CN110936624B - Repairing device and method for camera module - Google Patents
Repairing device and method for camera module Download PDFInfo
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- CN110936624B CN110936624B CN201811104507.6A CN201811104507A CN110936624B CN 110936624 B CN110936624 B CN 110936624B CN 201811104507 A CN201811104507 A CN 201811104507A CN 110936624 B CN110936624 B CN 110936624B
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- camera module
- module
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- adhesive layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
Abstract
The invention provides a repair device, which is used for repairing at least one camera module, wherein each camera module comprises a lens component and a photosensitive component, the lens component and the photosensitive component are connected through a combined glue layer, and the repair device comprises: the camera module comprises a preset module and a heating module, wherein the preset module is used for presetting a downward movement amount according to a stitching value required by the camera module, and the heating module is used for heating a bonding adhesive layer between the lens of the camera module and the photosensitive assembly so as to enable the bonding adhesive layer to be converted into a glass state from a solid state; and the pressing module presses the bonding adhesive layer of the camera module by the downward movement amount and the glass-state bonding adhesive layer, so that the imaging quality of the camera module reaches the standard. Therefore, the yield in the production of the camera module can be improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the field of camera modules, in particular to a repair device and a repair method of a camera module.
Background
With the advancement and development of technology, the camera module has become a standard configuration of the mobile electronic terminal, and the imaging quality of the camera module determines the overall quality of the mobile electronic terminal. However, in the actual production of the camera modules, it is difficult to completely fix all the camera modules to the vicinity of the clear position due to the difference in material and machine stability, which may cause image blur at the test stage.
Particularly, it has two reasons to lead to the image of module of making a video recording is blurred, and first is because the camera lens of the module of making a video recording and the distance between the sensitization chip of sensitization subassembly is too big, leads to the formation of image of camera lens and the formation of image of sensitization chip not to be in the coplanar, leads to the not clear image that makes of image that the sensitization chip received to be blurred. Secondly, because the position between the lens of the camera module and the photosensitive assembly is not at the preset angle, the imaging of the lens and the imaging of the photosensitive chip are not in the same plane, so that the image received by the photosensitive chip is not clear and image blurring is generated.
The existing camera module manufacturing process cannot guarantee that the camera module is a good product without causing imaging paste, generally speaking, in the actual production camera module process, the proportion of the imaging paste caused by the produced camera module is about 2-3%, and in order to save production cost and improve product yield, the processing of the camera module which generates the imaging paste becomes an inevitable problem.
However, the conventional processing method is to disassemble the camera module generating image blur, so as to clean the lens and the photosensitive assembly of the camera module, and encapsulate each component of the camera module after cleaning. Here, in the disassembling process, the camera module is easily destroyed, and irrecoverable damage is caused to the camera module. In the repackaging process, there is still a possibility that the image module generates image blur, and in addition, the repackaging also has a great influence on the imaging quality of the image module.
Disclosure of Invention
The invention aims to provide a repairing device and a repairing method for a camera module.
Another object of the present invention is to provide a repair apparatus for a camera module and a repair method thereof, in which the relative position between a lens and a photosensitive chip of the camera module is adjusted, so as to improve the imaging quality of the camera module to reach a standard, thereby improving the yield of products and reducing the production cost.
Another object of the present invention is to provide a device and a method for repairing a camera module, in which other components are not damaged during the process of heating and pressurizing the camera module, so that the camera module can be repaired conveniently, and the efficiency of repairing a defective camera module can be improved.
Another object of the present invention is to provide a device and a method for repairing a camera module, wherein the camera module is heated and pressurized without causing stains or dirt on the camera module, thereby ensuring the imaging quality of the camera module.
Another object of the present invention is to provide a repair device for a camera module and a repair method thereof, wherein the repair device can heat and pressurize the camera module, and the repair device has the characteristics of high precision and high stability, and can ensure the imaging quality of the camera module.
Another object of the present invention is to provide a repair device for a camera module and a repair method thereof, wherein the repair device can repair a plurality of camera modules simultaneously, thereby greatly improving repair efficiency.
Another object of the present invention is to provide a repair device for a camera module and a repair method thereof, wherein the repair device can heat and pressurize the camera module, and the repair device can repair the camera modules in batch, thereby improving repair efficiency and saving time and cost.
Another object of the present invention is to provide a repair device for a camera module and a repair method thereof, wherein the repair device can repair different types of camera modules, such as a fixed-focus camera module and an auto-focus camera module, and has the characteristic of good versatility.
Another objective of the present invention is to provide a device and a method for repairing a camera module, wherein the device comprises a fixing module capable of supporting and fixing the camera module, so that the camera module is kept constant during the pressing process.
Another objective of the present invention is to provide a device and a method for repairing a camera module, wherein the device comprises a heating module, which can heat a bonding adhesive layer of the camera module to a glass transition temperature, so that a lens and a photosensitive assembly of the camera module can be adjusted.
Another objective of the present invention is to provide a device and a method for repairing a camera module, wherein the device comprises a pressing module, which can press the bonding layer to adjust the relative position between the lens and the photosensitive assembly, so as to ensure that the performance and reliability of the camera module after pressing can meet the requirements.
Another objective of the present invention is to provide a device and a method for repairing a camera module, wherein the device comprises a setting module, and the setting module is capable of timing a pressing process to ensure that the performance and reliability of the camera module after pressing meet a standard.
Another objective of the present invention is to provide a repair device for a camera module and a repair method thereof, wherein the repair device includes a data acquisition and calculation module, and the data acquisition and calculation module can acquire an image of the camera module to calculate a pressing amount, so that the performance and reliability of the camera module after pressing meet standards.
In order to achieve at least one of the above objectives, the present invention provides a repair device for repairing at least one camera module, wherein each camera module includes a lens component and a photosensitive component, and the lens component and the photosensitive component are connected by a bonding adhesive layer, the repair device comprising:
the preset module is used for presetting a downward movement amount according to the pressing value required by the camera module;
the heating module is used for heating a bonding adhesive layer between the lens of the camera module and the photosensitive assembly so as to soften the bonding adhesive layer; and
and the pressing module presses the bonding adhesive layer of the camera module by virtue of the downward movement amount and the softened bonding adhesive layer so as to enable the imaging quality of the camera module to reach the standard.
In an embodiment of the invention, the bonding adhesive layer further comprises a setting module, the setting module comprises a temperature control module, and the temperature control module is used for controlling the temperature of the heating module for heating the bonding adhesive layer to the glass transition temperature
In an embodiment of the invention, the setting module further includes a pressing timing module, and the pressing timing module is configured to control a time for the pressing module to press the bonding adhesive layer of the camera module.
In an embodiment of the invention, the time for the stitching timing module to stitch the stitching adhesive layer of the camera module is 18 to 30 seconds.
In an embodiment of the invention, the setting module further includes a temperature control module, and the temperature control module is configured to control the heating module to heat the bonding adhesive layer to a glass transition temperature.
In order to achieve at least one of the above objects, the present invention further provides a repairing device for repairing at least one camera module, wherein each camera module includes a lens assembly and a photosensitive assembly, and the lens assembly and the photosensitive assembly are connected by a bonding adhesive layer, the repairing device comprising:
the image processing module comprises an image acquisition module and a generation module, and the image acquisition module is used for acquiring the image of the camera module; the generating module is used for obtaining the stitching amount required by the camera module according to the obtained image of the camera module;
the heating module is used for heating a bonding adhesive layer in the camera module so as to soften the bonding adhesive layer; and
and the pressing module presses the bonding adhesive layer of the camera module by virtue of the downward movement and the glass-state bonding adhesive layer, so that the imaging quality of the camera module reaches the standard.
In an embodiment of the invention, the bonding adhesive layer further includes a setting module, wherein the setting module further includes a temperature control module, and the temperature control module is configured to control the heating module to heat the temperature of the bonding adhesive layer to the glass transition temperature.
In an embodiment of the present invention, the image processing module further includes a determining module, where the determining module is configured to determine whether the imaging quality of the camera module meets a standard: when the imaging quality of the camera module reaches the standard, the pressing module is kept static and is in a pressing state; and when the imaging quality of the camera module does not reach the standard, acquiring the imaging of the camera module through the image acquisition module, acquiring the corresponding stitching amount required by the camera module through the generation module based on the acquired image, and stitching the camera module through the stitching module until the imaging of the camera module reaches the standard based on the stitching amount.
In an embodiment of the invention, the setting module includes a pressing timing module, and the pressing timing module is configured to control a time for the pressing module to press the bonding adhesive layer of the camera module.
In an embodiment of the invention, the time for the stitching timing module to stitch the stitching adhesive layer of the camera module is 18 to 30 seconds.
In order to achieve at least one of the above objects, the present invention further provides a method for repairing a camera module, comprising:
presetting the downward movement amount of the pressing module according to a pressing value required by the camera module;
heating a bonding adhesive layer in the camera module to soften the bonding adhesive layer; and
and pressing the camera module based on the preset downward movement amount of the pressing module so that the imaging quality of the camera module reaches the standard.
In an embodiment of the present invention, before the step of presetting the pre-pressing amount of the camera module, the method includes the steps of:
acquiring the image of the camera module to obtain a defocusing curve of the imaging quality of the camera module through an evaluation function; and
and obtaining a stitching value required by the camera module based on the defocusing curve.
In an embodiment of the invention, the evaluation function is any one or a combination of several selected from the group consisting of TV line, SFR, and MTF.
In an embodiment of the present invention, the step of heating a temperature of a bonding adhesive layer in the camera module to soften the bonding adhesive layer includes the steps of:
and controlling the temperature of the bonding glue layer to be heated to a glass transition temperature so that the bonding glue layer is converted from a solid state to a glass state.
In an embodiment of the present invention, the stitching the camera module to make the imaging quality of the camera module meet the standard based on the stitching amount required by the camera module includes:
presetting the stitching time under the stitching quantity required by the camera module; and
and pressing the camera module based on the preset pressing time under the pressing amount required by the camera module and the pressing amount required by the camera module so as to enable the imaging quality of the camera module to reach the standard.
In an embodiment of the present invention, the pressing time for the pressing amount required by the camera module is set to be 18 to 30 seconds.
In order to achieve at least one of the above objects, the present invention further provides a method for repairing a camera module, comprising:
acquiring an image of the camera module;
acquiring the compression amount of the camera module by the acquired image of the camera module;
heating a bonding adhesive layer in the camera module to soften the bonding adhesive layer; and
based on the softened combination glue layer and the downward movement amount required by the camera module, the camera module is pressed to enable the imaging quality of the camera module to reach the standard.
In an embodiment of the present invention, in the step of stitching the camera module based on the softened bonding glue layer and the stitching amount required by the camera module, so that the imaging quality of the camera module meets the standard, the stitching method includes:
the image acquisition processing module acquires the image of the camera module so as to judge whether the imaging quality of the camera module reaches the standard:
when the imaging quality of the camera module reaches the standard, stopping pressing the camera module; and
when the imaging quality of the camera module does not reach the standard, the corresponding amount of pressing required by the camera module is obtained by means of the imaging of the camera module, and the camera module is pressed based on the amount of pressing until the imaging of the camera module reaches the standard.
In an embodiment of the present invention, the step of obtaining the pressing amount required by the camera module according to the obtained image of the camera module includes:
acquiring an image of the camera module, and acquiring a defocusing curve of the imaging quality of the camera module through an evaluation function; and
and obtaining the stitching amount required by the camera module on the basis of the defocusing curve.
In an embodiment of the present invention, the evaluation manner is any one or a combination of several selected from the group consisting of TV line, SFR, and MTF.
In an embodiment of the present invention, the step of heating a temperature of a bonding adhesive layer in the camera module to soften the bonding adhesive layer includes the steps of:
and controlling the temperature of the bonding glue layer to be heated to a glass transition temperature so that the bonding glue layer is converted from a solid state to a glass state.
In an embodiment of the present invention, in the step of stitching the camera module based on the softened bonding glue layer and the stitching amount required by the camera module, so that the imaging quality of the camera module meets the standard, the stitching method includes:
presetting the stitching time under the stitching quantity required by the camera module; and
and pressing the camera module based on the preset pressing time under the pressing amount required by the camera module and the pressing amount required by the camera module so as to enable the imaging quality of the camera module to reach the standard.
In an embodiment of the present invention, the pressing time for the pressing amount required by the camera module is set to be 18 to 30 seconds.
Drawings
Fig. 1 is a schematic structural diagram of a repair apparatus for a camera module according to a first preferred embodiment of the invention.
Fig. 2 is a schematic structural diagram of a repairing apparatus for a camera module according to a second preferred embodiment of the invention.
Fig. 3 is a flowchart illustrating the rework method for the camera module according to the first preferred embodiment of the invention.
Fig. 4 is a flowchart illustrating the rework method for the camera module according to a second preferred embodiment of the invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
In production and the module in-process of making a video recording, because the difference of material and board stability, will all make a video recording the module and fix totally near the clear position department to can lead to making the formation of image paste in the test stage, and make the formation of image paste mainly include two reasons, firstly because the camera lens of the module of making a video recording and the distance between the sensitization chip of sensitization subassembly is too big, lead to the formation of image of camera lens and the formation of image of sensitization chip not in the coplanar, lead to the not clear formation of image paste of the image that the sensitization chip received. Secondly, because the position between the lens of the camera module and the photosensitive assembly is not parallel, the imaging of the lens and the imaging of the photosensitive chip are not in the same plane, and the image received by the photosensitive chip is not clear, so that imaging paste is generated.
However, the existing camera module manufacturing process cannot guarantee that the camera module is a good product and does not cause imaging paste, generally speaking, in the actual production camera module process, the proportion of the imaging paste caused by the produced camera module is about-% and an inevitable problem is caused in order to save production cost and improve product yield.
In order to solve the problems, the basic idea of the invention is to repair the camera module generating the image paste, change the relative position between the lens and the photosensitive assembly of the camera module according to the reason of generating the image paste, and ensure that the relative position between the lens and the photosensitive assembly can be adjusted under the action of applied pressure by heating the bonding adhesive layer between the lens and the photosensitive assembly of the camera module to the glass transition temperature. And then to the module of making a video recording exerts preset pressure to the adjustment the formation of image quality of the module of making a video recording reaches the standard, and the module of making a video recording of pasting the image is reprocessed to the module of making a video recording that meets the requirements.
Based on the above, the invention provides a method for repairing a camera module, which comprises the steps of firstly presetting the pressing amount of the camera module, arranging the camera module on a fixed module, preventing the camera module from moving in the process of applying pressure, secondly heating the camera module, and heating the temperature to the glass transition temperature of a bonding adhesive layer of the camera module; and pressing the camera module based on a preset pressing amount to change the relative position between a lens and a photosensitive assembly of the camera module, so that the imaging quality of the camera module can be improved, and the imaging quality of the camera module can reach the standard.
Fig. 1 is a schematic diagram of a repair apparatus for a camera module according to a preferred embodiment of the present invention, and as shown in fig. 1, the repair apparatus for a camera module according to a preferred embodiment of the present invention is described, wherein the repair apparatus can repair a camera module generating image blur to make the imaging quality of the camera module meet a standard, so as to improve the yield of production and reduce the production cost in the process of producing the imaging quality of the camera module. The repair device comprises a preset module 50, a fixed module 10, a heating module 20 and at least one pressing module 30, wherein the preset module 50 is used for presetting the downward movement of the pressing module 30 based on the pressing amount required by the camera module, the fixed module 10 is used for supporting and fixing the camera module so as to correspond the positions of the camera module and the pressing module 30 for subsequent repair treatment of the camera module, and the heating module 20 can be used for heating the camera module so as to change a bonding adhesive layer in the camera module from a solid state to a glass state, thereby facilitating the pressurization of the camera module when the pressing module 30 moves downward; the stitching module 30 can move downwards by the length of the downward movement amount preset by the preset module 50 so as to stitch at least one camera module, so that the imaging quality of the camera module meets the standard.
Correspondingly, in the invention, the camera module comprises a lens component, a photosensitive component and a bonding adhesive layer, wherein the lens component is arranged on a photosensitive path of the photosensitive component, and the bonding adhesive layer is arranged between the lens component and the photosensitive component so as to fixedly connect the lens component and the photosensitive component to form the camera module. In the present invention, the camera module may be a fixed-focus camera module or an auto-focus camera module, wherein for the auto-focus camera module, the lens assembly includes a driving part and a lens, wherein the lens is mounted on the driving part, the driving part and the lens form the lens assembly, and the lens assembly and the photosensitive assembly are fixedly connected by the bonding adhesive layer to form the auto-focus camera module. For the fixed-focus camera module, the lens assembly comprises a lens and a lens base, wherein the lens is arranged on the lens base to form the lens assembly, and the lens assembly is fixedly connected with the photosensitive assembly through the bonding glue layer. It should be appreciated that whether the camera module is implemented as an auto-focus camera module or a fixed-focus camera module in the present invention is not a limitation of the present invention. It is worth mentioning that the repair device can repair a plurality of camera modules simultaneously, including a plurality of the press-fit modules 30, wherein each of the press-fit modules 30 corresponds to one of the camera modules, so as to adjust the imaging quality of the camera modules simultaneously, thereby enabling the plurality of camera modules to reach the standard simultaneously, and improving the repair efficiency of the repair device.
For convenience of description and understanding, in the present invention, a camera module corresponding to one of the pressing modules 30 is used to illustrate a rework principle of the rework apparatus, and accordingly, the preset module 50 is used to preset a downward movement amount of the pressing module 30 according to a pressing amount required by the camera module. Here, since the stitching amounts required by each camera module are different, the defocus curve of the imaging quality of the camera module needs to be obtained by obtaining the image of the camera module in a manner of evaluating a function; and acquiring a stitching value required by the camera module based on the defocusing curve. In the invention, the evaluation function may be implemented but not limited to TV line, SFR, modulation function MTF. In addition, the downward movement amount of the stitching module 30 is a dimension of the stitching module 30 that needs to move downward in the process of stitching the camera module.
The camera module is arranged on the fixed module 10, and the position of the camera module corresponds to the position of the press-fit module 30, so that the press-fit module 30 can be pressed in the downward moving process of the camera module. In other words, when the pressing module 30 moves downward to press the camera module, the positions of the pressing module 30 and the camera module can be kept constant, so that the camera module is prevented from moving in the pressing process, the efficiency of repairing the camera module can be improved, and the repairing quality is ensured.
The heating module 20 can heat the camera module on the fixing module 10, and is configured to soften a bonding glue layer between the lens and the photosensitive component in the camera module, so that a relative position between the lens component and the photosensitive component is adjustable. It is worth mentioning that, in the present invention, the positional relationship between the lens assembly and the photosensitive assembly includes: the distance relationship between the lens assembly and the photosensitive assembly and the distance relationship between the lens assembly and the photosensitive assembly are not at a preset angle, in other words, the distance relationship between the lens assembly and the photosensitive assembly depends on the thickness of the bonding adhesive layer, and therefore, the distance relationship between the lens assembly and the photosensitive assembly is adjusted by changing the thickness of the bonding adhesive layer. Whether the lens assembly and the photosensitive assembly are at the preset angle depends on the shape of the bonding adhesive layer, and when the upper surface and the lower surface of the bonding adhesive layer are at the preset angle, good imaging quality can be achieved between the lens assembly and the photosensitive assembly. Consequently, through the adjustment thickness and the shape that combine the glue film can be adjusted the position relation between camera lens subassembly and the photosensitive assembly to be favorable to promoting the imaging quality of the module of making a video recording. Particularly, the thickness of the bonding glue layer is reduced, and the upper surface and the lower surface of the bonding glue layer are kept in a preset angle state, so that the imaging quality of the camera module can reach the standard.
Correspondingly, in the present invention, the heating module 20 heats the bonding adhesive layer of the camera module by heating the fixing module 10, so that when the pressing module 30 moves downward to act on the lens of the camera module, the bonding adhesive layer between the lens and the photosensitive component deforms to a certain extent, so as to change the thickness of the bonding adhesive layer, and the performance and reliability of the camera module meet the requirements. Particularly, the bonding adhesive layer is heated to about a glass transition temperature point (Tg point) so that the bonding adhesive layer is converted from a solid state to a glass state and softened, and during the process of pressing the camera module by the pressing module 30, the positional relationship between the lens and the photosensitive assembly of the camera module can be adjusted, so that the image obtained by the lens and the plane where the photosensitive assembly is located are in the same plane, and the specified requirements are met. It is worth mentioning that the material and thickness of the bonding adhesive layer are different for different camera modules, and the temperature at which the camera module is heated is different for different materials of the bonding adhesive layer, wherein the temperature at which the bonding adhesive layer of the camera module is heated depends on the glue material used, for example, if the glass transition temperature of the AA glue material is 80 degrees celsius, the glass transition temperature of the HA glue material is 55 degrees celsius.
More specifically, when the bonding adhesive layer of the camera module is heated to the glass transition temperature, the bonding adhesive layer between the lens and the photosensitive component of the camera module is softened, so that the relative position between the lens and the photosensitive component can be adjusted, especially when the lens and the photosensitive component are pressed by the pressing module 30, the distance between the lens and the photosensitive component is reduced, and according to the preset downward moving amount of the pressing module 30, the pressing module 30 moves downward by the length of the downward moving amount to ensure that the imaging quality of the camera module reaches the standard. In the process of heating and pressing the camera module, other parts of the camera module cannot be damaged, and only the distance between the lens and the photosensitive assembly is changed, in other words, the thickness of the bonding adhesive layer can be reduced by applying pressure to the camera module in the process of moving the pressing module 30 downwards, so that the distance between the lens and the photosensitive assembly is changed, the camera module cannot be stained or dirty in the process, and the repairing is convenient.
As shown in fig. 1, the repairing apparatus further includes a setting module 40, wherein the setting module 40 includes a temperature control module 41 and a pressing timing module 42, and the temperature control module 41 is configured to control the heating module 20 to heat the temperature of the bonding adhesive layer of the camera module to a glass transition temperature, so as to ensure that the heating module 20 can ensure that the bonding adhesive layer is heated to a proper temperature when heating the bonding adhesive layer of the camera module. The stitching timing module 42 is configured to time a stitching process of the stitching module 30, so as to ensure that performance and reliability of the camera module meet requirements after the camera module is stitched by the stitching module 30. It should be noted that the thickness and the parameter of the bonding adhesive layer of different camera modules are different, for example, the type of the glue, and usually, the glue parameter and the thickness corresponding to the camera module of the same type are the same, so that the stitching duration of the stitching module 30 can be collected through big data before repair, and then the duration is preset in the stitching process of the stitching module 30 through the setting module 40, so that the performance and the reliability of the camera module after being stitched can meet the requirements. In the present invention, the setting module 40 sets the stitching time of the stitching module 30 to 16 to 20 seconds, preferably 18 seconds.
Therefore, in the present invention, the downward movement of the pressing module 30 is preset according to the type of the camera module and the thickness and parameters of the bonding layer, and the camera module is disposed on the fixed module 10, wherein the camera module is fixed on the fixed module 10 so as to keep the position constant when the pressing module 30 is pressed down, which is beneficial to repair the camera module, and then the camera module is heated by the heating module 20, preferably, the bonding layer of the camera module is heated to the vicinity of the vitrification conversion temperature, so that the bonding layer can be converted from solid state to glass state, thereby ensuring that the lens assembly and the photosensitive assembly of the camera module can be adjusted when the pressing module 30 presses the camera module, and when the pressing module 30 presses the lens assembly and the photosensitive assembly of the camera module according to the downward movement and the pressing time, the performance and the reliability of the camera module can be ensured to reach the standard.
As shown in fig. 2, the repairing apparatus for a camera module according to another preferred embodiment of the present invention includes a fixing module 10, a heating module 20, a pressing module 30, and an image obtaining processing module, wherein the fixing module 10 is configured to keep a positional relationship between the camera module and the pressing module 30 unchanged, the heating module 20 is configured to heat the bonding layer of the camera module so that the bonding layer is converted from a solid state to a glass state, the image obtaining processing module is configured to obtain an image of the camera module, determine an image quality of the camera module based on the image of the camera module, and obtain a pressing value of the pressing module 30 required by the camera module at the image quality based on the image of the camera module, and the pressing module 30 is capable of obtaining a pressing value required by the camera module at the image quality based on the downward movement amount, and pressing the camera module by the length of the downward movement amount, and detecting whether the imaging quality of the camera module reaches the standard or not through the image processing module 60.
More specifically, the image processing module 60 includes an image acquiring module 61, an image determining module 63 and a generating module 62, wherein the image acquiring module 61 is configured to acquire an image of the camera module when the camera module is powered on, the image determining module 63 is configured to determine whether the quality of the image acquired by the image acquiring module 61 meets an imaging requirement, and if the quality of the image of the camera module meets the imaging requirement, the stitching module 30 stops moving downwards and continues to apply a larger pressure to pressurize the camera module. When the imaging quality of the camera module meets the requirement, the generating module 62 is configured to generate a downward movement amount of the pressing module 30, and the pressing module 30 moves downward based on the downward movement amount to press the camera module, and repeats the above steps until the imaging quality of the camera module meets the standard.
Accordingly, the image determining module 63 determines whether the imaging quality of the image acquiring module 61 reaches the required range based on the evaluation function, wherein the evaluation function is implemented as, but not limited to, TV line, SFR, MTF.
Specifically, in the preferred embodiment of the present invention, the repair process of the repair device for the camera module is as follows: firstly, fixing the camera module on the fixed module 10, electrifying the camera module, electrically connecting the image processing module 60 to the camera module, transmitting the shot image to the image processing module 60 by the camera module, acquiring the image of the camera module by the image acquisition module 61 of the image processing module 60, and generating the downward movement amount of the pressing module 30 by the image acquired by the image acquisition module 61 by the generation module 62; then, the camera module is heated by the heating module 20, so that the bonding glue layer of the camera module is converted into a glass state, and the pressing module 30 moves downwards for pressing the camera module based on the downward movement amount generated by the generating module 62; after the camera module is pressed by the pressing module 30, the image obtaining module 61 of the image legend module obtains the pressed image of the camera module, and based on the image obtained by the image obtaining module 61, the image determining module determines whether the imaging quality obtained by the image obtaining module 61 meets the requirement. The determination method of the image determination module is described above, and is not described herein again.
It is worth mentioning that, the rework apparatus can adjust the downward movement of the pressing module 30 in real time to adjust the camera module according to the image of the camera module obtained by the image processing module 60 until the imaging quality of the camera module meets the requirement.
Similarly, in the preferred embodiment of the invention, the repairing device includes a setting module 40, wherein the setting module 40 includes a temperature control module 41 and a pressing timing module 42, the temperature control module 41 is configured to control the heating module 20 to heat the temperature of the bonding adhesive layer of the camera module to the glass transition temperature, so that the bonding adhesive layer has a solid-state transition to a glass state, and thus the heating module 20 can ensure that the bonding adhesive layer is heated to a proper temperature when heating the bonding adhesive layer of the camera module. The stitching timing module 42 is used for timing the stitching process of the stitching module 30, so as to ensure that the performance and reliability of the camera module can meet the requirements after the camera module is stitched by the stitching module 30,
as shown in fig. 3, the method for hot press repairing of a camera module according to a first preferred embodiment of the present invention includes: s110, presetting a downward movement amount of a pressing module according to a pressing value required by the camera module; s120, heating the temperature of a bonding adhesive layer in the camera module to soften the bonding adhesive layer; and S130, pressing the camera module based on the preset downward movement amount of the pressing module so as to enable the imaging quality of the camera module to reach the standard.
In step S110, a downward movement amount of the pressing module is preset according to a pressing value required by the camera module. Here, the stitching values required by the camera module include: acquiring the image of the camera module, and acquiring a defocusing curve of the imaging quality of the camera module in an evaluation function mode; and acquiring a stitching value required by the camera module based on the defocusing curve. The merit function is implemented as TV line, SFR, MTF.
In step S120, a temperature of a bonding adhesive layer in the camera module is heated to soften the bonding adhesive layer. Here, for convenience, the pressfitting module pressfitting the bonding glue film of the module of making a video recording includes the steps of: and controlling the temperature of the bonding glue layer to be heated to a glass transition temperature so that the bonding glue layer is converted from a solid state to a glass state.
In step S120, the camera module is pressed based on a preset downward movement amount of the pressing module, so that the imaging quality of the camera module meets a standard. Here, the method further comprises the steps of: presetting the stitching time under the stitching quantity required by the camera module; and pressing the camera module based on the preset pressing time under the pressing amount required by the camera module and the pressing amount required by the camera module so that the imaging quality of the camera module reaches the standard. Preferably, in the present invention, the stitching time preset for the stitching amount required by the camera module is 18 to 30 seconds, preferably 18 seconds.
As shown in fig. 4, a repairing method for a camera module according to a second preferred embodiment of the present invention is provided, wherein the repairing method includes: s210, acquiring an image of the camera module; s220, acquiring the pressing amount required by the camera module according to the acquired image of the camera module; s230, heating a bonding adhesive layer in the camera module to soften the bonding adhesive layer; and S240, pressing the camera module until the imaging quality of the camera module reaches the standard based on the glass-state combined adhesive layer and the downward movement amount required by the camera module.
In step S210, an image of the camera module is obtained. Here, the image pickup module can acquire an image of the image pickup module under a power-on condition. In step S220, the required pressing amount of the camera module is obtained according to the obtained image of the camera module. Here, the method includes the steps of: acquiring an image of the camera module, and acquiring a defocusing curve of the imaging quality of the camera module through an evaluation function; and obtaining the downward movement amount required by the camera module based on the defocusing curve.
In step S230, a bonding adhesive layer in the camera module is heated to convert the bonding adhesive layer from a solid state to a glass state. Here, for convenience, the pressfitting module pressfitting the bonding glue film of the module of making a video recording includes the steps of: and controlling the temperature of the bonding glue layer to be heated to a glass transition temperature so that the bonding glue layer is converted from a solid state to a glass state.
In step S240, based on the glass-state bonding layer and the downward movement required by the camera module, the camera module is pressed to make the imaging quality of the camera module meet the standard. Here, the method includes the steps of: judging whether the imaging quality of the camera module reaches the standard: when the imaging quality of the camera module reaches the standard, stopping pressing the camera module; and when the imaging quality of the camera module does not reach the standard, correspondingly acquiring the pressing amount required by the camera module by means of the imaging of the camera module, and pressing the camera module based on the pressing amount so as to enable the imaging quality of the camera module to reach the standard. And repeating the steps until the imaging of the camera module reaches the standard. Further, the method comprises the steps of: presetting the stitching time under the stitching quantity required by the camera module; and based on the preset stitching time under the stitching quantity required by the camera module and the stitching quantity required by the camera module, stitching the camera module so as to enable the imaging quality of the camera module to reach the standard. Wherein the pressing time is 18 to 30 seconds, preferably 18 seconds.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (22)
1. A reprocess device for reprocess at least a module of making a video recording, wherein, each the module of making a video recording includes a camera lens subassembly and a sensitization subassembly, wherein, the camera lens subassembly with connect its characterized in that through combining the glued membrane between the sensitization subassembly, include:
the preset module is used for presetting a downward movement amount according to the pressing value required by the camera module;
the heating module is used for heating a bonding adhesive layer between the lens of the camera module and the photosensitive assembly so as to soften the bonding adhesive layer; and
and the pressing module presses the bonding adhesive layer of the camera module by virtue of the downward movement amount and the softened bonding adhesive layer so as to enable the imaging quality of the camera module to reach the standard.
2. The rework device of claim 1, further comprising a setting module, wherein the setting module comprises a temperature control module for controlling the temperature at which the heating module heats the bond paste layer to a glass transition temperature.
3. The repair device of claim 2, wherein the setting module further comprises a pressing timing module, and the pressing timing module is configured to control a time for the pressing module to press the bonding adhesive layer of the camera module.
4. The rework device of claim 3, wherein the lamination timing module is configured to laminate the lamination adhesive layer of the camera module for 18-30 seconds.
5. A reprocess device for reprocess at least a module of making a video recording, wherein, each the module of making a video recording includes a camera lens subassembly and a sensitization subassembly, wherein, the camera lens subassembly with connect its characterized in that through combining the glued membrane between the sensitization subassembly, include:
the image processing module comprises an image acquisition module and a generation module, and the image acquisition module is used for acquiring the image of the camera module; the generating module is used for obtaining the stitching amount required by the camera module according to the obtained image of the camera module;
the heating module is used for heating a bonding adhesive layer in the camera module so as to soften the bonding adhesive layer; and
and the pressing module presses the bonding adhesive layer of the camera module by virtue of the downward movement and the glass-state bonding adhesive layer, so that the imaging quality of the camera module reaches the standard.
6. The rework device of claim 5, further comprising a setting module, wherein the setting module comprises a temperature control module for controlling the temperature at which the heating module heats the bond paste layer to a glass transition temperature.
7. The repair device of claim 6, wherein the image processing module further comprises a determining module, wherein the determining module is configured to determine whether the imaging quality of the camera module meets a standard: when the imaging quality of the camera module reaches the standard, the pressing module is kept static and is in a pressing state; and when the imaging quality of the camera module does not reach the standard, acquiring the imaging of the camera module through the image acquisition module, acquiring the corresponding stitching amount required by the camera module through the generation module based on the acquired image, and stitching the camera module through the stitching module until the imaging of the camera module reaches the standard based on the stitching amount.
8. The repair device of claim 7, wherein the setting module further comprises a pressing timing module, and the pressing timing module is configured to control a time for the pressing module to press the bonding adhesive layer of the camera module.
9. The rework device of claim 8, wherein the lamination timing module is configured to laminate the lamination adhesive layer of the camera module for 18-30 seconds.
10. A method for repairing a camera module is characterized by comprising the following steps:
presetting the downward movement amount of the pressing module according to a pressing value required by the camera module;
heating the temperature of a bonding adhesive layer in the camera module to soften the bonding adhesive layer; and
and pressing the camera module based on the preset downward movement amount of the pressing module so that the imaging quality of the camera module reaches the standard.
11. The method for repairing a camera module according to claim 10, wherein before the step of presetting the pre-pressing amount of the camera module, the method comprises the steps of:
acquiring the image of the camera module to obtain a defocusing curve of the imaging quality of the camera module through an evaluation function; and
and obtaining a stitching value required by the camera module based on the defocusing curve.
12. The method for repairing a camera module according to claim 11, wherein the evaluation function is any one or a combination of TV line, SFR and MTF.
13. The method for repairing a camera module of claim 10, wherein the step of heating a temperature of a bonding adhesive layer in the camera module to soften the bonding adhesive layer comprises the steps of:
and controlling the temperature of the bonding glue layer to be heated to a glass transition temperature so that the bonding glue layer is converted from a solid state to a glass state.
14. The method for repairing a camera module according to claim 10, wherein the step of pressing the camera module based on the pressing amount required by the camera module so that the imaging quality of the camera module meets a standard comprises:
presetting the stitching time under the stitching quantity required by the camera module; and
and pressing the camera module based on the preset pressing time under the pressing amount required by the camera module and the pressing amount required by the camera module so that the imaging quality of the camera module reaches the standard.
15. The method for repairing a camera module of claim 14, wherein the predetermined pressing time for the required pressing amount of the camera module is 18-30 seconds.
16. A method for repairing a camera module is characterized by comprising the following steps:
acquiring an image of the camera module;
obtaining the pressing amount required by the camera module by the obtained image of the camera module;
heating a bonding adhesive layer in the camera module to soften the bonding adhesive layer; and
and pressing the camera module based on the softened bonding glue layer and the pressing amount required by the camera module so that the imaging quality of the camera module reaches the standard.
17. The method of repairing a camera module of claim 16, wherein the pressing the camera module based on the softened bonding glue layer and the required downward movement of the camera module to make the imaging quality of the camera module meet a standard comprises:
the image acquisition processing module acquires the image of the camera module so as to judge whether the imaging quality of the camera module reaches the standard:
when the imaging quality of the camera module reaches the standard, stopping pressing the camera module; and
when the imaging quality of the camera module does not reach the standard, the corresponding amount of pressing required by the camera module is obtained by means of the imaging of the camera module, and the camera module is pressed based on the amount of pressing until the imaging of the camera module reaches the standard.
18. The method for repairing a camera module according to claim 16, wherein the step of obtaining the pressing amount required by the camera module by the obtained image of the camera module comprises:
acquiring an image of the camera module, and acquiring a defocusing curve of the imaging quality of the camera module through an evaluation function; and
and obtaining the stitching amount required by the camera module on the basis of the defocusing curve.
19. The method for repairing a camera module according to claim 18, wherein the evaluation means is any one or a combination of several selected from the group consisting of TV line, SFR, and MTF.
20. The method for repairing a camera module of claim 16, wherein the step of heating a temperature of a bonding adhesive layer in the camera module to soften the bonding adhesive layer comprises the steps of:
and controlling the temperature of the bonding glue layer to be heated to a glass transition temperature so that the bonding glue layer is converted from a solid state to a glass state.
21. The method for repairing a camera module according to claim 16, wherein the step of pressing the camera module based on the softened bonding glue layer and the pressing amount required by the camera module so that the imaging quality of the camera module meets a standard comprises the steps of:
presetting the stitching time under the stitching quantity required by the camera module; and
and pressing the camera module based on the preset pressing time under the pressing amount required by the camera module and the pressing amount required by the camera module so that the imaging quality of the camera module reaches the standard.
22. The method for repairing a camera module of claim 21, wherein the predetermined pressing time for the required pressing amount of the camera module is 18-30 seconds.
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| CN100529825C (en) * | 2007-10-31 | 2009-08-19 | 无锡凯尔科技有限公司 | Automatic microdistance regulation type mobile phone camera module group assembling process |
| TWI366735B (en) * | 2008-08-21 | 2012-06-21 | Coretronic Corp | Assembling mechanism |
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