CN106206756A - Photosensitive tube and optical filter combined packaging structure and processing technology thereof - Google Patents
Photosensitive tube and optical filter combined packaging structure and processing technology thereof Download PDFInfo
- Publication number
- CN106206756A CN106206756A CN201610874984.5A CN201610874984A CN106206756A CN 106206756 A CN106206756 A CN 106206756A CN 201610874984 A CN201610874984 A CN 201610874984A CN 106206756 A CN106206756 A CN 106206756A
- Authority
- CN
- China
- Prior art keywords
- pin
- optical filter
- specific wavelength
- photosensitive tube
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 238000005516 engineering process Methods 0.000 title description 2
- 239000000565 sealant Substances 0.000 claims abstract description 23
- 239000012530 fluid Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 7
- 230000035807 sensation Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
The embodiment of the invention is suitable for the technical field of semiconductor packaging, and provides a combined packaging structure of a photosensitive tube and a light filter. The packaging structure comprises a light sensing chip, a lead, a first pin, a second pin, a specific wavelength optical filter and sealant, wherein the first pin is electrically connected with the light sensing chip, the second pin is electrically connected with the light sensing chip through the lead, and the first pin, the second pin and the light sensing chip are packaged through the sealant to form an integrated support; the first pin and the second pin are arranged on the periphery of the sealant in a surrounding mode to form a surface-mounted packaging structure, the inside of the integrated support is provided with a containing cavity, the light sensing chip is contained at the bottom of the containing cavity, and the specific wavelength filter cover is arranged on an opening of the containing cavity. The combined packaging structure of the photosensitive tube and the optical filter can be assembled only by buckling the optical filter with the specific wavelength in the accommodating cavity on the integrated bracket, and has the advantages of simple structure, low cost and high production efficiency.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, particularly relate to a kind of photosensitive tube and optical filter combination encapsulating structure and
Its processing technique.
Background technology
In recent years, environmental consciousness has been the common recognition of all mankind.Whole world components and parts supplier progressively develops various replacing
For the photosensitive tube material of conventional vulcanized cadmium photoconductive resistance, but major part photosensitive tube material has to rely on inside encapsulation and inlays certain wave
The mode of long length filter pipe cap realizes, and the specific wavelength optical filter inlayed in pipe cap is also required to filter specific wavelength on chip
It is assigned in pipe cap.This mounting means is only limitted to inline package photosensitive tube material, but for using paster LED lamp bead material
Panel, photosensitive tube miniature requirement is the strongest.Between the market demand, each components and parts supplier progressively develops of all kinds
Install the mode of specific wavelength optical filter additional.
As shown in Figure 1 to Figure 3, be existing direct insertion photosensitive tube material install additional specific wavelength optical filter assembled package knot
Structure schematic diagram. this encapsulating structure is that the wire 4 of light sense chip the 3, first pin the 5, second pin 6 and connection is packaged in colloid 7
In, colloid 7 is socketed in pipe cap 1, and installs specific wavelength optical filter 2 in pipe cap 1, and this structure uses twice combination to add
There is the shortcoming that cost of labor is high and production efficiency is low in the mode of dress.
Summary of the invention
Embodiment of the present invention technical problem to be solved is to provide a kind of photosensitive tube to combine encapsulating structure with optical filter
And processing technique, it is intended to solve direct insertion photosensitive tube material of the prior art and install the assembled package of specific wavelength optical filter additional
The problem that the cost of labor that structure exists is high and production efficiency is low.
The embodiment of the present invention is achieved in that a kind of photosensitive tube of offer combines encapsulating structure with optical filter, and it includes light
Sense chip, wire, the first pin, the second pin, specific wavelength optical filter and fluid sealant, described first pin and described light sensation
Chip is electrically connected with, and described second pin is electrically connected with described smooth sense chip by described wire, the first pin, the second pin
And light sense chip is encapsulated by described fluid sealant, form integrated bracket；Wherein, described first pin and the second pin enclose and are located at
The periphery of described fluid sealant, forms SMD encapsulating structure, and being internally formed of described integrated bracket accommodates chamber, described light sensation
Chip is contained in the bottom in described receiving chamber, and described specific wavelength optical filter is covered on the opening in described receiving chamber.
Further, the first receiving space and second that described receiving chamber includes being interconnected accommodates space, and described first
Accommodating and form a stage portion between space and the second receiving space, a part for described smooth sense chip and described wire is positioned at described
First accommodates in space, and described light sensation chip bottom is electrically connected with described first pin, another part encapsulation of described wire
In described fluid sealant, described specific wavelength optical filter is embedded in described second and accommodates in space, and is resisted against described stage portion
On.
Further, the described first axial cross section accommodating space is bowl shape, and described specific wavelength optical filter is covered on
Described first enlarging one end holding space.
Further, it is filled with epoxy resin in described first receiving space.
Further, the described second inwall accommodating space is provided with the card for fixing described specific wavelength optical filter
Button.
The embodiment of the present invention additionally provides the processing work of a kind of photosensitive tube as above and optical filter combination encapsulating structure
Skill, this processing technique comprises the following steps:
A, by metal stamping, be shaped to the first pin and the second pin；
Welding light sense chip by die bond on b, described first pin, described smooth sense chip is drawn by welding lead and second
Foot connects, and then carries out injection parcel by fluid sealant, forms integrated bracket, make described first pin and the second pin enclose and set
In the periphery of described fluid sealant, form SMD encapsulating structure, and on described integrated bracket, form receiving chamber, described light
Sense chip is positioned at the bottom in described receiving chamber；
C, opening part from described receiving chamber, be pressed into described receiving intracavity by specific wavelength optical filter.
Further, the opening part in described receiving chamber arranges buckle, and described specific wavelength optical filter is pressed into described receiving
After intracavity, described specific wavelength optical filter is buckled and is fixed on described receiving intracavity by described buckle.
The embodiment of the present invention compared with prior art, has the beneficial effects that: the first pin in the present invention, the second pin and
Light sense chip is packaged as a whole cribbing by fluid sealant, and is internally formed receiving chamber at integrated bracket.Wherein, first
Pin, the second pin enclose the periphery being located at integrated bracket, form paster type encapsulation structure, and light sense chip is contained in integral type and props up
The bottom of frame, specific wavelength optical filter is covered on the opening accommodating chamber.This encapsulating structure has only to filter specific wavelength on chip
Being located on integrated bracket and can complete to assemble, it has simple in construction, advantage easy to assembly, it is to avoid traditional direct insertion light
Quick tube material installs that cost of labor that specific wavelength optical filter uses the packaged type of twice combination to exist is high and production efficiency is low additional
Problem.
Accompanying drawing explanation
Fig. 1 is that the direct insertion photosensitive tube material that prior art provides installs the assembled package structure of specific wavelength optical filter additional and shows
It is intended to；
Fig. 2 is the plan structure schematic diagram of Fig. 1；
Fig. 3 is the decomposition texture schematic diagram of Fig. 1；
Fig. 4 is photosensitive tube and the optical filter encapsulating structure schematic diagram of embodiment of the present invention offer；
Fig. 5 is the plan structure schematic diagram of Fig. 4；
Fig. 6 is the decomposition texture schematic diagram of Fig. 4.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
The present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, and
It is not used in the restriction present invention.
As shown in Figures 4 to 6, it is that photosensitive tube and the optical filter combination encapsulating structure one of the embodiment of the present invention is preferably implemented
Example.This photosensitive tube includes light sense chip 11, wire the 12, first pin the 13, second pin 14, spy with optical filter combination encapsulating structure
Standing wave long length filter 20 and fluid sealant 15.First pin 13 is electrically connected with light sense chip 11, and the second pin 14 passes through wire
12 are electrically connected with light sense chip 11, and first pin the 13, second pin 14 and light sense chip 11 are encapsulated by fluid sealant 15, are formed
Integrated bracket 10.Wherein, the first pin 13 and the second pin 14 enclose the periphery being located at fluid sealant 15, form SMD encapsulation
Structure.Being internally formed of integrated bracket 10 accommodates chamber 30, and light sense chip 11 is contained in the bottom accommodating chamber 30, and specific wavelength is filtered
Mating plate 20 is covered on the opening accommodating chamber 30.Fluid sealant in the present embodiment uses PPA (poly-terephthalate p-phenylenediamine) plastics
Encapsulation.
In above-described embodiment, accommodate the first receiving space 31 and the second receiving space 32 that chamber 30 includes being interconnected, the
One accommodates formation one between space 31 and the second receiving space 32 is used for carrying the stage portion 33 of specific wavelength optical filter 20.Light sensation
A part for chip 11 and wire 12 is positioned at the first receiving space 31, is welded on first by die bond and draws bottom light sense chip 11
On foot 13 so that it is be electrically connected with the first pin 13；Another part of wire 12 is encapsulated in fluid sealant 15.Specific wavelength filters
Sheet 20 is embedded in the second receiving space 32, and is resisted against in stage portion 33.Specific wavelength optical filter 20 in the present embodiment
Wave-length coverage is preferably 400～700nm, in other embodiments, can select the wavelength in particular range according to demand.On
It is filled with epoxy resin in the first receiving space 31 stated, and its axial cross section is bowl shape, play certain guide-lighting effect.
The specific wavelength optical filter 20 being placed in the second receiving space 32 is covered on the enlarging one end in the first appearance space 31, and second
The inwall accommodating space 32 is provided with the buckle 320 for fixing specific wavelength optical filter 20.
The embodiment of the present invention additionally provides the processing work of a kind of photosensitive tube as above and optical filter combination encapsulating structure
Skill, this processing technique comprises the following steps:
A, by metal stamping, molding the first pin 13 and the second pin 14.
Welding light sense chip 11 by die bond on b, the first pin 13, light sense chip 11 is drawn with second by welding lead 12
Foot 14 connects, and then carries out injection parcel by fluid sealant 15, forms integrated bracket 10, make the first pin 13 and the second pin
14 enclose the periphery being located at fluid sealant 15, form SMD encapsulating structure, and form receiving chamber 30, light on integrated bracket 10
Sense chip 11 is positioned at the bottom accommodating chamber 30.
C, accommodate chamber 30 opening part buckle 320 is set, from accommodate chamber 30 opening specific wavelength optical filter 20 is pressed
Enter in the second receiving space 32, and fixed by buckle 320.
In sum, the photosensitive tube of the embodiment of the present invention has only to filter specific wavelength with optical filter combination encapsulating structure
In sheet 20 spiral-lock receiving chamber 30 on integrated bracket 10, i.e. use once combine just can complete assemble；It has structure letter
Single, easy to assembly, low cost and the high advantage of production efficiency, it is to avoid traditional direct insertion photosensitive tube material installs specific wavelength additional
Optical filter uses the problem that cost of labor is high and production efficiency is low that the packaged type of twice combination exists.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (7)
1. photosensitive tube and optical filter combine an encapsulating structure, including light sense chip, wire, the first pin, the second pin, specific
Wavelength filter and fluid sealant, described first pin is electrically connected with described smooth sense chip, and described second pin is by described
Wire is electrically connected with described smooth sense chip, it is characterised in that described first pin, the second pin and light sense chip are by described
Fluid sealant encapsulates, and forms integrated bracket；Wherein, described first pin and the second pin enclose the periphery being located at described fluid sealant,
Forming SMD encapsulating structure, being internally formed of described integrated bracket accommodates chamber, and described smooth sense chip is contained in described appearance
Receiving the bottom in chamber, described specific wavelength optical filter is covered on the opening in described receiving chamber.
2. photosensitive tube as claimed in claim 1 combines encapsulating structure with optical filter, it is characterised in that described receiving chamber includes phase
Intercommunicated the first receiving space and second accommodates space, and described first accommodates space and second accommodates formation one between space
Rank portion, a part for described smooth sense chip and described wire be positioned at described first accommodate space, described light sensation chip bottom with
Described first pin is electrically connected with, and another part of described wire is encapsulated in described fluid sealant, described specific wavelength optical filter
It is embedded in described second to accommodate in space, and is resisted against in described stage portion.
3. photosensitive tube as claimed in claim 2 combines encapsulating structure with optical filter, it is characterised in that described first accommodates space
Axial cross section be bowl shape, described specific wavelength optical filter be covered on described first hold space enlarging one end.
4. photosensitive tube as claimed in claim 2 combines encapsulating structure with optical filter, it is characterised in that described first accommodates space
Inside it is filled with epoxy resin.
5. photosensitive tube as claimed in claim 2 combines encapsulating structure with optical filter, it is characterised in that described second accommodates space
Inwall be provided with the buckle for fixing described specific wavelength optical filter.
6. the photosensitive tube as described in any one in claim 1 to 5 and optical filter combine a processing technique for encapsulating structure,
It is characterized in that, comprise the following steps:
A, by metal stamping, molding the first pin and the second pin；
Welding light sense chip by die bond on b, described first pin, described smooth sense chip is connected by welding lead and the second pin
Connect, then carry out injection parcel by fluid sealant, form integrated bracket, make described first pin and the second pin enclose and be located at institute
State the periphery of fluid sealant, form SMD encapsulating structure, and on described integrated bracket, form receiving chamber, described light sensation core
Sheet is positioned at the bottom in described receiving chamber；
C, opening part from described receiving chamber, be pressed into described receiving intracavity by specific wavelength optical filter.
7. a photosensitive tube as claimed in claim 6 and the processing technique of optical filter combination encapsulating structure, it is characterised in that
The opening part in described receiving chamber arranges buckle, and after described specific wavelength optical filter is pressed into described receiving intracavity, described buckle will
Described specific wavelength optical filter buckles and is fixed on described receiving intracavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610874984.5A CN106206756B (en) | 2016-09-30 | 2016-09-30 | Photosensitive tube and optical filter combined packaging structure and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610874984.5A CN106206756B (en) | 2016-09-30 | 2016-09-30 | Photosensitive tube and optical filter combined packaging structure and processing technology thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206756A true CN106206756A (en) | 2016-12-07 |
| CN106206756B CN106206756B (en) | 2018-03-02 |
Family
ID=57520908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610874984.5A Active CN106206756B (en) | 2016-09-30 | 2016-09-30 | Photosensitive tube and optical filter combined packaging structure and processing technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106206756B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591421A (en) * | 2017-08-15 | 2018-01-16 | 苏州昀冢电子科技有限公司 | Optical filter combination, camera module chip package base assembly and preparation method thereof |
| CN108987384A (en) * | 2018-08-23 | 2018-12-11 | 青岛海诺特电器有限公司 | A kind of light sensitive resistor photoelectric coupler and production method |
| CN111146296A (en) * | 2018-11-05 | 2020-05-12 | 上海集耀电子有限公司 | Improved photosensitive receiving tube |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174574A (en) * | 2001-12-05 | 2003-06-20 | Matsushita Electric Ind Co Ltd | Solid-state imaging unit and manufacturing method therefor |
| CN1635632A (en) * | 2003-12-30 | 2005-07-06 | 矽品精密工业股份有限公司 | Light sensitive semiconductor package, and manufacturing method and conductor frame thereof |
| JP2008103742A (en) * | 2003-09-09 | 2008-05-01 | Asahi Kasei Electronics Co Ltd | Infrared sensor ic |
| CN103490003A (en) * | 2013-10-10 | 2014-01-01 | 晶科电子（广州）有限公司 | High-reliability LED light source and LED module light source |
| CN103682030A (en) * | 2012-09-07 | 2014-03-26 | 深圳市龙岗区横岗光台电子厂 | LED, LED device and LED manufacture technology |
| US20140353789A1 (en) * | 2013-06-03 | 2014-12-04 | Optiz, Inc. | Sensor Package With Exposed Sensor Array And Method Of Making Same |
| JP2015165551A (en) * | 2014-02-04 | 2015-09-17 | セイコーインスツル株式会社 | Optical sensor device |
| CN105514248A (en) * | 2016-01-06 | 2016-04-20 | 宏齐光电子(深圳)有限公司 | High white light and low light decay LED and preparation method thereof |
-
2016
- 2016-09-30 CN CN201610874984.5A patent/CN106206756B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174574A (en) * | 2001-12-05 | 2003-06-20 | Matsushita Electric Ind Co Ltd | Solid-state imaging unit and manufacturing method therefor |
| JP2008103742A (en) * | 2003-09-09 | 2008-05-01 | Asahi Kasei Electronics Co Ltd | Infrared sensor ic |
| CN1635632A (en) * | 2003-12-30 | 2005-07-06 | 矽品精密工业股份有限公司 | Light sensitive semiconductor package, and manufacturing method and conductor frame thereof |
| CN103682030A (en) * | 2012-09-07 | 2014-03-26 | 深圳市龙岗区横岗光台电子厂 | LED, LED device and LED manufacture technology |
| US20140353789A1 (en) * | 2013-06-03 | 2014-12-04 | Optiz, Inc. | Sensor Package With Exposed Sensor Array And Method Of Making Same |
| CN103490003A (en) * | 2013-10-10 | 2014-01-01 | 晶科电子（广州）有限公司 | High-reliability LED light source and LED module light source |
| JP2015165551A (en) * | 2014-02-04 | 2015-09-17 | セイコーインスツル株式会社 | Optical sensor device |
| CN105514248A (en) * | 2016-01-06 | 2016-04-20 | 宏齐光电子(深圳)有限公司 | High white light and low light decay LED and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591421A (en) * | 2017-08-15 | 2018-01-16 | 苏州昀冢电子科技有限公司 | Optical filter combination, camera module chip package base assembly and preparation method thereof |
| CN107591421B (en) * | 2017-08-15 | 2023-08-04 | 苏州昀冢电子科技股份有限公司 | Camera module chip packaging base assembly and preparation method thereof |
| CN108987384A (en) * | 2018-08-23 | 2018-12-11 | 青岛海诺特电器有限公司 | A kind of light sensitive resistor photoelectric coupler and production method |
| CN108987384B (en) * | 2018-08-23 | 2023-10-31 | 青岛海诺特电器有限公司 | Photoresistor photoelectric coupler and manufacturing method thereof |
| CN111146296A (en) * | 2018-11-05 | 2020-05-12 | 上海集耀电子有限公司 | Improved photosensitive receiving tube |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106206756B (en) | 2018-03-02 |
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