CN107914453B - Plate structure, laminating method thereof and electronic equipment - Google Patents
Plate structure, laminating method thereof and electronic equipment Download PDFInfo
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- CN107914453B CN107914453B CN201711216669.4A CN201711216669A CN107914453B CN 107914453 B CN107914453 B CN 107914453B CN 201711216669 A CN201711216669 A CN 201711216669A CN 107914453 B CN107914453 B CN 107914453B
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- adhesive film
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- air pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a plate structure, a laminating method thereof and electronic equipment, wherein the plate structure comprises the following steps: the first substrate and the second substrate are oppositely attached through the adhesive film; putting the glue film into a curing oven, heating the glue film to a first preset temperature to melt the glue film, applying a first preset air pressure, and then preserving heat and pressure for a first preset time; heating to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time; and (6) cooling. According to the technical scheme provided by the invention, through the treatment of two bubble-discharging stages, bubbles in the adhesive film are effectively discharged, so that the quality of the plate structure is improved, and the quality of the electronic equipment is ensured.
Description
Technical Field
The invention relates to the technical field of substrate bonding, in particular to a plate structure, a bonding method thereof and electronic equipment.
Background
The cover plate of the electronic product in the current market is generally attached to the functional module by glue or solid glue. Because the size and the thickness of solid-state glue are easily managed and controlled, the product outward appearance that the laminating was come out is more pleasing to the eye, so, electronic product often selects solid-state glued membrane to laminate apron and functional module at present. However, with the structure of the bonded product and the concept of zero bubbles after bonding, the curing process using the conventional solid glue has a high probability of bubbles, and thus the requirement of product preparation cannot be met. Especially, if there is a certain amount of bubbles between the laminating of fingerprint identification module and apron, will influence the response precision.
Disclosure of Invention
In view of this, the present invention provides a sheet structure, a method for attaching the sheet structure, and an electronic device, in which bubbles in a glue film are effectively discharged by two bubble discharge stages, so as to improve the quality of the sheet structure and ensure the high quality of the electronic device.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a method for attaching a panel structure includes:
the first substrate and the second substrate are oppositely attached through the adhesive film;
putting the glue film into a curing oven, heating the glue film to a first preset temperature to melt the glue film, applying a first preset air pressure, and then preserving heat and pressure for a first preset time;
heating to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time;
and (6) cooling.
Optionally, the first preset temperature is a melting point temperature of the adhesive film.
Optionally, the second preset temperature is a temperature required for the adhesive film to perform a crosslinking reaction.
Optionally, the adhesive film is a solid adhesive film.
Optionally, the cooling treatment is furnace cooling treatment.
Optionally, after the cooling treatment, the method further includes:
and performing bubble detection on the adhesive film through electrical measurement or ultrasonic measurement.
Optionally, the first substrate is a fingerprint identification module;
and the second substrate is a cover plate.
Correspondingly, the invention also provides a plate structure, and the plate structure is manufactured by adopting the laminating method of the plate structure.
Correspondingly, the invention further provides electronic equipment which comprises the plate structure.
Compared with the prior art, the technical scheme provided by the invention at least has the following advantages:
the invention provides a plate structure, a laminating method thereof and electronic equipment, comprising the following steps: the first substrate and the second substrate are oppositely attached through the adhesive film; putting the glue film into a curing oven, heating the glue film to a first preset temperature to melt the glue film, applying a first preset air pressure, and then preserving heat and pressure for a first preset time; heating to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time; and (6) cooling.
According to the technical scheme provided by the invention, in the first bubble discharging stage (namely, the first heat and pressure preserving stage), the adhesive film material is melted to have certain fluidity, and meanwhile, the first preset air pressure is applied, so that most of bubbles in the adhesive film can be discharged to leave a few small bubbles, and at the moment, the curing efficiency of the adhesive film in the first stage is low, and the second bubble discharging (namely, the second heat and pressure preserving stage) is facilitated; in the second bubble discharging stage, the adhesive film is subjected to a cross-linking reaction, and a second preset air pressure is applied, so that small bubbles in the adhesive film are discharged or more tiny bubbles are scattered by the air pressure, and the purpose of discharging bubbles is achieved. The processing in the two bubble discharging stages effectively discharges bubbles in the adhesive film, so that the quality of the plate structure is improved, and the high quality of the electronic equipment is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a flowchart of a method for attaching a plate structure according to an embodiment of the present disclosure;
fig. 2 is a flowchart of another method for attaching a plate structure according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Just as the background art said, because the size and the thickness of solid-state glue are easily managed and control, the product outward appearance that the laminating came out is more pleasing to the eye, so, electronic product often selects solid-state glued membrane to laminate apron and functional module at present. However, with the structure of the bonded product and the concept of zero bubbles after bonding, the curing process using the conventional solid glue has a high probability of bubbles, and thus the requirement of product preparation cannot be met. Especially, if there is a certain amount of bubbles between the laminating of fingerprint identification module and apron, will influence the response precision.
Based on this, the embodiment of the application provides a plate structure, a laminating method thereof and electronic equipment, and bubbles in an adhesive film are effectively discharged through processing in a bubble discharge stage twice, so that the quality of the plate structure is improved, and the quality of the electronic equipment is ensured. In order to achieve the above object, the technical solutions provided by the embodiments of the present application are described in detail below, specifically with reference to fig. 1 and fig. 2.
Referring to fig. 1, a flowchart of a method for attaching a plate structure provided in an embodiment of the present application is shown, where the method for attaching includes:
s1, oppositely attaching the first substrate and the second substrate through the adhesive film;
s2, placing the glue film into a curing oven, heating the glue film to a first preset temperature to melt the glue film, applying a first preset air pressure, and keeping the temperature and the pressure for a first preset time;
s3, raising the temperature to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time;
and S4, cooling.
In an embodiment of the present application, the first predetermined temperature is a melting point temperature of the adhesive film. And, the second preset temperature that this application provided is for making the glued membrane takes place the required temperature of cross-linking reaction.
In an embodiment of the present application, the adhesive film provided herein is a solid adhesive film, such as DAF adhesive film (Dieattach film). The curing adhesive provided in the embodiment of the present application may be a curing adhesive using epoxy resin as a base material, and the application is not particularly limited; and, the range of the first preset temperature provided by the embodiment of the present application may be [60 degrees centigrade, 100 degrees centigrade ], the range of the first preset air pressure may be 0.3MPa-0.65MPa, inclusive, the range of the second preset temperature may be (100 degrees centigrade, 160 degrees centigrade ], the range of the second preset air pressure may be 0.3MPa-0.7MPa, inclusive.
In the laminating process, the bubble discharging stage is divided into two times, wherein in the first bubble discharging stage (namely the first heat preservation and pressure maintaining stage), the temperature is raised to the melting point temperature of the adhesive film, so that the adhesive film material is melted to have certain fluidity, meanwhile, the first preset air pressure is applied, further most bubbles in the adhesive film can be discharged to remain some small bubbles, at the moment, the curing efficiency of the adhesive film in the stage is low, and the bubble discharging for the second time is convenient (namely the second heat preservation and pressure maintaining stage)
A temperature and pressure maintaining stage); in the second bubble discharging stage, the adhesive film is subjected to a cross-linking reaction, and meanwhile, a second preset air pressure is applied, so that small bubbles in the adhesive film are discharged or more tiny bubbles are scattered by the air pressure, and the purpose of discharging bubbles is achieved; and finally, cooling the plate structure after the air bubbles are discharged, and releasing the stress of the adhesive film material after the cross-linking reaction, so that the quality of the laminated plate structure is more stable.
As can be seen from the above, in the technical solution provided in the embodiment of the present application, in the first bubble discharging stage (i.e., the first heat and pressure maintaining stage), the adhesive film material is melted to have a certain fluidity, and the first preset air pressure is applied at the same time, so that most of the bubbles in the adhesive film can be discharged and some small bubbles remain, and at this time, the curing efficiency of the adhesive film in this stage is low, which is convenient for the second bubble discharging (i.e., the second heat and pressure maintaining stage); in the second bubble discharging stage, the adhesive film is subjected to a cross-linking reaction, and a second preset air pressure is applied, so that small bubbles in the adhesive film are discharged or more tiny bubbles are scattered by the air pressure, and the purpose of discharging bubbles is achieved. The processing in the two bubble discharging stages effectively discharges bubbles in the adhesive film, so that the quality of the plate structure is improved, and the high quality of the electronic equipment is ensured.
Further, in order to ensure the quality of the laminated plate structure, a bubble test can be performed after cooling is completed. Referring to fig. 2, a flowchart of a fitting method of another plate structure provided in an embodiment of the present application is shown, where the fitting method includes:
s1, oppositely attaching the first substrate and the second substrate through the adhesive film;
s2, placing the glue film into a curing oven, heating the glue film to a first preset temperature to melt the glue film, applying a first preset air pressure, and keeping the temperature and the pressure for a first preset time;
s3, raising the temperature to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time;
and S4, cooling.
And, after the cooling process at S4, further comprising:
and S5, performing bubble detection on the adhesive film through electrical measurement or ultrasonic measurement. According to detection, the plate structure prepared by the laminating method provided by the embodiment of the application has no difference in product appearance from the plate structure prepared by the existing laminating method; however, in the plate structure prepared by the laminating method provided by the embodiment of the application, the number of bubbles in the adhesive film can reach zero under the detection of electrical measurement or ultrasonic measurement.
In any of the above embodiments of the present application, the first substrate provided by the present application is a fingerprint identification module;
and the second substrate is a cover plate.
When laminating fingerprint identification module and apron, adopt the laminating method that the above-mentioned embodiment of this application provided, can improve the laminating quality of fingerprint identification module and apron, improve the detection precision of fingerprint identification structure. Therefore, the fingerprint identification module is not limited to the first substrate as the fingerprint identification module, the second substrate is the cover plate, and the fingerprint identification module can also be of other substrate structures, and the fingerprint identification module is not limited to the first substrate.
Correspondingly, the embodiment of the application further provides a plate structure, and the plate structure is manufactured by adopting the laminating method of the plate structure provided by any one of the embodiments.
Correspondingly, the embodiment of the application also provides electronic equipment, and the electronic equipment comprises the plate structure provided by the embodiment.
The embodiment of the application provides a plate structure, a laminating method thereof and electronic equipment, wherein the plate structure comprises: the first substrate and the second substrate are oppositely attached through the adhesive film; putting the glue film into a curing oven, heating the glue film to a first preset temperature to melt the glue film, applying a first preset air pressure, and then preserving heat and pressure for a first preset time; heating to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time; and (6) cooling.
As can be seen from the above, in the technical solution provided in the embodiment of the present application, in the first bubble discharging stage (i.e., the first heat and pressure maintaining stage), the adhesive film material is melted to have a certain fluidity, and the first preset air pressure is applied at the same time, so that most of the bubbles in the adhesive film can be discharged and some small bubbles remain, and at this time, the curing efficiency of the adhesive film in this stage is low, which is convenient for the second bubble discharging (i.e., the second heat and pressure maintaining stage); in the second bubble discharging stage, the adhesive film is subjected to a cross-linking reaction, and a second preset air pressure is applied, so that small bubbles in the adhesive film are discharged or more tiny bubbles are scattered by the air pressure, and the purpose of discharging bubbles is achieved. The processing in the two bubble discharging stages effectively discharges bubbles in the adhesive film, so that the quality of the plate structure is improved, and the high quality of the electronic equipment is ensured.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A method for attaching a panel structure, comprising:
the first substrate and the second substrate are oppositely attached through the adhesive film;
putting the glue film into a curing oven, heating to a first preset temperature to melt the glue film, applying a first preset air pressure, and keeping the temperature and the pressure for a first preset time, wherein the range of the first preset air pressure is 0.3-0.65 MPa inclusive, and the first preset temperature is the melting point temperature of the glue film;
heating to a second preset temperature again to solidify the adhesive film, applying a second preset air pressure, and keeping the temperature and the pressure for a second preset time, wherein the range of the second preset air pressure is 0.3-0.7 MPa inclusive, and the second preset temperature is the temperature required for the adhesive film to generate a crosslinking reaction;
and (6) cooling.
2. The method of claim 1, wherein the adhesive film is a solid adhesive film.
3. A method of applying a sheet structure according to claim 1, wherein the cooling treatment is an in-furnace cooling treatment.
4. The method of applying a sheet structure according to claim 1, further comprising, after the cooling process:
and performing bubble detection on the adhesive film through electrical measurement or ultrasonic measurement.
5. The method of claim 1, wherein the first substrate is a fingerprint recognition module;
and the second substrate is a cover plate.
6. A panel structure, characterized in that the panel structure is manufactured by the method of applying the panel structure according to any one of claims 1 to 5.
7. An electronic device characterized in that it comprises the sheet structure of claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711216669.4A CN107914453B (en) | 2017-11-28 | 2017-11-28 | Plate structure, laminating method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711216669.4A CN107914453B (en) | 2017-11-28 | 2017-11-28 | Plate structure, laminating method thereof and electronic equipment |
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| Publication Number | Publication Date |
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| CN107914453A CN107914453A (en) | 2018-04-17 |
| CN107914453B true CN107914453B (en) | 2020-09-04 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110576593B (en) * | 2018-08-01 | 2021-07-06 | 蓝思科技（长沙）有限公司 | Film pasting method and application thereof and glass panel |
| CN110136573B (en) * | 2019-05-06 | 2021-09-17 | Oppo广东移动通信有限公司 | Display screen, preparation method thereof and electronic equipment |
| CN110126422B (en) * | 2019-05-06 | 2022-02-22 | 深圳市信维通信股份有限公司 | Preparation method of double-sided copper-clad LCP (liquid Crystal Polymer) plate |
| CN112725730A (en) * | 2020-12-30 | 2021-04-30 | 常州高光半导体材料有限公司 | Method for manufacturing metal mask for OLED evaporation |
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| CN1056478A (en) * | 1990-04-23 | 1991-11-27 | 詹姆斯·阿瑟·艾伯特·希克曼 | Method of laminating glass |
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| CN107914453A (en) | 2018-04-17 |
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