with tin cream 20a between the fingerprint recognition chip 20 and the chip fixed area 111.Specifically
, the fingerprint recognition chip 20 is welded on the chip fixed area 111 through surface mounting technology, the chip fixed area
The tin cream 20a is printed on 111, then by after the tin cream 20a heating and meltings, the fingerprint recognition chip 20 is positioned over institute
State on chip fixed area 111, so as to which the fingerprint recognition chip 20 is welded in the chip fixed area using the tin cream 20a
On 111, and the fingerprint recognition chip 20 is electrically connected with through the tin cream 20a and the circuit board 10, described so as to increase
The electric connection performance of fingerprint recognition chip 20 and the circuit board 10.
Further, gap 111a be present between the periphery of the fingerprint recognition chip 20 and the chip fixed area 111,
The fluid sealant 112a is also filled up in the gap 111a.
Specifically, when the fingerprint recognition chip 20 is welded in the chip fixed area 111, due to the fingerprint recognition
Tin cream 20a be present between chip 20 and the chip fixed area 111, so as to after the tin cream 20a solidification after, the fingerprint recognition
Separated between the bottom surface 21 of chip 20 and the chip fixed area 111 by the tin cream 20a, so as to the bottom surface 21 and the core
Gap be present between piece fixed area 111.By the gap be present between the bottom surface 21 and the chip fixed area 111
111a, so as to increase the heat dispersion of the fingerprint recognition chip 20.Meanwhile the fluid sealant 112a is filled into the angle
When, the fluid sealant 112a is filled in the gap 111a, so as to prevent liquid from entering institute using the fluid sealant 112a
State in the 111a of gap, so as to prevent the tin cream 20a to be corroded, so as to increase the fingerprint recognition chip 20 and the circuit board
10 electrical connection properties and firm performance so that the service life of the fingerprint recognition module mounting structure 100 improves.
Further, the becket 30 includes fitting in the bottom surface 31 of the becket fixed area 113, and is sheathed on
The medial surface 32 of the fingerprint recognition chip 20, the angle between the bottom surface 31 and the medial surface 32 set groove 33,
The fluid sealant 112a is housed in the groove 33.
Specifically, the groove 33 is bevelling, because the medial surface 32 apart from the side 22 is less than the sealing
The width in area 112, therefore the angle between the medial surface 32 and the bottom surface 31 sets the groove 33 so that it is described
There is sufficient space to accommodate the fluid sealant 112a between becket 30 and the fingerprint recognition chip 20, so as to ensure the fingerprint
The sealing property of identification chip 20 and the circuit board 10.In other embodiments, the groove 33 can also be that rectangle is recessed
Groove.
Further, the becket fixed area 113 includes conducting resinl area 113a and is connected to the conducting resinl area 113a
Insulating cement area 113b, between the conducting resinl area 113a and the becket 30 be bonded conductive viscose 30a, the insulating cement area
Bonding insulation viscose glue 30b between 113b and the becket 30.
Specifically, the becket fixed area 113 includes two conducting resinl area 113a being oppositely arranged and two phases
To the insulating cement area 113b of setting.Two conductive suburb 113a and two interlaced settings of insulating cement area 113b,
And enclose the surrounding of the adhesive area 112.The becket 30 and the circuit board 10 are adhered to using the conductive viscose 30a
Between so as to ensure the electrical connection properties between the becket 30 and the circuit board 10, while utilize the insulation viscose glue
30b is adhered between the becket 30 and the circuit board 10, so as to ensure the becket 30 and the circuit board 10
Firm performance, so as to improve the performance of the fingerprint recognition module 100.
Also referring to Fig. 1, Fig. 2 and Fig. 3, the present invention also provides a kind of fingerprint recognition module installation method, the fingerprint
Identification module installation method includes：
S01：A circuit board 10 is provided, the circuit board 10 has chip fixed area 111 and fixed around the chip
Adhesive area 112 around area 111, and around the becket fixed area 113 around the adhesive area 112.Present embodiment
In, the becket fixed area 113 is marked off into conducting resinl area 113a and is connected to the insulating cement area of the conducting resinl area 113a
113b。
S02：The print solder paste 20a on the chip fixed area 111.
In present embodiment, the tin cream 20a is printed on the chip fixed area 111, the tin cream 20a is in melting
State.
S03：One fingerprint recognition chip 20 is provided, the fingerprint recognition chip 20 is welded in through surface mount process described
Chip fixed area 111, the week side of boss and the adhesive area 112 of the fingerprint recognition chip 20 form angle., will in present embodiment
Tin cream 20a heating on the circuit board 10 so that tin cream 20a is in a liquid state, so as to which the fingerprint recognition chip 20 be mounted on
On the chip fixed area 111, after tin cream 20a solidifications, realize that the fingerprint recognition chip 20 is welded in the chip
On fixed area 111.Meanwhile in order to ensure the thermal diffusivity of the fingerprint recognition chip 20, in the week of the fingerprint recognition chip 20
Preset clearance 111a between edge and the circuit board 10, increase the radiating of the fingerprint recognition chip 20 using the gap 111a
Area.
S04：The filling with sealant 112a in the angle.Can be to described using glue spraying equipment in present embodiment
The spraying fluid sealant 112a in angle, while the fluid sealant 112a is sprayed into the gap 111a, so as to increase to institute
State the barrier propterty of fingerprint recognition chip 20.
S05：Viscose glue is set in the becket fixed area 113, the becket 30 is sheathed on the fingerprint recognition core
The week side of boss of piece 20, and be adhered on the becket fixed area 113.In present embodiment, because the becket fixed area 113 wraps
When including conducting resinl area 113a and insulating cement area 113b, therefore the becket 30 be adhered on the becket fixed area 113,
Conductive viscose 30a is set in the conducting resinl area 113a, insulation viscose glue 30b is set in the insulating cement area 113b, so as to utilize
The conductive viscose 30a and insulation viscose glue 30b is bonded the becket 30 simultaneously, so as to ensure that the He of becket 30
The electrical connection properties and firm switching performance of the circuit board 10.
The fingerprint recognition module installation method and fingerprint recognition module mounting structure of the present invention, passes through the fingerprint recognition core
The week side of boss of piece and the adhesive area form angle, filling with sealant in the angle, so that the fluid sealant can prevent
Liquid enters gap between the fingerprint fingerprint recognition chip and the circuit board, so as to improve the fingerprint recognition chip and
The connection fixing of the circuit board, so as to improve the performance of fingerprint recognition module.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of fingerprint recognition module installation method, it is characterised in that the fingerprint recognition module installation method includes：
A circuit board is provided, the circuit board has chip fixed area and the adhesive area around the chip fixed area, Yi Jiwei
The becket fixed area set around the adhesive area；
One fingerprint recognition chip is provided, the fingerprint recognition chip is welded in the chip fixed area through surface mount process,
The week side of boss of the fingerprint recognition chip and the adhesive area form angle region；
The filling with sealant in the angle region；
Viscose glue is set in the becket fixed area, a metal ring is located at the fingerprint recognition chip the week side of boss, and be adhered to
On the becket fixed area.
2. fingerprint recognition module installation method according to claim 1, it is characterised in that a circuit board is provided the step of
Afterwards, and before a step of fingerprint recognition chip is provided, the print solder paste on the chip fixed area.
3. fingerprint recognition module installation method according to claim 1, it is characterised in that a fingerprint recognition chip is provided
In step, gap be present between the periphery of the fingerprint recognition chip and the chip fixed area.
4. fingerprint recognition module installation method according to claim 3, it is characterised in that sealing is filled in the angle
In the step of glue, the fluid sealant is also filled up in the gap.
5. fingerprint recognition module installation method according to claim 1, it is characterised in that a step of circuit board is provided
In, the becket fixed area is marked off into conducting resinl area and insulating cement area；
In the step of becket fixed area sets viscose glue, conductive viscose is set in the conducting resinl area, in the insulation
Jiao Qu sets insulation viscose glue.
A kind of 6. fingerprint recognition module mounting structure, it is characterised in that the fingerprint recognition module mounting structure include circuit board,
Fingerprint recognition chip and becket, the circuit board include mounting surface, and the mounting surface includes chip fixed area, around described
The adhesive area of chip fixed area the week side of boss and the becket fixed area set around the adhesive area, the fingerprint recognition chip are consolidated
Due on the chip fixed area, the week side of boss of the fingerprint recognition chip and the adhesive area form angle region, the angle
Filling with sealant in region, the metal ring is located at the fingerprint recognition chip the week side of boss, and is fixed on the becket and fixes
Area.
7. fingerprint recognition module mounting structure according to claim 6, it is characterised in that the fingerprint recognition chip and institute
State and be welded with tin cream between chip fixed area.
8. fingerprint recognition module mounting structure according to claim 6, it is characterised in that the week of the fingerprint recognition chip
Gap between edge and the chip fixed area be present, the fluid sealant is also filled up in the gap.
9. fingerprint recognition module mounting structure according to claim 6, it is characterised in that the becket includes fitting in
The bottom surface of the becket fixed area, and it is sheathed on the medial surface of the fingerprint recognition chip, the bottom surface and the inner side
Angle between face sets groove, and the fluid sealant is housed in the groove.
10. fingerprint recognition module mounting structure according to claim 6, it is characterised in that the becket fixed area bag
Include conducting resinl area and be connected to the insulating cement area in the conducting resinl area, be bonded between the conducting resinl area and the becket conductive
Viscose glue, bonding insulation viscose glue between the insulating cement area and the becket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649141.0A CN105224926B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649141.0A CN105224926B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105224926A CN105224926A (en) | 2016-01-06 |
| CN105224926B true CN105224926B (en) | 2017-11-14 |
Family
ID=54993886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510649141.0A Expired - Fee Related CN105224926B (en) | 2015-10-09 | 2015-10-09 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
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Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512648A (en) * | 2016-01-21 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile equipment and fingerprint recognizing and sensing device |
| CN105635366A (en) * | 2016-01-26 | 2016-06-01 | 广东欧珀移动通信有限公司 | Mobile terminal |
| CN105512652A (en) * | 2016-01-26 | 2016-04-20 | 广东欧珀移动通信有限公司 | Mobile terminal and fingerprint recognizing and sensing device |
| CN107094365B (en) * | 2016-02-18 | 2019-10-29 | 深圳市汇顶科技股份有限公司 | Mould group and its assemble method |
| CN105763681B (en) * | 2016-03-22 | 2019-02-05 | Oppo广东移动通信有限公司 | For the fingerprint sensing component of communication terminal and with its communication terminal |
| CN106127195B (en) * | 2016-08-30 | 2017-11-17 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module preparation method and mobile terminal |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
| CN106384105B (en) * | 2016-10-29 | 2019-02-19 | 南昌欧菲生物识别技术有限公司 | The manufacturing method of fingerprint recognition mould group |
| CN106778513A (en) * | 2016-11-15 | 2017-05-31 | 深圳天珑无线科技有限公司 | The automatic assembly method and system of a kind of fingerprint module becket |
| CN106778483B (en) * | 2016-11-16 | 2023-08-22 | 江西合力泰科技有限公司 | Biological recognition module with key function and manufacturing method thereof |
| CN106599791B (en) * | 2016-11-16 | 2023-06-23 | 江西合力泰科技有限公司 | Biological identification module mounting structure and mounting method thereof |
| CN106650627B (en) * | 2016-11-16 | 2023-06-20 | 江西合力泰科技有限公司 | Biological recognition module mounting structure and mounting method thereof |
| CN108205650B (en) * | 2016-12-20 | 2021-11-30 | 致伸科技股份有限公司 | Fingerprint identification module |
| CN106815572A (en) * | 2017-01-03 | 2017-06-09 | 广东欧珀移动通信有限公司 | Support, cover plate assembly and terminal for fingerprint recognition component |
| CN106952353A (en) * | 2017-02-22 | 2017-07-14 | 苏州祥弘源电子科技有限公司 | A kind of installation method of easy-to-dismount artificial intelligence fingerprint recognition machine |
| CN106845465A (en) * | 2017-04-17 | 2017-06-13 | 信利光电股份有限公司 | A kind of fingerprint recognition module and terminal device |
| CN109152196A (en) * | 2018-07-25 | 2019-01-04 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint recognition mould group installation method and fingerprint recognition mould group |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117817A (en) * | 2006-10-31 | 2008-05-22 | Toshiba Corp | Semiconductor part mounting sheet member, printed wiring board, and electronic device |
| TWM475697U (en) * | 2013-12-11 | 2014-04-01 | Dynacard Co Ltd | Package module of fingerprint recognition chip |
| CN104050445B (en) * | 2014-04-08 | 2018-10-16 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, the packaging method of fingerprint identification device and intelligent terminal |
| CN204650549U (en) * | 2015-06-09 | 2015-09-16 | 江西合力泰科技有限公司 | The laminating apparatus of a kind of fingerprint recognition module and this fingerprint recognition module becket |
-
2015
- 2015-10-09 CN CN201510649141.0A patent/CN105224926B/en not_active Expired - Fee Related
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| CN105224926A (en) | 2016-01-06 |
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