KR101558439B1 - Method of manufacturing fingerprint recognition module of mobile device and the fingerprint recognition module thereof - Google Patents

Abstract

Disclosed are a method for manufacturing a fingerprint recognition module of a mobile device and a fingerprint recognition module thereof. According to an embodiment of the present invention, provided is the method for manufacturing the fingerprint recognition module of the mobile device, which includes: a bonding step of bonding a fingerprint recognition sensor and a PCB board; an EMC molding step of performing molding between the fingerprint recognition sensor and the PCB board using an epoxy molding compound (EMC); a surface mounting step of mounting the fingerprint recognition sensor and the PCB board with EMC molding finished on an FPCB board by one method of surface mounting technology (SMT), anisotropic conductive film (ACF), and anisotropic conductive adhesive (ACA); a stoving paint applying step of painting a touch surface of the fingerprint recognition sensor using a stoving paint; and a bezel bonding step of bonding a bezel to surround the fingerprint recognition sensor.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing a fingerprint recognition module of a mobile device, and a fingerprint recognition module of the fingerprint recognition module.

Embodiments of the present invention relate to a method of manufacturing a fingerprint recognition module of a mobile device and a fingerprint recognition module thereof.

In recent years, with the development of mobile technology and the development of computing devices, mobile devices such as smart phones and tablet PCs have built-in large-capacity data storage media, high-performance computing units and high-speed communication modules. Accordingly, unlike the intention of the user, personal information and contents recorded and stored in the portable device are frequently leaked to the outside.

 With this atmosphere, the importance of security enhancement of mobile devices is emerging.

Fingerprint recognition technology is a technique that is mainly used to prevent various security incidents by going through user registration and authentication procedures. In particular, it can be applied to personal and organizational network defense, protection of various contents and data, secure access control, and the like.

FIG. 1 shows a typical example of a mobile device. FIG. 1 (a) shows a smartphone, and FIG. 1 (b) shows a tablet PC.

1A and 1B, most of the mobile devices 10 and 20 are provided with large-area display devices 13 and 23 at the center of the front face, and the display devices are driven by touch . A home key H is provided at the bottom of the front side of the mobile devices 10 and 20.

However, according to the security enhancement of the mobile device described above, there is a need to apply a fingerprint recognition module to a mobile device, and it is required to develop a technique for manufacturing a fingerprint recognition module capable of enhancing quality and durability as well as productivity .

A prior art related to the present invention is Korean Patent Registration No. 10-1368264 (published on February 28, 2014), which discloses a method for manufacturing a fingerprint recognition home key using an epoxy molding and a technology relating to a fingerprint recognition home key manufactured thereby .

The present invention provides a method of manufacturing a fingerprint recognition module for a mobile device and a fingerprint recognition module of the mobile device, which are provided in a mobile device including a portable terminal such as a smart phone, a tablet PC, and the like.

The present invention also provides a method of manufacturing a fingerprint recognition module for a mobile device and a fingerprint recognition module thereof, which can reduce cost and shorten the working time.

The present invention also relates to a method of manufacturing a fingerprint recognition module for a mobile device that does not suffer from deformation and discoloration of coating even when SMT (Surface Mounting Technology) is applied in a later process by applying a paint using a high- .

The present invention also provides a fingerprint recognition module manufacturing method and a fingerprint recognition module of a mobile device capable of improving the sensor recognition rate compared with the conventional one and improving the coating surface reliability (e.g., dome test, securing strength, adhesion, etc.) do.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned here can be understood by those skilled in the art from the following description.

According to an embodiment of the present invention, there is provided a fingerprint recognition system comprising: a bonding step of bonding a fingerprint recognition sensor and a PCB board; An EMC molding step of performing molding between the fingerprint recognition sensor and the PCB board using an EMC molding compound; A surface mounting step of mounting the FPCB and the PCB board on the FPCB substrate in one of SMT (Surface Mounting Technology), ACF (Anisotropic Conductive Film) and ACA (Anisotropic Conductive Adhesive); A step of painting the touch surface of the fingerprint recognition sensor using a baking paint; And a bezel joining step of joining a bezel to surround the fingerprint recognition sensor. The present invention also provides a method of manufacturing a fingerprint recognition module for a mobile device.

In the bonding step, the fingerprint sensor and the PCB board may be bonded together by one of wire bonding, flip chip bonding, and TAB (tape automated bonding). Any other known die bonding method may be used.

A stiffener may be provided on the back surface of the FPCB substrate.

In the bezel bonding step, the bezel may be bonded to the FPCB substrate by a SMT (Surface Mounting Technology) method, or may be bonded by using a conductive epoxy or a conductive heat-sealing tape.

In addition, in the bezel joining step, the bezel is made of stainless steel, and the bezel may be tin-plated.

In the baking step, the baking paints may be any one of melamine baking paints, acrylic baking paints, and fluororesin baking paints.

The primer coating may be performed on the touch surface of the fingerprint sensor before the baking step.

According to another embodiment of the present invention, there is provided a fingerprint recognition method comprising: a bonding step of bonding a fingerprint sensor to a PCB board; An EMC molding step of performing molding between the fingerprint recognition sensor and the PCB board using an EMC molding compound; A surface mounting step of mounting the FPCB and the PCB board on the FPCB substrate in one of SMT (Surface Mounting Technology), ACF (Anisotropic Conductive Film) and ACA (Anisotropic Conductive Adhesive); A step of painting the touch surface of the fingerprint recognition sensor using a baking paint; A UV coating step of performing UV coating after the coating is completed; And a bezel joining step of joining a bezel to surround the fingerprint recognition sensor. The present invention also provides a method of manufacturing a fingerprint recognition module for a mobile device.

In the bonding step, the fingerprint sensor and the PCB board may be bonded together by one of wire bonding, flip chip bonding, and TAB (tape automated bonding). Any other known die bonding method may be used.

In the surface mounting step, a stiffener may be provided on the back surface of the FPCB substrate.

In the bezel bonding step, the bezel may be bonded to the FPCB substrate by an SMT (Surface Mounting Technology) method, or may be bonded by using a conductive epoxy or a conductive heat-sealing tape.

In addition, in the bezel joining step, the bezel is made of stainless steel, and the bezel may be tin-plated.

In the baking step, the baking paints may be any one of melamine baking paints, acrylic baking paints, and fluororesin baking paints.

The primer coating may be performed on the touch surface of the fingerprint sensor before the baking step.

According to another embodiment of the present invention, there is provided a fingerprint recognition module manufactured according to the method of manufacturing a fingerprint recognition module of the mobile device.

According to the present invention, security in use can be enhanced through fingerprint recognition in a mobile device including a mobile terminal such as a smart phone, a tablet PC, and the like.

In addition, according to the present invention, the coating operation can be simplified compared to the conventional method, and the cost reduction and the work time can be shortened.

Further, according to the present invention, even when SMT (Surface Mounting Technology) is applied in a post-process by applying a paint using a baking primer which is resistant to high temperatures, there is an advantage that there is no deformation or discoloration of paint.

Further, according to the present invention, even if the thickness of the coating film is reduced, the coating surface reliability (for example, dome test, strength assurance, adhesion, etc.) can be improved.

1 schematically illustrates a smartphone and a tablet PC as a mobile device.
2 is a flowchart of a method of manufacturing a fingerprint recognition module of a mobile device according to a first embodiment of the present invention.
3 to 7 are flow charts of a method of manufacturing a fingerprint recognition module of a mobile device according to a first embodiment of the present invention.
8 is a flowchart of a method of manufacturing a fingerprint recognition module of a mobile device according to a second embodiment of the present invention.
9 to 14 are flow charts of a method of manufacturing a fingerprint recognition module of a mobile device according to a second embodiment of the present invention.
15 is a perspective view illustrating a fingerprint recognition module of a mobile device manufactured according to embodiments of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions in the embodiments of the present invention, which may vary depending on the intention of the user, the intention or the custom of the operator. Therefore, the definition should be based on the contents throughout this specification.

Hereinafter, a method for manufacturing a fingerprint recognition module of a mobile device and a fingerprint recognition module according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment

2 is a flowchart of a method of manufacturing a fingerprint recognition module of a mobile device according to a first embodiment of the present invention.

The method of manufacturing a fingerprint module of a mobile device according to the first embodiment of the present invention includes a bonding step S110, an EMC molding step S120, an SMT step S130, a baking step coating step S140, S150).

Hereinafter, detailed steps included in the first embodiment of the present invention will be described with reference to the flowcharts of the respective steps shown in FIGS. 3 to 7 in parallel.

In the bonding step (S110)

This step corresponds to the step of bonding the fingerprint sensor to the PCB board.

3 is a process diagram of the bonding step.

At this stage, the bonding between the fingerprint sensor 110 and the PCB board 120 may be performed by one of wire bonding, flip chip bonding, and TAB (tape automated bonding). And any other die bonding method known in the art may be used. Hereinafter, a method using wire bonding will be described as one preferred example.

Referring to FIG. 3, it can be seen that the fingerprint sensor 110 and the PCB board 120 are vertically connected and a wire (ie, a bonding wire) 130 is electrically connected between the fingerprint sensor 110 and the PCB board 120.

Here, wire bonding refers to an operation of connecting a chip terminal of the fingerprint recognition sensor 110 and a terminal of the PCB board 120 with a metal wire of good conductivity.

In the EMC molding step S120,

This step corresponds to molding between the fingerprint recognition sensor 110 and the PCB board 120 using an epoxy molding compound (EMC).

4 is a process drawing of the EMC molding step.

Referring to FIG. 4, it is confirmed that the fingerprint recognition sensor 110 and the PCB board 120 are joined together in the previous step, and then the fingerprint recognition sensor 110 and the PCB board 120 are formed in a package form through EMC molding have.

However, the shape shown in FIG. 4 is an exemplary shape, and the cross-sectional shape of the EMC molding part 140 may be slightly different according to various embodiments.

Here, the EMC (Epoxy Molding Compound) refers to a thermosetting polymer material that forms a three-dimensional cured structure by external heat, and refers to an inorganic / organic composite material mixed with an inorganic material for enhancing the function of the material.

The above-mentioned EMC (Epoxy Molding Compound) can be used in the packaging process of an electronic part because an epoxy material which is easy to mold, excellent in mechanical properties and low in cost manifests curing characteristics through an organic material.

In the SMT step S130,

In this step, the FPCB substrate is bonded to the FPCB substrate by the SMT (Surface Mounting Technology) method. In addition, they can be bonded using ACF (Anisotropic Conductive Film) or ACA (Anisotropic Conductive Adhesive).

5 is a process diagram of the SMT step.

5, when the EMC molding is completed in the previous step, the fingerprint sensor 110 and the PCB board 120 are packaged into an integral structure, and then the PCB board 120 is bonded onto the FPCB substrate 150 .

At this time, the bonding between the PCB board 120 and the FPCB substrate 150 is bonded by a surface mount technology (SMT) method.

A stiffener 151 for reinforcing the structure may be provided on the back surface of the FPCB substrate 150.

As a specific example, the stiffener 151 may be a plate-like member made of stainless steel. In addition, the shape and material of the stiffener 151 may be varied and used, and it is not necessarily limited to a specific shape and material.

In step S140,

This step corresponds to a step of applying a paint on the touch surface of the fingerprint sensor using a baking paint.

Fig. 6 is a process drawing of the step of painting the baked paint.

Referring to FIG. 6, a baking coating layer 160 is formed on the touch surface of the fingerprint recognition sensor 110 using a baking paint.

Here, the solidification of a coating in a solution state into a thin film is referred to as drying, and in particular, a solidification through heat treatment is referred to as baking. The baking paint is advantageous in that a hard and uniform coating film can be formed by applying heat after drying by using a thermosetting resin.

The baking paint may be any one of melamine-based, acrylic-based, and fluororesin-based resins. As a method of coating the baking paints and then drying them, hot air circulation heating infrared ray irradiation, gas infrared ray irradiation, high frequency dielectric heating method and the like can be used.

Meanwhile, although not shown separately, a primer coating may be selectively applied to the touch surface of the fingerprint recognition sensor 110 before the baking step is performed.

As described above, the baked coating layer 160 formed on the touch surface of the fingerprint sensor 110 has a heat-resistant characteristic, and thus it is advantageous that a high-temperature process such as SMT (Surface Mounting Technology) can proceed after coating.

In addition, since the baking coat paint layer 160 is formed, the coating operation can be simplified compared to the conventional one without any additional UV coating. As a result, the manufacturing cost can be reduced and the working time can be shortened. Also, coating surface reliability (eg, dome testing, strength assurance, adhesion) can be improved by reducing the thickness of the coating differently from the UV specification.

The bezel joining step (S150)

This step is a step of bonding a bezel to surround the fingerprint sensor.

7 is a process diagram of a bezel joining step.

Referring to FIG. 7, the bezel 180 may be provided to surround the fingerprint recognition sensor 110.

The bezel 180 may be made of stainless steel. And tin plating may be formed through the surface of the bezel 180. [

The bezel 180 may be bonded to the FPCB substrate 150 by an SMT (Surface Mounting Technology) method. As another example, the bezel 180 may be attached to the FPCB substrate 150 using a conductive epoxy or a conductive heat-sealable tape.

Second Embodiment

8 is a flowchart of a method of manufacturing a fingerprint recognition module of a mobile device according to a second embodiment of the present invention.

The method for fabricating a fingerprint module of a mobile device according to the second embodiment of the present invention includes the steps of bonding S210, EMC molding S220, SMT S230, baking coating S240, S250, and a bezel joining step S260.

Hereinafter, the detailed steps included in the second embodiment of the present invention will be described with reference to the flowcharts of the respective steps shown in FIGS. 9 to 14 in parallel.

In the bonding step S210,

This step corresponds to the step of bonding the fingerprint sensor to the PCB board.

9 is a process diagram of the bonding step.

At this stage, the bonding between the fingerprint sensor 110 and the PCB board 120 may be performed by one of wire bonding, flip chip bonding, and TAB (tape automated bonding). And any other die bonding method known in the art may be used. Hereinafter, a method using wire bonding will be described as one preferred example.

Referring to FIG. 9, it can be seen that the fingerprint sensor 110 and the PCB board 120 are vertically connected, and a wire (i.e., a bonding wire) 130 is electrically connected between the fingerprint sensor 110 and the PCB board 120.

Here, wire bonding refers to an operation of connecting a chip terminal of the fingerprint recognition sensor 110 and a terminal of the PCB board 120 with a metal wire of good conductivity.

EMC molding step S220

This step corresponds to molding between the fingerprint recognition sensor 110 and the PCB board 120 using an epoxy molding compound (EMC).

10 is a process diagram of the EMC molding step. It can be seen that the fingerprint recognition sensor 110 and the PCB board 120 are formed in a package form through EMC molding.

However, the shape shown in FIG. 10 is an exemplary shape, and the cross-sectional shape of the EMC molding part 140 may be slightly different according to various embodiments.

Here, the EMC (Epoxy Molding Compound) refers to a thermosetting polymer material that forms a three-dimensional cured structure by external heat, and refers to an inorganic / organic composite material mixed with an inorganic material for enhancing the function of the material.

The above-mentioned EMC (Epoxy Molding Compound) can be used in the packaging process of an electronic part because the curing characteristic is manifested through an organic material called epoxy which is easy to mold, excellent in mechanical characteristics and low in cost.

In the SMT step S230,

In this step, the FPCB substrate is bonded to the FPCB substrate by the SMT (Surface Mounting Technology) method. In addition, they can be bonded by ACF (Anisotropic Conductive Film) or ACA (Anisotropic Conductive Adhesive) method.

11 is a process diagram of the SMT step. The PCB board 120 is bonded onto the FPCB substrate 150 by a surface mount technology (SMT) method.

A stiffener 151 may be provided on the back surface of the FPCB substrate 150 to reinforce the structure. For example, the stiffener 151 may be a plate-like member made of stainless steel. However, it is not necessarily limited to such a material.

In step S240,

This step corresponds to a step of applying a paint on the touch surface of the fingerprint sensor using a baking paint.

FIG. 12 is a process chart of a step of painting a baking coat. Referring to FIG. 12, a baking coat paint layer 160 is formed on a touch surface of a fingerprint recognition sensor 110 using a baking coat.

Here, the solidification of a coating in a solution state into a thin film is referred to as drying, and in particular, a solidification through heat treatment is referred to as baking. The baking paint is advantageous in that a hard and uniform coating film can be formed by applying heat after drying by using a thermosetting resin.

The baking paint may be any one of melamine-based, acrylic-based, and fluororesin-based resins. As a method of coating the baking paints and then drying them, hot air circulation heating infrared ray irradiation, gas infrared ray irradiation, high frequency dielectric heating method and the like can be used.

Meanwhile, although not shown separately, a primer coating may be selectively applied to the touch surface of the fingerprint recognition sensor 110 before the baking step is performed.

As described above, the baked coating layer 160 formed on the touch surface of the fingerprint sensor 110 has a heat-resistant characteristic, and thus it is advantageous that a high-temperature process such as SMT (Surface Mounting Technology) can proceed after coating.

In addition, since the baking coat paint layer 160 is formed, the coating operation can be simplified compared to the conventional one without any additional UV coating. As a result, the manufacturing cost can be reduced and the working time can be shortened. Also, coating surface reliability (eg, dome testing, strength assurance, adhesion) can be improved by reducing the thickness of the coating differently from the UV specification.

UV coating step S250

This step is a UV coating step in which a baking coating layer is formed on the touch surface of the fingerprint recognition sensor and then UV coating is selectively performed.

FIG. 13 is a process diagram of a UV coating step. As shown in FIG. 13, a baking coating layer 160 is formed on a touch surface of a fingerprint recognition sensor 110, and then a UV coating layer 170 is formed by UV coating .

The bezel joining step (S260)

This step is a step of bonding a bezel to surround the fingerprint sensor.

FIG. 14 is a process diagram of the bezel bonding step. Referring to FIG. 14, a bezel 180 of a stainless steel material is provided to surround the fingerprint recognition sensor 110. FIG. And preferably tin plating may be formed through the surface of the bezel 180.

In this step, the bezel 180 may be bonded to the FPCB substrate 150 by an SMT (Surface Mounting Technology) method. As another example, the bezel 180 may be attached to the FPCB substrate 150 using a conductive epoxy or a conductive heat-sealable tape.

The fingerprint recognition module of the mobile device manufactured according to the first and second embodiments of the present invention described above is schematically shown in FIG.

An FPCB substrate 160 is bonded to a PCB board (not shown), and then an EMC (Epoxy Molding Compound) -molded fingerprint recognition sensor 100 is provided on the FPCB substrate 160. The touch surface of the fingerprint recognition sensor includes a baking coat layer 160 . And a bezel 180 is attached in a wrapping manner. According to the second embodiment of the present invention, a UV coating layer may be additionally formed on the baking coat paint layer 160, which may be determined according to the user's selection.

As described above, according to the structure and operation of the present invention, security in use can be enhanced through fingerprint recognition in a mobile device including a portable terminal such as a smart phone and a tablet PC.

In addition, the coating operation is simplified compared with the conventional method, and cost reduction and work time reduction can be achieved.

In addition, even when SMT (Surface Mounting Technology) is applied in a post-process by applying a paint using a high-temperature baking paint, there is an advantage that there is no deformation or discoloration of the paint.

Further, even when the thickness of the coating film is reduced, the reliability of the coating surface (for example, dome test, strength assurance, adhesion, etc.) can be improved.

Although the present invention has been described with respect to a method for manufacturing a fingerprint recognition module of a mobile device and a specific embodiment of the fingerprint recognition module according to the present invention, various modifications may be made without departing from the scope of the present invention.

It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are not to be construed in a limiting sense, and the scope of the present invention is indicated by the appended claims rather than by the foregoing description, All changes and modifications that come within the spirit and scope of the appended claims are intended to be embraced therein.

100: Fingerprint recognition module
110: Fingerprint sensor
120: PCB board
130: wire
140: EMC molding part
150: FPCB substrate
151: Stiffener
160: Baking paint coating layer
170: UV coating layer
180: Bezel

Claims (15)

A bonding step of bonding the fingerprint sensor and the PCB board;
An EMC molding step of performing molding between the fingerprint recognition sensor and the PCB board using an EMC molding compound;
A surface mounting step of mounting the FPCB and the PCB board on the FPCB substrate in one of SMT (Surface Mounting Technology), ACF (Anisotropic Conductive Film) and ACA (Anisotropic Conductive Adhesive);
A coating layer which is resistant to heat is formed on the touch surface of the fingerprint sensor using any one of a melamine-based paint, an acryl-based paint, and a fluororesin-based paint, and a high-temperature A step of applying a baking coating to prevent deformation and discoloration of the coating layer when the step is performed; And
And a bezel bonding step of bonding a bezel on the FPCB substrate by a SMT (Surface Mounting Technology) method so as to surround the fingerprint recognition sensor.
The method according to claim 1,
In the bonding step,
A method of manufacturing a fingerprint recognition module for a mobile device that joins the fingerprint recognition sensor to the PCB board by one of wire bonding, flip chip bonding, and tape automated bonding (TAB).
The method according to claim 1,
In the surface mounting step,
And a stiffener is provided on a back surface of the FPCB substrate.
delete The method according to claim 1,
In the bezel joining step,
Wherein the bezel is made of a stainless steel material, and the bezel is tin-plated.
delete The method according to claim 1,
Before the baking step,
Wherein the primer coating is performed on the touch surface of the fingerprint recognition sensor.
A bonding step of bonding the fingerprint sensor and the PCB board;
An EMC molding step of performing molding between the fingerprint recognition sensor and the PCB board using an EMC molding compound;
A surface mounting step of mounting the FPCB and the PCB board on the FPCB substrate in one of SMT (Surface Mounting Technology), ACF (Anisotropic Conductive Film) and ACA (Anisotropic Conductive Adhesive);
A coating layer which is resistant to heat is formed on the touch surface of the fingerprint sensor using any one of a melamine-based paint, an acryl-based paint, and a fluororesin-based paint, and a high-temperature A step of applying a baking coating to prevent deformation and discoloration of the coating layer when the step is performed;
A UV coating step of performing UV coating on the top of the baking coat paint layer; And
And a bezel bonding step of bonding a bezel on the FPCB substrate by a SMT (Surface Mounting Technology) method so as to surround the fingerprint recognition sensor.
9. The method of claim 8,
In the bonding step,
A method of manufacturing a fingerprint recognition module for a mobile device that joins the fingerprint recognition sensor to the PCB board by one of wire bonding, flip chip bonding, and tape automated bonding (TAB).
9. The method of claim 8,
In the surface mounting step,
And a stiffener is provided on a back surface of the FPCB substrate.
delete 9. The method of claim 8,
In the bezel joining step,
Wherein the bezel is made of a stainless steel material, and the bezel is tin-plated.
delete 9. The method of claim 8,
Before the baking step,
Wherein the primer coating is performed on the touch surface of the fingerprint recognition sensor.
A fingerprint recognition module according to any one of claims 1 to 3, 5, 7, 10, 12, and 14, which is manufactured according to the method for manufacturing a fingerprint recognition module of a mobile device.

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