CN102127374A - Method for repairing DAD-40 conductive adhesive bonding product - Google Patents
Method for repairing DAD-40 conductive adhesive bonding product Download PDFInfo
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- CN102127374A CN102127374A CN 201010622760 CN201010622760A CN102127374A CN 102127374 A CN102127374 A CN 102127374A CN 201010622760 CN201010622760 CN 201010622760 CN 201010622760 A CN201010622760 A CN 201010622760A CN 102127374 A CN102127374 A CN 102127374A
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Abstract
The invention relates to a method for repairing a DAD-40 conductive adhesive bonding product, which solves the problem that the DAD-40 conductive adhesive bonding product is difficult to repair by the steps of integral preheating, local heating repair, cooling, cleaning and the like. The invention specifically analyzes the base material and structure of the product by combining part of theoretical references, determines all the technological parameters when repairing the DAD-40 adhesive curing microwave product, is very suitable for small-lot repair of multiple types of DAD-40 adhesive curing products, thoroughly solves the mass production bottleneck problem when the repair is caused by the failure of printed boards and parts, is widely used in repair production of multiple types of like products, and lays foundation for the mass production of serial microwave products. The analysis on the statistical result indicates that in nearly 500 microwave products using DAD-40 adhesive curing in different batches, which have been put into production at present, the repair qualification rate of defective products is higher than 98%. The invention effectively solves the problem that the delivery schedule can not be ensured due to rejection of a great deal of products because component boards, devices and parts fail and need repairing.
Description
Technical field
The present invention relates to a kind of repair method of the DAD-40 of application conductive adhesive series products, belong to and use DAD-40 conductive adhesive microwave product technical field.
Background technology
Along with microwave product is criticized increasing sharply of turnout, the application of DAD-40 conductive resin (easy to operate, ambient temperature curable, good bonding strength, good conductive characteristic etc.) on radio frequency products more and more widely.But use the product after this gluing connecing, go wrong in process of production in the time of need reprocessing, but exist and to dismantle or to dismantle difficult problem, scrap in enormous quantities when causing product to be reprocessed.
Constructional feature according to physical property, chemical property and the bonding position of product of DAD-40 conductive rubber itself, existing processing method can not guarantee the integrity that the product after bonding is reprocessed and repair after the stability of quality product, moreover the solid series products of glue is reprocessed and is not also had executable technological specification at present.Therefore can't guarantee the problem of quality product in the time of can't repairing or repair during the ubiquity fault in actual production for the conductive adhesive series products, adopting existing product percent of pass of reprocessing technology is about 10%.
Summary of the invention
Technology of the present invention is dealt with problems and is: overcome the deficiencies in the prior art, a kind of repair method that improves the application DAD-40 conductive adhesive series products of reprocessing qualification rate of product is provided.
Technical solution of the present invention is: use the repair method of DAD-40 conductive adhesive series products, realize by following steps:
The first step, the whole preheating of application DAD-40 conductive adhesive series products to be reprocessed,
The application DAD-40 conductive adhesive series products pre-heating technique that contains printed board is that heating was not less than 1 hour under 120 ± 5 ℃, and the application DAD-40 conductive adhesive series products pre-heating technique that does not contain printed board is that heating was not less than 1 hour under 150 ± 5 ℃;
In second step, local heating is reprocessed
With heat gun local heating is carried out at the position of reprocessing of the application DAD-40 conductive adhesive series products to be reprocessed after preheating is finished through the first step, heating applies external force simultaneously and reprocesses, local heating technology is that heating is no more than 1 minute under 300 ± 5 ℃, do not unclamp and then change the first step over to if reprocess the position in 1 minute, unclamp and then changed for the 3rd step over to if reprocess the position in 1 minute in heating in heating;
The 3rd step, cooling, cleaning
Carry out radiating treatment and cleaning with alcohol to reprocessing the position.
The present invention compared with prior art beneficial effect is:
(1) the present invention is from product base material, structure, the bound fraction theoretical foundation is made a concrete analysis of, determined the every processing parameter when the solid class microwave product of DAD-40 glue is reprocessed, very suitable short run, the solid series products of many kinds DAD-40 glue are reprocessed, thoroughly solved because of inefficacy printed board, component and reprocessed caused batch of production bottleneck problem, and be widely used in the reprocessing in the production of multiple model analogous products, produce in batches for later serial microwave product and lay a good foundation;
(2) adopt repair method of the present invention, from the statistics analysis, nearly 500 microwave products of using the solid different batches of DAD-40 glue of having gone into operation at present, defective product is reprocessed qualification rate and is reached more than 98%, efficiently solves because of element board, device, component lose efficacy to reprocess the product that brings and scrap the problem that causes guaranteeing delivery progress in a large number;
(3) the present invention is from product base material, structure, the bound fraction theoretical foundation is made a concrete analysis of, and with technological test be main means formed relevantly reprocess measure, processing method forms the production that the special process rules are used to instruct the later stage product, special-purpose technological process can greatly reduce product and reprocess production cost, guarantee the delivery progress of product, obtained huge economic benefit.
Description of drawings
Fig. 1 is a schema of the present invention.
Embodiment
Carry out smoothly for guaranteeing that microwave product is series-produced, improve DAD-40 conductive adhesive series products and reprocess qualification rate, in conjunction with various product structure inherent characteristics, the difficult problem of the ubiquitous fault correcting of conductive adhesive series products has been become one of bottleneck that production task finishes has on schedule carried out manufacturability and grope test, determine not only safety, but also economical and guarantee to repair after the processing method that is not damaged of product for like product with reference to use.
1, analyzes
The position of product application conductive resin mainly is the conductive adhesive between housing and metal parts and the printed circuit board metal level, and the point of production debugging regulator site is solid bonding.Reprocess the practical problems that existence is scrapped in a large number at this conductive adhesive series products, the practical situation of bonded products, to understand the bonding back of product characteristic by technological test under the prerequisite of reliability be the key of dealing with problems guaranteeing to reprocess.
(1) DAD-40 conductive resin characteristics:
This conductive resin is a two-pack, mainly is made up of epoxy resin glue and silver powder, uses by 1: 1 proportioning.This glue can be bonding to carrying out between metallic substance and the metallic substance, also can be bonding to carrying out between metallic substance and the non-metallic material, and irreversible after solidifying.But but the deliquescing that heats up continuously more than 300 ℃.
By above-mentioned analysis, considering is not influencing product performance, is not damaging the problem of reprocessing that can only solve DAD-40 conductive adhesive series products under the situation of product structure by physical method.
(2) microwave product material characteristics
Microwave product adopts aluminum alloy materials to be housing and to carry out the surface conduction oxide treatment; Regulate parts and adopt the gold-plated processing of brass material; Utilize good adhesiveproperties of DAD-40 conductive resin and conductivity to realize between housing and the printed circuit board and the reliable conduction of product structure regulator site after fixing is connected.
The microwave product printed circuit board material is selected the microwave dielectric material of the poly-two-sided deposited copper of tetrafluoro for use, and characteristics are that electric performance stablity is good.Material heatproof temperature is-80～+ 265 ℃;
High-frequency socket, inner insulation material are tetrafluoroethylene, and operating ambient temperature is at-65～+ 165 ℃;
Scolder is selected the HLSn60Pb ordinary solder for use, and fusing point is 183 ℃.
By above four part characteristics as can be seen, when reprocessing with physical method, the whole pre-heating temperature of product can not be above 165 ℃.For the sake of assurance, also be convenient to manual operations, whole pre-heating temperature be controlled at 120～160 ℃ test with interior.
2, by technological test, determine pre-heating technique
A does not preheat product integral body, only the part is carried out at bonding position and reprocesses, and this purpose is to compare for the effect of reprocessing after preheating with product.
Method: the part is carried out at the solid position of glue reprocess, requirement Applied Physics method under the situation of not destroying product plays sled, and bonding component are attempted pulling down carrying out technological test.Find in process of the test, unrestrictedly strengthen external force under the ruined situation of product, the solid position of glue glue sample does not but change at all, and it is inadvisable to illustrate that this reprocesses processing method.
B does not preheat product integral body, and only glue is reprocessed the position admittedly carries out local heating, and whether purpose is to observe the solid position of glue bonding strength by local heating to decrease; Utilize the physical property of DAD-40 conductive resin, apply external force rise the sled in, carry out technological test with the heat gun local heating.Observe from process of the test, glue is reprocessed position glue sample admittedly and carry out local heating with heat gun when being applied external force, and the glue sample does not reach hot melt or deliquescing, and it is also inadvisable to illustrate that this reprocesses processing method.
C preheats product integral body, only changes envrionment temperature, and 75 ℃, 100 ℃, 120 ℃ of the high ambient temperatures (contain element board and do not power up condition) of product-derived are arranged, and passive product was tested from 100～150 ℃ (containing element board), and purpose is chosen suitable pre-heating temperature;
The solid product of glue is placed on carries out integral body in the high-temperature cabinet and preheat, envrionment temperature improves the incubator temperature gradually from 75 ℃, 100 ℃, 120 ℃, 150 ℃, takes out immediately behind the heat penetration, applies external force and rises when prizing, and reusable heat air pressure gun local heating is carried out technological test.
Observe from process of the test, along with the rising of the whole pre-heating temperature of product, the solid position of glue is also with the raising of envrionment temperature, and the glue sample presents the trend of deliquescing gradually.Explanation is under the situation of not destroying product, and whole preheating temperature is high more good more, and this to reprocess processing method feasible.
D uses best pre-heating temperature to the whole heating of product, only adjusts and tests heat-up time, and purpose is determined best heat-up time.
The product that will contain active part (printed board) was put into 120 ℃ of high-temperature cabinets and is preheated, and the product that will not contain active device (printed board) is put into 150 ℃ of high-temperature cabinets and preheated, and constantly prolongs heat-up time, carried out technological test until 1 hour from 10 minutes.From process of the test, observe, also in time the prolongation of the solid position of glue, glue sample deliquescing gradually in the time of with the heat gun local heating, conductive adhesive intensity weakens gradually, applies external force and reprocesses successfully.Explanation whole preheating temperature under the situation of not destroying product reaches enough height, and the heat penetration time, the longer the better, and this to reprocess processing method convenient feasible.
3 definite conductive adhesive series products are reprocessed technical process
Technical process is finished by following steps as shown in Figure 1:
(1) determines to reprocess the position
(2) integral body preheats
The application DAD-40 conductive adhesive series products pre-heating technique that contains printed board is that heating was not less than 1 hour under 120 ± 5 ℃, and the application DAD-40 conductive adhesive series products pre-heating technique that does not contain printed board is that heating was not less than 1 hour under 150 ± 5 ℃;
(3) the heat gun local heating is reprocessed the position
With heat gun local heating is carried out at the position of reprocessing of the application DAD-40 conductive adhesive series products to be reprocessed after finishing through preheating, heating applies external force simultaneously will reprocess the position separately, local heating technology be 300 ± 5 ℃ down heating be no more than 1 minute, do not unclamp then to return and carry out whole preheating if reprocess the position in 1 minute in heating;
(4) cooling, cleaning
Carry out radiating treatment and clean with alcohol to reprocessing the position.
The unspecified part of the present invention belongs to general knowledge as well known to those skilled in the art.
Claims (1)
1. use the repair method of DAD-40 conductive adhesive series products, it is characterized in that realizing by following steps:
The first step, the whole preheating of application DAD-40 conductive adhesive series products to be reprocessed,
The application DAD-40 conductive adhesive series products pre-heating technique that contains printed board is that heating was not less than 1 hour under 120 ± 5 ℃, and the application DAD-40 conductive adhesive series products pre-heating technique that does not contain printed board is that heating was not less than 1 hour under 150 ± 5 ℃;
In second step, local heating is reprocessed
With heat gun local heating is carried out at the position of reprocessing of the application DAD-40 conductive adhesive series products to be reprocessed after preheating is finished through the first step, heating applies external force simultaneously and reprocesses, local heating technology is that heating is no more than 1 minute under 300 ± 5 ℃, do not unclamp and then change the first step over to if reprocess the position in 1 minute, unclamp and then changed for the 3rd step over to if reprocess the position in 1 minute in heating in heating;
The 3rd step, cooling, cleaning
Carry out radiating treatment and cleaning with alcohol to reprocessing the position.
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| CN 201010622760 CN102127374B (en) | 2010-12-29 | 2010-12-29 | Method for repairing DAD-40 conductive adhesive bonding product |
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| CN 201010622760 CN102127374B (en) | 2010-12-29 | 2010-12-29 | Method for repairing DAD-40 conductive adhesive bonding product |
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| CN102127374A true CN102127374A (en) | 2011-07-20 |
| CN102127374B CN102127374B (en) | 2012-06-13 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107094365A (en) * | 2016-02-18 | 2017-08-25 | 深圳市汇顶科技股份有限公司 | Module and its assemble method |
| CN112951972A (en) * | 2021-02-02 | 2021-06-11 | 东莞市中麒光电技术有限公司 | COB module repairing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101173156A (en) * | 2007-09-27 | 2008-05-07 | 夏晓军 | Conductive adhesive degumming agent and use method of the degumming agent |
| CN101344654A (en) * | 2008-08-18 | 2009-01-14 | 友达光电（苏州）有限公司 | Conductive adhesive film and cutting tool |
| CN101614888A (en) * | 2009-07-14 | 2009-12-30 | 友达光电（苏州）有限公司 | The cutting tool of conductive adhesive film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201166757Y (en) * | 2008-03-13 | 2008-12-17 | 北京京东方光电科技有限公司 | Apparatus FOR shearing and peeling aeolotropism conducting resin |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101173156A (en) * | 2007-09-27 | 2008-05-07 | 夏晓军 | Conductive adhesive degumming agent and use method of the degumming agent |
| CN101344654A (en) * | 2008-08-18 | 2009-01-14 | 友达光电（苏州）有限公司 | Conductive adhesive film and cutting tool |
| CN101614888A (en) * | 2009-07-14 | 2009-12-30 | 友达光电（苏州）有限公司 | The cutting tool of conductive adhesive film |
Non-Patent Citations (2)
| Title |
|---|
| 《中国胶粘剂》 20090731 张绍东，傅仁利 无铅化微电子互连技术与导电胶 全文 1 第18卷, 第7期 * |
| 《电子制造技术：利用无铅、无卤素和导电胶材料》 20050831 [美]刘汉诚 汪正平 李宁成 李世玮著 姜岩峰 张常年译 电子制造技术：利用无铅、无卤素和导电胶材料 全文 1 , * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107094365A (en) * | 2016-02-18 | 2017-08-25 | 深圳市汇顶科技股份有限公司 | Module and its assemble method |
| CN107094365B (en) * | 2016-02-18 | 2019-10-29 | 深圳市汇顶科技股份有限公司 | Mould group and its assemble method |
| CN112951972A (en) * | 2021-02-02 | 2021-06-11 | 东莞市中麒光电技术有限公司 | COB module repairing method |
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| CN102127374B (en) | 2012-06-13 |
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