CN107094365B - Mould group and its assemble method - Google Patents
Mould group and its assemble method Download PDFInfo
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- CN107094365B CN107094365B CN201610092212.6A CN201610092212A CN107094365B CN 107094365 B CN107094365 B CN 107094365B CN 201610092212 A CN201610092212 A CN 201610092212A CN 107094365 B CN107094365 B CN 107094365B
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- mould group
- over again
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of mould group and its assemble method, mould group includes the first component and second component, and the assemble method is the following steps are included: be pre-positioned the first component and the second component to obtain pre-determined bit mould group；It whether qualified detects the pre-determined bit mould group, if qualified, can do over again the fixed first component of material and the second component using first；If unqualified, then separate the first component and the second component, and pre-determined bit is re-started to the first component and the second component and is detected, until obtaining the qualified pre-determined bit mould group of detection and can do over again the fixed first component of material and the second component using described first.Assemble method according to the present invention can do over again the fixed first component of material and second component by using first, so that the production process of mould group can do over again, use process is reworkable.
Description
Technical field
The present invention relates to high level mould technical group fields, more particularly, to a kind of mould group and its assemble method.
Background technique
Point out in the related technology, high level device or equipment in production or use process if there is bad, then need from
It dismantles in device or equipment bad element, is done over again or reprocessed, however, can usually be damaged during dismantling bad element
Hurt remaining element, causes device or equipment scrapping.For example, the process of the screen mould group using barbola work assembling smart phone
In, sensor is pasted at the back side of screen by glue, however, standardization barbola work requires the glue used and the screen back side
Ink layer adhesiveness it is very strong, when fitting complete and solidify after, glue can not pass through the high temperature or solvent in safe range
Immersion is separated with ink layer, and sensor surface also can remnants can not clean glue, so as to cause the whole reports of screen mould group
It is useless, cause the failure rate done over again and reprocessed very high, increases input cost.
In addition, standardization barbola work, which requires the glue used to usually require longer time, could complete to solidify, if
Accelerate to solidify, generally require for glue to be heated to the solidification temperature significantly more than optimum range, this, which just brings, is difficult to capture
Technological challenge, such as whether the uniformity of heating can guarantee whether the escape medium in solidification process can sufficiently volatilize, cold
But big stress etc. caused by the thermal expansion factor after.The production efficiency of mould group is caused to be difficult to improve as a result,.
To sum up, mould group in the related technology is difficult to realize do over again and reprocess, and production efficiency is low, when waiting online
Between it is long.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art.Therefore, the present invention intends to propose one
The assemble method of kind of mould group, the assemble method can carry out it is lossless do over again and reprocess, high yield rate.
The present invention also proposes a kind of mould group assembled using above-mentioned assemble method.
The assemble method of mould group according to a first aspect of the present invention, the mould group include the first component and second component, institute
Assemble method is stated the following steps are included: being pre-positioned to the first component and the second component to obtain pre-determined bit mould
Group；Whether qualified detect the pre-determined bit mould group, if qualified, using first can do over again the fixed first component of material and
The second component；If unqualified, the first component and the second component are separated, and to the first component and institute
It states second component to re-start pre-determined bit and detect, until obtaining the qualified pre-determined bit mould group of detection and can return using described first
The fixed first component of work material and the second component.
The assemble method of mould group according to the present invention can do over again the fixed first component of material and second by using first
Part, so that the production process of mould group can do over again, use process is reworkable.
In some embodiments, the first component and the second component by described first can do over again material it is fixed after such as
It damages, progress is following to reprocess step: separating the first component and the second component；Replace or repair described first
Part and/or the second component；It re-assemblies.
In some embodiments, it separates the first component and the second component is further comprised the steps of: using solvent later
Removing first on the first component and/or the second component can do over again material.
In some embodiments, there is mounting portion for installing the first component on the second component, described the
One material that can do over again is folded between the first component and the mounting portion.
In some embodiments, when described first can do over again material be repeatable heating fusing do over again material when, institute
It states and the first component and the second component is pre-positioned to obtain pre-determined bit mould group specifically: A1, can be returned first
Work material is folded between the first component and the mounting portion；A2, to the mounting portion first heat again cooling it is pre- to obtain
Positioning module；It is described to do over again the fixed first component of material and the second component using first specifically: B1, described pre-
After the testing result of positioning module is qualified, the first component and the mounting portion are compressed；B2, the mounting portion is first heated again
It is cooled to room temperature.
In some embodiments, described to do over again after the fixed first component of material and the second component using first
It further comprises the steps of: and second material that can do over again is filled in the mounting portion and around the first component.
In some embodiments, described first can do over again material be paraffin, described first can do over again material be paraffin, it is described
Second can do over again material for room temperature vulcanized silicone rubber.
In some embodiments, when described first can do over again material be can be used shearing force removing do over again material when,
It is described the first component and the second component to be pre-positioned to obtain pre-determined bit mould group specifically: C1, can by third
Material of doing over again is filled in the mounting portion and around the first component；C2, can do over again to the third material and/or described
Mounting portion, which carries out heating, makes the third that can do over again material instantaneous solidification to obtain pre-determined bit mould group；It is described to do over again using first
The fixed first component of material and the second component specifically: D1, before the step C1 can do over again first material
It is folded between the first component and the mounting portion；After D2, the testing result for being pre-positioned mould group are qualified, described in compression
The first component and the mounting portion can be done over again material spontaneous curing by described first.
In some embodiments, described first material that can do over again is room temperature vulcanized silicone rubber, and the third can do over again material
For paraffin.
In some embodiments, using fixed point heating device to the third can do over again material heating.
In some embodiments, the fixed point heating device is resistance wire or laser.
In some embodiments, the mounting portion is heated using fixed heating device.
In some embodiments, the fixed heating device includes: mounting platform, has heating zone on the mounting platform
Domain and room temperature region, the second component be located on the mounting platform and the mounting portion and the heating region up and down just
It is right；And heater, the heater are used to heat the heating region.
Mould group according to a second aspect of the present invention, using the assemble method assembling of mould group according to a first aspect of the present invention
At.
Mould group according to the present invention, is assembled by using the assemble method of above-mentioned first aspect, to improve mould
The yield rate of group, reduces the production cost of mould group.
In some embodiments, the mould group is the fingerprint recognition mould group of mobile terminal, and the first component is fingerprint biography
Sensor, the second component are screen.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Fig. 1 is the assembling schematic diagram of mould group according to an embodiment of the invention；
Fig. 2 is the assembling schematic diagram of mould group according to another embodiment of the invention.
Appended drawing reference:
Mould group 1,1a；The first component 11；Second component 12；Mounting portion 121；
First can do over again material 21,22；Third can do over again material 23；
Mounting platform 3；Heating region 31；Room temperature region 32；Pressurizing device 4；Pinpoint heating device 5.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.For letter
Change disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
It is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or letter.It is this heavy
It is for purposes of simplicity and clarity, itself not indicate the relationship between discussed various embodiments and/or setting again.This
Outside, the present invention provides various specific techniques and material example, but those of ordinary skill in the art may be aware that
The applicable property of other techniques and/or the use of other materials.
Mould group 1 according to an embodiment of the present invention and its assemble method are described below with reference to Fig. 1 and Fig. 2, wherein mould group 1 can
Think high value mould group, such as the mould group of mobile terminal (such as smart phone, tablet computer).Below only with mould group 1 for intelligently
It is illustrated for the fingerprint recognition mould group of mobile phone, those skilled in the art are after having read following technical solution, it is clear that energy
Enough understand that mould group 1 is the technical solution of other kinds of mould group.
As depicted in figs. 1 and 2, mould group 1 according to an embodiment of the present invention, including the first component 11 and second component 12, the
It can have the mounting portion 121 for installing the first component 11 on two components 12, such as mounting portion 121 can be to be formed in second
Groove (or blind hole) on component 12, to facilitate the installation of the first component 11.For example, when mould group 1 is fingerprint recognition mould group
When, it can be screen, such as glass cover-plate or touch screen that the first component 11, which can be fingerprint sensor, second component 12,.
As depicted in figs. 1 and 2, the assemble method of mould group 1 according to an embodiment of the present invention is the following steps are included: to first
Part 11 and second component 12 are pre-positioned to obtain pre-determined bit mould group, and whether detection pre-determined bit mould group is qualified, if qualified,
It can do over again the fixed first component 11 of material (such as described below first can do over again material 21 or 22) and second using first
Part 12；If unqualified, separate the first component 11 and second component 12, and to the first component 11 and second component 12 again into
Row, which is pre-positioned, simultaneously to be detected, until obtaining the qualified pre-determined bit mould group of detection and (such as described below using first material that can do over again
First can do over again material 21 or 22) the fixed first component 11 and second component 12.
Wherein, " being pre-positioned to the first component 11 and second component 12 " can be with are as follows: using the adhesive material that can be done over again
The first component 11 and second component 12 are pasted, such as the first component 11 is pre-positioned at second by the adhesive material by that can do over again
On the mounting portion 121 of part 12, so that the first component 11 and second component 12 are pre-positioned.
Wherein, whether " detection pre-determined bit mould group qualified " can be with are as follows: the detection first component 11 is opposite with second component 12
Whether setting position meets technique requirement, qualified if meeting technique requirement, unqualified if being unsatisfactory for technique requirement.
Wherein, " can do over again material " refers to: having paste performance, is realized using its paste performance and connected with the fixed of component
It connects, and there are corresponding removal scheme, removal scheme is easy to accomplish；When using removal scheme removal, can do over again material can
To be kept completely separate with component.For example, needing to remove glass cover plate surfaces when first material that can do over again is pasted on glass cover-plate
First can do over again material when, using corresponding removal scheme, first can do over again material can be intact point with glass cover plate surfaces
From that is, first material that can do over again will not stick out the ink layers of glass cover plate surfaces, so that glass cover plate surfaces are intact.Separately
Outside, it should be noted that although the material that can do over again described in the embodiment of the present invention has paste performance, in the prior art
These materials are not used to standardization barbola work.If paraffin is used for the fixed wafer in cutting crystal wafer, in order to avoid occur when cutting
Film flying；Room temperature vulcanized silicone rubber is for sealing.
In fact, " can do over again material " has very much, for example, the material of doing over again of some repeatable heating fusings, such as paraffin
Deng can realize the removal of paraffin by the heating being easily achieved；In another example some soluble materials of doing over again, i.e.,
The removal of the material can be realized by the dissolving method being easily achieved；For another example some removable by shearing force
Can do over again material, such as room temperature vulcanized silicone rubber, the adhesion strength of such material of doing over again under common use condition (impact,
Vibration, temperature, humidity, electromagnetic interference, corrosive environment etc.) it is very strong, but (sheared in the application torsion being easily achieved
Power) under conditions of can remove.In short, the material that can do over again can be hot melt, reaction equation, dissolution type, shearing
Power formula etc., as long as there is a removal scheme easy to accomplish to be just no longer described in detail one by one here.
In this way, can be returned since the material that can do over again is with a removal scheme corresponding, easy to accomplish using first
After the fixed first component 11 of work material and second component 12, by using corresponding, easy to accomplish with first material that can do over again
Removal scheme can realize the intact separation of the first component 11 and second component 12, to realize in 1 production process of mould group
Reworkable property in 1 use process of doing over again property and mould group.Mould group 1 according to an embodiment of the present invention and its assemble method as a result,
With undamaged doing over again property of production and use reworkable property, to reduce scrappage and input cost, improve yield rate and
Repairable rate.
Since the production process of mould group 1 has doing over again property, when occurring disqualified upon inspection in process of producing product, so that it may
Relievedly to do over again, components damage not will cause due to doing over again, to improve the yield rate of mould group 1, reduce rejection rate
And input cost.In the following, the rework step of mould group 1 is briefly described, it is specific as follows: the separation first component 11 and second component first
12, it is then reassembled with the first component 11 and second component 12, the process re-assemblied is carried out using above-mentioned assemble method.
Since the use process of mould group 1 has reworkable property, when there is failure fault in product use process, so that it may
It is relievedly reprocessed, not will cause components damage due to reprocessing, to reduce the maintenance difficulty of mould group 1, reduce maintenance
Scrappage and maintenance cost.It is specific as follows in the following, briefly describe mould group 1 reprocesses step: the separation first component 11 and the first
Then two components 12 are replaced or are repaired the component (such as first component 11, second component 12) to break down, finally re-assembly not
The problematic first component 11 and second component 12, the process re-assemblied are carried out using above-mentioned assemble method.
In some embodiments of the invention, it separates the first component 11 and second component 12 is further comprising the steps of later:
It can be done over again material using first on the solvent cleaning first component 11 and/or second component 12.Thus, it is possible to guarantee product product
Matter.
In the following, briefly describing the mould group and its assemble method of two specific embodiments according to the present invention.Specifically, following
In two embodiments, first material that can do over again is folded between the first component 11 and mounting portion 121, thus, it is possible to guarantee first
The connection reliability of component 11 and second component 12.
In order to assemble the mould group 1, the assemble method of the mould group 1, specifically, assembling can be implemented using following assembling device
Device may include: mounting platform 3, heater (not shown go out) and pressurizing device 4, have heating region on mounting platform 3
31 and room temperature region 32, wherein the upper surface of mounting platform 3 can be formed as plane, and heating region 31 can be with mounting portion 121
Structure (shape, size) it is identical, heater is located in the bottom or mounting platform 3 of mounting platform 3 and for heating zone
Domain 31 is heated, and pressurizing device 4 can be located at the top of mounting platform 3 up or down.Wherein, mounting platform 3 and heater can be with
Constitute fixation heating device described below.
Embodiment one,
As shown in Figure 1, the specific assemble method of the mould group 1 the following steps are included:
Firstly, first material 21 that can do over again is folded between the first component 11 and mounting portion 121；Then, to mounting portion
121 heat cooling again first to obtain pre-determined bit mould group；Then, whether detection pre-determined bit mould group is qualified, if qualified, compresses first
Component 11 and mounting portion 121 then first heat mounting portion 121 and are cooled to room temperature, so that the first component 11 and second component
12 are fixed together.
Thus, it is possible to find out, in above process, first material 21 that can do over again is played to the first component 11 and second component
12 carry out pre-determined bit and finally fixed double action, to realize the doing over again property of production of the first component 11 and second component 12
With use reworkable property, and effectively improve the whole assembly efficiency of mould group 1.
The specific assemble method of the mould group 1 is further comprising the steps of:
Second material (not shown go out) that can do over again is filled in mounting portion 121 and around the first component 11, to realize
To the fixation booster action of the first component 11 and second component 12.Preferably, the second adhesiveness that can do over again material is greater than first
Can do over again the adhesiveness of material 21, so as to further increase the connection fixing of the first component 11 Yu second component 12.The
One material 21 and second that can do over again can do over again the solidification of material or surface cure duration is much smaller than the solidification duration of common glue,
So as to effectively improve the whole assembly efficiency of mould group 1.
Preferably, first can do over again material 21 for high-melting-point and dissolve in the adhesive material of doing over again of corresponding solvent, such as
Paraffin piece etc..During doing over again as a result, paraffin piece and the first component 11 and second can be realized by heating paraffin wax piece
The separation of part 12.Preferably, the thickness of paraffin piece can at 50 μm hereinafter, so that it is guaranteed that rework preocess go on smoothly and can be with
Ensure the assembly precision and connection reliability of the first component 11 and second component 12.Further, the geomery of paraffin piece can
With identical as the geomery of mounting portion 121, so that paraffin piece can be fitted in just on mounting portion 121, to further increase
The assembly precision of the first component 11 and second component 12.
Preferably, second can do over again material can be for room temperature vulcanized silicone rubber, the performance with accelerated surface cure.Due to
Room temperature vulcanized silicone rubber is only after surface cure, so that it may and it realizes the fixation of the first component 11 and second component 12, continues subsequent handling,
So as to further increase the overall package efficiency of mould group 1.In short, second can do over again material usually select without heating,
Only at normal temperature can spontaneous curing material of doing over again, such as room temperature vulcanized silicone rubber etc., to effectively improve mould group 1
Overall package efficiency.
A kind of assemble method and reworking method of the mould group 1 of the complete expression embodiment one:
(1) first that the first component 11 and second component 12 is clean, it is flat that second component 12 is then lain in into installation
On platform 3 and ensure mounting portion 121 and about 31 face of heating region, then first can do over again, and (such as thickness is in 50 μ for material 21
M or less and section shape and size paraffin piece identical with mounting portion 121) it is placed on the mounting portion 121 of second component 12.
Hereafter, can using heater to heating region 31 heat so that mounting portion 121 heat up, make first can do over again material 21 fusing with
(can also save this step certainly) Nian Jie with mounting portion 121, then the first component 11 can be placed on to first can do over again material
On 21.
(2) then, heating region 31 is heated by heater, makes first can do over again material so that mounting portion 121 is warming up to
21 fusing of material, is then cooled to room temperature again, after first can do over again material 21 it is cooling after, the first component 11 can be located in well
In mounting portion 121, to obtain pre-determined bit mould group.Specifically, before this step, 121 He of mounting portion can be compressed in advance
The first component 11, such as can be by moving down pressurizing device 4 to compress second component 12 and the first component 11, to improve the
The reliability of positioning of one component 11 and second component 12.
(3) then, pre-determined bit mould group is detected, if testing result display is qualified, second can be done over again material
Material (such as room temperature vulcanized silicone rubber) is filled in mounting portion 121 and around the first component 11, securely by the first component 11
It is fixed on second component 12, reinforces and protect the bonding of the first component 11 and second component 12, still, if testing result is aobvious
Show unqualified, that is to say, that testing result display failure can do over again.
Reworking method is as follows:
(1) first component 11 and second component 12 are separated.For example, mounting platform 3 can be placed on the mould group 1 that need to be done over again
On, then heating region 31 is heated by heater, causes first can do over again the fusing of material 21, it then can be by first
Component 11 is taken off from mounting portion 121.Hereafter, it can do over again material using on solvent cleaning mounting portion 121 remaining first
First on material 21 and the first component 11 can do over again material 21 (this step can be omitted).As a result, since first can do over again material
21 adhesiveness is not very strong, thus do over again remove the first component 11 during, second component 12 is not damaged, such as glass
The ink layer of glass panel surface is not damaged, moreover, because first material 21 that can do over again dissolves in corresponding solvent, so as to
Ensure the cleannes of the first component 11 and second component 12, to facilitate repositioning.
(2) pre-determined bit is re-started to the first component 11 and second component 12 and is detected using first material 21 that can do over again,
Until obtaining the qualified pre-determined bit mould group of detection and can do over again the fixed first component 11 of material 21 and second component 12 using first.
In conclusion the assemble method of above-mentioned mould group 1 is simple, produce and easy to operate, high production efficiency of doing over again, waste product
Rate is low.In addition, the component that this assemble method can be used for high value carries out the assembling that can be done over again, such as assembling fingerprint mould
The assembling etc. of group key.
Embodiment two,
Referring to Fig. 2, the specific assemble method of mould group 1a the following steps are included:
Firstly, first material 22 that can do over again is folded between the first component 11 and mounting portion 121；It then, can by third
Material 23 of doing over again is filled in mounting portion 121 and around the first component 11；Then, pass through fixed point heating device (such as resistance wire
Or laser) the third material 23 that can do over again is carried out by heating makes third that can do over again 23 instantaneous solidification of material, it at the same time, can be with
Heating region 31 is heated using fixed heating device, i.e. using heater so that mounting portion 121 heats up, makes third that can do over again
23 instantaneous solidification of material；Finally, whether detection pre-determined bit mould group 1a is qualified, if qualified, the first component 11 and second are compressed
Component 12 can be done over again 22 spontaneous curing of material by first.
Thus, it is possible to find out, in above process, using third can do over again material 23 instantaneous solidification to the first component 11
Play the role of pre-determined bit with second component 12, by first can do over again material 22 spontaneous curing to the first component 11 and second
Part 12 plays final fixed function, to realize the doing over again property of production of the first component 11 and second component 12 and using reworkable
Property, to effectively improve the whole assembly efficiency of mould group 1a.
Preferably, first can do over again material 22 for room temperature vulcanized silicone rubber, and third can do over again material 23 for paraffin.As a result,
During production, if detection is unqualified, can be done over again material 23 by heating third, realize the first component 11 and second
The separation of component 12, to ensure going on smoothly for rework preocess；It, can be with when breaking down in mould group 1a use process or failure
First the heating third material 23 that can do over again removes third and can do over again material 23, and then removing first by shearing force can do over again material
22, separate the first component 11 and second component 12, to ensure going on smoothly for Rework Technics.It can do over again material 22 due to first
For under room temperature can spontaneous curing room temperature vulcanized silicone rubber, thus first can do over again solidifying for material 22 can be in production
It is naturally done in subsequent technique, and then greatlys improve the overall package efficiency of mould group 1a.
A kind of assemble method and reworking method of the mould group 1a of the complete expression embodiment two:
(1) first material 22 that can do over again is located between mounting portion 121 and the first component 11, third can be done over again material 23
It is located in mounting portion 121 and around the first component 11.It, can be first second such as in a specific example of the present embodiment
Component 12, such as glass panel are placed on mounting platform 3, and then setting first can do over again material 22 in mounting portion 121, example
It such as can be the room temperature vulcanized silicone rubber that viscous liquid shape is presented, the first component 11 then fallen on to the in mounting portion 121 again
One can do over again on material 22, and being then stained in the neighboring of the first component 11 can do over again and the third of quick solidifying can do over again material
23, such as paraffin (certainly, this step can also carry out in advance).
(2) it uses fixed point heating device 5 that can do over again after material 23 heats third to be cooled down again to obtain pre-determined bit mould group.Example
Such as, it can be done over again in the top of mounting platform 3 to the third for being looped around 11 periphery of the first component by resistance wire or laser
Material 23 carries out fixed point heating, and the high-temperature heating of moment makes third that can do over again 23 rapid melting of material, then can stop heating,
Make third can do over again material 23 be quickly cooled down solidification, the first component 11 is just temporarily assembled on second component 12 at this time, from
And obtain pre-determined bit mould group 1a.
In addition, in this embodiment, using fixed point heating device 5 to third can do over again material 23 heat while,
Fixed heating device can also be used to heat mounting portion 121 simultaneously to accelerate the third material 23 that can do over again to melt, wherein fixed
Heating device can be above-mentioned mounting platform 3 and heater, that is to say, that heater can be allowed simultaneously on mounting platform 3
Heating region 31 heat so that the temperature of mounting portion 121 increases, to accelerate third that can do over again the fusing of material 23.Certainly,
The invention is not limited thereto, and can also can do over again material 23 only with fixed heating device fusing third.
(3) then, pre-determined bit mould group 1a is detected, it, can following fixture continuation if testing result display is qualified
Remaining process, making first between the first component 11 and mounting portion 121 can do over again, material 22 is abundant to be solidified, such as at normal temperature certainly
So solidification.But if testing result show it is unqualified, that is to say, that testing result display failure, can do over again, return
Work process and a upper embodiment are essentially identical, i.e., removing the third material 23 and first that can do over again by heating or solvent can do over again
Material 22, and the first component 11 and second component 12 that separate are re-assemblied.
To sum up, can make the assembling process of mould group can when being pre-positioned using the material that can do over again to mould group
It is lossless to do over again；When use can do over again material fixed module, the assembling process of mould group can be made lossless can to do over again, use process
It lossless can reprocess；When using the material of doing over again of surface cure fast speed to be pre-positioned or fixed module, can greatly mention
The packaging efficiency of high mould group；When using adhesiveness it is stronger do over again material fixed module when, it can be ensured that mould group is in various rings
Connection reliability under the conditions of border.
In conclusion assemble method according to an embodiment of the present invention, enables to the assembling of high value mould group to produce and has
Doing over again property reduces input cost to reduce scrappage.Moreover, the assemble method is efficient and convenient, what be can choose does over again
There are many material, and can use fast-curing process, are reduced to common online waiting time from several minutes 10 seconds
Magnitude.Meanwhile the fixed point instantaneous solidification measure of introducing can to avoid, treat the process that assembling parts are integrally heated at high temperature,
The potential danger of technique is greatly reduced, and avoids the introducing of big stress.In short, the group of mould group according to an embodiment of the present invention
Dress method, packaging efficiency is high, can do over again, is reworkable, is highly-safe.
In the description of the present invention, it is to be understood that, the orientation or positional relationship of the instructions such as "upper", "lower" is based on attached
Orientation or positional relationship shown in figure, is merely for convenience of description of the present invention and simplification of the description, rather than indication or suggestion is signified
Device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the present invention
Limitation.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of assemble method of mould group, which is characterized in that the mould group includes the first component and second component, the assembling side
Method the following steps are included:
The first component and the second component are pre-positioned to obtain pre-determined bit mould group；
It whether qualified detects the pre-determined bit mould group, if qualified, can do over again the fixed first component of material using first
With the second component；If unqualified, separate the first component and the second component, and to the first component and
The second component re-starts pre-determined bit and detects, up to the pre-determined bit mould group and use described first that obtain detection qualification can
The fixed first component of material of doing over again and the second component,
There is mounting portion for installing the first component, described first material that can do over again is folded in institute on the second component
State between the first component and the mounting portion, when described first can do over again material be can be used shearing force removing material of doing over again
When, it is described the first component and the second component to be pre-positioned to obtain pre-determined bit mould group specifically:
C1, material that third can do over again are filled in the mounting portion and around the first components；
C2, material can be done over again to the third and/or the mounting portion carries out heating keeps third material moment that can do over again solid
Change to obtain pre-determined bit mould group；
It is described to do over again the fixed first component of material and the second component using first specifically:
D1, before the step C1, first material that can do over again is folded between the first component and the mounting portion；
After D2, the testing result for being pre-positioned mould group are qualified, the first component and the mounting portion are compressed, by described first
Can do over again material spontaneous curing.
2. the assemble method of mould group according to claim 1, which is characterized in that the first component and the second component
By described first can do over again material it is fixed after as damaged, carry out following reprocessing step:
Separate the first component and the second component；
Replace or repair the first component and/or the second component；
It re-assemblies.
3. the assemble method of mould group according to claim 1 or 2, which is characterized in that separate the first component and described
It is further comprised the steps of: after second component
It can be done over again material using first on the first component described in solvent cleaning and/or the second component.
4. the assemble method of mould group according to claim 1, which is characterized in that described first can do over again material for room temperature sulphur
SiClx rubber, the third can do over again material for paraffin.
5. the assemble method of mould group according to claim 1, which is characterized in that using fixed point heating device to the third
The material that can do over again heating.
6. the assemble method of mould group according to claim 5, which is characterized in that the fixed point heating device be resistance wire or
Person's laser.
7. the assemble method of mould group according to claim 1, which is characterized in that using fixed heating device to the installation
It is heated in portion.
8. the assemble method of mould group according to claim 7, which is characterized in that the fixed heating device includes:
Mounting platform has heating region and room temperature region on the mounting platform, and it is flat that the second component is located at the installation
On platform and the mounting portion and the heating region face up and down；With
Heater, the heater are used to heat the heating region.
9. a kind of mould group, which is characterized in that assembled using the assemble method of mould group according to claim 1 to 8
It forms.
10. mould group according to claim 9, which is characterized in that the mould group is the fingerprint recognition mould group of mobile terminal, institute
Stating the first component is fingerprint sensor, and the second component is screen.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610092212.6A CN107094365B (en) | 2016-02-18 | 2016-02-18 | Mould group and its assemble method |
| PCT/CN2016/091980 WO2017140091A1 (en) | 2016-02-18 | 2016-07-28 | Module and assembling method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610092212.6A CN107094365B (en) | 2016-02-18 | 2016-02-18 | Mould group and its assemble method |
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| CN107094365A CN107094365A (en) | 2017-08-25 |
| CN107094365B true CN107094365B (en) | 2019-10-29 |
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| CN201610092212.6A Active CN107094365B (en) | 2016-02-18 | 2016-02-18 | Mould group and its assemble method |
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| CN (1) | CN107094365B (en) |
| WO (1) | WO2017140091A1 (en) |
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| CN107733176B (en) * | 2017-09-26 | 2019-11-15 | 东莞市大为工业科技有限公司 | A kind of welding technique of motor diverter and motor coil |
| CN110936624B (en) * | 2018-09-21 | 2021-08-06 | 宁波舜宇光电信息有限公司 | Repairing device and method for camera module |
| CN115071180A (en) * | 2022-06-29 | 2022-09-20 | 深圳市航盛电子股份有限公司 | Repair recycling process of vehicle-mounted display module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261156A (en) * | 1991-02-28 | 1993-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of electrically connecting an integrated circuit to an electric device |
| US6365700B1 (en) * | 1999-06-07 | 2002-04-02 | National Starch And Chemical Investment Holding Corporation | High green strength reactive hot melt by a prepolymerization in the main reactor |
| CN102127374A (en) * | 2010-12-29 | 2011-07-20 | 北京遥测技术研究所 | Method for repairing DAD-40 conductive adhesive bonding product |
| CN104942431A (en) * | 2015-06-17 | 2015-09-30 | 王金 | Laser processing device and process for laser hot melt adhesive quick adhesion thereof |
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1386936A1 (en) * | 2002-07-30 | 2004-02-04 | Thomas Abend | Process and composition for preparing reactive melts based on surface-deactivated solid isocyanates and polymers with functional groups |
-
2016
- 2016-02-18 CN CN201610092212.6A patent/CN107094365B/en active Active
- 2016-07-28 WO PCT/CN2016/091980 patent/WO2017140091A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261156A (en) * | 1991-02-28 | 1993-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of electrically connecting an integrated circuit to an electric device |
| US6365700B1 (en) * | 1999-06-07 | 2002-04-02 | National Starch And Chemical Investment Holding Corporation | High green strength reactive hot melt by a prepolymerization in the main reactor |
| CN102127374A (en) * | 2010-12-29 | 2011-07-20 | 北京遥测技术研究所 | Method for repairing DAD-40 conductive adhesive bonding product |
| CN104942431A (en) * | 2015-06-17 | 2015-09-30 | 王金 | Laser processing device and process for laser hot melt adhesive quick adhesion thereof |
| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107094365A (en) | 2017-08-25 |
| WO2017140091A1 (en) | 2017-08-24 |
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