CN107591421B - Camera module chip packaging base assembly and preparation method thereof - Google Patents
Camera module chip packaging base assembly and preparation method thereof Download PDFInfo
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- CN107591421B CN107591421B CN201710698558.5A CN201710698558A CN107591421B CN 107591421 B CN107591421 B CN 107591421B CN 201710698558 A CN201710698558 A CN 201710698558A CN 107591421 B CN107591421 B CN 107591421B
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Abstract
The invention relates to a preparation method of a camera module chip packaging base component, which comprises the following steps: and (3) integrally placing the metal piece and the optical filter into a plastic mold cavity in a mode of combining the optical filter, and demolding after injection molding to finally obtain the base assembly for packaging the camera module chip. When the optical filter combination is prepared, the optical filter combination can be obtained by a manufacturing method of automatic stretching strap continuous production, and the patch yield of the optical filter is higher. In addition, a camera module chip package base assembly is also provided.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a camera module chip packaging base assembly and a preparation method thereof.
Background
The chip package base in the mobile phone camera module is a component on the mobile phone camera module and is used between an electronic component and a voice coil motor on a PCB.
The current infrared filter patch technology in the mobile phone camera module is as follows: the injection molding pure plastic part is used for sticking the infrared filter and the chip packaging base in the optical camera module together by using specific glue in an IR mode through a patch factory, and then the H/R assembly is formed. The chip package base in the optical camera module mainly refers to: AF-Holder base (for optical camera).
However, because the pure plastic parts are packaged in bulk, the pure plastic products are required to be put into a specific jig before being attached, the jigs are different from each other, and the cost of inputting an automaton is high. The clearance can not be reduced due to the assembly requirement of the specific jig, the patch precision is not high, and unstable fluctuation can occur in the yield.
Disclosure of Invention
Based on the above, it is necessary to provide a method for manufacturing a base assembly of a camera module chip package, aiming at the problems of high filter patch yield and high process cost in the camera module of a mobile phone. A filter assembly and a camera module chip package base assembly using the same are also provided.
A preparation method of a camera module chip packaging base component comprises the following steps:
the method comprises the steps of manufacturing a metal sheet into a metal piece with a preset shape, wherein the metal piece is provided with a bearing part, and a light hole is formed in the bearing part;
bonding and fixing the optical filter on the bearing part to form an optical filter combination;
implanting the optical filter combination into a plastic mold cavity in a material belt mode, and demolding after injection molding to obtain a plurality of semi-finished products of the material belt;
and cutting the semi-finished product of the connecting strip to obtain a plurality of camera module chip packaging base assemblies, wherein the camera module chip packaging base assemblies comprise plastic bases, and the metal pieces are embedded into the plastic bases.
According to the preparation method of the camera module chip packaging base component, the metal piece and the optical filter are integrally placed into the plastic mold cavity in the form of the optical filter combination, when the optical filter combination is prepared, the optical filter combination can be obtained through the manufacturing method of automatic pull belt continuous production, and the patch yield of the optical filter is high.
In one embodiment, before the step of bonding and fixing the optical filter on the bearing part to form the optical filter combination, the bearing part is subjected to surface treatment to form an adhesive insulating layer, and in the step of bonding and fixing the optical filter on the bearing part to form the optical filter combination, the optical filter is bonded on the insulating layer by using glue.
In one embodiment, two filter assemblies are embedded in the same plastic base, and the two filter assemblies are arranged side by side on the plastic base.
In one embodiment, the top surface of the plastic base is provided with a window hole, the metal piece is located in the window hole, the edge of the metal piece is embedded into the plastic base, and the top surface of the optical filter is not higher than the top surface of the plastic base.
A filter combination comprising: the metal piece is provided with a material belt part and a bearing part connected with the material belt part, and a light hole is formed in the bearing part; the optical filter is adhered and fixed on the bearing part of the metal piece.
In one embodiment, the surface of the bearing part is provided with an adhesive insulating layer, and the optical filter is adhered and fixed on the insulating layer.
In one embodiment, the filter is an infrared filter, which is a white glass infrared filter, a basket glass infrared filter, or a resin basket glass infrared filter.
In one embodiment, the thickness of the metal piece is 0.05-0.15 mm.
In one embodiment, the surface of the bearing part is a pure metal surface or a mixed surface of metal and plastic, and the mixed surface comprises a metal supporting part and a plastic supporting part positioned in a hole on the metal supporting part.
The camera module chip packaging base assembly comprises the optical filter assembly and further comprises a plastic base, wherein the plastic base is provided with a fenestration, the optical filter assembly is positioned in the fenestration, and the bearing part is embedded in the plastic base.
Drawings
FIG. 1 is a schematic diagram of a filter assembly according to an embodiment of the invention;
FIG. 2 is an exploded view of the filter assembly shown in FIG. 1;
FIG. 3 is a schematic diagram of a base assembly of a camera module chip package formed by combining optical filters according to another embodiment;
FIG. 4 is a schematic diagram of a chip package base assembly having the filter assembly camera module of FIG. 1;
FIG. 5 is an exploded view of the camera module chip package base assembly of FIG. 4;
fig. 6 is a schematic diagram of a camera module chip package base assembly according to another embodiment.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The preferred embodiments of the optical filter assembly, the camera module chip package base assembly and the manufacturing method thereof according to the present invention are described below with reference to the accompanying drawings.
Referring to fig. 1 and 2, the present invention provides a filter assembly 10 that can be used to form a camera module chip package base assembly (H/R assembly).
The filter assembly 10 includes a metal member 110 and a filter 120 fixed to the metal member 110. The metal member 110 is embedded in the plastic base 20, and is provided with a material belt portion 112 and a bearing portion 113 connected with the material belt portion 112. The carrying portion 113 is provided with a light hole 114. The optical filter 120 is adhered and fixed on the carrying portion 113 of the metal member 110, and corresponds to the light hole 114.
The metal piece 110 is a metal sheet with a thickness of 0.05-0.15 mm. The metal piece can be made of pure metal, stainless steel, alloy and the like.
Further, the surface of the carrying portion 113 may be further provided with an insulating layer having adhesiveness. The optical filter 120 is adhered and fixed on the insulating layer by glue, so as to improve the adhesion firmness.
The surface of the carrying portion 113 of the metal member 110 is a pure metal supporting surface, so as to improve the strength of the carrying portion 113. In other embodiments, as shown in fig. 3, the surface of the bearing portion 113 may be a mixed surface of metal and plastic. For example, injection molding holes can be formed in the metal surface. The injection holes are filled with plastic cement, so that a mixed surface of metal and plastic cement is formed. The carrier 113 includes a metal support 1131 and a plastic support 1132 positioned in a hole on the metal support 1131. The surfaces of the metal support 1131 and the plastic support 1132 are coplanar to form the mixing surface.
The filter 120 is an infrared filter. Specifically, the infrared filter may be a white glass infrared filter, a basket glass infrared filter, or a resin basket glass infrared filter.
In the above-mentioned optical filter assembly 10, the metal member 110 and the optical filter 120 are combined in advance to form the optical filter assembly 10, and then the optical filter assembly is used to form a base assembly of a camera module chip package with a plastic base. The pure plastic base is not required to be placed into a specific jig, so that the attaching process of the optical filter 120 is simple, the yield is high, and the mass production can be realized.
Referring to fig. 4 and 5, a camera module chip package base assembly according to an embodiment of the invention includes the aforementioned optical filter assembly 10 and the plastic base 20. The filter assembly 10 is embedded in the plastic base 20. Specifically, the plastic base 20 and the optical filter assembly 10 may be formed as a single piece by insert molding.
The top surface of the plastic base 20 is provided with a window 210. The filter assembly 10 is disposed in the opening 210, and the edge of the metal member 110 is embedded in the plastic base 20.
The top surface of the filter 120 may be optionally not higher than the top surface of the plastic base 20. Specifically, the top surface of the optical filter 120 is flush with the top surface of the plastic base 20.
In the camera module chip package base assembly illustrated in fig. 4 and 5, the plastic base 20 is a single-shot base, and an optical filter assembly 10 is embedded therein.
In addition, the plastic base 20 may be a double-shot base as shown in fig. 6, and two open windows 210 are provided, in which two filter assemblies 10 are embedded, and the two filter assemblies 10 are arranged side by side on the plastic base 20.
The above-mentioned camera module chip package base component, the metal member 110 and the optical filter 120 are integrally embedded into the plastic base 20 in the form of the optical filter assembly 10, so that the chip mounting yield of the optical filter is high.
The preparation process of the camera module chip packaging base component comprises the following steps.
S100, manufacturing a metal sheet into a metal piece with a preset shape, wherein the metal piece is provided with a bearing part, and the bearing part is provided with a light hole.
In the step, firstly, a metal alloy (alloy, copper, stainless steel and the like) sheet with the thickness of 0.05-0.15 mm is punched into a shape meeting the requirements of customer functions and the forming quantification by a precision punching die, and is coiled and packaged.
However, it is further optional to press a metal alloy (alloy, copper, stainless steel, etc.) product into a predetermined shape by a special surface treatment to obtain the property of strong insulation and adhesion and reel-pack to obtain a predetermined metal product. The bearing part surface of the metal product is provided with an insulating layer with viscosity.
S200, bonding and fixing the optical filter on the bearing part to form an optical filter combination. In this step, the infrared filter is fixed to the metal product by using a specific glue.
When the surface of the bearing part is provided with an adhesive insulating layer, the optical filter is adhered on the insulating layer by using glue.
S300, implanting the optical filter combination into a plastic mold cavity in a material belt mode, and demolding after injection molding to obtain a plurality of semi-finished products of the material belt.
Continuously implanting a metal product with an infrared filter into a prepared plastic mold cavity in a material belt mode, melting plastic particles by selecting a proper injection molding machine, injecting the molten plastic particles into the plastic mold cavity by an injection molding process, cooling, ejecting, and demolding to obtain a semi-finished product of the material belt: and (3) attaching a plastic and hardware integrated product with an optical filter.
In the plastic hardware integrated product with the optical filter, which is obtained by injection molding, the top surface of the plastic base is provided with a window hole, the metal piece is positioned in the window hole, the edge of the metal piece is embedded into the plastic base, and the top surface of the optical filter is not higher than the top surface of the plastic base.
The plastic base can be a single-shot base as shown in fig. 1, and a light filter combination is embedded in the plastic base. In addition, the two optical filter assemblies can be embedded in the same plastic base at the same time, and the two optical filter assemblies are arranged on the plastic base side by side.
S400, cutting the semi-finished product of the connecting belt to obtain a plurality of camera module chip packaging base components, wherein the camera module chip packaging base components comprise plastic bases, and the metal pieces are embedded into the plastic bases.
The plastic and hardware integrated product after the patch is subjected to a special cutting machine, and the cutting machine has the functions of cutting a material belt and dividing a plurality of holes. The cut product is a finished product (shown in figure 1) meeting the requirements of customer drawings, and the automatic production can be realized by pulling the material belt through an automatic machine.
In the method for manufacturing the camera module chip package base component, the metal piece 110 and the optical filter 120 are integrally placed into the plastic mold cavity in the form of the optical filter combination 10, when the optical filter combination 10 is manufactured, the optical filter combination 10 can be obtained through the manufacturing method of continuous production of an automatic pull belt, and the patch yield of the optical filter is high.
In addition, the base component of the camera module chip package obtained by the invention is a pure hardware integrated stretching component, the thinnest limit of pure plastic can be broken through, the thinnest range can be 0.05-0.15 mm, and more use space is reserved for the double camera module chip package of the mobile phone.
The camera module chip packaging base component is a plastic hardware integrated part, and because metal is embedded in plastic, the strength is greatly improved, and the defect of insufficient strength after the pure plastic part is thin can be effectively overcome.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The preparation method of the camera module chip packaging base assembly is characterized by comprising the following steps:
the method comprises the steps of manufacturing a metal sheet into a metal piece with a preset shape, wherein the metal piece is provided with a bearing part, and a light hole is formed in the bearing part;
bonding and fixing the optical filter on the bearing part to form an optical filter combination;
implanting the optical filter combination into a plastic mold cavity in a material belt mode, and demolding after injection molding to obtain a plurality of semi-finished products of the material belt;
cutting the semi-finished product of the connecting strip to obtain a plurality of camera module chip packaging base components, wherein the camera module chip packaging base components comprise plastic bases, the plastic bases and the optical filters are combined to form an integral piece in a buried molding mode, and the metal piece is embedded into the plastic bases; the formed plastic base is provided with a window hole, the metal piece is positioned in the window hole, the edge of the metal piece is embedded into the plastic base, and the top surface of the optical filter is flush with the top surface of the plastic base.
2. The method of claim 1 wherein the step of adhesively securing the filter to the carrier forms the filter assembly is preceded by a step of surface treating the carrier to form an adhesive insulating layer, and wherein the step of adhesively securing the filter to the carrier forms the filter assembly is preceded by a step of adhesively securing the filter to the insulating layer.
3. The method of claim 1, wherein two of said filter assemblies are simultaneously embedded in the same plastic base, and wherein two filter assemblies are disposed side-by-side on said plastic base.
4. A camera module chip package base assembly, comprising:
a filter assembly comprising a metal piece and a filter; the metal piece is provided with a material belt part and a bearing part connected with the material belt part, and a light hole is formed in the bearing part; the optical filter is adhered and fixed on the bearing part of the metal piece; and
the plastic base and the optical filter combination are formed into an integral piece in a buried molding mode; the plastic base is provided with a fenestration, the optical filter assembly is positioned in the fenestration, the bearing part is embedded in the plastic base, and the top surface of the optical filter is flush with the top surface of the plastic base.
5. The camera module chip package base assembly of claim 4, wherein the surface of the carrier is provided with an adhesive insulating layer, and the optical filter is adhered and fixed on the insulating layer.
6. The camera module chip package base assembly of claim 4, wherein the optical filter is an infrared optical filter, and the infrared optical filter is a white glass infrared optical filter, a basket glass infrared optical filter, or a resin basket glass infrared optical filter.
7. The camera module chip package base assembly of claim 4, wherein the metal piece has a thickness of 0.05-0.15 mm.
8. The camera module chip package base assembly of claim 4, wherein the surface of the carrier is a pure metal surface.
9. The camera module chip package base assembly of claim 4, wherein the surface of the carrier is a metal-plastic mixed surface, the carrier includes a metal support and a plastic support in a hole in the metal support, and the surfaces of the metal support and the plastic support are coplanar to form the mixed surface.
10. The camera module chip package base assembly of claim 4, wherein the plastic base is provided with two open holes, the number of the optical filter assemblies is two, the optical filter assemblies are respectively embedded into each open hole, and the two optical filter assemblies are arranged side by side on the plastic base.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710698558.5A CN107591421B (en) | 2017-08-15 | 2017-08-15 | Camera module chip packaging base assembly and preparation method thereof |
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| CN201710698558.5A CN107591421B (en) | 2017-08-15 | 2017-08-15 | Camera module chip packaging base assembly and preparation method thereof |
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| CN107591421A CN107591421A (en) | 2018-01-16 |
| CN107591421B true CN107591421B (en) | 2023-08-04 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108632514B (en) * | 2018-06-08 | 2024-07-19 | 昆山丘钛微电子科技有限公司 | Camera module and mobile terminal |
| CN109819151A (en) * | 2019-02-26 | 2019-05-28 | 苏州昀冢电子科技有限公司 | A kind of voice coil motor pedestal, voice coil motor and camera module |
| CN113363171B (en) * | 2021-05-11 | 2023-06-16 | 苏州昀冢电子科技股份有限公司 | Camera module chip packaging base combination and manufacturing method thereof |
| CN113629086A (en) * | 2021-08-03 | 2021-11-09 | 深圳市群晖智能科技股份有限公司 | Manufacturing method of FCM packaging chip machine, packaging chip machine and camera module product |
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