CN107094365A - Module and its assemble method - Google Patents
Module and its assemble method Download PDFInfo
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- CN107094365A CN107094365A CN201610092212.6A CN201610092212A CN107094365A CN 107094365 A CN107094365 A CN 107094365A CN 201610092212 A CN201610092212 A CN 201610092212A CN 107094365 A CN107094365 A CN 107094365A
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- China
- Prior art keywords
- component
- over again
- module
- installation portion
- determined bit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
The invention discloses a kind of module and its assemble method, module includes first component and second component, and the assemble method comprises the following steps：The first component and the second component are carried out pre-determined bit to obtain pre-determined bit module；Detect whether the pre-determined bit module is qualified, if qualified, the first component and the second component are fixed using first material that can do over again；If unqualified, then separate the first component and the second component, and pre-determined bit is re-started to the first component and the second component and detected, until obtaining detecting qualified pre-determined bit module and fixing the first component and the second component using described first material that can do over again.According to the assemble method of the present invention, first component and second component are fixed by using first material that can do over again so that the production process of module can do over again, it is reworkable using process.
Description
Technical field
The present invention relates to high level module technical field, more particularly, to a kind of module and its assemble method.
Background technology
Pointed out in correlation technique, high level device or equipment if there is bad, are then needed from device during production or use
Or bad element of being dismantled in equipment, done over again or reprocessed, however, during bad element is dismantled, can usually damage
Remaining element, causes device or equipment scrapping.For example, during assembling the screen module of smart mobile phone using barbola work,
Sensor is pasted at the back side of screen by glue, however, standardization barbola work requires the glue used and the screen back side
The adhesiveness of ink layer is very strong, after laminating is completed and is solidified, and glue can not be soaked by the high temperature in safe range or solvent
Bubble is separated with ink layer, and the glue that sensor surface remaining can not can also be cleaned, so that cause screen module all to be scrapped,
Cause the mortality done over again and reprocessed very high, increase input cost.
In addition, the glue that standardization barbola work requirement is used is it is generally necessary to which longer time could complete solidification, if to add
Speed solidification, generally requires glue being heated to solidification temperature significantly more than optimum range, this just brings the skill for being difficult to capture
Art is challenged, and whether the uniformity of such as heating can guarantee that whether the escape medium in solidification process can fully volatilize, and is cooled down
Big stress that thermal expansion factor afterwards is caused etc..Thus, the production efficiency of module is caused to be difficult to improve.
Sum it up, the module in correlation technique is difficult to do over again and reprocessed, and low production efficiency, online stand-by period
It is long.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the invention reside in propose a kind of mould
Group assemble method, the assemble method can carry out it is lossless do over again and reprocess, high yield rate.
The present invention also proposes a kind of module assembled using above-mentioned assemble method.
The assemble method of module according to a first aspect of the present invention, the module includes first component and second component, described group
Dress method comprises the following steps：The first component and the second component are carried out pre-determined bit to obtain pre-determined bit module；Inspection
Whether qualified survey the pre-determined bit module, if qualified, the first component is fixed and described using first material that can do over again
Second component；If unqualified, the first component and the second component are separated, and to the first component and described
Second component re-starts pre-determined bit and detected, until obtaining detecting qualified pre-determined bit module and can be done over again using described first
Material fixes the first component and the second component.
According to the assemble method of the module of the present invention, first component and second component are fixed by using first material that can do over again,
So that the production process of module can do over again, it is reworkable using process.
In certain embodiments, the first component and the second component can be done over again after material is fixed by described first such as occurs
Damage, progress is following to reprocess step：Separate the first component and the second component；Change or repair the first component
And/or the second component；Re-assembly.
In certain embodiments, step is also included after the separation first component and the second component：Using solvent cleaning
First on the first component and/or the second component can do over again material.
In certain embodiments, there is the installation portion for being used for installing the first component, described first can on the second component
Material of doing over again is folded between the first component and the installation portion.
In certain embodiments, when described first can do over again material for repeatable heating fusing do over again material when, it is described right
The first component and the second component carry out pre-determined bit：A1, can do over again material by first
Feed collet is located between the first component and the installation portion；A2, the installation portion is first heated cooled down again to obtain pre-determined bit
Module；It is described to fix the first component and the second component using first material that do over again and be specially：It is B1, described predetermined
After the testing result of position module is qualified, the first component and the installation portion are compressed；B2, the installation portion is first heated again
It is cooled to normal temperature.
In certain embodiments, described can be done over again after material fixes the first component and the second component using first is also wrapped
Include step：Second material that can do over again is filled in the installation portion and around the first component.
In certain embodiments, described first can do over again material for paraffin, and described first can do over again material for paraffin, and described the
Two can do over again material for room temperature vulcanized silicone rubber.
In certain embodiments, when described first can do over again material for can using shearing force remove do over again material when, it is described
Carry out pre-determined bit to the first component and the second component is specially to obtain pre-determined bit module：C1, the 3rd can be done over again
Material is filled in the installation portion and around the first component；C2, can do over again material and/or the installation to the described 3rd
Portion, which carries out heating, makes the described 3rd can do over again material instantaneous solidification to obtain pre-determined bit module；It is described to be done over again material using first
The fixed first component and the second component are specially：D1, before the step C1, first can be done over again material
It is folded between the first component and the installation portion；D2, the pre-determined bit module testing result it is qualified after, compress institute
First component and the installation portion are stated, can be done over again material spontaneous curing by described first.
In certain embodiments, described first can do over again material for room temperature vulcanized silicone rubber, and the described 3rd can do over again material for stone
Wax.
In certain embodiments, using fixed point heater can be done over again to the described 3rd material heating.
In certain embodiments, the fixed point heater is resistance wire or laser.
In certain embodiments, the installation portion is heated using fixed heater.
In certain embodiments, the fixed heater includes：There is heating region on mounting platform, the mounting platform
With normal temperature region, the second component is located on the mounting platform and the installation portion and the heating region are just right up and down；
And heater, the heater to the heating region for heating.
Module according to a second aspect of the present invention, the assemble method using module according to a first aspect of the present invention assembles.
According to the module of the present invention, assembled by using the assemble method of above-mentioned first aspect, so as to improve module
Yield rate, reduces the production cost of module.
In certain embodiments, the module is the fingerprint recognition module of mobile terminal, and the first component is fingerprint sensor,
The second component is screen.
The additional aspect and advantage of the present invention will be set forth in part in the description, and partly will become bright from the following description
It is aobvious, or recognized by the practice of the present invention.
Brief description of the drawings
Fig. 1 is the assembling schematic diagram of module according to an embodiment of the invention；
Fig. 2 is the assembling schematic diagram of module according to another embodiment of the invention.
Reference：
Module 1,1a；First component 11；Second component 12；Installation portion 121；
First can do over again material 21,22；3rd can do over again material 23；
Mounting platform 3；Heating region 31；Normal temperature region 32；Pressue device 4；Pinpoint heater 5.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein identical from beginning to end
Or similar label represents same or similar element or the element with same or like function.Retouched below with reference to accompanying drawing
The embodiment stated is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to simplify this
The disclosure of invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and mesh
Do not lie in limitation the present invention.In addition, the present invention can in different examples repeat reference numerals and/or letter.This repetition
It is the relation between itself not indicating discussed various embodiments and/or setting for purposes of simplicity and clarity.In addition,
The invention provides various specific techniques and material example, but those of ordinary skill in the art can be appreciated that other
The applicable property of technique and/or the use of other materials.
Module 1 and its assemble method according to embodiments of the present invention is described below with reference to Fig. 1 and Fig. 2, wherein, module 1 can
High value module is thought, such as the module of mobile terminal (as smart mobile phone, tablet personal computer).Only it is with module 1 below
Illustrated exemplified by the fingerprint recognition module of smart mobile phone, those skilled in the art show after following technical scheme has been read
So it will be appreciated that module 1 is the technical scheme of other kinds of module.
As depicted in figs. 1 and 2, module 1 according to embodiments of the present invention, including first component 11 and second component 12, the
There can be the installation portion 121 for being used for installing first component 11 on two parts 12, such as installation portion 121 can exist for formation
Groove (or blind hole) on second component 12, so as to facilitate the installation of first component 11.For example, when module 1 is fingerprint
When recognizing module, first component 11 can be fingerprint sensor, second component 12 can be screen, such as glass cover-plate or
Touch-screen etc..
As depicted in figs. 1 and 2, the assemble method of module 1 according to embodiments of the present invention comprises the following steps：To first
Part 11 and second component 12 carry out pre-determined bit to obtain pre-determined bit module, and whether detection pre-determined bit module is qualified, if qualified,
It can then be done over again the fixed first component 11 of material (such as described below first can do over again material 21 or 22) and the using first
Two parts 12；If unqualified, separation first component 11 and second component 12, and to first component 11 and second component
12 re-start pre-determined bit and detect, until obtaining detecting qualified pre-determined bit module and can do over again material (for example using first
Described below first can do over again material 21 or 22) fixed first component 11 and second component 12.
Wherein, " carrying out pre-determined bit to first component 11 and second component 12 " can be：It is viscous using the adhesive material that can be done over again
Paste first component 11 and second component 12, such as by the adhesive material that can do over again by the pre-determined bit of first component 11 at second
On the installation portion 121 of part 12, so that first component 11 and the pre-determined bit of second component 12.
Wherein, " whether detection pre-determined bit module is qualified " can be：Detection first component 11 is relative with second component 12 to be set
Whether seated position meets technological requirement, qualified if meeting technological requirement, unqualified if being unsatisfactory for technological requirement.
Wherein, " can do over again material " refers to：With performance is pasted, performance pasted using it realized and be fixedly connected with part,
And there is corresponding removal scheme, removal scheme is easily realized；When being removed using the scheme of removal, the material that can do over again can be with
It is kept completely separate with part.For example, when first material that can do over again is pasted onto on glass cover-plate, it is necessary to remove glass cover plate surfaces
First can do over again material when, using corresponding removal scheme, first can do over again material just can be intact point with glass cover plate surfaces
From that is, first material that can do over again will not stick out the ink layer of glass cover plate surfaces so that glass cover plate surfaces stand intact.Separately
Outside, it is necessary to illustrate, although the material of doing over again described by the embodiment of the present invention, which has, is pasted performance, in prior art
In these materials be not used to standardize barbola work.Such as paraffin is used to fix wafer in cutting crystal wafer, in order to avoid go out during cutting
Existing film flying；Room temperature vulcanized silicone rubber is used to seal.
In fact, " can do over again material " has a lot, for example, the material of doing over again of some repeatable heating fusings, such as paraffin,
The removal of paraffin can just be realized by the heating being easily achieved；In another example, some soluble materials of doing over again lead to
The removal of the material can just be realized by crossing the dissolving method being easily achieved；For another example some by shearing force is removable can
Do over again material, such as room temperature vulcanized silicone rubber, the adhesion of such material of doing over again under common use condition (impact,
Vibration, temperature, humidity, electromagnetic interference, corrosive environment etc.) it is very strong, but in the application torsion being easily achieved (i.e.
Shearing force) under conditions of can just remove.In short, the material that can do over again can be hot melt, and reaction equation, dissolution type
, shear force etc., as long as there is the removal easily a realized scheme, here, just no longer it is described in detail one by one.
So, because the material that can do over again can do over again with a removal scheme that is corresponding, easily realizing, therefore using first
Material is fixed after first component 11 and second component 12, by using can do over again that material is corresponding with first, is easily realized
Removal scheme can just realize the intact separation of first component 11 and second component 12, so as to realize in the production process of module 1
Doing over again property and the use of module 1 during reworkable property.Thus, module 1 according to embodiments of the present invention and its assembling
Method, with undamaged doing over again property of production and uses reworkable property, so as to reduce scrappage and input cost, improves into
Product rate and repairable rate.
Because the production process of module 1 has doing over again property, when occurring disqualified upon inspection in process of producing product, it is possible to
Relievedly done over again, components damage is not resulted in due to doing over again, so that the yield rate of module 1 is improved, rate of reducing the number of rejects and seconds
And input cost.Below, the rework step of module 1 is briefly described, it is specific as follows：First component 11 and second is separated first
Part 12, is then reassembled with first component 11 and second component 12, and the process re-assemblied uses above-mentioned assemble method
Carry out.
Because the use process of module 1 has reworkable property, when there is failure fault during product use, it is possible to put
Heart is reprocessed, and components damage is not resulted in due to reprocessing, so as to reduce the maintenance difficulty of module 1, reduces maintenance
Scrappage and maintenance cost.Below, the step of reprocessing of module 1 is briefly described, it is specific as follows：First component 11 is separated first
With second component 12, the part (such as first component 11, second component 12) broken down is then changed or repaired, is finally weighed
The new first component 11 and second component 12 for being assembled without problem, the process re-assemblied is carried out using above-mentioned assemble method.
In some embodiments of the invention, separation first component 11 and second component 12 are further comprising the steps of afterwards：Adopt
First on solvent removal first component 11 and/or second component 12 can do over again material.Thus, it is possible to ensure product quality.
Below, the module and its assemble method according to two specific embodiments of the invention are briefly described.Specifically, following two
In individual embodiment, first material that can do over again is folded between first component 11 and installation portion 121, thus, it is possible to ensure first
The connection reliability of part 11 and second component 12.
In order to assemble the module 1, the assemble method of the module 1 can be implemented using following assembling device, specifically, assembling dress
Putting to include：There is heating zone on mounting platform 3, heater (not shown) and pressue device 4, mounting platform 3
Domain 31 and normal temperature region 32, wherein, the upper surface of mounting platform 3 can be formed as plane, and heating region 31 can be with peace
The structure (shape, size) in dress portion 121 is identical, heater be located at mounting platform 3 bottom or mounting platform 3 in and
For being heated to heating region 31, pressue device 4 can be located at the top of mounting platform 3 up or down.Wherein, install flat
Platform 3 and heater may be constructed fixation heater described below.
Embodiment one,
As shown in figure 1, the specific assemble method of the module 1 comprises the following steps：
First, first material 21 that can do over again is folded between first component 11 and installation portion 121；Then, to installation portion
121 first heat and cool down to obtain pre-determined bit module again；Then, whether detection pre-determined bit module is qualified, if qualified, compresses
First component 11 and installation portion 121, then first heat to installation portion 121 and are cooled to normal temperature, so that first component 11 and
Two parts 12 are fixed together.
Thus, it is possible to find out, in above process, first material 21 that can do over again is played to first component 11 and second component
12 carry out pre-determined bit and finally fixed double action, so that realizing the production of first component 11 and second component 12 can do over again
Property and reworkable property is used, and effectively improve the overall efficiency of assembling of module 1.
The specific assemble method of the module 1 is further comprising the steps of：
Second material (not shown) that can do over again is filled in installation portion 121 and around first component 11, so as to realize pair
The fixation booster action of first component 11 and second component 12.Preferably, the second adhesiveness that can do over again material is more than first
Can be done over again the adhesiveness of material 21, so as to further improve the connection fixing of first component 11 and second component 12.
First can do over again material 21 and second can do over again material solidification or surface cure duration be much smaller than common glue solidification when
It is long, so as to effectively improve the overall efficiency of assembling of module 1.
Preferably, first can do over again material 21 for high-melting-point and dissolve in correspondence solvent adhesive material of doing over again, such as paraffin
Piece etc..Thus, during doing over again, paraffin piece and first component 11 and second component can be realized by heating paraffin wax piece
12 separation.Preferably, the thickness of paraffin piece can below 50 μm, so that it is guaranteed that technique of doing over again be smoothed out and can
To ensure the assembly precision and connection reliability of first component 11 and second component 12.Further, the shape chi of paraffin piece
It is very little can be identical with the geomery of installation portion 121 so that paraffin piece can be fitted on installation portion 121 just, to enter one
Step improves the assembly precision of first component 11 and second component 12.
Preferably, second can do over again material can be room temperature vulcanized silicone rubber, the performance with accelerated surface cure.Due to room
After temperature vulcanizable silicone rubber only surface cure, so that it may realize the fixation of first component 11 and second component 12, continue subsequent handling,
So as to further improve the overall package efficiency of module 1.In short, second can do over again the usual selection of material without heating,
Only at normal temperatures just can be with the material of doing over again of spontaneous curing, such as room temperature vulcanized silicone rubber, to effectively improve module 1
Overall package efficiency.
A kind of assemble method and reworking method of the module 1 of the complete expression embodiment one：
(1) first component 11 and second component 12 are cleaned totally first, it is flat that second component 12 then is lain in into installation
On platform 3 and ensure that installation portion 121 and heating region are just right about 31, then first can do over again (such as thickness of material 21
Below 50 μm and section shape and size with the identical paraffin piece of installation portion 121) be placed on the peace of second component 12
In dress portion 121.Hereafter, heating region 31 can be heated using heater so that installation portion 121 heats up, makes first can return
Work material 21 is melted with (can also save this step certainly) be bonded with installation portion 121, then can place first component 11
It can be done over again on material 21 first.
(2) then, heating region 31 is heated by heater, makes first can do over again material so that installation portion 121 is warming up to
Material 21 melt, normal temperature is then cooled to again, after first can do over again material 21 cool down after, first component 11 can be determined well
Position is in installation portion 121, so as to obtain pre-determined bit module.Specifically, before this step, installation can be compressed in advance
Portion 121 and first component 11, for example can by moving down pressue device 4 so that second component 12 and first component 11 to be compressed,
So as to improve the reliability of positioning of first component 11 and second component 12.
(3) then, pre-determined bit module is detected, if testing result shows qualified, second be able to can be done over again material
(such as room temperature vulcanized silicone rubber) is filled in installation portion 121 and surround first component 11, by first component 11 securely
It is fixed on second component 12, strengthens and protect the bonding of first component 11 and second component 12, still, if detection knot
Fruit shows unqualified, that is to say, that testing result display failure, can be done over again.
Reworking method is as follows：
(1) separation first component 11 and second component 12.For example, the module 1 that need to be done over again can be placed on into mounting platform 3
On, then heating region 31 is heated by heater, causes first material 21 that can do over again to melt, then can be by
First component 11 is taken off from installation portion 121.Hereafter, can using on solvent cleaning installation portion 121 remaining first
Doing over again first on material 21 and first component 11 can do over again material 21 (this step can be omitted).Thus, due to first
The adhesiveness of material 21 of can doing over again is not very strong, so during doing over again and removing first component 11, second component 12 is not
Can be damaged, the ink layer on such as glass panel surface is not damaged, be additionally, since first can do over again material 21 dissolve in correspondence
Solvent, so as to ensure the cleannes of first component 11 and second component 12, so that convenient reposition.
(2) pre-determined bit is re-started to first component 11 and second component 12 and detected using first material 21 that can do over again,
Until obtaining detecting qualified pre-determined bit module and fixing first component 11 and second component 12 using first material 21 that can do over again.
In summary, the assemble method of above-mentioned module 1 is simple, simple to operate, the production efficiency height, waste product for producing and doing over again
Rate is low.In addition, the component that this assemble method can be used for high value carries out the assembling that can be done over again, such as assembling fingerprint
Assembling of module button etc..
Embodiment two,
Reference picture 2, module 1a specific assemble method comprises the following steps：
First, first material 22 that can do over again is folded between first component 11 and installation portion 121；Then, can by the 3rd
Material 23 of doing over again is filled in installation portion 121 and around first component 11；Then, it is (such as electric by pinpointing heater
Resistance silk or laser) material 23 that can be done over again to the 3rd carries out heating makes the 3rd can do over again the instantaneous solidification of material 23, at the same time,
Heating region 31 can also be heated using fixed heater, i.e. using heater so that installation portion 121 heats up, causes the
Three can do over again the instantaneous solidification of material 23；Finally, whether detection pre-determined bit module 1a is qualified, if qualified, compresses first
Part 11 and second component 12, can be done over again the spontaneous curing of material 22 by first.
Thus, it is possible to find out, in above process, using the 3rd can do over again material 23 instantaneous solidification to first component 11
With second component 12 play pre-determined bit effect, by first can do over again material 22 spontaneous curing to first component 11 and second
Part 12 plays final fixation, so as to realize that first component 11 and the doing over again property of production of second component 12 and use can
Reworkability, so as to be effectively improved module 1a overall efficiency of assembling.
Preferably, first can do over again material 22 for room temperature vulcanized silicone rubber, and the 3rd can do over again material 23 for paraffin.Thus,
During production, if detection is unqualified, be able to can be done over again material 23 by heating the 3rd, realize the He of first component 11
The separation of second component 12, with being smoothed out for the technique that ensures to do over again；Break down or lose during module 1a uses
Spirit, can first heat the 3rd material 23 that can do over again and remove the 3rd and can do over again material 23, then removing first by shearing force can
Do over again material 22, separate first component 11 and second component 12, to ensure being smoothed out for Rework Technics.Due to first
The material 22 that can do over again be normal temperature under can spontaneous curing room temperature vulcanized silicone rubber so that the first solidification that can do over again material 22 can
To be naturally done in the subsequent technique of production, and then it is greatly enhanced module 1a overall package efficiency.
The module 1a of the complete expression embodiment two a kind of assemble method and reworking method：
(1) first material 22 that can do over again is located between installation portion 121 and first component 11, the 3rd can be done over again material 23
It is located in installation portion 121 and around first component 11., can be first for example in a specific example of the present embodiment
Two parts 12, such as glass panel is placed on mounting platform 3, then sets in the installation portion 121 first can do over again material
22, it for example can be the room temperature vulcanized silicone rubber that viscous liquid shape is presented, first component 11 is then fallen on into installation portion 121 again
Interior first can do over again on material 22, and being then stained with the neighboring of first component 11 can do over again and the 3rd of quick solidifying the can
Do over again material 23, for example paraffin (certainly, this step can also be carried out in advance).
(2) use fixed point 5 pair the 3rd of heater can do over again material 23 heat after cool down to obtain pre-determined bit module again.Example
Such as, it be able to can be done over again in the top of mounting platform 3 to being looped around the 3rd of the periphery of first component 11 the by resistance wire or laser
Material 23 carries out fixed point heating, and the high-temperature heating of moment makes the 3rd can do over again the rapid melting of material 23, then can stop plus
Heat, making the 3rd can do over again, material 23 is quick to be cooled and solidified, and now first component 11 is just assembled on second component 12 temporarily
, so as to obtain pre-determined bit module 1a.
In addition, in this embodiment, while heating using fixed point 5 pair of the 3rd material 23 that can do over again of heater, also
Fixed heater can be used to heat installation portion 121 simultaneously to accelerate the 3rd material 23 that can do over again to melt, wherein, it is fixed
Heater can be above-mentioned mounting platform 3 and heater, that is to say, that can allow heater simultaneously to mounting platform 3
On heating region 31 heat so that the temperature rise of installation portion 121, so as to accelerate the 3rd fusing that can do over again material 23.
Certainly, the invention is not restricted to this, can also can do over again material 23 only with fixed heater fusing the 3rd.
(3) then, pre-determined bit module 1a is detected, if testing result shows qualified, it can be continued with lower clamp
Remaining process, making first between first component 11 and installation portion 121 can do over again, material 22 is abundant to be solidified, such as natural at normal temperatures
Solidification.But, if testing result shows unqualified, that is to say, that testing result display failure, it can be done over again,
Process of rework and a upper embodiment are essentially identical, i.e., removing the 3rd material 23 and first that can do over again by heating or solvent can return
Work material 22, and the first component 11 and second component 12 separated is re-assemblied.
Sum it up, when use can do over again material to module progress pre-determined bit, can make it that the assembling process of module can be lossless
Do over again；When use can do over again material fixed module, the assembling process of module can be caused lossless can to do over again, can using process
It is lossless to reprocess；When using surface cure speed do over again material pre-determined bit or fixed module when, can be greatly enhanced
The packaging efficiency of module；When using adhesiveness it is stronger do over again material fixed module when, it can be ensured that module is in various environment
Under the conditions of connection reliability.
In summary, assemble method according to embodiments of the present invention, enables to the assembling of high value module to produce and possesses and can return
Work, so as to reduce scrappage, reduces input cost.Moreover, the assemble method is efficient and convenient, what can be selected does over again
Material is a lot, it is possible to use fast-curing process, common online stand-by period from some minutes is reduced to 10 seconds
Magnitude.Meanwhile, the fixed point instantaneous solidification measure of introducing can avoid, treat the process that assembling parts are integrally heated at high temperature,
The potential danger of technique is greatly reduced, and avoids the introducing of big stress.In short, module according to embodiments of the present invention
Assemble method, packaging efficiency is high, can do over again, reworkable, safe.
In the description of the invention, it is to be understood that the orientation or position relationship of the instruction such as " on ", " under " be based on
Orientation shown in the drawings or position relationship, are for only for ease of the description present invention and simplify description, rather than indicate or imply institute
The device or element of finger must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this hair
Bright limitation.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relatively important
Property or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be with
Express or implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two
Or two or more, unless otherwise specifically defined.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " tool
The description of body example " or " some examples " etc. means to combine specific features, structure, material that the embodiment or example are described
Material or feature are contained at least one embodiment of the present invention or example.In this manual, to the signal of above-mentioned term
Property statement be necessarily directed to identical embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner be combined in any one or more embodiments or example.In addition, in the case of not conflicting,
Those skilled in the art can be by the not be the same as Example described in this specification or the spy of example and non-be the same as Example or example
Levy and be combined and combine.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Do not departing from
In the case of the principle and objective of the present invention a variety of change, modification, replacement and modification, this hair can be carried out to these embodiments
Bright scope is limited by claim and its equivalent.
Claims (15)
1. a kind of assemble method of module, it is characterised in that the module includes first component and second component, the assembling
Method comprises the following steps：
The first component and the second component are carried out pre-determined bit to obtain pre-determined bit module；
Detect whether the pre-determined bit module is qualified, if qualified, the first component is fixed using first material that can do over again
With the second component；If unqualified, the first component and the second component are separated, and to the first component
Pre-determined bit is re-started with the second component and is detected, until obtaining detecting qualified pre-determined bit module and using described first
The material that can do over again fixes the first component and the second component.
2. the assemble method of module according to claim 1, it is characterised in that the first component and described second
Part by described first can do over again material fix after as damaged, carry out following reprocessing step：
Separate the first component and the second component；
Change or repair the first component and/or the second component；
Re-assembly.
3. the assemble method of module according to claim 1 or 2, it is characterised in that the separation first component and institute
Stating also includes step after second component：
It can be done over again material using first on first component described in solvent cleaning and/or the second component.
4. the assemble method of module according to claim 1, it is characterised in that having on the second component is used to pacify
Fill the installation portion of the first component, described first material that can do over again is folded between the first component and the installation portion.
5. the assemble method of module according to claim 4, it is characterised in that material can be done over again for can when described first
Repeat-heating fusing do over again material when,
It is described to be specially to obtain pre-determined bit module to the first component and second component progress pre-determined bit：
A1, material that first can do over again are folded between the first component and the installation portion；
A2, the installation portion is first heated cool down to obtain pre-determined bit module again；
It is described to fix the first component and the second component using first material that do over again and be specially：
B1, the pre-determined bit module testing result it is qualified after, compress the first component and the installation portion；
B2, the installation portion is first heated it is cooled to normal temperature.
6. the assemble method of the module according to claim 4 or 5, it is characterised in that described to be done over again using first
Material, which is fixed, also includes step after the first component and the second component：
Second material that can do over again is filled in the installation portion and around the first component.
7. the assemble method of module according to claim 6, it is characterised in that described first can do over again material for paraffin,
Described second can do over again material for room temperature vulcanized silicone rubber.
8. the assemble method of module according to claim 4, it is characterised in that material can be done over again for can when described first
Using shearing force remove do over again material when,
It is described to be specially to obtain pre-determined bit module to the first component and second component progress pre-determined bit：
C1, material that the 3rd can do over again are filled in the installation portion and around the first component；
C2, can be done over again to the described 3rd material and/or the installation portion, which carry out heating, makes the described 3rd can do over again material instantaneous solidification
To obtain pre-determined bit module；
It is described to fix the first component and the second component using first material that do over again and be specially：
D1, before the step C1, first material that can do over again is folded between the first component and the installation portion；
D2, the pre-determined bit module testing result it is qualified after, the first component and the installation portion are compressed, by described the
One can do over again material spontaneous curing.
9. the assemble method of module according to claim 8, it is characterised in that described first can do over again material for room temperature
Sulphurated siliastic, the described 3rd can do over again material for paraffin.
10. the assemble method of module according to claim 8, it is characterised in that using fixed point heater to described
3rd can do over again material heating.
11. the assemble method of module according to claim 10, it is characterised in that the fixed point heater is resistance
Silk or laser.
12. the assemble method of the module according to claim 5 or 8, it is characterised in that using fixed heater pair
The installation portion is heated.
13. the assemble method of module according to claim 12, it is characterised in that the fixed heater includes：
There is heating region and normal temperature region, the second component is located at described install and put down on mounting platform, the mounting platform
On platform and the installation portion and the heating region are just right up and down；With
Heater, the heater is used to heat the heating region.
14. a kind of module, it is characterised in that using the assemble method of the module according to any one of claim 1-13
Assemble.
15. module according to claim 14, it is characterised in that the module is the fingerprint recognition module of mobile terminal,
The first component is fingerprint sensor, and the second component is screen.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610092212.6A CN107094365B (en) | 2016-02-18 | 2016-02-18 | Mould group and its assemble method |
| PCT/CN2016/091980 WO2017140091A1 (en) | 2016-02-18 | 2016-07-28 | Module and assembling method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610092212.6A CN107094365B (en) | 2016-02-18 | 2016-02-18 | Mould group and its assemble method |
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| Publication Number | Publication Date |
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| CN107094365A true CN107094365A (en) | 2017-08-25 |
| CN107094365B CN107094365B (en) | 2019-10-29 |
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| CN201610092212.6A Active CN107094365B (en) | 2016-02-18 | 2016-02-18 | Mould group and its assemble method |
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| Country | Link |
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| CN (1) | CN107094365B (en) |
| WO (1) | WO2017140091A1 (en) |
Cited By (2)
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|---|---|---|---|---|
| CN107733176A (en) * | 2017-09-26 | 2018-02-23 | 东莞市东翱智能科技有限公司 | A kind of motor steering gear and the welding technique of motor coil |
| CN110936624A (en) * | 2018-09-21 | 2020-03-31 | 宁波舜宇光电信息有限公司 | Repairing device and method for camera module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115071180A (en) * | 2022-06-29 | 2022-09-20 | 深圳市航盛电子股份有限公司 | Repair recycling process of vehicle-mounted display module |
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| US6365700B1 (en) * | 1999-06-07 | 2002-04-02 | National Starch And Chemical Investment Holding Corporation | High green strength reactive hot melt by a prepolymerization in the main reactor |
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| CN105224926A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Fingerprint recognition module installation method and fingerprint recognition module mounting structure |
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| EP1386936A1 (en) * | 2002-07-30 | 2004-02-04 | Thomas Abend | Process and composition for preparing reactive melts based on surface-deactivated solid isocyanates and polymers with functional groups |
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| US5261156A (en) * | 1991-02-28 | 1993-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Method of electrically connecting an integrated circuit to an electric device |
| US6365700B1 (en) * | 1999-06-07 | 2002-04-02 | National Starch And Chemical Investment Holding Corporation | High green strength reactive hot melt by a prepolymerization in the main reactor |
| CN102127374A (en) * | 2010-12-29 | 2011-07-20 | 北京遥测技术研究所 | Method for repairing DAD-40 conductive adhesive bonding product |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107094365B (en) | 2019-10-29 |
| WO2017140091A1 (en) | 2017-08-24 |
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