CN107072054A - A kind of process for pressing of flexible circuit - Google Patents
A kind of process for pressing of flexible circuit Download PDFInfo
- Publication number
- CN107072054A CN107072054A CN201710373467.4A CN201710373467A CN107072054A CN 107072054 A CN107072054 A CN 107072054A CN 201710373467 A CN201710373467 A CN 201710373467A CN 107072054 A CN107072054 A CN 107072054A
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- CN
- China
- Prior art keywords
- pressing
- fpc
- flexible circuit
- circuit
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention disclose a kind of process for pressing of flexible circuit, and one, FPC is placed on polyester heatproof PET film, FPC sets circuit one side upward, place mat TPX films in circuit one side, formation stepped construction are set in FPC；Two, two sections of pressings of progress make between being placed in the upper pressure component of pressing machine by stepped construction and push component, wherein, in first paragraph pressing, 180 DEG C ± 3 DEG C of temperature, the 4Mpa of pressure 1, the time is 10 15 seconds；In second segment pressing, 180 DEG C ± 3 DEG C of design temperature, the 13Mpa of pressure 10, the time is 75 100 seconds.The present invention can eliminate pressing bubble and produce, control pressing glue overflow amount, realize the pressing of small size pad flexible circuit.
Description
Technical field
The present invention relates to flexible circuit manufacture craft, a kind of process for pressing of flexible circuit is referred in particular to.
Background technology
Flexible circuit（FPC）Be the reliability that is made of the copper foil of covering by base material of polyimides and polyimides cap rock it is high and
The good printed circuit of flexibility, by the substrate sheets of flexible light thin copper embedded circuit design so that narrow and
The embedding a large amount of precision elements of heap in the confined space, form flexible flexible circuit.The circuit can arbitrarily bend, fold, lightweight,
Small volume, thermal diffusivity is good, easy for installation.
As shown in Figures 1 and 2, in the prior art, will be on Copper base material be covered in the pressing working procedure in FPC manufacture crafts
The FPC middlewares of line layer and cap rock are set, the upper pressure component 20 of pressing machine is placed in and pushes progress pressing system between component 30
Make.Wherein, upper pressure component 20 is followed successively by thermal conductive metal plate 201, upper iron plate 202, upper heating disk 203 from the bottom to top；Push component
30 are followed successively by lower heating dish 301, lower iron plate 302, burn and pay iron plate 303, polytetrafluoroethylene (PTFE) bed course 304, green silica gel from the bottom to top
305；FPC middlewares are stepped construction 10, and polyester heatproof PET film 101, FPC102, polyester heatproof PET film are followed successively by from the bottom to top
101st, PE shrink films 103, polyester heatproof PET film 101.In process for pressing, temperature is set as 160 DEG C ± 3 DEG C, pressure 14-
15Mpa, the time is 150 seconds, and one step press is completed, and product is directly placed on heating work table top.
The defect of shown process for pressing is：One, bubble is also easy to produce in pressing, layering oxidative phenomena is easily caused；Two,
The pad of present prototype part of the product to attaching is more accurate, and in the design of pad, minimum pad size only has 0.2*
0.3mm sizes, and the original technical controlling index to glue overflow amount is 0.1-0.2mm, the glue overflow amount completely or partially seals pad
Close, cause element not mounted.
The content of the invention
It is an object of the invention to provide a kind of process for pressing of flexible circuit, produced with eliminating pressing bubble, control pressure
Glue overflow amount is closed, the pressing of small size pad flexible circuit is realized.
In order to reach above-mentioned purpose, solution of the invention is：
A kind of process for pressing of flexible circuit, comprises the following steps：
One, FPC is placed on polyester heatproof PET film, FPC sets circuit one side upward, and place mat in circuit one side is set in FPC
TPX films, form stepped construction；
Two, two sections of pressings of progress make between being placed in the upper pressure component of pressing machine by stepped construction and push component, wherein, first
In section pressing, 180 DEG C ± 3 DEG C of temperature, pressure 1-4Mpa, the time is 10-15 seconds；In second segment pressing, 180 DEG C of design temperature ±
3 DEG C, pressure 10-13Mpa, the time is 75-100 seconds.
Further, after pressing, in 24 hours, it is divided into one group by 25-30 stepped constructions, stacks neatly and use aluminum foil sealing
Closure is filled, and is put into baking oven, the temperature of baking oven is 150 DEG C ± 3 DEG C, and the time is 60 points ± 5 points, is solidified.
Further, upper pressure component is followed successively by silicon aluminium foil, upper iron plate, upper heating disk from the bottom to top；Push component from the bottom to top
Lower heating dish is followed successively by, burns and pays iron plate, glass-fiber-fabric.
After such scheme, the one-part form pressing of prior art is changed to two-part pressing mode, and pressure by the present invention
The process conditions of conjunction change；FPC is placed on polyester heatproof PET film, FPC sets circuit one side upward, and circuit one is set in FPC
Place mat TPX films on face, form stepped construction, using the auxiliary material of more resistance colloidality energy；Product is carried out outside heating space
Stack, the flow of operation is shortened, improved efficiency, the consumption of auxiliary material are reduced, while avoiding the insecurity such as personnel's scald.
Therefore, two-part pressing of the present invention, can effectively eliminate pressing bubble and produce, stepped construction selection coordinates two-part
Pressing, so as to control to press glue overflow amount, realizes the pressing of small size pad flexible circuit.
Brief description of the drawings
Fig. 1 is the upper pressure component of prior art pressing machine and pushes the structural representation of component；
Fig. 2 is prior art FPC stepped construction schematic diagrames；
Fig. 3 is the upper pressure component of pressing machine of the present invention and pushes the structural representation of component；
Fig. 4 is FPC stepped constructions schematic diagram of the present invention.
Label declaration
The polyester heatproof PET film 101 of stepped construction 10
FPC102 PE shrink films 103
The upper pressure thermal conductive metal plate 201 of component 20
The upper upper heating disk 203 of iron plate 202
Push 30 times heating dish of component 301
Lower iron plate 302, which is burnt, pays iron plate 303
The green silica gel 305 of polytetrafluoroethylene (PTFE) bed course 304
The FPC11 of stepped construction 1
The TPX films 13 of polyester heatproof PET film 12
The upper pressure silicon aluminium foil 21 of component 2
The upper upper heating disk 23 of iron plate 22
Push 3 times heating dish of component 31
Burn and pay the glass-fiber-fabric 33 of iron plate 32.
Embodiment
The present invention is described in detail below in conjunction with drawings and the specific embodiments.
Refer to described in Fig. 3 and Fig. 4, a kind of process for pressing for flexible circuit that the present invention is disclosed comprises the following steps：
One, as shown in figure 4, FPC11 is placed on polyester heatproof PET film 12, FPC11 sets circuit one side upward, is set in FPC11
The upper place mat TPX films 13 of circuit one side are put, stepped construction 1 is formed.
Two, two sections of pressings of progress make between being placed in the upper pressure component 2 of pressing machine by stepped construction 1 and push component 3, its
In, in first paragraph pressing, 180 DEG C ± 3 DEG C of temperature, pressure 1-4Mpa, the time is 10-15 seconds；In second segment pressing, design temperature
180 DEG C ± 3 DEG C, pressure 10-13Mpa, the time is 75-100 seconds.Upper pressure component 2 is followed successively by silicon aluminium foil 21, upper iron plate from the bottom to top
22nd, upper heating disk 23, push component 3 and are followed successively by lower heating dish 31 from the bottom to top, burn and pay iron plate 32, glass-fiber-fabric 33.
Two sections of pressing mode, makes the fillibility and pressing compactness of product, and the first pressing of first paragraph forms preheating, makes bonding
Glue carries out preliminarily softened, and mobility is more uniform.
Three, after pressing, in 24 hours, it is divided into one group by 25-30 stepped constructions 1, stacks neat and closed with aluminium foil
Packaging, is put into baking oven, the temperature of baking oven is 150 DEG C ± 3 DEG C, and the time is 60 points ± 5 points, is solidified.
The one-part form pressing of prior art is changed to two-part pressing mode by the present invention, and the process conditions of pressing change
Become, can effectively eliminate pressing bubble and produce；FPC is placed on polyester heatproof PET film, FPC sets circuit one side upward,
FPC sets circuit simultaneously upper place mat TPX films, forms stepped construction, using the auxiliary material of more resistance colloidality energy, so as to control
System pressing glue overflow amount, realizes the pressing of small size pad flexible circuit.Product is stacked outside heating space, makes operation
Flow is shortened, and improved efficiency, the consumption of auxiliary material are reduced, while avoiding the insecurity such as personnel's scald.
In bonding processes, because the bondline thickness of FPC cap rocks is inconsistent, in bonding processes, easy gassing, overflow
Glue, situations such as press impermeable, deformation, so to different bondline thickness, carrying out necessary parameter adjustment, see the table below：
The Contrast on effect that the present invention is implemented such as following table：
The preferred embodiments of the present invention are the foregoing is only, the limitation not designed this case, all design key institutes according to this case
The equivalent variations done, each fall within the protection domain of this case.
Claims (3)
1. a kind of process for pressing of flexible circuit, it is characterised in that：Comprise the following steps：
One, FPC is placed on polyester heatproof PET film, FPC sets circuit one side upward, and place mat in circuit one side is set in FPC
TPX films, form stepped construction；
Two, two sections of pressings of progress make between being placed in the upper pressure component of pressing machine by stepped construction and push component, wherein, first
In section pressing, 180 DEG C ± 3 DEG C of temperature, pressure 1-4Mpa, the time is 10-15 seconds；In second segment pressing, 180 DEG C of design temperature ±
3 DEG C, pressure 10-13Mpa, the time is 75-100 seconds.
2. a kind of process for pressing of flexible circuit as claimed in claim 1, it is characterised in that：After pressing, in 24 hours, press
25-30 stepped constructions are divided into one group, stack neat and are filled with aluminum foil sealing closure, are put into baking oven, and the temperature of baking oven is 150 DEG C ±
3 DEG C, the time is 60 points ± 5 points, is solidified.
3. a kind of process for pressing of flexible circuit as claimed in claim 1, it is characterised in that：Upper pressure component is from the bottom to top successively
For silicon aluminium foil, upper iron plate, upper heating disk；Component is pushed to be followed successively by lower heating dish from the bottom to top, burn and pay iron plate, glass-fiber-fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373467.4A CN107072054A (en) | 2017-05-24 | 2017-05-24 | A kind of process for pressing of flexible circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373467.4A CN107072054A (en) | 2017-05-24 | 2017-05-24 | A kind of process for pressing of flexible circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107072054A true CN107072054A (en) | 2017-08-18 |
Family
ID=59609861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710373467.4A Pending CN107072054A (en) | 2017-05-24 | 2017-05-24 | A kind of process for pressing of flexible circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072054A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107914453A (en) * | 2017-11-28 | 2018-04-17 | 信利光电股份有限公司 | A kind of plate construction and its applying method and electronic equipment |
| CN115955783A (en) * | 2022-12-30 | 2023-04-11 | 福莱盈电子股份有限公司 | Method for improving size stability of LCM soft and hard board ACF golden finger |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166396A (en) * | 2006-10-17 | 2008-04-23 | 比亚迪股份有限公司 | Joint tool and method for flexible printed circuit board |
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN203251519U (en) * | 2013-05-30 | 2013-10-23 | 双鸿电子(惠州)有限公司 | Press-fit auxiliary structure of quick press machine |
-
2017
- 2017-05-24 CN CN201710373467.4A patent/CN107072054A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166396A (en) * | 2006-10-17 | 2008-04-23 | 比亚迪股份有限公司 | Joint tool and method for flexible printed circuit board |
| CN101212867A (en) * | 2006-12-25 | 2008-07-02 | 比亚迪股份有限公司 | Flexible circuit board press bonding method |
| CN203251519U (en) * | 2013-05-30 | 2013-10-23 | 双鸿电子(惠州)有限公司 | Press-fit auxiliary structure of quick press machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107914453A (en) * | 2017-11-28 | 2018-04-17 | 信利光电股份有限公司 | A kind of plate construction and its applying method and electronic equipment |
| CN107914453B (en) * | 2017-11-28 | 2020-09-04 | 信利光电股份有限公司 | Plate structure, laminating method thereof and electronic equipment |
| CN115955783A (en) * | 2022-12-30 | 2023-04-11 | 福莱盈电子股份有限公司 | Method for improving size stability of LCM soft and hard board ACF golden finger |
| CN115955783B (en) * | 2022-12-30 | 2024-03-08 | 福莱盈电子股份有限公司 | Method for improving size stability of ACF golden finger of LCM soft and hard plate |
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| PB01 | Publication | ||
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Application publication date: 20170818 |